Circuit connection structure

Abstract

The utility model belongs to the technical field of printed circuit structures, and particularly relates to a circuit connection structure. The field effect transistor comprises a field effect transistor, the bottom surface is a bonding pad, and the side surface is provided with a pin used for controlling the on-off of the field effect transistor; the surface of the aluminum substrate is provided with a surface-mounted bonding pad, and the surface-mounted bonding pad is used for welding a bonding pad on the bottom surface of the field effect transistor; the circuit board is fixed right above the aluminum substrate through a supporting column, and a through hole bonding pad is arranged on the circuit board; after the field effect transistor is welded on the surface-mounted bonding pad on the aluminum substrate, the pin of the field effect transistor extends into the through hole bonding pad of the aluminum substrate after being bent and is connected with the through hole bonding pad in a welding mode. When in use, after the circuit board is connected with a power supply, the pin of the field effect transistor can be used for replacing a binding post to transmit an on-off signal of the field effect transistor, so that the use quantity of the binding post can be reduced, and the tilting risk of the binding post in the aluminum substrate in the reflow soldering process can be reduced.

Description

TECHNICAL FIELD

[0001] The utility model belongs to printed circuit structure technical field, concretely relates to a circuit connection structure. BACKGROUND

[0002] The existing driver needing to adopt the heat dissipation measure usually needs to weld the power device on the single aluminum substrate with good heat dissipation, weld the device for controlling the power device opening and closing on the ordinary FR-4 circuit board, and complete the signal transmission between the aluminum substrate and FR-4 circuit board through the metal terminal post.

[0003] In the existing driver, one end of the terminal post is mostly welded on the aluminum substrate in the surface mounting mode, and the other end of the terminal post penetrates the through-hole type pad of the FR-4 circuit board and is welded on the through-hole type pad through soldering. When the metal terminal post is surface-mounted and welded on the aluminum substrate, because the number of terminal posts is large, after the aluminum substrate is brushed with tin paste, pasted with components and terminal posts, and placed into the reflow soldering furnace for reflow soldering, hot air in the furnace flows through the components and terminal posts, the surface-mounted area of the bottom of the terminal post is small, and the height of the terminal post is high, so the flowing hot air can make the terminal post tilt. SUMMARY

[0004] The utility model aims at the problem that when the metal terminal post is surface-mounted and welded on the aluminum substrate in the existing driver structure, because the number of terminal posts is large, after the aluminum substrate is brushed with tin paste, pasted with components and terminal posts, and placed into the reflow soldering furnace for reflow soldering, hot air in the furnace flows through the components and terminal posts, the surface-mounted area of the bottom of the terminal post is small, and the height of the terminal post is high, so the flowing hot air can make the terminal post tilt, provides a circuit connection structure, when applied to the driver, can greatly reduce the occurrence of the tilting event of the terminal post in the reflow soldering process.

[0005] A circuit connection structure comprises

[0006] A field effect transistor, the bottom surface is a pad, and the side surface is provided with a pin for controlling the on-off of the field effect transistor;

[0007] An aluminum substrate, a surface-mounted pad is arranged on the plate surface, and the surface-mounted pad is used for welding the pad of the bottom surface of the field effect transistor;

[0008] A circuit board is fixed above the aluminum substrate through a support column, and a through-hole pad is arranged on the circuit board;

[0009] After the field effect transistor is welded on the surface-mounted pad of the aluminum substrate, the pin of the field effect transistor is bent and inserted into the through-hole pad of the aluminum substrate and welded and connected with the through-hole pad.

[0010] Furthermore, each surface mount pad is provided with a lead bending area on its side, the number of through-hole pads is consistent with the number of lead bending areas, and the through-hole pads are correspondingly arranged directly above the lead bending area.

[0011] After the field-effect transistor is soldered to the surface mount pad on the aluminum substrate, the lead of the field-effect transistor is bent at the lead bending area next to the surface mount pad and then extends into the corresponding through-hole pad above and is soldered to the corresponding through-hole pad.

[0012] Furthermore, each field-effect transistor (FET) includes three pins: gate, drain, and source. Each lead bending region includes a gate bending section G, a drain bending section D, and a source bending section S. Each via pad has three pin vias, which are respectively positioned above the gate bending section G, the drain bending section D, and the source bending section S, so that the gate pin, drain pin, and source pin on the FET can be soldered to the corresponding via pad.

[0013] Furthermore, the aluminum substrate is provided with a first mounting hole, the circuit board is provided with a second mounting hole, the support column is a hollow structure, and the number of the support columns and the number of the second mounting holes are consistent with the number of the first mounting holes. The aluminum substrate, the support column and the circuit board are fixedly connected by fasteners passing through the first mounting hole, the support column and the second mounting hole in sequence.

