Ball laying device

Abstract

The utility model provides a ball laying device. Comprising a supporting table, a supporting flow channel used for horizontally supporting a base plate, a vacuum suction table used for sucking the base plate on the supporting flow channel from the lower portion, a net rack located on the left-right direction side of the supporting table, a first linear driving module used for driving the supporting table to horizontally move to the position below the net rack in the left-right direction and a ball laying mechanism. According to the utility model, a jig is not needed, and only the specification of the net body on the net rack needs to be adjusted, so that the solder balls with different sizes can be implanted, the application range is wide, and the cost is greatly reduced.

Description

Technical Field

[0001] This utility model belongs to the field of semiconductor processing technology, and in particular relates to a ball-laying device. Background Technology

[0002] In precision manufacturing fields (such as semiconductor manufacturing), it is often necessary to attach balls to the substrate.

[0003] In the existing technology, solder balls are first laid flat in a fixture that corresponds to the ball placement position on the substrate, and then the solder balls in the fixture are transferred to the substrate to achieve ball placement. This method is limited by the difficulty of fixture processing, and cannot implant solder balls with a diameter of less than 150um. In addition, the fixture cost is high, and each type of substrate requires a corresponding fixture, which greatly increases the cost. Utility Model Content

[0004] Based on this, a ball-laying device is provided to address the aforementioned technical problems.

[0005] To solve the above-mentioned technical problems, the present invention adopts the following technical solution:

[0006] A ball-laying device, characterized in that it includes a support platform, a support channel for horizontally supporting a substrate, a vacuum suction stage for suctioning the substrate on the support channel from below, a mesh frame located on the left and right sides of the support platform, a first linear drive module for driving the support platform to move horizontally in the left and right directions to below the mesh frame, and a ball-laying mechanism. The support platform is fixed on the first linear drive module. The support channel and the vacuum suction stage are fixed on the support platform by a first lifting module and a second lifting module, respectively. The support channel includes two side plates arranged at left and right intervals. The inner surfaces of the two side plates each have a support edge for supporting the substrate. The vacuum suction stage is located between the two side plates, and its upper surface is initially lower than the support edge. The upper surface of the vacuum suction stage has adsorption holes. The mesh frame has a horizontal mesh body. The ball-laying mechanism includes a ball-laying head located above the mesh body and a horizontal drive module for driving the ball-laying head to move horizontally.

[0007] This invention does not require the use of fixtures as in the prior art. It only requires adjusting the specifications of the mesh frame to accommodate the implantation of solder balls of different sizes, thus having a wide range of applications and greatly reducing costs. Attached Figure Description

[0008] Figure 1 This is a schematic diagram of the structure of a bulb planting device used in this utility model;

[0009] Figure 2 This is a top view of a planting device used in this utility model.

[0010] Figure 3 This is a schematic diagram of the feed channel of a planting ball equipment used in this utility model;

[0011] Figure 4 This is a schematic diagram of the supporting flow channel and the horizontal adjustment mechanism of this utility model;

[0012] Figure 5 This is a partially enlarged view of the side plate supporting the flow channel of this utility model;

[0013] Figure 6 This is a schematic diagram of the structure of the pressure plate of this utility model;

[0014] Figure 7 This is a schematic diagram of the actuator of the glue-brushing device of a planting ball equipment used in this utility model.

[0015] Figure 8 This is a schematic diagram of the structure of the actuator of this utility model;

[0016] Figure 9 This is a schematic diagram of the cleaning mechanism of the adhesive brushing device in a planting ball equipment for which this utility model is applied;

[0017] Figure 10 This is a schematic diagram of the structure of the first collecting mechanism of this utility model;

[0018] Figure 11 This is a schematic diagram of the structure of the second collecting mechanism of this utility model;

[0019] Figure 12 This is a schematic diagram of four transfer devices of a bulb planting device used in this utility model;

[0020] Figure 13 This is a schematic diagram of the structure of a transfer device for a seeding equipment used in this utility model;

[0021] Figure 14 This is a schematic diagram of the jam detection principle of a transfer device for a planting ball equipment used in this utility model.

