Keyboard circuit board

Abstract

The keyboard circuit board comprises an upper base material layer, an interlayer and a lower base material layer which are sequentially arranged from top to bottom, the interlayer comprises an interlayer body layer and an interlayer circuit layer located on the upper surface of the interlayer body layer, and the lower base material layer comprises a lower surface layer and a lower circuit layer located on the upper surface of the lower surface layer. The interlayer body layer is provided with a connecting part penetrating through the interlayer body layer in the thickness direction, and the interlayer circuit layer and the lower circuit layer are communicated through the connecting part. According to the keyboard circuit board provided by the utility model, the interlayer provided with the interlayer body layer and the interlayer circuit layer, the lower substrate layer provided with the lower circuit layer and the lower surface layer, and the connecting part arranged on the interlayer body layer are used for conducting the interlayer circuit layer and the lower circuit layer, so that the steps of a production process can be effectively reduced; the production efficiency of the keyboard circuit board is improved; and the light and thin characteristics of the keyboard circuit board can be ensured to meet the design requirements of customers on light and thin notebook computers.

Description

Technical Field

[0001] This utility model belongs to the field of electronic product technology, and specifically relates to a keyboard circuit board. Background Technology

[0002] Thin-film circuit boards are a common type of flexible circuit board and an important component of membrane keyboards. Membrane keyboard circuit boards are trending towards thinner, more flexible, and lower-cost designs, giving membrane keyboards advantages such as small size, light weight, and ease of operation.

[0003] Currently, common keyboard circuit boards consist of an upper substrate layer, a lower substrate layer, and an intermediate partition between them. The upper substrate layer typically includes a PET layer, a silver wire layer, a UV layer, and a silver jumper layer. The silver wire layer, UV layer, and silver jumper layer are all applied to the PET layer using a printing process. The structure of the lower substrate layer is similar to that of the upper substrate layer. This makes the overall structure of the upper and lower substrate layers quite complex, resulting in a cumbersome manufacturing process and low production efficiency for the keyboard circuit board. Existing technologies, such as the Chinese utility model patent with publication number CN219678784U entitled "A Keyboard Circuit Board," disclose a keyboard circuit board composed of an upper substrate layer, an intermediate partition layer, a lower substrate layer, and a bottom layer. The upper substrate layer includes an upper surface layer and an upper circuit layer, and the lower substrate layer includes a lower surface layer, a first lower circuit layer, and a second lower circuit layer. Compared to the existing complex upper and lower substrate layers, this design simplifies the manufacturing process and improves production efficiency. However, the addition of a bottom layer increases the overall thickness of the keyboard circuit board, making it unsuitable for the design requirements of thin and light laptops. Utility Model Content

[0004] In view of this, in order to overcome the shortcomings of the prior art, the purpose of this utility model is to provide a keyboard circuit board.

[0005] To achieve the above objectives, the present invention adopts the following technical solution:

[0006] A keyboard circuit board includes an upper substrate layer, a partition layer, and a lower substrate layer arranged sequentially from top to bottom. The partition layer includes a partition body layer and a partition circuit layer located on the upper surface of the partition body layer. The lower substrate layer includes a lower surface layer and a lower circuit layer located on the upper surface of the lower surface layer. A connecting portion is provided on the partition body layer through its thickness direction. The partition circuit layer and the lower circuit layer are connected through the connecting portion.

[0007] According to some preferred embodiments of the present invention, the connecting portion includes a through hole and a conductive substrate located within the through hole. The conductive substrate fills the through hole, the through hole extends through the thickness direction of the interlayer body layer, and the height direction of the through hole is perpendicular to the length direction of the interlayer body layer. In some embodiments of the present invention, the conductive substrate is made of silver paste, and the connecting portion is formed by printing silver paste in the through hole; and the thickness of the interlayer circuit layer is less than the thickness of the interlayer body layer, wherein the thickness of the interlayer body layer is 30–40 μm, and the thickness of the interlayer circuit layer is 4–5 μm.

