Wafer conveying device and deposition device

Abstract

The utility model discloses a wafer conveying device and a deposition device, the conveying device comprises a lifting device, a transverse moving device, a loading device, a controller and a cooling turntable, a wafer mechanical arm device is provided with a mechanical arm, and the mechanical arm is controlled to grab a wafer by the loading device, turn over the wafer and transfer the wafer to a limiting device of a turntable main body. A first main shaft and a first motor used for driving the first main shaft are arranged on the side portion of the mechanical arm in the extending direction of the wafer so that the wafer can be overturned under instruction control of the controller, and the cooling rotating disc comprises a rotating disc body provided with a limiting device. A second main shaft and a second motor used for driving the second main shaft are arranged on the rotating disc body in the direction perpendicular to the extension direction so that wafer translation can be achieved under instruction control of the controller. According to the utility model, the wafers are kept in a downward state in the conveying process, so that the surfaces of the wafers are effectively prevented from being polluted by particles, and the conveying quality of the wafers is improved.

Description

Technical Field

[0001] This utility model belongs to the field of semiconductor processing technology, specifically relating to a wafer transfer device and a deposition device. Background Technology

[0002] Chemical vapor deposition (CVD) is the most widely used technique in the semiconductor industry for depositing a wide range of materials, including a broad spectrum of insulating materials, most metals, and metal alloys. CVD refers to the process of introducing vapors of gaseous or liquid reactants containing the elements constituting the thin film, along with other gases required for the reaction, into a reaction chamber where a chemical reaction occurs on the substrate surface to form a thin film. Many thin films in very large-scale integrated circuits are prepared using CVD. After CVD treatment, the adhesion of the surface-treated film is improved by approximately 30%, preventing scratches caused during bending, stretching, and other forming processes in high-strength steel.

[0003] CVD technology features low deposition temperature, easy control of film composition, film thickness that is directly proportional to deposition time, good uniformity and repeatability, and excellent step coverage.

[0004] In existing technologies, CVD machines, such as the CVD SEQUEL and CENTURA machines, are commonly used for wafer CVD processing. During the wafer transfer process, because the deposition surface of the wafer faces upwards, it is highly susceptible to the influence of particulate matter and other impurities in the indoor air, such as dust, during the transfer. These particulate impurities adhere to the deposition surface, significantly affecting the quality of the deposited layer during wafer CVD processing and reducing the yield.

[0005] Therefore, in order to address the aforementioned technical problems, it is necessary to provide a wafer transfer device and a deposition device.

[0006] The information disclosed in this background section is intended only to enhance the understanding of the overall background of this utility model and should not be construed as an admission or in any way implying that the information constitutes prior art known to those skilled in the art. Utility Model Content

[0007] The purpose of this invention is to provide a wafer transfer device and a deposition device.

[0008] To achieve the above objectives, the technical solution provided by a specific embodiment of this utility model is as follows:

[0009] A wafer transfer device includes a lifting device, a traversing device, a loading device, a wafer robotic arm device, a controller, and a cooling turntable. The wafer robotic arm device has a robotic arm, and the robotic arm is controlled by the loading device to grasp and flip the wafer, transferring it to the turntable body via a limiting device. A first spindle and a first motor for driving the first spindle are arranged on the side of the robotic arm along the wafer's extension direction to achieve wafer flipping under the control of the controller. The cooling turntable includes a turntable body with a limiting device. A second spindle and a second motor for driving the second spindle are arranged perpendicular to the extension direction to achieve wafer translation under the control of the controller. Preferably, the axis of the second spindle coincides with the axis of symmetry of the turntable body.

[0010] In one or more embodiments of this utility model, the turntable body is provided with a plurality of holes, and the limiting device includes a support device and an adapter ring that are fitted into the holes, the adapter ring being fitted into the support device:

[0011] The support device includes a flanged linear bearing correspondingly connected to the hole, a shaft disposed on the bearing, and a spring and guide sleeve sleeved on the shaft.

