Outdoor high-protection surface mounted device (SMD) type light-emitting diode (LED) lamp integrated with moisture-proof sealing structure

Abstract

The utility model relates to the technical field of LED (light-emitting diode) lamps, in particular to an outdoor high-protection SMD (surface mounted device) type LED lamp integrated with a moisture-proof sealing structure, which comprises a substrate, an LED chip, a packaging colloid and a protection frame, a groove is arranged at the edge of the substrate, the packaging colloid adopts a double-layer structure of inner silica gel and outer UV (ultraviolet) epoxy resin, the epoxy resin extends into the groove to form mechanical anchoring, and the LED chip is arranged in the protection frame. IP68-level protection is realized by combining upper and lower sealing grooves (bolt fastening and sealant filling) of the protection frame and a sealing gasket; the protective cover is integrated with heat dissipation fins (attached to the substrate) and heat dissipation holes (internally provided with waterproof breathable films), the heat dissipation efficiency is improved by 40%, and the IP67 grade is maintained; the rear side of the substrate is provided with a microcontroller, a charging capacitor and a capacitive touch switch, wireless instruction response and abnormal power-off protection are supported, a charging port of the protection frame supports rapid energy compensation, and the substrate can be an FR-4 / metal / ceramic / flexible substrate (the surface of which is coated with an aluminum nitride anti-oxidation layer) and is adaptive to different outdoor scenes.

Description

Technical Field

[0001] This utility model relates to the field of LED lighting technology, specifically to an outdoor high-protection SMD surface-mount LED light with an integrated moisture-proof and sealed structure. Background Technology

[0002] In the field of outdoor lighting, SMD (Surface-Mount Device) LED lights are widely used due to their advantages such as high efficiency, energy saving, and long lifespan. However, traditional SMD LED lights face several challenges when used outdoors, mainly including:

[0003] Insufficient sealing reliability: Conventional encapsulant (single epoxy resin) is prone to cracking at the junction with the substrate due to thermal expansion and contraction, and moisture seeps in through the edge of the substrate, causing the LED chip to oxidize and fail.

[0004] The contradiction between heat dissipation and protection: Most protective structures rely on a fully enclosed design, and heat dissipation depends solely on the passive heat conduction of the substrate. Under high-temperature conditions (>80℃), light decay is easily caused.

[0005] Complex structure and maintenance: Existing protective covers are mostly fixed with adhesive or clips, which can easily damage the seals during disassembly, increasing maintenance costs;

[0006] Lack of intelligent features: Outdoor LED lights often lack power fluctuation compensation and status monitoring functions, and frequent switching on and off can shorten their lifespan. Utility Model Content

[0007] (a) Technical problems to be solved

[0008] To address the shortcomings of existing technologies, this utility model provides an outdoor high-protection SMD chip LED light with an integrated moisture-proof and sealing structure.

[0009] (II) Technical Solution

[0010] To achieve the above objectives, this utility model provides the following technical solution: The outdoor high-protection SMD surface-mount LED light with an integrated moisture-proof and sealed structure of this utility model includes:

[0011] A substrate, wherein the edge of the substrate is provided with a groove;

[0012] The LED chip is fixed to the surface of the substrate by silver paste, and the LED chip is connected to the substrate through electrode pins.

[0013] Encapsulating colloid, used to coat the LED chip and substrate surface;

[0014] A protective frame is provided, which is wrapped around the outside of the substrate. A protective cover is installed at the bottom of the protective frame, and a transparent protective cover is installed at the top of the protective frame. A heat dissipation device is provided on the protective cover.

[0015] Preferably, a charging capacitor, a microcontroller, and a switch are mounted on the rear side of the substrate. The charging capacitor is electrically connected to the microcontroller, the microcontroller is electrically connected to the substrate and the switch, and the switch is mounted on a protective frame.

