Heat dissipation structure of circuit board and power equipment

Abstract

The utility model discloses a heat radiation structure of a circuit board and a power device, the heat radiation structure comprises a PCB, a power device, a first heat radiator and a second heat radiator, and the PCB is provided with a first board and a second board which are arranged back to back; the power device is arranged on the first plate surface, and the top surface of the power device protrudes out of the first plate surface; the first radiator is arranged on the side where the first plate surface is located and is provided with a first boss which is in insulated contact with the top surface of the power device for heat exchange; the second radiator is arranged on the side where the second plate surface is located and is provided with a second boss which is in insulated contact with the second plate surface for heat exchange; in addition, the first boss and the second boss are oppositely arranged. According to the heat dissipation structure of the circuit board, the first boss and the second boss which are oppositely arranged are used for clamping the two faces of the position, corresponding to the power device, on the PCB, so that the situation that the single face of the PCB is extruded to generate bending deformation is avoided, and the problem that the difference of the heat dissipation performance between different power devices on the PCB is large is effectively solved.

Description

Technical Field

[0001] This application relates to the field of heat dissipation technology for power devices, and more specifically, to a heat dissipation structure for a circuit board and a power device. Background Technology

[0002] To improve the heat dissipation efficiency of power devices, the heat dissipation protrusions of the heat sink are usually placed directly in contact with the top surface of the power device on the PCB board. In this case, the heat transfer between the heat sink and the power device does not need to pass through the PCB board, thereby reducing thermal resistance and improving the heat dissipation efficiency of the power device.

[0003] However, when the PCB board is fastened to the heat sink, the PCB board is prone to bending deformation under the pressure of the heat sink protrusion on the top surface of the power device. This results in different flatness of the contact surface between different power devices and the heat sink, which in turn causes a large difference in heat dissipation performance between different power devices.

[0004] In summary, how to solve the problem of significant differences in heat dissipation performance among different power devices on a PCB has become a technical problem that urgently needs to be solved by those skilled in the art. Utility Model Content

[0005] In view of this, this application provides a heat dissipation structure and power device for a circuit board to solve the problem of large differences in heat dissipation performance between different power devices on a PCB.

[0006] To achieve the above objectives, this application provides the following technical solution:

[0007] A heat dissipation structure for a circuit board, comprising:

[0008] A PCB board has a first board surface and a second board surface arranged back to back;

[0009] A power device is disposed on the first plate surface, and the top surface of the power device protrudes from the first plate surface;

[0010] The first heat sink is disposed on the side where the first plate is located, and has a first boss that is insulated from the top surface of the power device for heat exchange.

[0011] The second heat sink is disposed on the side where the second plate is located, and has a second protrusion that is insulated from the second plate for heat exchange;

[0012] The first boss and the second boss are arranged opposite to each other.

[0013] In some embodiments of this application, the top surface of the power device is provided with a top window, the number of the first protrusions is at least one, and each of the first protrusions has insulated contact with at least one top window of the power device for heat exchange.

[0014] In some embodiments of this application, the first boss and the second boss are arranged opposite to each other; or, the first boss is arranged opposite to at least two second bosses; or, the second boss is arranged opposite to at least two first bosses.

[0015] In some embodiments of this application, a first housing with a heat dissipation duct and a turbulence fan disposed in the heat dissipation duct are also included. The PCB board and the second heat sink are both disposed inside the first housing and located on the airflow path of the heat dissipation duct.

[0016] In some embodiments of this application, the second heat sink includes a second heat sink substrate and a second heat sink fin. The second heat sink fin and the second boss are respectively disposed on two back-to-back surfaces of the second heat sink substrate, and the flow channel gap formed between two adjacent second heat sink fins is arranged along the airflow path of the heat sink duct.

[0017] In some embodiments of this application, the second boss is configured as an insulating thermally conductive pad disposed on the second heat dissipation substrate; wherein the second boss and the second heat dissipation substrate are an integral structure or a separate fixed connection structure.