[0014] Furthermore, the fastener includes a screw and a nut. After the screw passes through the first mounting hole on the aluminum substrate, the inner hole of the support column, and the second mounting hole on the circuit board in sequence, the nut is used to lock the screw on the outside of the circuit board to achieve a fixed connection between the aluminum substrate, the support column, and the circuit board.

[0015] Furthermore, the shape of the aluminum substrate and the shape of the circuit board should be consistent.

[0016] Furthermore, the aluminum substrate is provided with four first mounting holes, and the four first mounting holes are arranged at intervals along the circumference of the aluminum substrate.

[0017] Furthermore, four first mounting holes are arranged at the four corners of the aluminum substrate.

[0018] Furthermore, the four first mounting holes on the aluminum substrate are named K11 mounting hole, K12 mounting hole, K13 mounting hole and K14 mounting hole in sequence, and the four second mounting holes on the circuit board are named K21 mounting hole, K22 mounting hole, K23 mounting hole and K24 mounting hole in sequence. Among them, the K11 mounting hole is the processing positioning hole of the aluminum substrate, and the K21 mounting hole is the processing positioning hole of the circuit board.

[0019] Furthermore, the aluminum substrate has six surface mount pads, which are divided into two groups and distributed along both sides of the aluminum substrate.

[0020] The beneficial effects of this utility model are as follows:

[0021] This invention provides a circuit connection structure. In use, after the circuit board is powered on, this invention can use the pins of a field-effect transistor (FET) instead of terminals to transmit the FET's on / off signal, thereby reducing the number of terminals required and thus reducing the risk of terminals in the aluminum substrate tilting during reflow soldering. Attached Figure Description

[0022] Figure 1 This is a three-dimensional structural diagram of this embodiment.

[0023] Figure 2 This is a schematic diagram of the structure of the drawing component.

[0024] Figure 3 This is a schematic diagram of the top rod structure.

[0025] Figure label:

[0026] 1-Aluminum substrate, 11-Surface mount pad, 12-Lead bending area, 2-Circuit board, 21-Through hole pad, 3-Support, 4-Fastener, 41-Nut, 42-Screw. Detailed Implementation

[0027] Exemplary embodiments will be described more fully below with reference to the accompanying drawings; however, these exemplary embodiments may be embodied in different forms and should not be construed as limited to the embodiments set forth herein. Rather, these embodiments are provided so that this invention will be thorough and complete, and will enable those skilled in the art to fully understand the scope of this invention.

[0028] Where there is no conflict, the embodiments of this utility model and the features thereof can be combined with each other.

[0029] As used herein, the term “and / or” includes any and all combinations of one or more related enumerated entries.

[0030] The terminology used herein is for the purpose of describing particular embodiments only and is not intended to limit the scope of the invention. The singular forms “a” and “the” used herein are also intended to include the plural forms unless the context clearly indicates otherwise.

[0031] When the terms “comprising” and / or “made of” are used in this specification, the presence of the stated feature, integral, step, operation, element and / or component is specified, but the presence or addition of one or more other features, integrals, steps, operations, elements, components and / or groups thereof is not excluded.

[0032] Unless otherwise specified, all terms used herein (including technical and scientific terms) have the same meaning as commonly understood by one of ordinary skill in the art. It will also be understood that terms such as those defined in commonly used dictionaries should be understood to have the meaning consistent with their meaning in the context of the relevant art and the present invention, and will not be understood to have an idealized or overly formal meaning unless expressly so defined herein.

[0033] In existing driver structures, when metal terminals are surface-mounted onto an aluminum substrate, the large number of terminals and the high-temperature hot airflow during reflow soldering after solder paste application, component placement, and terminal mounting can cause them to tilt. This embodiment provides a circuit connection structure that significantly reduces the occurrence of terminal tilting during reflow soldering when applied to a driver.

[0034] like Figures 1 to 3 As shown, this embodiment provides a circuit connection structure, including an aluminum substrate 1, a circuit board 2, a field-effect transistor, and a support pillar 3.

[0035] In this embodiment, the bottom surface of the field-effect transistor (FET) is a large pad, and the side surface of the FET has relatively long metal leads. Furthermore, some of these leads possess the electrical characteristics necessary to control the on / off state of the FET.

[0036] In this embodiment, the aluminum substrate 1 is provided with first mounting holes and surface mount pads 11. The number of first mounting holes is not limited and can be selected and arranged according to actual needs. For ease of implementation, such as... Figure 2 As shown, in this embodiment, four first mounting holes can be selected, and the four first mounting holes can be arranged at intervals along the circumference of the aluminum substrate 1. Preferably, the four first mounting holes can be arranged at the four corners of the aluminum substrate 1. Specifically, in Figure 2 In the view shown, the four first mounting holes on the aluminum substrate 1 can be named K11 mounting hole, K12 mounting hole, K13 mounting hole and K14 mounting hole in sequence.