[0008] According to some preferred embodiments of the present invention, the upper substrate layer includes an upper surface layer and an upper circuit layer disposed on the lower surface of the upper surface layer, wherein the area of ​​the upper circuit layer is smaller than the area of ​​the upper surface layer. In some embodiments of the present invention, the upper circuit layer is formed by a plurality of silver contacts. Furthermore, the materials of the upper surface layer, the interlayer body layer, and the lower surface layer can all be one or more combinations of PET, PE, BOPET, TPU, or PC materials. The thickness of both the upper and lower surface layers is 60–75 μm; the thickness of both the upper and lower circuit layers is 4–5 μm.

[0009] According to some preferred embodiments of the present invention, the partition layer is further provided with a pore, the pore penetrating the thickness direction of the partition layer body layer and the partition layer circuit layer, and the upper circuit layer is located in the pore.

[0010] According to some preferred embodiments of the present invention, the partition hole is located between the two ends of the partition circuit layer, and at least one through hole is provided on each side of the partition hole, the height of the through hole being less than the height of the partition hole.

[0011] According to some preferred embodiments of this utility model, the orthographic projections of the partition holes and all through holes on the lower substrate layer are all located within the range of the lower circuit layer, and the area of ​​the orthographic projection of the partition holes on the lower circuit layer is larger than the area of ​​the orthographic projection of the upper circuit layer on the lower circuit layer. The partition holes ensure that when the keyboard circuit board is pressed by an external force, the upper circuit layer can contact and conduct with the lower circuit layer under pressure.

[0012] According to some preferred embodiments of the present invention, the horizontal distance from the through hole to the partition hole is greater than or equal to 10 mm.

[0013] According to some preferred embodiments of this invention, the length of the partition circuit layer located on one side of the partition hole is greater than or equal to the horizontal distance between the partition hole and one of the through holes furthest from the partition hole on the same side. This arrangement ensures that the top of the connection portion remains connected to the bottom surface of the partition circuit layer.

[0014] According to some preferred embodiments of this utility model, the horizontal distance between one through-hole on one side of the partition hole and another through-hole on the other side of the partition hole is less than or equal to the length of the lower circuit layer. This arrangement ensures that the bottom end of the connection portion remains connected to the top surface of the lower circuit layer, ultimately ensuring that the partition circuit layer and the lower circuit layer are electrically connected through the connection portion.

[0015] According to some preferred embodiments of the present invention, it further includes a first adhesive layer and a second adhesive layer, wherein the first adhesive layer is used to connect the lower surface of the upper surface layer to the upper surface of the interlayer circuit layer, and the second adhesive layer is used to connect the lower surface of the interlayer body layer to the upper surface of the lower circuit layer.

[0016] Compared with the prior art, the advantages of this utility model are as follows: The keyboard circuit board of this utility model, by setting a partition with a partition body layer and a partition circuit layer, a lower substrate layer with a lower circuit layer and a lower surface layer, and setting a connecting part on the partition body layer to make the partition circuit layer and the lower circuit layer conductive, can effectively reduce the number of production process steps and improve the production efficiency of the keyboard circuit board; it can also ensure the thin and light characteristics of the keyboard circuit board to meet the design requirements of customers for thin and light laptops. Attached Figure Description

[0017] To more clearly illustrate the technical solutions in the embodiments of this utility model, the drawings used in the description of the embodiments will be briefly introduced below. Obviously, the drawings described below are only some embodiments of this utility model. For those skilled in the art, other drawings can be obtained based on these drawings without creative effort.

[0018] Figure 1 This is a schematic diagram of the keyboard circuit board in a preferred embodiment of the present invention;

[0019] The attached figures are labeled as follows:

[0020] Upper substrate layer-1, upper surface layer-11, upper circuit layer-12, first adhesive layer-2, spacer layer-3, spacer body layer-31, through hole-311, spacer circuit layer-32, spacer-33, second adhesive layer-4, lower substrate layer-5, lower surface layer-51, lower circuit layer-52. Detailed Implementation

[0021] To enable those skilled in the art to better understand the technical solutions of this utility model, the technical solutions of the embodiments of this utility model will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only some embodiments of this utility model, and not all embodiments. Based on the embodiments of this utility model, all other embodiments obtained by those skilled in the art without creative effort should fall within the protection scope of this utility model.