[0018] In some embodiments of this application, a process window is provided on the side of the first housing corresponding to the first plate surface, and at least a portion of the heat dissipation structure of the first heat sink extends from the process window to the outside of the first housing.

[0019] In some embodiments of this application, the first heat sink includes a first heat sink substrate and a first heat sink fin, wherein the first heat sink fin and the first boss are respectively disposed on two back-to-back surfaces of the first heat sink substrate.

[0020] In some embodiments of this application, the first heat dissipation substrate is disposed on the inner side of the first housing and is attached to the inner side of the housing wall where the process window is located, and the first heat dissipation fins extend to the outer side of the first housing.

[0021] In some embodiments of this application, the first heat dissipation substrate and the first heat dissipation fins are both disposed on the outer side of the first housing, and the first heat dissipation substrate is attached to the outer side of the housing wall where the process window is located.

[0022] In some embodiments of this application, the first boss is configured as an insulating thermally conductive pad disposed on the first heat dissipation substrate; wherein the first boss and the first heat dissipation substrate are an integral structure or a separate fixed connection structure.

[0023] In some embodiments of this application, a second housing is further provided on the outside of the first housing, the second housing covering the protruding portion of the first heat sink extending from the process window to the outside of the first housing.

[0024] In some embodiments of this application, the first heat sink and the second heat sink are arranged opposite to each other, and the two are tightened and fixed by a tensioning member.

[0025] In some embodiments of this application, the PCB board is provided with through holes for the tensioning member to pass through.

[0026] In some embodiments of this application, the tensioning member is configured as a tensioning member made of a thermally conductive material.

[0027] To address the significant differences in heat dissipation performance among different power devices on a PCB board, this application provides a heat dissipation structure for a circuit board, comprising a PCB board, power devices, a first heat sink, and a second heat sink. The PCB board has a first surface and a second surface arranged back-to-back. The power device is disposed on the first surface, with its top surface protruding from the first surface. The first heat sink is disposed on the side of the first surface and has a first boss that makes insulated contact with the top surface of the power device for heat exchange. The second heat sink is disposed on the side of the second surface and has a second boss that makes insulated contact with the second surface for heat exchange. Furthermore, the first boss and the second boss are arranged opposite to each other. In practical applications, the heat dissipation structure of this circuit board features a first heat sink positioned on the first side of the PCB board, which exchanges heat through insulated contact with the top surface of the power device via a first boss. A second heat sink is positioned on the second side of the PCB board, exchanging heat through insulated contact with the second surface via a second boss. The first and second bosses are arranged opposite each other, clamping the corresponding power device positions on both sides of the PCB board. This prevents the PCB board from being compressed on one side, thus avoiding bending deformation and ensuring the flatness of the contact surfaces between different power devices and the heat sinks. This effectively solves the problem of significant differences in heat dissipation performance between different power devices on the PCB board. Furthermore, the combined heat dissipation of the first and second heat sinks results in better heat dissipation performance.

[0028] On the other hand, this application also provides a power device, including a heat dissipation structure for a circuit board, wherein the heat dissipation structure for the circuit board is the heat dissipation structure for the circuit board described in any of the above-mentioned solutions. Since the aforementioned heat dissipation structure for the circuit board has the above-mentioned technical effects, the power device having the heat dissipation structure for the circuit board should also have the corresponding technical effects, which will not be elaborated here.

[0029] The technical features mentioned above, those to be mentioned below, and those shown individually in the accompanying drawings can be combined arbitrarily, provided that the combined technical features are not contradictory. All feasible combinations of features are the technical content explicitly described herein. Any one of the multiple sub-features contained in the same statement can be applied independently, without necessarily being applied together with other sub-features. Attached Figure Description

[0030] To more clearly illustrate the technical solutions in the embodiments of this application or the prior art, the drawings used in the description of the embodiments or the prior art will be briefly introduced below. Obviously, the drawings described below are only some embodiments of this application. For those skilled in the art, other drawings can be obtained based on these drawings without creative effort.

