Stable-clamping rotary polishing device for silicon carbide substrate

Abstract

The utility model discloses a stably-clamped rotary polishing device for a silicon carbide substrate, relates to the technical field of silicon carbide substrate polishing, and aims to solve the problems that when an existing polishing device fixes raw materials, the side edges of the raw materials are prone to being damaged, and meanwhile the overall machining efficiency needs to be improved. A rotary disc is rotatably mounted at the upper end of the base, a plurality of adsorption seats are mounted on the upper surface of the rotary disc, each adsorption seat comprises a communication seat, a rubber disc is adhered to the upper surface of each communication seat, and a plurality of annular convex strips sharing the same center point are integrally connected to the upper surface of each rubber disc. A plurality of air suction holes corresponding in position are formed in the upper surface of the communicating base and the outer surface of the rubber disc, and the air suction holes are distributed in the gap between every two adjacent protruding strips. And the effects that the raw materials can be stably and firmly adsorbed and limited, the raw materials are prevented from being damaged, and meanwhile the overall machining efficiency is high are achieved.

Description

Technical Field

[0001] This utility model relates to the field of silicon carbide substrate polishing technology, and in particular to a rotary polishing device for stably clamping silicon carbide substrates. Background Technology

[0002] Silicon carbide substrates are a fundamental material in the field of semiconductor materials. The main component of silicon carbide substrates is silicon carbide, a compound composed of silicon and carbon. Its crystal structure is zincblende type, which gives silicon carbide many excellent physical and chemical properties. During the fabrication of silicon carbide substrates, a polishing process is required, necessitating the use of polishing equipment.

[0003] Existing polishing equipment is prone to damaging the sides of raw materials when fixing them, and the overall processing efficiency needs to be improved. Utility Model Content

[0004] The purpose of this invention is to provide a rotary polishing device for a stable clamping silicon carbide substrate that can stably and firmly adsorb and limit the material, avoiding damage to the material, while also having high overall processing efficiency.

[0005] To achieve the above objectives, the present invention provides the following technical solution:

[0006] A rotary polishing device for stably clamping silicon carbide substrates includes a base, a turntable rotatably mounted on the upper end of the base, a plurality of adsorption seats mounted on the upper surface of the turntable, each adsorption seat including a connecting seat, a rubber disc adhered to the upper surface of the connecting seat, a plurality of annular protrusions sharing a common center point integrally connected to the upper surface of the rubber disc, a plurality of corresponding air suction holes provided on the upper surface of the connecting seat and the outer surface of the rubber disc, the air suction holes being distributed in the gaps between two adjacent protrusions, an air extraction pipe fixedly connected to the air outlet of the connecting seat, and an air extraction pump fixedly installed in the pipe.

[0007] By adopting the above technical solution, the silicon carbide substrate can be stably and firmly adsorbed and confined, ensuring that the silicon carbide substrate will not be damaged during the stable processing.

[0008] Furthermore, a mounting plate is fixedly connected to the inner wall of the base, and a motor is fixedly installed at the middle position of the mounting plate. One end of the rotating shaft of the motor is fixedly connected to the middle position of the lower surface of the turntable.

[0009] By adopting the above technical solution, the stable rotation of the turntable can be ensured.

[0010] Furthermore, a first linear module is provided on one side of the base, and a polishing arm is fixedly connected to the moving end of the first linear module. A polishing motor is fixedly installed at one end of the polishing arm, and a polishing disc is fixedly installed at one end of the rotating shaft of the polishing motor.

[0011] By adopting the above technical solution, effective surface polishing operations can be performed.

[0012] Furthermore, a bracket is fixedly connected to the side surface of the base, a lamp holder is fixedly connected to one end of the bracket, a mounting hole is provided in the middle of the lamp holder, an optical camera is fixedly installed inside the mounting hole, and a ring-shaped lighting lamp is fixedly installed on the inner wall of the lamp holder.

[0013] By adopting the above technical solution, optical inspection operations can be performed.

