Wafer film cutting device and wafer film pasting equipment

Abstract

The utility model relates to a wafer film cutting device and wafer film pasting equipment, and the wafer film cutting device comprises a cutter assembly which comprises an installation seat and a cutter; the first driving assembly comprises a first driving motor, is connected with the cutter assembly and can drive the cutter assembly to rotate by taking the first driving motor as the center; the connecting assembly comprises a first connecting plate, an adjusting rod and a second connecting plate, the adjusting rod is detachably connected with the first connecting plate and the second connecting plate, the second connecting plate is coaxially connected with the cutter assembly through a connecting shaft, and the cutter assembly can rotate relative to the second connecting plate under the action of external force; the adjusting assembly comprises a push-pull electromagnet connected with the connecting shaft and a connecting rod connected with the push-pull electromagnet and the connecting shaft, and the push-pull electromagnet can drive the connecting shaft to drive the cutter assembly to rotate. And finally, the production efficiency is remarkably improved.

Description

Technical Field

[0001] This utility model relates to the field of wafer lamination technology, specifically to a wafer cutting device and a wafer lamination equipment. Background Technology

[0002] In semiconductor manufacturing, a blue film is typically applied to wafers during processing to prevent scratches or contamination of the wafer surface. A cutting device is needed during the film application process to cut the blue film attached to the wafer. However, existing cutting devices are difficult to adapt to wafers of different sizes and irregular shapes, requiring planning or replacement of the cutting device based on the specific shape, resulting in low production efficiency.

[0003] Therefore, it is necessary to improve the existing technology to overcome the aforementioned defects. Utility Model Content

[0004] In view of this, embodiments of this application provide a wafer dicing apparatus to solve at least one problem existing in the prior art, comprising:

[0005] A cutting assembly includes a mounting base and a cutting blade vertically mounted on the mounting base;

[0006] The first drive assembly includes a first drive motor arranged in a vertical direction. The first drive motor is connected to the cutter assembly and can drive the cutter assembly to rotate around the first drive motor.

[0007] The connecting assembly includes a first connecting plate connected to the first driving assembly, an adjusting rod extending in a horizontal direction, and a second connecting plate. The adjusting rod is detachably connected to the first connecting plate and the second connecting plate. The second connecting plate is coaxially connected to the cutter assembly via a connecting shaft, and the cutter assembly can rotate relative to the second connecting plate under the action of external force.

[0008] The adjustment assembly includes a push-pull electromagnet connected to the connecting shaft and a connecting rod connecting the push-pull electromagnet and the connecting shaft. The push-pull electromagnet can drive the connecting shaft to rotate the cutter assembly.

[0009] Optionally, in the above-described wafer dicing apparatus, the adjusting rod is a micrometer.

[0010] Optionally, in the above-described wafer dicing apparatus, the first connecting plate includes a vertical plate and a horizontal plate connected to the vertical plate, the vertical plate is connected to the first driving assembly, and the adjusting rod connects the horizontal plate to the second connecting plate.

[0011] Optionally, in the above-described wafer dicing apparatus, the dicing assembly includes a mounting bracket connected to the connecting shaft and a dicing module mounted on the mounting bracket via a rotating shaft, wherein the center line of the rotating shaft is perpendicular to the adjusting rod in the water direction;

[0012] The film cutting device further includes a swing assembly, which includes a second drive motor connected to the rotating shaft. The second drive motor can drive the rotating shaft to swing the cutter module.

[0013] Optionally, in the above-described wafer dicing apparatus, the dicing assembly further includes a heating module. The heating module includes a heat-conducting element disposed in close contact with the dicing module and a heating element connected to the heat-conducting element. The heat-conducting element is capable of transferring the heat from the heating element to the dicing module.

[0014] Optionally, in the above-described wafer dicing apparatus, the heating module further includes a heat insulation sleeve mounted on the dicing module, the heat insulation sleeve surrounding the outside of the heat-conducting component.

[0015] Optionally, in the above-described wafer dicing apparatus, the heating module further includes a detection element connected to the heat-conducting element.

[0016] Optionally, the wafer dicing apparatus described above further includes a transmission assembly, which includes a first gear connected to a first drive motor, a second gear, a transmission belt connecting the first gear and the second gear, and an output wheel connected to the second gear. The output wheel is connected to the first connecting plate.