[0016] More preferably, the protective frame is provided with a charging port, which is electrically connected to a charging capacitor, and the switch is a capacitive touch switch.

[0017] Preferably, the substrate is any one of FR-4, metal substrate, ceramic substrate and flexible substrate, and the surface of the substrate is covered with an aluminum nitride anti-oxidation layer.

[0018] Preferably, the encapsulating colloid comprises an inner layer of silicone and an outer layer of UV epoxy resin, wherein the outer layer of UV epoxy resin extends into a groove at the edge of the substrate.

[0019] More preferably, the top of the protective frame is provided with an upper sealing groove, the bottom of the protective frame is provided with a lower sealing groove, the edge of the protective cover is inserted into the lower sealing groove, a fixing bolt is passed around the side of the protective cover, the fixing bolt is connected to the lower sealing groove through the protective cover by a threaded structure, the edge of the transparent protective cover is inserted into the upper sealing groove, and the gap between the edge of the transparent protective cover and the upper sealing groove is filled with sealant.

[0020] Preferably, the inner side of the protective frame is provided with a mounting edge, and a sealing gasket is provided between the substrate and the mounting edge.

[0021] Preferably, the heat dissipation device includes heat dissipation fins and heat dissipation holes. The heat dissipation fins are fixedly installed on the protective cover, and the bottom end of the heat dissipation fins is attached to the substrate. Several heat dissipation holes are arranged on the protective cover, and a waterproof and breathable membrane is provided inside the heat dissipation holes.

[0022] (III) Beneficial Effects

[0023] Compared with the prior art, this utility model provides an outdoor high-protection SMD surface-mount LED light with an integrated moisture-proof and sealing structure, which has the following beneficial effects:

[0024] Long-lasting moisture-proof sealing: The substrate edge groove and the double-layer encapsulation colloid (inner layer silicone buffer stress, outer layer UV epoxy resin anchoring seal) form a physical lock, combined with the upper and lower sealing groove structure of the protective frame (bolt fastening + sealant filling) and sealing gasket, to achieve IP68 waterproof and dustproof rating, and insulation resistance >100MΩ after damp heat cycling test (85℃ / 85%RH).

[0025] High efficiency in heat dissipation and protection: The heat dissipation fins are directly attached to the substrate (metal / ceramic substrate preferred), and the airflow is regulated by a waterproof and breathable membrane (ePTFE material), which improves heat dissipation efficiency by 40% while maintaining IP67 protection level, and the operating temperature is stable at -40℃~85℃.

[0026] Intelligent control and modular maintenance: The microcontroller links the capacitive touch switch and charging capacitor, supporting wireless command response and abnormal power failure protection; the quick-release design of the protective cover bolts, combined with the modular substrate (FR-4 / flexible substrate can be replaced), improves maintenance efficiency by 60%.

[0027] Synergistic material effects: The aluminum nitride anti-oxidation layer (substrate) and UV epoxy resin (encapsulation) resist UV aging, show no corrosion after salt spray testing (240h), and have a lifespan of over 50,000 hours. Suitable for extreme outdoor lighting scenarios, reducing overall costs by 30%. Attached Figure Description

[0028] Figure 1 This is a schematic diagram of the disassembled structure of this utility model;

[0029] Figure 2 This is a schematic diagram of the front view of the substrate structure of this utility model;

[0030] Figure 3 This is a schematic diagram of the rear view structure of the substrate of this utility model;

[0031] Figure 4 This is a schematic diagram of the encapsulating colloid structure of this utility model;

[0032] In the diagram: 1. Substrate; 2. Protective frame; 3. Protective cover; 4. Transparent protective cover; 5. Electrode pins; 6. Groove; 7. LED chip; 8. Upper sealing groove; 9. Lower sealing groove; 10. Charging capacitor; 11. Microcontroller; 12. Switch; 13. Charging port; 14. Heat sink fins; 15. Heat dissipation holes; 16. Waterproof and breathable membrane; 17. Inner silicone layer; 18. Outer UV epoxy resin layer; 19. Mounting edge. Detailed Implementation

[0033] The technical solutions of the present utility model will be clearly and completely described below with reference to the accompanying drawings of the embodiments. Obviously, the described embodiments are only some embodiments of the present utility model, and not all embodiments. Based on the embodiments of the present utility model, all other embodiments obtained by those of ordinary skill in the art without creative effort are within the protection scope of the present utility model.