[0037] It should be understood that in this embodiment, the shape of the aluminum substrate 1 and the shape of the circuit board 2 should be consistent, both of which can be regular or irregular structural boards. In this embodiment, the four first mounting holes are arranged at the four corners of the aluminum substrate 1, which can be understood as the four first mounting holes being located at the four corners near the edge of the aluminum substrate 1.

[0038] In this embodiment, the number of surface mount pads 11 on the aluminum substrate 1 can be one, two, or more, and each surface mount pad 11 is used to solder to a large pad on the bottom surface of the field-effect transistor. For example... Figure 2 As shown, in this embodiment, a lead bending area 12 is also provided on the side of each surface mount pad 11. When the field effect transistor is soldered to the surface mount pad 11 on the aluminum substrate 1, the metal lead on the side of the field effect transistor first extends to the lead bending area 12 on the side of the upper surface mount pad, and then bends away from the aluminum substrate 1.

[0039] Preferably, such as Figure 2 As shown, in this embodiment, the surface mount pads 11 can be selected as six. Specifically, the six surface mount pads 11 can be divided into two groups and distributed along both sides of the aluminum substrate 1.

[0040] In this embodiment, the circuit board 2 is disposed directly above the aluminum substrate 1, and the circuit board 2 is provided with second mounting holes and through-hole pads 21. The number of second mounting holes on the circuit board 2 should be consistent with the number of first mounting holes on the aluminum substrate 1, and the second mounting holes are correspondingly arranged directly above the first mounting holes. Specifically, as shown... Figure 3 As shown, the circuit board 2 has four second mounting holes, which can be named K21 mounting hole, K22 mounting hole, K23 mounting hole and K24 mounting hole in sequence.

[0041] In this embodiment, the number of through-hole pads 21 on the circuit board 2 should be consistent with the number of lead bending areas 12 on the aluminum substrate 1, and the through-hole pads 21 on the circuit board 2 should be arranged directly above the lead bending areas 12.

[0042] During the assembly process, after the field-effect transistor is soldered to the surface mount pad 11 on the aluminum substrate 1, the metal pins on the side of the field-effect transistor are bent toward the circuit board 2 in the lead bending area 12 on the side of the surface mount pad, so that the metal pins extend into the corresponding through-hole pads 21 above, and the soldering between the metal pins and the corresponding through-hole pads 21 is completed.

[0043] Preferably, in this embodiment, the circuit board 2 is fixed to the top of the aluminum substrate 1 by the support column 3. That is, in this embodiment, both ends of the support column 3 are fixedly connected to the aluminum substrate 1 and the circuit board 2, respectively. Further, to facilitate the fixed connection of both ends of the support column 3 to the aluminum substrate 1 and the circuit board 2, the support column 3 in this embodiment can adopt a hollow structure. The number of support columns 3 in this embodiment can be selected to be the same as the number of first mounting holes, and the aluminum substrate 1, support column 3 and circuit board 2 are fixedly connected together by screws 42 passing through the first mounting hole, the support column 3 and the second mounting hole in sequence.

[0044] Specifically, in this embodiment, four support pillars 3 can be selected and named sequentially as K1 support pillar 3, K2 support pillar 3, K3 support pillar 3, and K4 support pillar 3. Taking K1 support pillar 3, K11 mounting hole, and K21 mounting hole as examples, the aluminum substrate 1, support pillars 3, and circuit board 2 can be fixedly connected in the following way:

[0045] First, screws 42 are used to pass through the K11 mounting hole on the aluminum substrate 1, the inner hole of the K1 support 3, and the K21 mounting hole on the circuit board 2 in sequence. Then, screws 42 are locked on the outside of the circuit board 2 by nuts 41 to achieve a fixed connection between the aluminum substrate 1, the support 3 and the circuit board 2.

[0046] In this embodiment, four second mounting holes are respectively disposed directly above four first mounting holes, and through-hole pads 21 are respectively disposed directly above lead wire bending area 12. In order to facilitate the quick acquisition of the position between various structures on aluminum substrate 1 or circuit board 2 during processing and manufacturing, this embodiment can select mounting hole K11 as the processing positioning hole of aluminum substrate 1, and correspondingly select mounting hole K21 as the processing positioning hole of circuit board 2.

[0047] In use, after the power supply is turned on to the circuit board 2, this embodiment can use the pins of the field-effect transistor to replace the terminals to transmit the on / off signal of the field-effect transistor, thereby reducing the number of terminals used and thus reducing the risk of the terminals in the aluminum substrate 1 tilting during the reflow soldering process.

[0048] It should be understood that this embodiment uses the pins of the field-effect transistor (FET) to replace some of the terminals, rather than using the pins of the FET to replace all the terminals. That is, in the circuit connection structure provided in this embodiment, both terminals and pins of the FET are used to transmit signals.