[0017] This application also discloses a wafer lamination apparatus, which includes at least a wafer dicing device and a frame as described in any of the above claims, wherein the wafer dicing device is connected to the frame via a fixing plate.

[0018] Optionally, the wafer lamination equipment described above further includes a linear moving device, which includes a first linear cylinder and a second linear cylinder respectively connected to the fixed plate. The first linear cylinder can drive the wafer dicing device to move in the vertical direction, and the second linear cylinder can drive the wafer dicing device to move in the horizontal direction.

[0019] Compared with the prior art, this application has the following beneficial effects: by providing a first driving component and a cutting component connected to the first driving component, and the first driving motor being able to drive the cutting component to rotate around the first driving motor as the center, the blue film on the circular wafer is cut. Furthermore, an adjusting rod detachably connecting the first connecting plate and the second connecting plate is provided, which can adjust the radius of rotation of the cutting component, thus adapting to the cutting of blue film on circular wafers of different specifications. The adjusting component includes a push-pull electromagnet connected to the connecting shaft and a connecting rod connecting the push-pull electromagnet and the connecting shaft. The push-pull electromagnet can drive the connecting shaft to rotate the cutting component, thereby adjusting the direction of the cutting component to adapt to the cutting of blue film on irregularly shaped wafers. Compared with the prior art, this film cutting device not only improves the accuracy and stability of blue film cutting, but also enhances the flexibility and applicability of the device, ultimately achieving a significant improvement in production efficiency. Attached Figure Description

[0020] Figure 1 This is a schematic diagram of the structure of a wafer dicing apparatus shown in this embodiment;

[0021] Figure 2 yes Figure 1 A partial schematic diagram of the wafer dicing apparatus shown;

[0022] Figure 3 yes Figure 1 A partial schematic diagram of the wafer cutting apparatus shown from another direction.

[0023] Explanation of reference numerals in the attached figures:

[0024] Fixed plate -100;

[0025] Cutter assembly-200, mounting base-201, cutter-202, mounting bracket-203, swivel-204, cutter module-205;

[0026] First drive assembly-300, first drive motor-301;

[0027] Connecting assembly-400, first connecting plate-401, vertical plate-401a, horizontal plate-401b, adjusting rod-402, second connecting plate-403, connecting shaft-404;

[0028] Adjustment component-500, push-pull electromagnet-501, connecting rod-502;

[0029] Oscillating component-600, second drive motor-601;

[0030] Heating module-700, heat-conducting component-701, heating component-702, heat insulation sleeve-703, detection component-704;

[0031] Transmission assembly - 800, first gear - 801, second gear - 802, transmission belt - 803, output pulley - 804. Detailed Implementation

[0032] The exemplary embodiments disclosed in this application will now be described in more detail. Numerous specific details are set forth in the following description to provide a more thorough understanding of this application. However, it will be apparent to those skilled in the art that this application can be implemented without one or more of these details. In other instances, to avoid confusion with this application, some technical features well-known in the art have not been described; that is, not all features of actual embodiments are described herein, nor are well-known functions and structures described in detail.

[0033] It should be understood that when an element or layer is referred to as "on," "adjacent to," "connected to," or "coupled to" other elements or layers, it may be directly on, adjacent to, connected to, or coupled to other elements or layers, or there may be intervening elements or layers. Conversely, when an element is referred to as "directly on," "directly adjacent to," "directly connected to," or "directly coupled to" other elements or layers, there are no intervening elements or layers. It should be understood that although the terms first, second, third, etc., may be used to describe various elements, components, areas, layers, and / or portions, these elements, components, areas, layers, and / or portions should not be limited by these terms. These terms are only used to distinguish one element, component, area, layer, or portion from another element, component, area, layer, or portion. Therefore, without departing from the teachings of this application, the first element, component, area, layer, or portion discussed below may be referred to as a second element, component, area, layer, or portion. And the discussion of a second element, component, area, layer, or portion does not imply that the first element, component, area, layer, or portion necessarily exists in this application.

[0034] Spatial relation terms such as “below,” “under,” “below,” “under,” “above,” “above,” etc., are used here for convenience to describe the relationship between one element or feature shown in the figure and other elements or features. It should be understood that, in addition to the orientation shown in the figure, spatial relation terms are intended to also include different orientations of devices in use and operation.