[0022] Figure 15 This is a schematic diagram illustrating the principle of tensioning and laying the ball in the net according to this utility model. Detailed Implementation

[0023] The embodiments of this utility model will be described below with reference to the accompanying drawings. It should be noted that the embodiments described in this specification are not exhaustive and do not represent the only embodiments of this utility model. The following corresponding embodiments are only for clearly illustrating the utility model content of this patent and are not intended to limit its implementation. For those skilled in the art, different variations and modifications can be made based on the described embodiments. Any obvious variations or modifications that fall within the technical concept and utility model content of this utility model are also within the protection scope of this utility model.

[0024] This application provides a ball-laying device, which is applied to a ball-planting equipment, such as... Figure 1 and Figure 2 As shown, the equipment includes a machine base 1100, a feed channel 1200, a glue application device 1300, a transfer channel 1400, a ball-laying device 1500, a discharge channel 1600, and four transfer devices 1700.

[0025] The feed channel 1200, the glue application device 1300, the transfer channel 1400, the ball spreading device 1500, and the discharge channel 1600 are arranged from back to front (Y direction) on the machine base 1100. The left side of the machine base 1100 has a vertical mounting plate 1110, and four transfer devices 1700 are set on the right side of the mounting plate 1110.

[0026] like Figure 3 As shown, the feed channel 1200 has two support plates 1210 arranged at a left-right (X-direction) interval. The inner side of each support plate 1210 has a drive belt assembly 1220 for feeding the substrate. The drive belt assemblies 1220 on the two support plates 1210 are synchronously driven by a first motor 1230. Simultaneously, the spacing between the two support plates 1210 can be adjusted by a second motor 1240 and a lead screw 1250 to accommodate substrates of different widths. Furthermore, the two support plates 1210 can also move back and forth under the action of a cylinder 1260. It should be noted that the above structure is conventional and therefore not described in detail.

[0027] The adhesive application device 1300 is used to apply adhesive to the ball placement points on the upper surface of the substrate, and the ball placement device 1500 is used to place balls on the ball placement points on the upper surface of the substrate after applying adhesive. Here, adhesive refers to flux and solder paste, and ball refers to solder ball.

[0028] The glue application device 1300 and the ball-laying device 1500 have basically the same structure. Taking the ball-laying device 1500 as an example, as follows... Figure 1 , Figure 2 and Figure 4As shown, it includes a support platform 1510, a support flow channel 1520, a vacuum suction stage 1530, a pressure plate 1540, a detection mechanism 1550, a horizontal adjustment mechanism 1560, a space frame 1570, a first linear drive module 1580, and an actuator 1590.

[0029] The support platform 1510 is mounted on the horizontal adjustment mechanism 1560 and is initially located on the left side.

[0030] The support channel 1520 is used to horizontally support the substrate. Initially, its rear end and front end are respectively connected to the front end of the transfer channel 1400 and the rear end of the discharge channel 1600. The support channel 1320 of the glue application device 1300 is initially connected to the front end of the feed channel 1200 and the rear end of the transfer channel 1400.

[0031] The support channel 1520 is fixed on the support platform 1510 by the first lifting module, and the lifting of the support channel 1520 can be realized by the first lifting module.

[0032] like Figure 4 and Figure 5 As shown, the support channel 1520 includes two side plates 1521 arranged at left and right intervals. The inner surfaces of the two side plates 1521 each have a support edge 1521a for supporting the substrate and a baffle 1521b located above the support edge 1521a. The baffle 1521b is used to constrain the substrate that is warped. In order to facilitate the entry of the warped substrate into the support channel 1520, the rear end of the support edge 1521a has a slope 1521c that gradually rises from back to front to the same height as the main body of the support edge 1521a. The slope 1521c and the rear end of the baffle 1521b form a flared opening.

[0033] It should be noted that the top of the side plate 1521 has multiple adsorption holes arranged horizontally at intervals in the front-back direction for adsorbing the mesh, while the top of the side plate of the support channel 1320 of the glue brushing device 1300 does not need to be provided with adsorption holes.