[0034] Please see Figure 1-4 The outdoor high-protection SMD surface-mount LED light with an integrated moisture-proof and sealed structure of this utility model includes:

[0035] Substrate 1, wherein a groove 6 is provided on the edge of substrate 1;

[0036] LED chip 7 is fixed to the surface of substrate 1 by silver paste, and the LED chip 7 is connected to substrate 1 through electrode pins 5.

[0037] Encapsulating colloid, covering the surface of LED chip 7 and substrate 1;

[0038] The protective frame 2 is wrapped around the outside of the substrate 1. A protective cover 3 is installed at the bottom of the protective frame 2 and a transparent protective cover 4 is installed at the top of the protective frame 2. A heat dissipation device is provided on the protective cover 3.

[0039] This outdoor high-protection SMD surface-mount LED light, with an integrated moisture-proof and sealed structure, is designed to provide an efficient and reliable outdoor lighting solution through a series of innovative designs and technological improvements. The following are the main components of the device and their working principle.

[0040] Core working principle

[0041] Moisture-proof sealing and structural synergy

[0042] The groove 6 of the substrate 1 works in conjunction with the encapsulating colloid: The groove 6 on the edge of the substrate 1 (FR-4 / metal substrate, etc.) serves as a mechanical locking structure. When the outer UV epoxy resin 18 is cured, it penetrates into the groove 6 to form a physical anchor. Combined with the flexible filling of the inner silicone 17, the encapsulating colloid and the substrate 1 are double-sealed, effectively preventing moisture from entering from the edge of the substrate 1.

[0043] Several LED chips 7 are typically arranged on the substrate 1, and different numbers of LED chips 7 are turned on by the microcontroller 11 according to the brightness requirements. At the same time, the microcontroller 11 can also adjust the color tone of the light source of the LED chips 7, such as the WS2811 series or SM2258E series controllers.

[0044] Sealing system of protective frame 2: The upper / lower sealing grooves 9 of protective frame 2 form an axial compression seal by means of an insert-type frame design (transparent protective cover 4 and protective cover 3) combined with sealant filling; the sealing gasket between the base plate 1 and the mounting edge 19 of protective frame 2 provides a radial compression seal, and the multi-directional sealing structure ensures IP67 protection.

[0045] Intelligent control and power supply management

[0046] The microcontroller 11 (MCU) is linked with the charging capacitor 10: the charging capacitor 10 can be used as an energy storage medium or a power stabilizing medium. The MCU monitors the LED's operating status (current / temperature) in real time and adjusts the brightness through the switch 12 (capacitive touch). The charging capacitor 10 acts as an instantaneous energy storage unit to maintain a stable power supply when the external power supply fluctuates, thus avoiding flickering.

[0047] The microcontroller 11 can be configured with a wireless communication device, through which the microcontroller 11 can remotely connect to a wireless control terminal. The wireless communication device is preferably a 433MHz radio frequency module, Bluetooth / BLE 5.2, or LoRa module. The wireless control terminal is...

[0048] Remote control: Equipped with an STM8 microcontroller, supporting 433MHz / 2.4GHz frequency bands, and the button commands are encoded and transmitted via ASK modulation.

[0049] Mobile App: Based on Bluetooth / BLE protocol, it adjusts LED brightness / color temperature through PWM signal and stores user preferences in a synchronized manner.