[0035] The terminology used herein is for the purpose of describing particular embodiments only and is not intended to limit the scope of this application. When used herein, the singular forms “a,” “an,” and “ / the” are also intended to include the plural forms unless the context clearly indicates otherwise. It should also be understood that the terms “compose” and / or “comprising,” when used in this specification, identify the presence of features, integers, steps, operations, elements, and / or components, but do not exclude the presence or addition of one or more other features, integers, steps, operations, elements, components, and / or groups. When used herein, the term “and / or” includes any and all combinations of the associated listed items.

[0036] To fully understand this application, detailed steps and structures will be presented in the following description to illustrate the technical solution of this application. Preferred embodiments of this application are described in detail below; however, in addition to these detailed descriptions, this application may have other implementation methods.

[0037] Please refer to Figures 1-3 As shown in the preferred embodiment of this application, a wafer dicing apparatus is connected to the frame of a wafer laminating equipment via a fixing plate 100 to cut the blue film attached to the wafer. In this embodiment, the wafer laminating equipment also includes a linear moving device (not shown), which includes a first linear cylinder and a second linear cylinder respectively connected to the fixing plate 100. The first linear cylinder can drive the wafer dicing apparatus to move vertically, and the second linear cylinder can drive the wafer dicing apparatus to move horizontally, so as to achieve precise control of the movement path of the wafer dicing apparatus. It can also cooperate with the wafer dicing apparatus to cut the blue film on wafers with flat edges or notches.

[0038] In this embodiment, the wafer dicing apparatus includes a dicing assembly 200, a first driving assembly 300, a connecting assembly 400, and an adjusting assembly 500. Specifically: the dicing assembly 200 includes a mounting base 201 and a dicing blade 202 vertically mounted on the mounting base 201; the first driving assembly 300 includes a first driving motor 301 arranged vertically, connected to the dicing assembly 200, and capable of driving the dicing assembly 200 to rotate around the output shaft of the first driving motor 301; the connecting assembly 400 includes a first connecting plate 401 connected to the first driving assembly 300, an adjusting rod 402 extending horizontally, and a second connecting plate 500. Plate 403 and adjusting rod 402 are detachably connected to the first connecting plate 401 and the second connecting plate 403. The second connecting plate 403 is coaxially connected to the cutter assembly 200 through the connecting shaft 404, and the cutter assembly 200 can rotate relative to the second connecting plate 403 under the action of external force. The adjusting component 500 includes a push-pull electromagnet 501 connected to the connecting shaft 404 and a connecting rod 502 connecting the push-pull electromagnet 501 and the connecting shaft 404. The push-pull electromagnet 501 can drive the connecting shaft 404 to drive the cutter assembly 200 to rotate.

[0039] Understandably, by connecting the first drive assembly 300 to the cutter assembly 200, the first drive assembly 300 can drive the cutter assembly 200 to rotate around the output shaft of the first drive motor 301, so as to realize the cutter assembly 200 cutting blue film along the circular wafer.

[0040] Understandably, by detachably connecting the adjusting rod 402 to the first connecting plate 401 and the second connecting plate 403, the distance between the first connecting plate 401 and the second connecting plate 403 can be adjusted, thereby changing the radius of the rotation trajectory of the cutter assembly 200 to be suitable for cutting blue film on wafers of different specifications, such as 4-inch, 6-inch, 8-inch, and 12-inch wafers.

[0041] Understandably, by setting up a push-pull electromagnet 501 connected to the connecting shaft 404, the push-pull electromagnet 501 can drive the connecting shaft 404 to rotate the cutter assembly 200, thereby achieving fine adjustment of the angle of the cutter assembly 200.

[0042] In an alternative embodiment, the adjusting rod 402 is a micrometer, which can improve the adjustment accuracy of the rotation trajectory radius of the cutter assembly 200 and further improve the cutting accuracy.

[0043] In an optional embodiment, the first connecting plate 401 includes a vertical plate 401a and a horizontal plate 401b connected to the vertical plate 401a. The vertical plate 401a is connected to the first driving assembly 300, and the adjusting rod 402 connects the horizontal plate 401b and the second connecting plate 403, so that the first driving assembly 300 can drive the cutter assembly 200 to perform circular motion.