[0034] Similar to the two support plates 1210 of the feed channel 1200, the two side plates 1521 of the support channel 1520 can also have their spacing adjusted by a motor and a lead screw to accommodate substrates of different widths. This is a conventional technical method and will not be described in detail here.

[0035] The vacuum stage 1530 is used to hold the substrate on the support channel 1520 from below. It is located between the two side plates 1521 of the support channel 1520, and its upper surface is initially lower than the support edge 1521a. The upper surface has adsorption holes.

[0036] The vacuum suction table 1530 is fixed on the support table 1510 by the second lifting module, which can realize the lifting and lowering of the vacuum suction table 1530.

[0037] The pressure plate 1540 is used to press down the substrate on the vacuum suction stage 1530. It is located on the right side of the support stage 1510. The pressure plate 1540 is driven to rise and fall by the third lifting module 1541, which is fixed on the crossbeam 1120 above the machine base 1100. See [reference needed]. Figure 6 .

[0038] The inspection mechanism 1550 is used for visual inspection to check whether the horizontal position of the substrate on the vacuum suction stage 1530 deviates from the mesh on the mesh frame 1570. It is fixed on the crossbeam 1120 and located on the right side of the pressure plate 1540.

[0039] In this embodiment, the detection mechanism 1550 has two detection cameras. The two cameras can be moved by a linear drive module, so that they can simultaneously detect the marker points on the substrate or the marker points on the mesh to determine whether there is a deviation on the substrate.

[0040] The horizontal adjustment mechanism 1560 is used to adjust the horizontal position of the substrate when there is a deviation in the horizontal position of the substrate on the vacuum stage 1530. It is provided on the first linear drive module 1580.

[0041] Specifically, such as Figure 4 As shown, the horizontal adjustment mechanism 1560 includes a lower plate 1561, an upper plate 1562, a second linear drive module 1563, and a rotary drive module 1564. The lower plate 1561 is driven by the first linear drive module 1580 and slides in cooperation with the first slide rail 1581a on the base plate 1581 of the first linear drive module 1580. The upper plate 1562 is driven by the second linear drive module 1563 to achieve forward and backward horizontal movement. The second linear drive module 1563 is fixed on the upper surface of the lower plate 1561, and the upper plate 1562 slides in cooperation with the second slide rail 1561a on the lower plate 1561. The rotary drive module 1564 can be a motor, which is fixed on the upper surface of the upper plate 1562, and its output shaft is fixed to the support platform 1510.

[0042] When it is necessary to adjust the horizontal position of the substrate, the front and rear horizontal position of the support platform 1510 can be adjusted by the second linear drive module 1563, and the horizontal angle of the support platform 1510 can be adjusted by the rotation drive module 1564.

[0043] The space frame 1570 is located to the right of the testing mechanism 1550. It can be fixed above the machine base 1100 by support columns. The space frame 1570 has a horizontal space.

[0044] The first linear drive module 1580 is used to drive the support platform 1510 to move horizontally in the left and right directions, that is, to move from the initial left position to the right, and move sequentially to below the pressure plate 1540, the detection mechanism 1550 and the mesh frame 1570 (adjusted to be aligned with the mesh body of the mesh frame 1570).

[0045] For the glue application device 1300, its actuator 1390 is a glue application mechanism, such as... Figure 7 As shown, the glue application mechanism includes a glue application head 1391 located above the mesh body and a horizontal drive module 1392 for driving the glue application head 1391 to move horizontally. The glue application head 1391 is a commercially available product, and its structure is not limited here. The glue application head 1391 is connected to the horizontal drive module 1392, which is a linear drive module in the front-back direction. It is fixed on the mesh frame 1570 and can realize the horizontal movement of the glue application head 1391 in the front-back direction.