[0031] Figure 1 The heat dissipation structure of the circuit board provided in the embodiments of this application is not shown in the structural schematic diagram of the first and second housings;

[0032] Figure 2 The heat dissipation structure of the circuit board provided in the embodiments of this application shows a schematic diagram of the structure of the first housing and the second housing;

[0033] Figure 3 A schematic diagram of the split structure of the first housing body, the housing cover plate, and the second housing provided in the embodiments of this application.

[0034] in, Figures 1-3 middle:

[0035] 1- PCB board;

[0036] 11-First panel;

[0037] 12 - Second panel;

[0038] 2-Power devices;

[0039] 3-First radiator;

[0040] 30 - First boss;

[0041] 31-First heat dissipation substrate;

[0042] 32 - First heat dissipation fin;

[0043] 4-Second radiator;

[0044] 40 - Second boss;

[0045] 41-Second heat dissipation substrate;

[0046] 42 - Second heat dissipation fin;

[0047] 5-First casing;

[0048] 50-Burst Fan;

[0049] 51-Process Window;

[0050] 52 - Housing cover;

[0051] 6-Second casing;

[0052] 7-Tensioning components. Detailed Implementation

[0053] The core of this application is to provide a heat dissipation structure and power device for a circuit board, so as to solve the problem of large differences in heat dissipation performance between different power devices on a PCB board.

[0054] The technical solutions of the embodiments of this application will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only some embodiments of this application, and not all embodiments. Based on the embodiments of this application, all other embodiments obtained by those skilled in the art without creative effort are within the scope of protection of this application.

[0055] To reduce thermal resistance and improve heat dissipation efficiency, heat sinks typically make direct contact with the top surface of power devices on the circuit board (PCB), eliminating the need for heat transfer between the heat sink and power devices to pass through the PCB. However, it's inevitable that several power devices mounted on the circuit board will be close together, requiring a single heat dissipation bump on the heat sink to support multiple devices. When multiple power devices share the same heat dissipation bump, the PCB is prone to bending deformation under the pressure of the heat dissipation bump on the top surface of the power devices when the PCB is fastened to the heat sink. This results in varying flatness of the contact surfaces between different power devices and the heat sink, leading to significant differences in heat dissipation performance between different power devices.

[0056] Based on this, one embodiment of this application provides a heat dissipation structure for a circuit board, referring to... Figure 1 and Figure 2The heat dissipation structure specifically includes a PCB board 1, a power device 2, a first heat sink 3, and a second heat sink 4.

[0057] The PCB board 1 has a first surface 11 and a second surface 12 arranged back-to-back. A power device 2 is disposed on the first surface 11, with its top surface protruding from the first surface 11. A first heat sink 3 is disposed on the side of the first surface 11 and has a first boss 30 that makes insulated contact with the top surface of the power device for heat exchange. The protruding top surface of the first boss 30 directly contacts the top surface of the power device for heat exchange, or indirectly contacts it (e.g., through thermally conductive adhesive). The top surface of the power device is generally parallel to the first surface 11, and the protruding top surface of the corresponding first boss 30 is also parallel to the first surface 11. A second heat sink 4 is disposed on the side of the second surface 12 and has a second boss 40 that makes insulated contact with the second surface 12 for heat exchange. The first boss 30 and the second boss 40 are arranged opposite each other to create a clamping effect on both sides of the PCB board.

[0058] In practical applications, the heat dissipation structure of this circuit board features a first heat sink 3 positioned on the first surface 11 of the PCB board 1, which exchanges heat with the top surface of the power device 2 through an insulated contact via a first protrusion 30 (either direct or indirect contact). A second heat sink 4 is positioned on the second surface 12 of the PCB board 1, and exchanges heat with the second surface 12 through an insulated contact via a second protrusion 40 (again, either direct or indirect contact). The first and second protrusions 30 and 40 are arranged opposite to each other, clamping the positions of the power devices 2 on both sides of the PCB board 1. This prevents the PCB board 1 from being compressed on one side, thus ensuring the flatness of the contact surfaces between different power devices 2 and the heat sinks. This effectively solves the problem of significant differences in heat dissipation performance between different power devices 2 on the PCB board 1. Furthermore, the combined heat dissipation of the PCB board 1 by the first heat sink 3 and the second heat sink 4 results in better heat dissipation.