[0022] like Figure 1 As shown, this utility model provides a keyboard circuit board, which includes an upper substrate layer 1, a first adhesive layer 2, a spacer layer 3, a second adhesive layer 4 and a lower substrate layer 5 arranged sequentially from top to bottom. The first adhesive layer 2 is used to connect the upper substrate layer 1 and the spacer layer 3, and the second adhesive layer 4 is used to connect the lower substrate layer 5 and the spacer layer 3.

[0023] Specifically, the upper substrate layer 1 includes an upper surface layer 11 and an upper circuit layer 12 disposed on the lower surface of the upper surface layer 11, and the area of ​​the upper circuit layer 12 is smaller than the area of ​​the upper surface layer 11. In this embodiment, the upper circuit layer 12 is located in the middle of the upper surface layer 11. The lower substrate layer 5 includes a lower surface layer 51 and a lower circuit layer 52 located on the upper surface of the lower surface layer 51, wherein the length of the lower circuit layer 52 is less than the length of the lower surface layer 51. In this embodiment, both the upper surface layer 11 and the lower surface layer 51 are made of PET, the upper circuit layer 12 is formed by multiple silver contacts, and the lower circuit layer 52 is made of conductive silver wire. The thickness of both the upper surface layer 11 and the lower surface layer 51 is 60-75 μm, and the thickness of both the upper circuit layer 12 and the lower circuit layer 52 is 4-5 μm.

[0024] The separator 3 includes a separator body layer 31, a separator circuit layer 32 located on the upper surface of the separator body layer 31, and a connecting portion disposed on the separator body layer 31. The separator circuit layer 32 is electrically connected to the lower circuit layer 52 through the connecting portion. The thickness of the separator circuit layer 32 is less than the thickness of the separator body layer 31. Specifically, the thickness of the separator body layer 31 is 30-40 μm, preferably 38 μm, and the thickness of the separator circuit layer 32 is 4-5 μm. The separator body layer 31 is made of PET, and the separator circuit layer 32 is made of conductive silver wire. A first adhesive layer 2 is used to connect the lower surface of the upper surface layer 11 to the upper surface of the separator circuit layer 32, and the first adhesive layer 2 avoids the positions of the separator circuit layer 32 and the diaphragm 33. A second adhesive layer 4 is used to connect the lower surface of the separator body layer 31 to the upper surface of the lower circuit layer 52, and the second adhesive layer 4 avoids the position of the lower circuit layer 52. In this embodiment, the first adhesive layer 2 is made of water-based adhesive, and the second adhesive layer 4 is made of hot melt adhesive.

[0025] Furthermore, a perforation 33 is provided on the partition layer 3. The perforation 33 penetrates the thickness direction of the partition body layer 31 and the partition circuit layer 32, and is located between the two ends of the partition circuit layer 32. The upper circuit layer 12 is located in the perforation 33. The orthographic projection of the perforation 33 on the lower substrate layer 5 is within the range of the lower circuit layer 52, and the area of ​​the orthographic projection of the perforation 33 on the lower circuit layer 52 is larger than the area of ​​the orthographic projection of the upper circuit layer 12 on the lower circuit layer 52. The perforation 33 ensures that when the keyboard circuit board is pressed by external force, the upper circuit layer 12 can contact and conduct with the lower circuit layer 52 under pressure.

[0026] At least one connecting portion is provided on each side of the partition hole 33. In this embodiment, one connecting portion is provided on each side of the partition hole 33. Specifically, each connecting portion includes a through hole 311 penetrating the thickness direction of the partition body layer 31 and a conductive substrate (not shown) located in the through hole 311. The height direction of the through hole 311 is perpendicular to the length direction of the partition body layer 31, and the height of the through hole 311 is less than the height of the partition hole 33. The conductive substrate fills the through hole 311. In this embodiment, the conductive substrate is made of silver paste.