[0014] Furthermore, a second linear module is provided on one side of the base. A hydraulic rod is fixedly connected to the moving end of the second linear module. A rotary cylinder is fixedly connected to the telescopic end of the hydraulic rod. A connecting arm is fixedly connected to the rotating end of the rotary cylinder. A suction cup is fixedly installed at one end of the connecting arm.

[0015] By adopting the above technical solution, the position of the suction cup can be flexibly adjusted, which facilitates material feeding and sorting out defective products.

[0016] Furthermore, an annular sliding rail conductive structure is provided on the outer surface of the base.

[0017] By adopting the above technical solutions, a stable power supply can be achieved.

[0018] In summary, the beneficial technical effects of this utility model are as follows:

[0019] 1. In this invention, during polishing, the silicon carbide substrate to be polished is placed on the annular protrusion of the rubber disc, and then the air pump is started. At this time, the air extraction pipe can effectively extract the air inside the connecting seat, thereby generating suction at the air intake of the connecting seat. Since the air intake is distributed in the gap between two adjacent protrusions, the silicon carbide substrate can be effectively adsorbed and fixed. At the same time, the rubber protrusion can provide a good lateral anti-slip effect, thereby improving the stability of the silicon carbide substrate on the upper end of the adsorption seat, ensuring that the silicon carbide substrate can be polished stably and effectively, and the sides of the silicon carbide substrate will not be squeezed and damaged during the adsorption process.

[0020] 2. By setting multiple adsorption seats on the turntable, this utility model allows the silicon carbide substrates adsorbed on each adsorption seat to be processed independently, which can effectively improve the functionality and processing efficiency of the device. Attached Figure Description

[0021] Figure 1 This is a first-view perspective view of the three-dimensional structure of this utility model;

[0022] Figure 2 This is a second perspective view of the three-dimensional structure of this utility model;

[0023] Figure 3 This utility model Figure 1 Enlarged view of point A.

[0024] In the diagram: 1. Base; 2. Turntable; 3. Adsorption seat; 4. First linear module; 5. Polishing arm; 6. Polishing motor; 7. Polishing disc; 8. Bracket; 9. Lamp holder; 10. Optical camera; 11. Second linear module; 12. Hydraulic rod; 13. Rotary cylinder; 14. Connecting arm; 15. Suction cup; 16. Mounting plate; 17. Motor; 18. Suction pipe; 19. Suction pump; 20. Connecting seat; 21. Rubber disc; 22. Raised strip. Detailed Implementation

[0025] The method of this utility model will be further described in detail below with reference to the accompanying drawings.

[0026] Reference Figure 1 , Figure 2 , Figure 3A rotary polishing device for stably clamping silicon carbide substrates includes a base 1, a turntable 2 rotatably mounted on the upper end of the base 1, multiple adsorption seats 3 mounted on the upper surface of the turntable 2, each adsorption seat 3 including a connecting seat 20, a rubber disc 21 adhered to the upper surface of the connecting seat 20, multiple annular protrusions 22 with a common center point integrally connected to the upper surface of the rubber disc 21, multiple suction holes corresponding to different positions are provided on the upper surface of the connecting seat 20 and the outer surface of the rubber disc 21, and the suction holes are distributed in the gap between two adjacent protrusions 22, an exhaust pipe 18 is fixedly connected to the exhaust port of the connecting seat 20, an exhaust pump 19 is fixedly installed in the pipe of the exhaust pipe 18, a mounting plate 16 is fixedly connected to the inner wall of the base 1, a motor 17 is fixedly installed at the middle position of the mounting plate 16, one end of the rotating shaft of the motor 17 is fixedly connected to the middle position of the lower surface of the turntable 2, and the outer surface of the base 1... The device is equipped with a ring-shaped sliding rail conductive structure. During polishing, the silicon carbide substrate to be polished is placed on the ring-shaped protrusion 22 of the rubber disc 21. Then, the air pump 19 is started, and the air extraction pipe 18 can effectively extract the air inside the connecting seat 20, thereby generating suction at the air intake of the connecting seat 20. Since the air intake is distributed in the gap between two adjacent protrusions 22, the silicon carbide substrate can be effectively adsorbed and fixed. At the same time, the rubber protrusions 22 can provide good lateral anti-slip effect, thereby improving the stability of the silicon carbide substrate on the upper end of the adsorption seat 3, ensuring that the silicon carbide substrate can be polished stably and effectively, and preventing the sides of the silicon carbide substrate from being squeezed and damaged during the adsorption process. In addition, by setting multiple adsorption seats 3 on the turntable 2, the silicon carbide substrate adsorbed on each adsorption seat 3 can be processed independently, which can effectively improve the functionality and processing efficiency of the device.