[0059] In a further embodiment, the top surface of the power device 2 can be configured with a top-window structure. Specifically, the top window can expose the power device substrate or incorporate a metal thermally conductive layer. Direct contact between the heat sink and the top window of the power device's top surface, without needing to pass through a PCB board, further enhances heat dissipation. Examples include top-window QFN packages, DDPAK packages, and QDPAK packages.

[0060] It should be noted that the number of the aforementioned first protrusions 30 can be one or more (i.e., two or more), and their specific number is related to the number of power devices 2 disposed on the first surface 11 of the PCB board 1. Each first protrusion 30 makes insulated contact with at least one top opening of a power device 2 for heat exchange. For example, if several power devices 2 connected in parallel on the first surface 11 are close to each other, heat exchange can be achieved by having one first protrusion 30 simultaneously contact the top openings of these closely spaced power devices 2. This can reduce the number of first protrusions 30 required and improve the ease of manufacturing the first heat sink 3.

[0061] It should also be noted that the aforementioned arrangement of the first boss 30 and the second boss 40 opposite each other can specifically be a one-to-one arrangement; or a first boss 30 opposite to at least two second bosses 40; or a second boss 40 opposite to at least two first bosses 30. In practical applications, the corresponding structural form can be selected according to actual needs (such as ease of processing and manufacturing), and no further specific limitations are made here.

[0062] In some specific implementation plans, refer to Figure 1 and Figure 2 The heat dissipation structure of the aforementioned circuit board may further include a first housing 5, which has a heat dissipation duct and a baffle fan 50 disposed within the heat dissipation duct. The PCB board 1 and the second heat sink 4 are both disposed within the first housing 5 and located along the airflow path of the heat dissipation duct. By designing the first housing 5, the heat dissipation duct inside the first housing 5, and the baffle fan 50, the baffle fan 50 can dissipate some of the heat from the second heat sink 4 along the heat dissipation duct to other locations inside the first housing 5, resulting in a more even temperature distribution. For ease of disassembly and assembly of related components within the first housing 5, refer to... Figure 3 As shown, the first housing 5 can be designed as a housing body and a housing cover 52 that can be detachably connected to the housing body. The detachable connection method can be, but is not limited to, a fastener connection or other similar methods.

[0063] In a further implementation plan, refer to Figure 1 and Figure 2The second heat sink 4 specifically includes a second heat sink substrate 41 and second heat sink fins 42. The second heat sink fins 42 and the second protrusions 40 are respectively disposed on two back-to-back surfaces of the second heat sink substrate 41 (that is, the second heat sink fins 42 are disposed on one side of the second heat sink substrate 41, and the second protrusions 40 are disposed on the other side of the second heat sink substrate 41). The flow channel gap formed between two adjacent second heat sink fins 42 is arranged along the airflow path of the heat dissipation channel. Generally, there are multiple second heat sink fins 42 arranged in parallel intervals. Their main function is to improve the heat dissipation effect of the second heat sink 4. The specific number and size of the second heat sink fins 42 can be selected according to actual needs. It is understood that the above-described structure of the heat sink substrate and heat sink fins is merely an example of the structure of the second heat sink 4 in this embodiment. In actual applications, other heat sink structures can also be designed, such as a combined heat sink substrate and heat sink block structure.

[0064] In a further embodiment, the second protrusion 40 can be specifically configured as an insulating thermally conductive pad, such as a ceramic thermally conductive sheet, disposed on the second heat dissipation substrate 41. The second protrusion 40 and the second heat dissipation substrate 41 can be an integral structure, such as a one-piece molded structure, or a separate fixed connection structure, such as an adhesive connection. By designing the second protrusion 40 as an insulating thermally conductive pad, the fabrication of the second protrusion 40 becomes more convenient, and the insulating thermal conductivity is more easily guaranteed. Of course, it is understood that the second protrusion 40 can also be designed as a non-insulating thermally conductive structure, achieving insulating contact heat exchange with the second plate surface 12 through insulating thermally conductive adhesive.