[0046] For the ball-laying device 1500, its actuator 1590 is a ball-laying mechanism, such as Figure 8 As shown, it includes a ball-laying head 1591 located above the net and a horizontal drive module 1592 for driving the ball-laying head 1591 to move horizontally. The ball-laying head 1591 is a commercially available product, and its structure is not limited here. The ball-laying head 1591 is connected to the horizontal drive module 1592. The horizontal drive module 1592 consists of a linear drive module 1592a in the front-back direction and a linear drive module 1592b in the left-right direction. The linear drive module 1592a is fixed to the linear drive module 1592b through a transmission beam 1592c. The linear drive module 1592b is fixed to the net frame 1570, thereby enabling the ball-laying head 1591 to move horizontally in the front-back and left-right directions.

[0047] In addition, such as Figure 7 As shown, the adhesive application device 1300 also includes a cleaning mechanism 1399 for cleaning residual adhesive on the back of the mesh. In this embodiment, as... Figure 9As shown, the cleaning mechanism 1399 includes a mounting base plate 1399a, a take-up roller 1399b, an unwind roller 1399c, and a guide rod 1399d. The mounting base plate 1399a is mounted on the linear drive module, enabling the cleaning mechanism 1399 to move horizontally in the front-to-back direction. The mounting base plate 1399a has a mounting bracket 1399f. The take-up roller 1399b, unwind roller 1399c, and guide rod 1399d are all mounted on the mounting bracket 1399f. The unwind roller 1399b... c is used to place the cleaning cloth roll. The take-up roller 1399b is driven by a motor. The cleaning cloth drawn from the cleaning cloth roll is connected to the take-up roller 1399b via several guide rods 1399d. The cleaning cloth is tensioned by the top block 1399e on the mounting frame at the highest point. During cleaning, under the drive of the linear drive module, the cleaning mechanism 1399 passes under the net body in the front-back direction. The tensioned surface of the cleaning cloth, which is tensioned by the top block 1399e, just contacts the lower surface of the net body, carrying away the residual adhesive on the lower surface.

[0048] like Figure 8 As shown, the ball-laying device 1500 also has a first collection mechanism 1598 for collecting residual solder balls on the back side of the net and a second collection mechanism 1599 for collecting residual solder balls on the front side of the net.

[0049] like Figure 10 As shown, the first collecting mechanism 1598 includes a mounting base plate 1598a and an adhesive roller 1598b. The mounting base plate 1598a is mounted on the linear drive module, enabling the first collecting mechanism 1598 to move horizontally in the front-back direction. The mounting base plate 1598a has a bearing bracket 1598d. The circumferential surface of the adhesive roller 1598b is adhesive, and it is fixed to the bearing bracket 1598d by rotating back and forth through the bearing. The bearing is fixed by a quick-release piece 1598c, which enables quick replacement of the adhesive roller 1598b. In use, driven by the linear drive module, the first collecting mechanism 1598 passes under the mesh in the front-back direction, and the top of the adhesive roller 1598b just contacts the lower surface of the mesh. Under the action of friction, the adhesive roller 1598b rotates, thus carrying away the residual solder balls on the back of the mesh.

[0050] like Figure 11As shown, the second collection mechanism 1599 includes a fixed beam 1599a in the front-to-back direction, a vacuum chamber 1599b fixed on the fixed beam 1599a, a collection chamber 1599c, and a long, slotted suction nozzle 1599d. The fixed beam 1599a is located above the mesh frame 1570 and is driven by a linear drive module, enabling horizontal movement left and right above the mesh. The linear drive module is fixed to the mesh frame 1570. The vacuum chamber 1599b has two first interfaces 1599e, and the collection chamber 1599c has two second interfaces 1599f and two third interfaces 1599g. The two first interfaces 1599e... The nozzle 1599d is connected to two third interfaces 1599g via pipelines, and two second interfaces 1599f are connected to a vacuuming device. The nozzle 1599d is a long strip-shaped box structure in the front-to-back direction, with a suction port on its lower side. The inner cavity of the nozzle 1599d is connected to the inner cavity of the vacuum chamber 1599b. During operation, the vacuuming device evacuates the inner cavity of the nozzle 1599d through the two second interfaces 1599f, the collection chamber 1599c, the two third interfaces 1599g, the two first interfaces 1599e, and the vacuum chamber 1599b, thereby removing the residual solder balls on the front of the mesh. Finally, the solder balls are collected in the collection chamber 1599c.