[0050] Balance between directional heat dissipation and waterproof breathability

[0051] Heat dissipation fins 14 are attached to conduct heat: the heat dissipation fins 14 on the protective cover 3 directly contact the back of the substrate 1, and quickly conduct the heat generated by the LED chip 7 through the metal substrate 1 (such as an aluminum substrate).

[0052] Waterproof and breathable membrane 16 regulates airflow: The waterproof and breathable membrane 16 (54) is made of ePTFE expanded polytetrafluoroethylene material with a pore size of 0.1-0.5μm. The ePTFE membrane inside the heat dissipation holes 15 allows airflow (moisture permeability ≥5000g / m). 2 • 24h), while blocking liquid water and dust, solving the problem of easy water leakage in traditional heat dissipation holes 15.

[0053] Detailed Explanation of the Working Principle of the Preferred Technical Solution

[0054] Substrate 1 and Packaging Structure

[0055] Substrate 1 Material Selection:

[0056] Metal substrate (preferred): The aluminum substrate has improved corrosion resistance through an aluminum nitride anti-oxidation layer (5-10μm) and combined with high thermal conductivity (>200W / m·K) for rapid heat dissipation;

[0057] Ceramic substrate: Alumina ceramic substrate is resistant to high temperature (>300℃) and is suitable for high-power LED applications;

[0058] FR-4 substrate: a low-cost solution that compensates for thermal conductivity by adding heat dissipation vias.

[0059] Layered encapsulation colloid design:

[0060] Inner silicone 17: High temperature resistance (-50℃~200℃), low stress, buffering the mechanical impact of thermal expansion and contraction on LED chip 7;

[0061] Outer layer UV epoxy resin 18: high hardness (Shore D>85), resistant to ultraviolet aging, and forms a dense moisture-proof layer on the surface.

[0062] Protective Frame 2 Sealing System (Advanced Solution)

[0063] Bolt compression seal: The protective cover 3 is connected to the lower sealing groove 9 by a fixed bolt, and uniform pressure is applied to deform the sealing gasket and fill the micro gaps;

[0064] Encapsulation and sealing enhancement: Silicone sealant is injected into the gap between the frame of the transparent protective cover 4 and the upper sealing groove 8. After curing, it forms an elastic seal that can adapt to outdoor temperature differences and deformation.

[0065] Heat dissipation device

[0066] Fin-substrate 1 bonding design: The heat dissipation fins 14 (aluminum) are tightly bonded to the back of the substrate 1 with thermal grease, and the heat is dissipated naturally by convection through the expansion of the fin surface area (more than 300%).

[0067] Waterproof and breathable membrane 16 dynamic balance: The micropores (0.1-0.5μm) of the ePTFE membrane only allow gas molecules to pass through, and it can withstand 1m water pressure without leakage in heavy rain.

[0068] Detailed Workflow

[0069] Start-up and power supply phase

[0070] Power input: Connect an external power source through the charging port 13 on the protective frame 2 to charge the charging capacitor 10, and the MCU enters standby mode;

[0071] Switch 12 Trigger: When the user touches the capacitive switch 12 (anti-accidental touch design), the MCU activates the LED chip 7 and adjusts it to the preset brightness.

[0072] Work and Protection Phase

[0073] LED light emission: Current drives LED chip 7 to emit light through electrode pin 5, and heat is conducted to heat dissipation fins 14 through substrate 1;

[0074] Dynamic heat dissipation: The ePTFE membrane inside the heat dissipation hole 15 discharges hot air, while external cold air is drawn in through the membrane pores, forming a circulating airflow;

[0075] Sealing and protection: The sealing system of the encapsulating colloid and the protective frame 2 works together to block rainwater and moisture, and the sealing gasket compensates for gaps caused by mechanical vibration.

[0076] Error handling and maintenance

[0077] Overload protection: The microcontroller 11 can be configured with a temperature detector and a current detector. When the temperature is >85℃ or the current is abnormal, the power supply will be automatically cut off and the fault code will be stored.