[0044] In the actual wafer lamination process, to ensure the smooth progress of the wafer dicing process and reduce contamination and residue, the blue film attached to the wafer usually needs to be smaller than the wafer, that is, the edge of the wafer is located outside the edge of the blue film. Therefore, in an optional embodiment, the dicing assembly 200 includes a mounting bracket 203 connected to the connecting shaft 404 and a dicing module 205 mounted on the mounting bracket 203 via a rotating shaft 204. The centerline of the rotating shaft 204 is perpendicular to the adjusting rod 402 in the horizontal direction. The dicing device also includes a swing assembly 600, which includes a second drive motor 601 connected to the rotating shaft 204. The second drive motor 601 can drive the rotating shaft 204 to swing the dicing module 205 so that the dicing blade 202 of the dicing module 205 is tilted relative to the edge of the wafer, that is, there is a certain angle between the dicing blade 202 and the upper surface of the wafer. This angle is acute, so that the area of ​​the cut blue film is smaller than the area of ​​the wafer.

[0045] In an optional embodiment, the cutter assembly 200 further includes a heating module 700, which includes a heat-conducting element 701 disposed in close contact with the cutter module 205 and a heating element 702 connected to the heat-conducting element 701. The heat-conducting element 701 can transfer the heat of the heating element 702 to the cutter module 205.

[0046] Understandably, by setting up the heating module 700, the heat generated by the heating module 700 is transferred to the cutter 202 of the cutter module 205. The heated cutter 202 can soften the blue film, reduce cutting resistance, reduce tool wear, extend tool life, and improve cutting quality.

[0047] In an optional embodiment, the heating module 700 further includes a heat insulation sleeve 703 mounted on the cutter module 205, the heat insulation sleeve 703 surrounding the outside of the heat-conducting element 701.

[0048] Understandably, the heat insulation sleeve 703 can effectively prevent heat loss, improve heating efficiency, and protect other parts of the cutter assembly 200 from heat.

[0049] In an alternative embodiment, the heating module 700 further includes a detection element 704 connected to the heat-conducting element 701.

[0050] Understandably, the detection component 704 can monitor the heating temperature in real time, achieve precise temperature control, and further optimize the cutting effect.

[0051] In an optional embodiment, the film cutting device further includes a transmission assembly 800, which includes a first gear 801 and a second gear 802 connected to the first drive motor 301, a transmission belt 803 connecting the first gear 801 and the second gear 802, and an output wheel 804 connected to the second gear 802. The output wheel 804 is connected to the first connecting plate 401.

[0052] Understandably, by setting the first gear 801, the second gear 802, and the transmission belt 803, a smoother power transmission can be achieved, the rotational motion of the cutter assembly 200 can be optimized, and the cutting stability can be improved.

[0053] The above is only one specific implementation of this application, and any other improvements made based on the concept of this application shall be considered within the scope of protection of this application.

Claims

1. A wafer film cutting device, characterized by comprising: The application relates to a wafer film cutting device. The application relates to a wafer film cutting device. The application relates to a wafer film cutting device. The application relates to a wafer film cutting device. The application relates to a wafer film cutting device.

2. The wafer film cutting device according to claim 1, wherein The application relates to a wafer film cutting device.

3. The wafer film cutting device according to claim 1, wherein The application relates to a wafer film cutting device.

4. The wafer film cutting device according to claim 1, wherein The application relates to a wafer film cutting device. The application relates to a wafer film cutting device.

5. The wafer film cutting device according to claim 4, wherein The application relates to a wafer film cutting device.

6. The wafer film cutting device according to claim 5, wherein The application relates to a wafer film cutting device.

7. The wafer film cutting device according to claim 5, wherein The application relates to a wafer film cutting device.

8. The wafer film cutting device according to claim 1, wherein The application relates to a wafer film cutting device.

9. A wafer film attaching apparatus characterized by comprising: The application relates to a wafer film cutting device.

10. The wafer film attaching apparatus according to claim 9, wherein The application relates to a wafer film cutting device. The application relates to a wafer film cutting device. The application relates to a wafer film cutting device. The application relates to a wafer film cutting device. The application relates to a wafer film cutting device. The application relates to a wafer film cutting device. The application relates to a wafer film cutting device. The application relates to a wafer film cutting device. The application relates to a wafer film cutting device. The application relates to a wafer film cutting device. The application relates to a wafer film cutting device. The application relates to a wafer film cutting device. The application relates to a wafer film cutting device. The application relates to a wafer film cutting device. The application relates to a wafer film cutting device. The application relates to a wafer film cutting device. 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