[0051] The structures of the transfer channel 1400 and the discharge channel 1600 are the same as those of the feed channel 1200, and will not be described in detail here.

[0052] All of the above modules can be made using either pneumatic cylinders or electric cylinders.

[0053] like Figure 2 As shown, the four transfer devices 1700 are respectively used to push the substrate on the feed channel 1200 to the support channel 1320 of the glue application device 1300, push the substrate on the support channel 1320 of the glue application device 1300 to the transfer channel 1400, push the substrate on the transfer channel 1400 to the support channel 1520 of the ball-laying device 1500, and push the substrate on the support channel 1520 of the ball-laying device 1500 to the discharge channel 1600.

[0054] Among them, such as Figure 13 As shown, the transfer device 1700 includes a push plate 1710, a transmission arm 1720, and a drive mechanism.

[0055] The push plate 1710 includes a vertical plate 1711 and a horizontal plate 1712. The vertical plate 1711 is used to push the substrate forward horizontally on the rear side of the substrate in the flow channel. The upper end of the vertical plate 1711 is connected to the lower surface of the rear end of the horizontal plate 1712. The upper surface of the rear end of the horizontal plate 1712 has a top seat 1713.

[0056] The transmission arm 1720 is used to drive the push plate 1710 to move up and down and horizontally in the front and back directions. The transmission arm 1720 is in the left and right direction. The lower surface of its right end is fixed to the first plate 1721, and the upper surface of the right end of the first plate 1721 is connected to the second plate 1722.

[0057] The second plate 1722 is located above the horizontal plate 1712. The two are connected by a combination of slider and slide rail to form a front-to-back sliding fit. An elastic self-recovering component 1740, such as a spring, is connected between the second plate 1722 and the horizontal plate 1712 in the front-to-back horizontal direction. The top seat 1713 is exactly abutting against the rear side of the second plate 1722.

[0058] The elastic self-recovering component 1740 acts as a buffer to prevent damage to the substrate during the process of the pusher plate 1710 pushing the substrate.

[0059] The front end of the spring is connected to the first fixing pin 1722a on the lower surface of the second plate 1722, and the rear end of the spring is connected to the second fixing pin 1712a on the right side of the horizontal plate 1712.

[0060] The drive mechanism is used to drive the transmission arm 1720 to move up and down and horizontally in the forward and backward directions, such as... Figure 13 As shown, it consists of a lifting module 1731 and a linear module 1732 that drives the lifting module 1731 to move horizontally in the front-back direction. The lifting module 1731 can be a pneumatic cylinder or an electric cylinder. It is mounted on the linear module 1732 via a transmission plate 1733 and connected to the left end of the transmission arm 1720. At the same time, the transmission plate 1733 is slidably engaged with the guide rail 1111 on the right side of the mounting plate 1110 of the machine base 1100. The linear module 1732 is a pulley assembly, which is mounted on the right side of the mounting plate 1110.

[0061] When the transfer device 1700 is working, under the action of the drive mechanism 1730, the push plate 1710 first moves to the rear side above the target substrate, and then descends so that the front side of the vertical plate 1711 is aligned with the rear side of the target substrate. Then, the push plate 1710 moves forward to push the target substrate.

[0062] In practical use, if the substrate is warped, it may cause jamming during the pushing process. In order to detect jamming in a timely manner, such as Figure 14 As shown, a detection marking section 1712b is provided in the middle of the left side of the horizontal plate 1712, and a sensor 1721a arranged in the left-right direction is embedded in the back of the first plate 1721 of the transmission arm 1720. The sensor 1721a is used to detect the detection marking section 1712b. When a jam occurs, the push plate 1710 will slide backward. When the sensor 1721a cannot detect the marking section 1712b, it indicates that a jam has occurred.

[0063] During operation, the substrate first enters the feed channel 1200, and then the transfer device 1700 moves the substrate to the support channel of the adhesive application device 1300.