[0012] In one or more embodiments of the present invention, the adapter ring includes a ring body, a first arm is provided on the ring body, a first hole is provided on the first arm, a quartz piece having a second hole is connected to the first hole, and a fixing pin is restricted in the second hole.

[0013] In one or more embodiments of this utility model, a magnet is provided on the fixing pin, and a clamping device for limiting the magnet is provided in the second hole.

[0014] In one or more embodiments of this utility model, a motion sensor is also provided on the side of the ring body away from the first arm, and the motion sensor is used to collect the position status information of the ring body.

[0015] In one or more embodiments of this utility model, the first motor is disposed at the end of the second rotating shaft.

[0016] In one or more embodiments of this utility model, the lifting device is provided with a lifting arm corresponding to the vacuum deposition chamber of the vacuum adsorption device. The lifting arm lifts or lowers the wafer transferred by the cooling turntable, and the end of the lifting arm is provided with a lifting chassis device for carrying the wafer.

[0017] In one or more embodiments of this utility model, the lifting arm is driven by the lifting platform body.

[0018] In one or more embodiments of this utility model, the main body of the elevator is driven to be connected to an electric cylinder.

[0019] In one or more embodiments of this utility model, a CVD deposition apparatus includes a wafer transfer device and a vacuum deposition device. The vacuum deposition chamber of the vacuum deposition device is configured in conjunction with a lifting device to allow the lifting arm of the lifting device to lift or lower the wafer transferred by the cooling turntable.

[0020] Compared with the prior art, the wafer transport device and deposition device of this invention effectively avoid particle contamination on the wafer surface by keeping the wafer facing downward during the transport process, thereby improving the wafer transport quality. Furthermore, it can further prevent contamination particles from affecting the wafer deposition quality in CVD deposition operations. Attached Figure Description

[0021] To more clearly illustrate the technical solutions in the embodiments of this utility model or the prior art, the drawings used in the description of the embodiments or the prior art will be briefly introduced below. Obviously, the drawings described below are only some embodiments recorded in this utility model. For those skilled in the art, other drawings can be obtained based on these drawings without creative effort.

[0022] Figure 1 This is a schematic diagram of the assembly state of the CVD deposition apparatus in one embodiment of the present invention;

[0023] Figure 2 This is a top view of the assembled CVD deposition apparatus in one embodiment of the present invention;

[0024] Figure 3 This is a schematic diagram of the cooling turntable in one embodiment of the present invention;

[0025] Figure 4 This is a schematic diagram of the lifting device in one embodiment of the present invention;

[0026] Figure 5 This is a schematic diagram of the loading device in one embodiment of the present invention;

[0027] Figure 6 This is a top view of the loading device in one embodiment of the present invention;

[0028] Figure 7 This is a schematic diagram of the structure of a wafer robotic arm device in one embodiment of the present invention. Detailed Implementation

[0029] To enable those skilled in the art to better understand the technical solutions of this utility model, the technical solutions of the embodiments of this utility model will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only some embodiments of this utility model, and not all embodiments. Based on the embodiments of this utility model, all other embodiments obtained by those skilled in the art without creative effort should fall within the protection scope of this utility model.

[0030] like Figure 1-7 As shown, the wafer robotic arm device in one embodiment of this utility model may include:

[0031] 1. Cooling turntable 2, used to carry wafers, has a conveying surface that contacts the wafers, and the wafer side of the turntable is set downward so that the wafers remain in a downward state during the conveying process;

[0032] 2. Lifting device 3, used to lift the wafer to ensure that the wafer reaches the designated position during wafer transfer;

[0033] 3. Loading device 4, used for stacking and temporarily storing wafers to be processed or processed;

[0034] 4. Transverse movement device 1, used to guide the movement direction of the wafer to ensure that the wafer reaches the process position;

[0035] 5. Wafer robotic arm device 6, used to remove undeposited wafers or return deposited wafers via a loading device, and to flip the wafers;

[0036] 6. Vacuum deposition apparatus 5, located at the end of the lifting device's stroke, provides a vacuum deposition chamber to perform CVD operations on the wafer transferred to that position;

[0037] 7. Controller, used to control the working status of wafer robotic arm device, cooling turntable, traverse device and vacuum adsorption device, etc., to ensure the stability and safety of wafers during the transfer process, and to drive the transfer motion so that the wafers are transferred along a predetermined path.