[0065] In some other specific embodiments, a process window 51 may be provided on the side of the first housing 5 corresponding to the first plate surface 11, and at least part of the heat dissipation structure of the first heat sink 3 extends from the process window 51 to the outside of the first housing 5. By designing the above-mentioned structural form, the heat of the first heat sink 3 can be dissipated to the outside of the first housing 5, which helps to reduce the temperature of the PCB board 1 and power device 2 inside the first housing 5.

[0066] In a further implementation plan, refer to Figure 1 and Figure 2The aforementioned first heat sink 3 may specifically include a first heat sink substrate 31 and first heat sink fins 32. The first heat sink fins 32 and the first protrusions 30 are respectively disposed on two back-to-back surfaces of the first heat sink substrate 31 (that is, the first heat sink fins 32 are disposed on one side of the first heat sink substrate 31, and the first protrusions 30 are disposed on the other side of the first heat sink substrate 31). Generally, there are multiple first heat sink fins 32 arranged in parallel at intervals. Their main function is to improve the heat dissipation effect of the first heat sink 3. The specific number and size of the first heat sink fins 32 can be selected and arranged according to actual needs. It is understood that the above-mentioned structural form of the heat sink substrate and heat sink fins is merely an example of the structural form of the first heat sink 3 in this application embodiment. In actual applications, other heat sink structural forms can also be designed, such as a combined heat sink substrate and heat sink block structure.

[0067] In a further implementation plan, refer to Figure 1 As shown, the first heat dissipation substrate 31 can be disposed inside the first housing 5 and fitted against the inner side of the housing wall where the process window 51 is located, while the first heat dissipation fins 32 extend to the outer side of the first housing 5. Alternatively, it can be designed as follows: Figure 2 In the structural configuration shown, both the first heat dissipation substrate 31 and the first heat dissipation fins 32 are disposed on the outer side of the first housing 5, and the first heat dissipation substrate 31 is attached to the outer side of the housing wall where the process window 51 is located. By designing the above structural configuration, the first heat dissipation substrate 31 is attached to the housing wall of the first housing 5, which helps to maintain the structural seal of the first housing 5.

[0068] It should be noted that the aforementioned first protrusion 30 can be specifically constructed as an insulating thermally conductive pad disposed on the first heat dissipation substrate 31, such as a ceramic thermally conductive sheet; wherein, the first protrusion 30 and the first heat dissipation substrate 31 can be designed as an integral structure, such as an integrally molded structure, or as a separate fixed connection structure, such as an adhesive connection. By designing the first protrusion 30 as the aforementioned insulating thermally conductive pad structure, the fabrication of the first protrusion 30 becomes more convenient, and the insulating thermal conductivity effect is more easily guaranteed. Of course, it is understandable that the aforementioned first protrusion 30 can also be designed as a non-insulating thermally conductive structure, which achieves insulating contact heat exchange with the top opening of the power device 2 through insulating thermally conductive adhesive.

[0069] In some specific implementation plans, refer to Figure 2 and Figure 3As shown, the heat dissipation structure of the circuit board may further include a second housing 6 disposed outside the first housing 5. The second housing 6 covers the extended portion of the first heat sink 3 extending from the process window 51 to the outside of the first housing 5. By designing the second housing 6, a certain degree of protection can be provided for the extended portion of the first heat sink 3, while also forming a corresponding heat dissipation channel. It should be noted that the first housing 5 and the second housing 6 can be designed as an integrated structure or as separate structures. In practical applications, the arrangement can be chosen according to requirements, and no specific limitation is made here.

