Heat dissipation module for enhancing utilization efficiency of heat pipe
By optimizing the contact design between the heat pipe and the fins and the airflow layout, the problems of insufficient heat pipe utilization and cooling airflow leakage in the existing technology are solved, achieving more efficient heat dissipation performance and airflow utilization, and significantly reducing thermal resistance.
Patent Information
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- Filing Date
- 2025-03-03
- Publication Date
- 2026-03-13
AI Technical Summary
The existing 2U heat pipe module design fails to effectively utilize the heat pipe rise section, the fin design causes cooling airflow leakage, and the performance improvement after increasing the fin density is limited, resulting in poor cost performance.
It adopts a vertical and inclined climbing heat pipe design, combined with a small fin heatsink and a base copper block, to enhance the close contact between the heat pipes and the fins, and sets up air ducts in the small fin heatsink to optimize the heat pipe layout and cooling airflow path.
It improves the heat pipe heat dissipation efficiency and cooling airflow efficiency, enhances heat dissipation performance, and keeps the overall module voltage drop within an acceptable range, reducing thermal resistance by 0.012-0.015C/W.
Smart Images
Figure CN223992541U_ABST
Abstract
Description
Technical Field
[0001] This utility model relates to the field of heat pipes, and more specifically to a heat dissipation module that enhances the utilization efficiency of heat pipes. Background Technology
[0002] Conventional 2U heatsink modules have the following problems with their heat pipe and fin designs:
[0003] Due to the location of the heat source, heat pipes must be arranged in a concentrated manner at the bottom. When extending to the cooling area above the fins, the existing design does not take into account the utilization of the heat pipe's ascending section.
[0004] 2. Stamped fins require a certain thickness and width to be formed, so conventional designs will directly break them open. At this time, the cooling airflow is easy to leak from the broken part, and the heat pipe does not fully utilize its heat dissipation area.
[0005] 3. Increasing fin density can effectively increase the heat dissipation area and improve performance; however, simply increasing fin density, once it exceeds the system's optimal operating point, will not significantly improve performance, resulting in low cost-effectiveness and potentially causing excessive overall voltage drop across the module.
[0006] In summary, existing technologies have encountered bottlenecks in further improving heat dissipation performance, so there is an urgent need for a heat dissipation module that enhances the utilization efficiency of heat pipes. Utility Model Content
[0007] In order to overcome the above-mentioned defects of the prior art, the present invention provides a heat dissipation module that enhances the utilization efficiency of heat pipes.
[0008] The technical solution of this utility model is as follows:
[0009] A heat dissipation module for enhancing heat pipe utilization efficiency includes a main fin heat sink, a small fin heat sink, heat pipes, and a base plate. The heat pipes are multiple, including upright climbing heat pipes and inclined climbing heat pipes. The heat-absorbing end of the upright climbing heat pipe is embedded in the base plate, and the heat-dissipating end is inserted into and tightly attached to the main fin heat sink. The upright section in the middle is tightly attached to the small fin heat sink. The heat-absorbing end of the inclined climbing heat pipe is embedded in the base plate, and the heat-dissipating end is inserted into and tightly attached to the main fin heat sink. The inclined section in the middle is embedded in the inclined groove of the main fin heat sink.
[0010] There are two small fin heat sinks, which are located diagonally opposite the main fin heat sink.
[0011] The contact portion between the small fin heat sink and the upright section in the middle of the vertically rising heat pipe is configured as a complete contact surface.
[0012] The small Fin heat sink has multiple air ducts inside.
[0013] The heat pipes are arranged in two sets, with three pipes in each set, and the two sets are inserted from both sides of the main fin heat sink.
[0014] A copper block is fixed on the base plate, and the bottom surface of the heat-absorbing end of the heat pipe is in close contact with the copper block.
[0015] The top surface of the heat-absorbing end of the heat pipe is in close contact with the bottom of the main fin heat sink.
[0016] The base plate is equipped with multiple spring screws.
[0017] The technical effects and advantages of this utility model are as follows:
[0018] Further improve the efficiency of heat pipe heat dissipation;
[0019] Further improve the efficiency of cooling airflow utilization;
[0020] Further improve heat dissipation performance, while the overall module voltage drop remains within the acceptable range of the system fan static pressure;
[0021] Performance improvement: Thermal resistance improved by 0.012-0.015 C / W. Attached Figure Description
[0022] Figure 1 This is a schematic diagram of the overall structure of this utility model;
[0023] Figure 2 This is a side view of the present invention;
[0024] Figure 3 and Figure 4 A schematic diagram showing the main fin heatsink and base plate separated;
[0025] Figure 5 A schematic diagram showing the main fin heatsink separated from the heat pipe;
[0026] Figure 6 Schematic diagram of a small fin heatsink;
[0027] Figure 7 This is a schematic diagram after removing part of the main fin heatsink. Detailed Implementation
[0028] The technical solutions in the embodiments of this utility model will be clearly and completely described below. Obviously, the described embodiments are only some embodiments of this utility model, and not all embodiments. Based on the embodiments of this utility model, all other embodiments obtained by those skilled in the art without creative effort are within the protection scope of this utility model.