[0038] In addition, to improve the stability of wafers during transport, a vacuum adsorption device with a vacuum adsorption port can be installed. This device can be used to adsorb wafers located on structures such as cooling turntables, wafer robotic arms, and lifting devices, preventing wafers from slipping or falling during transport. The vacuum adsorption device includes an adsorption plate with perforated grooves on its surface, spreading outwards from the center to adsorb products. Vacuum lines are connected to the adsorption plate, generating negative pressure within the adsorption plate area in conjunction with the connected grooves.

[0039] The CVD deposition apparatus of the present invention, as described above, uses a robotic arm to rotate the wafer, which, through a cooling turntable and a lifting device, keeps the wafer with the deposition surface facing downwards during transport. This effectively avoids particle contamination on the wafer surface and improves the wafer transport quality.

[0040] The wafer transfer device of this utility model may include a wafer robotic arm device, a cooling turntable, a lifting device, a traversing device, a loading device, and a controller.

[0041] like Figure 1 and 2 As shown, in the combined state, the wafer robotic arm device 6 is located between the cooling turntable 2 and the loading device 4. The robotic arm 61 of the wafer robotic arm device 6 picks up the unprocessed deposited wafer from the loading device 4 according to the instructions under the program control of the controller such as PLC or industrial computer.

[0042] like Figure 7 As shown, the front end of the robotic arm 61 can be equipped with a sensor for sensing and scanning to identify the wafer position, and the rear end of the robotic arm 61 is equipped with a controllable rotating rotary motor 63. The robotic arm 61 and the rotary motor 63 can be connected and fixed by a connecting device 62, such as a shaft with flanges at both ends. Since this connecting device 62 is detachable, the robotic arm 61 can be replaced as needed to meet the operational requirements of wafers of different types and specifications.

[0043] Furthermore, a first perforated groove can be formed on the surface of the robotic arm 61, and a first vacuum adsorption port connected to the vacuum adsorption device can be provided in the first groove, thereby enabling the wafer to be gently and firmly bound to the robotic arm 61.

[0044] Furthermore, to facilitate the transfer of wafers between the cooling turntable 2 and the loading device 4, the rotary motor 63 is also connected to a horizontal steering device. This horizontal steering device includes a steering motor 64 and a steering gear. The steering gear includes a drive shaft 65 connected to the steering motor 64 and a driven shaft driven by the drive shaft 65 (via a belt or gear, etc.). The driven shaft is connected to one end of a steering arm 66, and the rotary motor 63 is confined to the other end of the steering arm 66. When the steering motor 64 drives the drive shaft 65 to rotate, the driven shaft is driven to operate, thereby further tractioning the steering arm 66, thus adjusting the position and orientation of the rotary motor 63 and the robotic arm 61.

[0045] like Figure 1 and 2 As shown, the cooling turntable 2 is located between the wafer robotic arm 6 and the lifting device 3. The cooling turntable 2 includes a turntable body 23 equipped with a limiting device 24. The turntable body is transferred between the wafer robotic arm 6 and the lifting device 3, thereby realizing the transfer of wafers between the two.

[0046] like Figure 3 As shown, the turntable body is provided with a second spindle 22 and a second motor for driving the second spindle 22 along a direction perpendicular to the extension direction to realize wafer transfer under the command of the controller.

[0047] Furthermore, several turntable sensors 21 can be installed on the side of the second motor to monitor the operation of the turntable, and the turntable sensors 21 provide signal feedback to the controller.