[0070] Reference Figure 1 As shown, the first heat sink 3 and the second heat sink 4 are arranged opposite to each other and are tightened and fixed by a specific tensioning component 7. This tightening and fixing method helps to achieve consistency in the applied force on both sides of the PCB board 1, better ensuring the flatness of the PCB board 1. It is understood that the tightening and fixing method described above is merely an example of an embodiment of this application. In actual applications, other fixing methods can be designed, such as fixing the first heat sink 3 and the second heat sink 4 to the PCB board 1 separately, for example, using fasteners. In this case, to avoid deformation of the PCB board 1, the first heat sink 3 and the second heat sink 4 can be pre-tightened and fixed to the PCB board 1. The pre-tightening force is insufficient to cause deformation of the PCB board 1. Then, the tightening force of the first heat sink 3 and the second heat sink 4 on the PCB board 1 is gradually increased by alternating lifting until the fixing is complete. The specific settings can be selected according to actual needs, and no further specific limitations are made here.

[0071] It should be noted that the tensioning component 7 can either pass through the PCB board 1 or not. When the tensioning component 7 passes through the PCB board 1, the PCB board 1 is designed with a through hole for the tensioning component 7 to pass through. By having the tensioning component 7 (such as a fastener) pass through the first heat dissipation substrate 31 of the first heat sink 3, the through hole on the PCB board 1, and the second heat dissipation substrate 41 of the second heat sink 4, the through hole can provide a certain lateral restraint on the position of the tensioning component 7 relative to the PCB board 1. On the other hand, to ensure that the first heat dissipation substrate 31 and the second heat dissipation substrate 41 are tensioned relative to each other, the first heat dissipation substrate 31 and the second heat dissipation substrate 41 do not need to extend to the periphery of the PCB board 1.

[0072] In a further embodiment, the aforementioned tensioning component 7 can be specifically constructed as a tensioning component made of a thermally conductive material. For example, a copper screw, designed as a tensioning fastener made of a thermally conductive material, enables a certain heat transfer effect between the first heat sink 3 and the second heat sink 4, which helps to improve the uniformity of heat dissipation on both sides of the PCB board 1.

[0073] Another aspect of this application provides a power device, including a heat dissipation structure for a circuit board, wherein the heat dissipation structure for the circuit board is the heat dissipation structure for the circuit board described in any of the above-described solutions. Since the aforementioned heat dissipation structure for the circuit board has the above-described technical effects, the power device having this heat dissipation structure for the circuit board should also have corresponding technical effects, which will not be elaborated further here.

[0074] It should be noted that the various embodiments in this specification are described in a progressive manner, with each embodiment focusing on the differences from other embodiments. The same or similar parts between the various embodiments can be referred to each other.

[0075] As indicated in this application and claims, unless the context clearly indicates otherwise, the words "a," "an," "a," and / or "the" are not specifically singular and may include the plural. Generally, the terms "comprising" and "including" only indicate the inclusion of expressly identified steps and elements, which do not constitute an exclusive list, and the method or apparatus may also include other steps or elements. An element defined by the phrase "comprising an..." does not exclude the presence of other identical elements in the process, method, product, or apparatus that includes the element.

[0076] In the description of the embodiments of this application, unless otherwise stated, " / " means "or", for example, A / B can mean A or B; "and / or" in this document is merely a description of the relationship between related objects, indicating that three relationships can exist. For example, A and / or B can represent: A existing alone, A and B existing simultaneously, and B existing alone. Furthermore, in the description of the embodiments of this application, "multiple" refers to two or more.

[0077] This document uses specific examples to illustrate the principles and implementation methods of this application. The descriptions of the embodiments above are only for the purpose of helping to understand the core ideas of this application. It should be noted that those skilled in the art can make several improvements and modifications to this application without departing from the principles of this application, and these improvements and modifications also fall within the protection scope of the claims of this application.