[0029] Example 1: A heat dissipation module for enhancing heat pipe utilization efficiency includes a main fin heat sink 1, a small fin heat sink 2, heat pipes 3, and a base plate 4. The heat pipes are arranged in two groups of three, with each group inserting into the main fin heat sink from both sides. The heat pipes 3 include two upright heat pipes 31 and one inclined heat pipe 32. The heat absorption end 311 of the upright heat pipe 31 is embedded in the base plate 4, the heat dissipation end 312 is inserted into the main fin heat sink and attached tightly, and the upright section 313 in the middle is attached tightly to the small fin heat sink. The heat absorption end 321 of the inclined heat pipe 32 is embedded in the base plate, the heat dissipation end 322 is inserted into the main fin heat sink and attached tightly, and the inclined section 323 in the middle is embedded in the inclined groove of the main fin heat sink.
[0030] Furthermore, there are two small fin heat sinks 2, which are respectively located diagonally opposite the main fin heat sink.
[0031] Furthermore, the contact portion between the small fin heat sink 2 and the upright section in the middle of the vertically rising heat pipe is configured as a complete contact surface 21.
[0032] Furthermore, the small Fin heat sink 2 has multiple air ducts 22 inside.
[0033] Furthermore, a copper block 5 is fixed on the base plate 4, and the bottom surface of the heat-absorbing end of the heat pipe is in close contact with the copper block. The top surface of the heat-absorbing end of the heat pipe is in close contact with the bottom of the main fin heat sink.
[0034] Furthermore, a plurality of spring screws 6 are installed on the base plate 4.
[0035] Implementation Example 2: The performance comparison report based on experimental testing is as follows:
[0036]
[0037] The data shows that this patent further improves the heat pipe heat dissipation efficiency; further improves the cooling airflow efficiency; further improves heat dissipation performance, while the overall module voltage drop is still within the acceptable range of the system fan static pressure; performance improvement: thermal resistance improved by 0.012-0.015C / W.
[0038] The above description is only a preferred embodiment of the present utility model and is not intended to limit the present utility model. Any modifications, equivalent substitutions, improvements, etc., made within the spirit and principles of the present utility model should be included within the protection scope of the present utility model.
Claims
1. A heat dissipation module for enhancing the efficiency of a heat pipe, characterized by: The application relates to a heat dissipation device, which comprises a main Fin heat dissipation fin, a small Fin heat dissipation fin, heat pipes and a bottom plate, wherein the heat pipes are arranged in multiple, including upright climbing heat pipes and inclined climbing heat pipes; the heat absorbing end of the upright climbing heat pipes is embedded in the bottom plate, the heat radiating end is inserted into the main Fin heat dissipation fin and closely attached, and the upright section in the middle part is closely attached to the small Fin heat dissipation fin; the heat absorbing end of the inclined climbing heat pipes is embedded in the bottom plate, the heat radiating end is inserted into the main Fin heat dissipation fin and closely attached, and the middle part is an inclined section and is embedded in the inclined groove of the main Fin heat dissipation fin.
2. The heat dissipation module of claim 1, wherein: The small Fin heat dissipation fin is arranged in two, and is arranged at the opposite corners of the main Fin heat dissipation fin.
3. The heat dissipation module of claim 1, wherein: The contact part between the small Fin heat dissipation fin and the upright section of the middle part of the upright climbing heat pipe is arranged as a complete contact surface.
4. The heat sink module of claim 1, wherein: The small Fin heat dissipation fin is internally provided with multiple air ducts.
5. The heat sink module of claim 1, wherein: The heat pipes are arranged in two groups, three in each group, and the two groups are inserted from the two sides of the main Fin heat dissipation fin.
6. The heat sink module of claim 1, wherein: The bottom plate is fixed with a copper block, and the bottom surface of the heat absorbing end of the heat pipe closely attaches to the copper block.
7. The heat sink module of claim 1, wherein: The top surface of the heat absorbing end of the heat pipe closely attaches to the bottom of the main Fin heat dissipation fin.
8. The heat sink module of claim 1, wherein: Multiple spring screws are installed on the bottom plate.