[0048] Furthermore, the turntable body's adapter ring can have three hollowed-out first holes, each corresponding to a flanged linear bearing. Each flanged linear bearing is fitted with a stainless steel spring, a guide sleeve, and a sliding shaft, symmetrically distributed below the two adapter rings. The two adapter rings are symmetrically distributed relative to the second main shaft 22. A turntable arm is correspondingly positioned above the first holes, and the turntable arm has second holes. Quartz pieces with connecting holes are correspondingly connected to the second holes, and the connecting holes are connected to the second holes by fixing pins. Furthermore, three magnets can also be provided at the lower end of the fixing pins, and the magnets are secured within the second holes by a magnet clamping mechanism such as snap rings.

[0049] Furthermore, a fiber optic sensor bracket can be provided on the outer side of the second main shaft 22 at the lower part of the adapter ring for fixing the fiber optic sensor. The fiber optic sensor bracket includes a notched plate and a mounting plate. A sensor, such as a photoelectric sensor, is installed on the mounting plate at the notch on the notched plate. The sensor detects the position of the motor through the notched plate.

[0050] like Figure 1 and 2 As shown, the lifting device 3 is located below the adapter ring on one side of the cooling turntable 2, thereby lifting the wafer transferred from the cooling turntable 2 to the vacuum deposition device 5 for deposition in the working state, and resetting it to the adapter ring on one side of the cooling turntable 2 after deposition, thus completing the wafer replacement.

[0051] like Figure 4 The lifting device 3 shown may include a lifting arm 36 corresponding to the vacuum deposition chamber of the vacuum adsorption device. The lifting arm 36 lifts or lowers the wafer transferred from the cooling turntable. A lifting platform 34 for supporting the wafer is provided at the end of the lifting arm. The lifting platform 34 can be connected to the top of the lifting arm 36 via a spring support device 35.

[0052] Furthermore, the spring support assembly 35 may be configured with a clamping flange, a spring support, a spring, and a retainer. The clamping flange is connected to the retainer and restricts one end of the retainer's retaining shaft to the end of the lifting arm 36, such as by threading it into a threaded hole at that end. The other end of the retaining shaft is provided with a nut for restricting the spring. The spring is restricted outside the retaining shaft, and one end abuts against the lifting chassis assembly 34, thereby providing effective support for the body of the lifting chassis assembly 34.

[0053] Furthermore, the lifting platform device 34 includes a lifting platform body. A similar lifting support arm is also provided within the recessed structure of the lifting platform body to receive the transferred wafer. A first lifting hole is provided within the recessed structure, and a corresponding lifting support arm is provided above the first lifting hole. A second lifting hole is provided on the lifting support arm, and a quartz component with a connecting hole is correspondingly connected to the second lifting hole. The connecting hole is connected to the second hole by a fixing pin. Furthermore, three magnets can also be provided at the lower end of the fixing pin, and the magnets are constrained within the second hole by a magnet clamping mechanism such as a snap ring.

[0054] Furthermore, the lifting platform body is connected to the lifting arm 36 via a preheating fastener. The preheating fastener may include a preheating flange connected to the lifting platform body, and the lifting platform body is connected to the lifting arm 36 by the engagement of heat-resistant bolts with the preheating flange. A preheating shaft may also be provided between the lifting platform body and the preheating flange to provide a larger preheating range.

[0055] Furthermore, a cylinder 33 is installed at the lower end of the lifting arm 36, which provides support for the lifting arm 36 under the action of a speed control valve, air pump, etc. More importantly, the lower side of the lifting arm 36 is connected to the electric cylinder 31 through a fixing block 32. During operation, the electric cylinder receives the mass from the controller to raise and lower the lifting arm 36, thereby synchronously completing the wafer lifting operation. At this time, under the action of the electric cylinder, the fixing block 32 is driven, and the lifting arm 36 rises or falls. At this time, the cylinder 33 can controllably achieve small up and down movements, realizing micro-movement, flexible and stable movement, and thus conveying the product.