[0027] Reference Figure 1 A first linear module 4 is provided on one side of the base 1. A polishing arm 5 is fixedly connected to the moving end of the first linear module 4. A polishing motor 6 is fixedly installed at one end of the polishing arm 5. A polishing disk 7 is fixedly installed at one end of the rotating shaft of the polishing motor 6. When the silicon carbide substrate moves directly below the polishing disk 7, the polishing motor 6 is started. The polishing motor 6 drives the polishing disk 7 to rotate. Then, the first linear module 4 drives the polishing arm 5 and the polishing disk 7 to descend in height, thereby performing a polishing operation on the silicon carbide substrate.

[0028] Reference Figure 1A bracket 8 is fixedly connected to the side surface of the base 1, and a lamp holder 9 is fixedly connected to one end of the bracket 8. A mounting hole is provided in the middle of the lamp holder 9, and an optical camera 10 is fixedly installed inside the mounting hole. A ring-shaped lighting lamp is fixedly installed on the inner wall of the lamp holder 9. After polishing, when the polished silicon carbide substrate is moved directly under the lamp holder 9, the lighting lamp illuminates the surface of the silicon carbide substrate, and at the same time, the optical camera 10 takes a picture of the polished surface of the silicon carbide substrate and transmits it to the image analysis system. After optical analysis, the result is obtained, which enables the device to have the function of optical detection.

[0029] Reference Figure 1 A second linear module 11 is provided on one side of the base 1. A hydraulic rod 12 is fixedly connected to the moving end of the second linear module 11. A rotary cylinder 13 is fixedly connected to the telescopic end of the hydraulic rod 12. A connecting arm 14 is fixedly connected to the rotating end of the rotary cylinder 13. A suction cup 15 is fixedly installed at one end of the connecting arm 14. When the silicon carbide substrate after optical inspection moves to the unloading position, the hydraulic rod 12 is retracted so that the suction cup 15 can adsorb the silicon carbide substrate. Then, the hydraulic rod 12 is extended to raise the height of the silicon carbide substrate. Then, the rotary cylinder 13 is activated, and the second linear module 11 is moved at the same time to adjust the position of the suction cup 15, thereby transferring the adsorbed silicon carbide substrate to the designated position, realizing automatic unloading operation. At the same time, during the unloading process, defective products are sorted out, and the functionality and practicality are further improved.

[0030] Working principle: In use, first install the device at the designated location, then place the silicon carbide substrate to be polished on the annular protrusion 22 of the rubber disc 21. Next, start the air pump 19. At this time, the air extraction pipe 18 can effectively extract the air inside the connecting seat 20, thereby generating suction at the air intake of the connecting seat 20. Since the air intake is distributed in the gap between two adjacent protrusions 22, it can effectively adsorb and fix the silicon carbide substrate. At the same time, the rubber protrusions 22 provide good lateral anti-slip effect, thereby improving the stability of the silicon carbide substrate on the upper end of the adsorption seat 3. Then, start the motor 17, which drives the turntable 2 to rotate, moving the silicon carbide substrate to the polishing position. When the silicon carbide substrate moves directly below the polishing disc 7, start the polishing motor 6, which drives the polishing disc 7 to rotate. Then, the first linear module 4 drives the polishing arm 5 and the polishing disc 7 to descend, thereby polishing the silicon carbide substrate. Then, rotate... The rotating turntable 2 moves the polished silicon carbide substrate to the detection position. At this time, the polishing disc 7 performs a new round of polishing operation. Simultaneously, the illumination lamp illuminates the surface of the silicon carbide substrate, and the optical camera 10 takes a picture of the polished surface of the silicon carbide substrate and transmits it to the image analysis system. After optical analysis, the result is obtained. After the inspection is completed, the silicon carbide substrate moves to the unloading position as the turntable 2 rotates. At this time, the unloading position is selected according to the detection structure. During unloading, the hydraulic rod 12 is retracted so that the suction cup 15 can adsorb the silicon carbide substrate. Then, the hydraulic rod 12 is extended to raise the height of the silicon carbide substrate. Then, the rotary cylinder 13 is activated, and the second linear module 11 is moved to adjust the position of the suction cup 15, thereby transferring the adsorbed silicon carbide substrate to the designated position to realize automatic unloading operation. At the same time, during the unloading process, defective products are sorted out. This device can perform loading, polishing, optical inspection, unloading or defective product sorting operations simultaneously.