Claims

1. A heat dissipating structure of a circuit board, characterized by comprising: The application relates to a PCB (1) with a first plate face (11) and a second plate face (12) arranged oppositely, a power device (2) arranged on the first plate face (11) and having a top surface protruding from the first plate face (11), a first heat sink (3) arranged on the side of the first plate face (11) and having a first protrusion (30) in insulating contact with the top surface of the power device (2), and a second heat sink (4) arranged on the side of the second plate face (12) and having a second protrusion (40) in insulating contact with the second plate face (12), wherein the first protrusion (30) and the second protrusion (40) are arranged oppositely. The top surface of the power device (2) is provided with a top window, the number of the first protrusions (30) is at least one, and each first protrusion (30) is in insulating contact with at least one top window of the power device (2). The first protrusion (30) and the second protrusion (40) are arranged oppositely; or the first protrusion (30) and at least two second protrusions (40) are arranged oppositely; or the second protrusion (40) and at least two first protrusions (30) are arranged oppositely. The application further relates to a first casing (5) with a heat dissipation air duct and a spoiler fan (50) arranged in the heat dissipation air duct, wherein the PCB (1) and the second heat sink (4) are arranged in the first casing (5) and located on the airflow path of the heat dissipation air duct. The second heat sink (4) comprises a second heat dissipation base plate (41) and second heat dissipation fins (42), the second heat dissipation fins (42) and the second protrusion (40) are arranged on two opposite surfaces of the second heat dissipation base plate (41) respectively, and the flow channel gaps formed between adjacent two second heat dissipation fins (42) are arranged along the airflow path of the heat dissipation air duct. The second protrusion (40) is configured to be arranged on the insulating heat conduction gasket of the second heat dissipation base plate (41); wherein the second protrusion (40) and the second heat dissipation base plate (41) are in an integrated structure or a split type fixed connection structure.

2. The heat dissipating structure of a circuit board according to claim 1, wherein The first casing (5) is provided with a process window (51) corresponding to the side of the first plate face (11), and at least part of the heat dissipation structure of the first heat sink (3) protrudes from the process window (51) to the outside of the first casing (5).

3. The heat dissipating structure of a circuit board according to claim 1, wherein The first heat sink (3) comprises a first heat dissipation base plate (31) and first heat dissipation fins (32), and the first heat dissipation fins (32) and the first protrusion (30) are arranged on two opposite surfaces of the first heat dissipation base plate (31) respectively.

4. The heat dissipating structure of a circuit board according to claim 1, wherein The first heat dissipation base plate (31) is arranged on the inner side of the first casing (5) and is arranged in close contact with the inner side of the casing wall where the process window (51) is located, and the first heat dissipation fins (32) protrude to the outside of the first casing (5).

5. The heat dissipating structure of a circuit board according to claim 4, wherein ​ 6. The heat dissipating structure of a circuit board according to claim 5, wherein ​ 7. The heat dissipating structure of a circuit board according to claim 4, wherein ​ 8. The heat dissipating structure of a circuit board according to claim 7, wherein ​ 9. The heat dissipating structure of a circuit board according to claim 8, wherein ​ 10. The heat dissipating structure of a circuit board according to claim 8, wherein The first heat dissipation substrate (31) and the first heat dissipation fin (32) are arranged on the outer side of the first cabinet (5), and the first heat dissipation substrate (31) is arranged in close contact with the outer side of the cabinet wall where the process window (51) is located.

11. The heat dissipating structure of a circuit board according to claim 8, wherein The first boss (30) is configured to be arranged on the insulating and heat-conducting gasket of the first heat dissipation substrate (31); wherein the first boss (30) and the first heat dissipation substrate (31) are in an integrated structure or a separate fixed connection structure.

12. The heat dissipating structure of a circuit board according to any one of claims 7 to 11, wherein Further comprising a second cabinet (6) arranged on the outer side of the first cabinet (5), the second cabinet (6) covers the part of the first heat sink (3) that extends from the process window (51) to the outside of the first cabinet (5).

13. The heat dissipating structure of a circuit board according to any one of claims 1 to 11, wherein The first heat sink (3) and the second heat sink (4) are arranged opposite to each other and are fixed by the tensioning component (7).

14. The heat dissipating structure of a circuit board according to Claim 13, wherein The PCB (1) is provided with a via hole through which the tensioning component (7) passes.

15. The heat dissipating structure of a circuit board according to Claim 13, wherein The tensioning component (7) is made of heat-conducting material.

16. A power device comprising a heat dissipating structure of a circuit board, characterized by, The circuit board heat dissipation structure is the heat dissipation structure of the circuit board according to any one of claims 1-15.

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