[0078] Maintenance and disassembly: Loosen the fixing bolts to separate the protective cover 3, replace the heat sink fins 14 or clean the heat sink holes 15. The modular design reduces maintenance costs.

[0079] Although embodiments of the present invention have been shown and described, it will be understood by those skilled in the art that various changes, modifications, substitutions and alterations can be made to these embodiments without departing from the principles and spirit of the present invention, the scope of which is defined by the appended claims and their equivalents.

Claims

1. An outdoor high protection SMD patch type LED lamp integrated with a moisture-proof sealing structure, characterized in that, Include: The substrate (1) is provided with a groove (6) on the edge; LED chip (7) is fixed on the surface of the substrate (1) by silver glue, and the LED chip (7) is connected with the substrate (1) through the electrode pin (5); The encapsulating glue covers the surface of the LED chip (7) and the substrate (1); The protective frame (2) is wrapped outside the substrate (1), the protective cover (3) is installed at the bottom of the protective frame (2), the transparent protective cover (4) is installed at the top of the protective frame (2), and the heat dissipation device is arranged on the protective cover (3).

2. The outdoor high protection SMD paster type LED lamp integrated with moisture-proof sealing structure according to claim 1, characterized in that, The back side of the substrate (1) is provided with a charging capacitor (10), a microcontroller (11) and a switch (12), the charging capacitor (10) is electrically connected with the microcontroller (11), the microcontroller (11) is electrically connected with the substrate (1) and the switch (12), and the switch (12) is installed on the protective frame (2).

3. The outdoor high protection SMD paster type LED lamp integrated with moisture-proof sealing structure according to claim 2, characterized in that, The protective frame (2) is provided with a charging port (13), the charging port (13) is electrically connected with the charging capacitor (10), and the switch (12) is a capacitive touch switch (12).

4. The outdoor high protection SMD paster type LED lamp integrated with moisture-proof sealing structure according to claim 3, characterized in that, The substrate (1) is any one of FR-4, metal substrate, ceramic substrate and flexible substrate, and the surface of the substrate (1) is covered with an aluminum nitride oxidation layer.

5. The outdoor high protection SMD paster type LED lamp integrated with moisture-proof sealing structure according to claim 4, characterized in that, The encapsulating glue includes inner layer silica gel (17) and outer layer UV epoxy resin (18), and the outer layer UV epoxy resin (18) extends into the groove (6) on the edge of the substrate (1).

6. The outdoor high protection SMD paster type LED lamp integrated with moisture-proof sealing structure according to claim 5, characterized in that, The top end of the protective frame (2) is provided with an upper sealing groove (8), the bottom end of the protective frame (2) is provided with a lower sealing groove (9), the frame of the protective cover (3) is inserted into the lower sealing groove (9), the side of the protective cover (3) is surrounded by a fixing bolt, the fixing bolt is connected with the lower sealing groove (9) through the thread structure of the protective cover (3), the frame of the transparent protective cover (4) is inserted into the upper sealing groove (8), and the gap between the frame of the transparent protective cover (4) and the upper sealing groove (8) is filled with sealant.

7. The outdoor high protection SMD paster type LED lamp integrated with moisture-proof sealing structure according to claim 6, characterized in that, The inner side of the protective frame (2) is provided with a mounting edge (19), and the sealant pad is arranged between the substrate (1) and the mounting edge (19).

8. The outdoor high protection SMD paster type LED lamp integrated with the moisture-proof sealing structure according to claim 7, characterized in that, The heat dissipation device includes heat dissipation fins (14) and heat dissipation holes (15), the heat dissipation fins (14) are fixedly installed on the protective cover (3), the bottom end of the heat dissipation fins (14) is attached to the substrate (1), a plurality of heat dissipation holes (15) are arranged on the protective cover (3), and a waterproof breathable film (16) is arranged in the heat dissipation hole (15).

Images