[0031] The specific real-time examples described herein are preferred real-time examples of this utility model and are not intended to limit the scope of protection of this utility model. Therefore, all equivalent changes made to the structure, shape, and principle of this utility model should be included within the scope of protection of this utility model.

Claims

1. A rotary polishing apparatus for a stable-holding silicon carbide substrate comprising a base (1), characterized by: The upper end of the base (1) is rotatably installed with a rotating disc (2), the upper surface of the rotating disc (2) is installed with a plurality of adsorption seats (3), the adsorption seat (3) comprises a communication seat (20), the upper surface of the communication seat (20) is adhered with a rubber disc (21), the upper surface of the rubber disc (21) is integrally connected with a plurality of concentric point annular convex strips (22), a plurality of position corresponding air suction holes are arranged on the upper surface of the communication seat (20) and the outer surface of the rubber disc (21), and the air suction holes are distributed at the gap between adjacent two convex strips (22), the exhaust port of the communication seat (20) is fixedly connected with an exhaust pipe (18), and the pipeline of the exhaust pipe (18) is fixedly installed with an exhaust pump (19).

2. The apparatus for polishing a stable-holding silicon carbide substrate according to claim 1, wherein: The inner wall of the base (1) is fixedly connected with a mounting plate (16), the middle position of the mounting plate (16) is fixedly installed with a motor (17), and one end of the rotating shaft of the motor (17) is fixedly connected to the middle position of the lower surface of the rotating disc (2).

3. The apparatus of claim 1 wherein: the apparatus further comprises a polishing pad; and the polishing pad is mounted on the platen. One side of the base (1) is provided with a first linear module (4), the moving end of the first linear module (4) is fixedly connected with a polishing arm (5), one end of the polishing arm (5) is fixedly installed with a polishing motor (6), one end of the rotating shaft of the polishing motor (6) is fixedly installed with a polishing disc (7).

4. The apparatus of claim 1 wherein: the apparatus further comprises a polishing pad; and the polishing pad is mounted on the platen. The side surface of the base (1) is fixedly connected with a support (8), one end of the support (8) is fixedly connected with a lamp holder (9), the middle position of the lamp holder (9) is provided with a mounting hole, and the inside of the mounting hole is fixedly installed with an optical camera (10), and the inner wall of the lamp holder (9) is fixedly installed with an annular illuminating lamp.

5. The apparatus of claim 1 wherein: the apparatus further comprises a polishing pad; and the polishing pad is mounted on the platen. 5 One side of the base (1) is provided with a second linear module (11), the moving end of the second linear module (11) is fixedly connected with a hydraulic rod (12), the telescopic end of the hydraulic rod (12) is fixedly connected with a rotating air cylinder (13), the rotating end of the rotating air cylinder (13) is fixedly connected with a connecting arm (14), and one end of the connecting arm (14) is fixedly installed with a suction disc (15).

6. The apparatus of claim 1 wherein: the apparatus further comprises a polishing pad; and the polishing pad is mounted on the platen. The outer surface of the base (1) is provided with an annular slide rail type conductive structure.

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