[0027] To ensure good conductivity between the interlayer circuit layer 32 and the lower circuit layer 52, the orthographic projections of the two through holes 311 on the lower substrate layer 5 are both located within the range of the lower circuit layer 52, and the horizontal distance from each through hole 311 to the partition hole 33 is greater than or equal to 10 mm. Furthermore, the length of the interlayer circuit layer 32 located on one side of the partition hole 33 is greater than or equal to the horizontal distance between a through hole 311 and the partition hole 33 on the same side, ensuring communication between the top of the connector and the bottom surface of the interlayer circuit layer 32. Further, the horizontal distance between the two through holes 311 in this embodiment is less than or equal to the length of the lower circuit layer 52, ensuring communication between the bottom of the connector and the top surface of the lower circuit layer 52, thereby ultimately ensuring that the interlayer circuit layer 32 and the lower circuit layer 52 are electrically connected through the connector.

[0028] The structural arrangement of the upper substrate layer 1, the partition layer 3, the lower substrate layer 5, and the connecting part on the partition layer 3 in this utility model can realize the conduction between the partition layer circuit layer 32 and the lower circuit layer 52, which can effectively reduce the number of manufacturing steps, while ensuring the thinness of the keyboard circuit board and avoiding the circuit board being too thick and heavy.

[0029] The above embodiments are only for illustrating the technical concept and features of this utility model. Their purpose is to enable those skilled in the art to understand the content of this utility model and implement it accordingly. They should not be used to limit the protection scope of this utility model. All equivalent changes or modifications made in accordance with the spirit and essence of this utility model should be included within the protection scope of this utility model.

Claims

1. A keyboard circuit board, characterized by, The spacer layer includes a spacer layer body layer and a spacer layer circuit layer on the upper surface of the spacer layer body layer, and the spacer layer body layer is provided with a connecting portion penetrating through the thickness direction of the spacer layer body layer, and the spacer layer circuit layer and the lower layer circuit layer are in conduction through the connecting portion.

2. The keyboard circuit board of claim 1, wherein, The connecting portion includes a through hole and a conductive base in the through hole, the conductive base fills the through hole, the through hole penetrates through the thickness direction of the spacer layer body layer, and the height direction of the through hole is perpendicular to the length direction of the spacer layer body layer.

3. The keyboard circuit board of claim 2, wherein, The upper substrate layer includes an upper surface layer and an upper layer circuit layer provided on the lower surface of the upper surface layer, and the area of the upper layer circuit layer is smaller than the area of the upper surface layer.

4. The keyboard circuit board of claim 3, wherein, The spacer layer is also provided with a spacer hole, the spacer hole penetrates through the thickness direction of the spacer layer body layer and the spacer layer circuit layer, and the upper layer circuit layer is located in the spacer hole.

5. The keyboard circuit board of claim 4, wherein, The spacer hole is located between the two ends of the spacer layer circuit layer, and at least one through hole is provided on both sides of the spacer hole, and the height of the through hole is smaller than the height of the spacer hole.

6. The keyboard circuit board of claim 5, wherein, The orthographic projection of the spacer hole and all through holes on the lower substrate layer is located within the range of the lower layer circuit layer, and the area of the orthographic projection of the spacer hole on the lower layer circuit layer is greater than the area of the orthographic projection of the upper layer circuit layer on the lower layer circuit layer.

7. The keyboard circuit board of claim 6, wherein, The horizontal distance from the through hole to the spacer hole is greater than or equal to 10 mm.

8. The keyboard circuit board of claim 7, wherein, The length of the spacer layer circuit layer on one side of the spacer hole is greater than or equal to the horizontal distance between one through hole far from the spacer hole and the spacer hole on the same side.

9. The keyboard circuit board of claim 8, wherein, The horizontal distance between one through hole far from the spacer hole among all through holes on one side of the spacer hole and another through hole far from the spacer hole among all through holes on the other side of the spacer hole is less than or equal to the length of the lower layer circuit layer.

10. The keyboard circuit board according to any one of claims 3 to 9, characterized in that, It also includes a first adhesive layer and a second adhesive layer, the first adhesive layer is used to connect the lower surface of the upper surface layer and the upper surface of the spacer layer circuit layer, and the second adhesive layer is used to connect the lower surface of the spacer layer body layer and the upper surface of the lower layer circuit layer.

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