[0049] Preferably, each field-effect transistor (FET) in this embodiment includes three pins: a gate, a drain, and a source. Correspondingly, each lead bending region 12 includes a gate bending region G, a drain bending region D, and a source bending region S. In this case, the through-hole pad 21 on the circuit board 2 can be provided with three pin vias, and these three pin vias are respectively positioned above the gate bending region G, the drain bending region D, and the source bending region S, so that the gate pin, drain pin, and source pin of the FET can be soldered to the corresponding through-hole pad 21.

[0050] Therefore, when in use, each MOSFET pin can replace three terminals, which greatly reduces the number of terminals used and significantly reduces the risk of the terminals in the aluminum substrate 1 tilting during reflow soldering.

[0051] Example embodiments have been disclosed herein, and while specific terminology has been used, it is for general illustrative purposes only and should not be construed as limiting. In some embodiments, it will be apparent to those skilled in the art that features, characteristics, and / or elements described in connection with particular embodiments may be used alone, or in combination with features, characteristics, and / or elements described in connection with other embodiments, unless otherwise expressly indicated. Therefore, those skilled in the art will understand that various changes in form and detail may be made without departing from the scope of the invention as set forth in the appended claims.

Claims

1. A circuit connection structure, characterized by: The application relates to a field effect transistor and a circuit board fixed on the field effect transistor. The field effect transistor comprises a base and a side provided with a pin for controlling the on-off of the field effect transistor; The aluminum substrate is provided with surface mounting pads on the surface, and the surface mounting pads are used for welding the pads on the bottom surface of the field effect transistor; The circuit board is fixed on the top of the aluminum substrate through a support, and the circuit board is provided with through-hole pads; After the field effect transistor is welded on the surface mounting pads on the aluminum substrate, the pin of the field effect transistor is bent and inserted into the through-hole pads of the aluminum substrate and welded with the through-hole pads.

2. The circuit connection structure according to claim 1, characterized by: Each surface mounting pad is provided with a lead bending area on the side, the number of the through-hole pads is consistent with the number of the lead bending areas, and the through-hole pads are arranged above the corresponding lead bending areas; After the field effect transistor is welded on the surface mounting pads on the aluminum substrate, the pin on the side of the field effect transistor is bent in the lead bending area on the side of the surface mounting pads, and then is inserted into the corresponding through-hole pad and welded with the corresponding through-hole pad.

3. The circuit connection structure according to claim 2, characterized by: Each field effect transistor comprises three pins of a gate, a drain and a source, each lead bending area comprises a gate bending area G, a drain bending area D and a source bending area S, and three pin through holes are arranged on each through-hole pad and above the gate bending area G, the drain bending area D and the source bending area S, so that the gate pin, the drain pin and the source pin on the field effect transistor are welded with the corresponding through-hole pad of the field effect transistor.

4. The circuit connection structure according to any one of claims 1 to 3, characterized by: The aluminum substrate is further provided with first mounting holes, the circuit board is further provided with second mounting holes, the support is a hollow structure, the number of the support is consistent with the number of the first mounting holes and the number of the second mounting holes, and the aluminum substrate, the support and the circuit board are fixed and connected through fasteners in the mode of sequentially penetrating the first mounting holes, the support and the second mounting holes.

5. The circuit connection structure according to claim 4, characterized by: The fastener comprises a screw and a nut, after the screw sequentially penetrates the first mounting holes on the aluminum substrate, the inner hole of the support and the second mounting holes on the circuit board, the screw is locked by the nut on the outside of the circuit board, and the fixed connection among the aluminum substrate, the support and the circuit board is realized.

6. The circuit connection structure according to any one of claims 1, 2, 3, or 5, characterized by: The shape of the aluminum substrate and the shape of the circuit board should be consistent.

7. The circuit connection structure according to any one of claims 1, 2, 3, or 5, characterized by: The aluminum substrate is provided with four first mounting holes, and the four first mounting holes are arranged at intervals along the circumference of the aluminum substrate.

8. The circuit connection structure according to claim 7, characterized by: The four first mounting holes are arranged at four corners of the aluminum substrate.

9. The circuit connection structure according to claim 7, characterized by: The four first mounting holes on the aluminum substrate are sequentially named as K11 mounting hole, K12 mounting hole, K13 mounting hole and K14 mounting hole, and the four second mounting holes on the circuit board are sequentially named as K21 mounting hole, K22 mounting hole, K23 mounting hole and K24 mounting hole, wherein the K11 mounting hole is a machining positioning hole of the aluminum substrate, and the K21 mounting hole is a machining positioning hole of the circuit board.

10. The circuit connection structure according to any one of claims 1, 2, 3, 5, 8 or 9, characterized by: The aluminum substrate is provided with six surface mounting pads, and the six surface mounting pads are divided into two groups and distributed along the two sides of the aluminum substrate.

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