[0056] like Figure 1 and 2As shown, the traverse device is mounted on the frame and includes a main board assembly, a heater support assembly, a DH main board assembly, a traverse electric cylinder assembly, a traverse cable chain assembly, and a process chamber cover assembly. The main board assembly supports the base plate of all upper components. The heater support assembly mounts heaters, such as those for preheating flanges. The DH main board assembly secures the vacuum deposition apparatus. The traverse electric cylinder assembly and its corresponding linear guide (configured along the movement range and direction of the lifting platform body, etc.) facilitate the reciprocating movement of the lifting platform assembly 34, etc. The traverse cable chain assembly ensures that cables and other components move with the lifting platform assembly 34 during reciprocating movement, preventing damage.

[0057] like Figure 5 and 6 As shown, the loading device 4 includes a carrier plate 41 and a plurality of wafer stacking racks 42 disposed on the carrier plate 41. The wafer stacking racks 42 are provided with slots for horizontally placing wafers for loading wafers.

[0058] It will be apparent to those skilled in the art that this invention is not limited to the details of the exemplary embodiments described above, and that it can be implemented in other specific forms without departing from the spirit or essential characteristics of this invention. Therefore, the embodiments should be considered illustrative and non-limiting in all respects, and the scope of this invention is defined by the appended claims rather than the foregoing description. Thus, it is intended that all variations falling within the meaning and scope of equivalents of the claims be included within this invention. No reference numerals in the claims should be construed as limiting the scope of the claims.

[0059] Furthermore, it should be understood that although this specification describes embodiments, not every embodiment contains only one independent technical solution. This narrative style is merely for clarity. Those skilled in the art should consider the specification as a whole, and the technical solutions in each embodiment can also be appropriately combined to form other embodiments that can be understood by those skilled in the art.

Claims

1. A wafer transfer apparatus comprising a lifting device, a horizontal transfer device, a loading device, a wafer robot device, a controller, characterized by, The wafer mechanical arm device has a mechanical arm, and the mechanical arm is controlled to grab the wafer by the loading device and transfer to the defined device of the rotating disc main body after turning over, the first spindle is arranged on the side of the mechanical arm along the extension direction of the wafer, and the first motor for driving the first spindle is used to realize the wafer turning over under the instruction control of the controller, and the cooling rotating disc includes the rotating disc main body provided with the defined device, and the second spindle is arranged along the vertical direction of the extension direction, and the second motor for driving the second spindle is used to realize the wafer translation under the instruction control of the controller.

2. The wafer transfer device of claim 1, wherein, The rotating disc main body is provided with a plurality of holes, the defined device includes a support device matched to the holes and an adapter ring matched to the support device. The support device includes a flange linear bearing corresponding to the holes, a shaft provided to the bearing and a spring and guide sleeve sleeved on the shaft.

3. The wafer transfer device of claim 2, wherein, The adapter ring includes a ring main body, the ring main body is provided with a first arm, the first arm is provided with a first hole, the first hole is connected with a quartz piece with a second hole, and a fixed pin is limited in the second hole.

4. The wafer transfer device of claim 3, wherein, The fixed pin is provided with a magnet, and the second hole is provided with a compression device for limiting the magnet.

5. The wafer transfer device of claim 3, wherein, The ring main body is further provided with a motion sensor on the side away from the first arm, and the motion sensor is used to collect the position state information of the ring main body.

6. The wafer transfer device of claim 1, wherein, The first motor is arranged at the end of the second rotating shaft.

7. The wafer transfer device of claim 1, wherein, The lifting device is provided with a lifting arm corresponding to the vacuum deposition chamber of the vacuum suction device, the lifting arm lifts or lowers the wafer transferred by the cooling rotating disc, and the end of the lifting arm is provided with a lifting bottom plate device for carrying the wafer.

8. The wafer transfer device of claim 7, wherein, The lifting arm is driven by a lifting machine main body.

9. The wafer transfer device of claim 8, wherein, The lifting machine main body is drivingly connected to an electric cylinder.

10. A deposition apparatus characterized by comprising: The wafer conveying device includes the wafer conveying device according to any one of claims 1-9 and a vacuum deposition device, and the vacuum deposition chamber of the vacuum deposition device is matched with the lifting device to satisfy the lifting arm of the lifting device lifting or lowering the wafer transferred by the cooling rotating disc.

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