[0064] The vacuum stage of the adhesive application device 1300 rises and lifts the substrate on the support channel. At the same time, the support stage moves with the vacuum stage to the bottom of the pressure plate. After the pressure plate 1340 presses the substrate, the vacuum stage holds the substrate. Then, the support stage moves with the vacuum stage to the bottom of the detection mechanism 1350 for detection. If it is necessary to adjust the horizontal position of the substrate, it is adjusted by the horizontal adjustment mechanism.

[0065] Afterwards, the support platform, along with the vacuum suction stage, moves to below the grid frame 1370. The vacuum suction stage raises the substrate to a predetermined height, where the adhesive application mechanism applies adhesive.

[0066] After the adhesive is applied, the support platform returns to its original position with the vacuum suction stage. After returning to its original position, the vacuum suction stage descends and returns the substrate to the support flow channel. The transfer device 1700 then moves the substrate to the transfer flow channel 1400.

[0067] When the ball-laying device 1500 is idle, the transfer device 1700 moves the substrate from the transfer channel 1400 to the support channel of the ball-laying device 1500.

[0068] Then, the vacuum suction stage of the ball-laying device 1500 rises and lifts the substrate on the support channel, while simultaneously... Figure 6 As shown, the support platform moves with the vacuum suction stage to the bottom of the pressure plate. After the pressure plate 1540 presses the substrate 2, the vacuum suction stage picks up the substrate. Then, the support platform moves with the vacuum suction stage to the bottom of the detection mechanism 1550 for detection. If it is necessary to adjust the horizontal position of the substrate, it is adjusted by the horizontal adjustment mechanism.

[0069] Subsequently, the support platform, carrying the vacuum suction stage, moves to below the mesh frame 1570. The support channel rises, and the mesh 1571 is suctioned by the suction holes at the top of its side plate 1521. Simultaneously, the vacuum suction stage raises the substrate, pressing it against the mesh 1571, which is stretched into the tension area 1571a formed by the suction of the two side plates 1521 of the support channel. Since the spacing between the two side plates 1521 of the support channel is adapted to the left and right width of the substrate, as... Figure 15 As shown, the width of the tensioned area 1571a is only slightly larger than the width of the substrate, so that the deformation of the tensioned area 1571a after being pushed up by the substrate is very small and will not affect the ball placement position.

[0070] Next, the ball-laying mechanism lays the balls.

[0071] After the ball is laid, the support platform returns to its original position with the vacuum suction platform. After returning to its original position, the vacuum suction platform descends and returns the substrate to the support flow channel. The transfer device 1700 then moves the substrate to the discharge flow channel 1600.

[0072] As can be seen from the above, the ball-laying device provided in this application embodiment does not require the use of jigs as in the prior art. It can adapt to the implantation of solder balls of different sizes simply by adjusting the specifications of the mesh frame. It has a wide range of applications and greatly reduces costs.

[0073] Obviously, those skilled in the art should recognize that the above embodiments are only used to illustrate the present utility model and are not intended to limit the present utility model. Any changes or modifications to the above embodiments within the essential spirit of the present utility model will fall within the scope of the claims of the present utility model.

Claims

1. A ball laying device, characterized in that, The support table, the support flow channel for horizontally supporting the substrate, the vacuum suction table for sucking the substrate on the support flow channel from below, the net frame located on the left and right direction sides of the support table, the first linear drive module for driving the support table to horizontally move to below the net frame, and the ball laying mechanism, the support table is fixed on the first linear drive module, the support flow channel and the vacuum suction table are fixed on the support table through the first lifting module and the second lifting module respectively, the support flow channel includes two side plates arranged at intervals left and right, the inner side surface of the two side plates is provided with a supporting edge for supporting the substrate, the vacuum suction table is located between the two side plates, and the upper surface thereof is initially lower than the supporting edge, the upper surface of the vacuum suction table is provided with a suction hole, the net frame is provided with a horizontal net body, and the ball laying mechanism includes a ball laying head located above the net body and a horizontal drive module for driving the ball laying head to horizontally move.

2. A ball laying device according to claim 1, wherein Further comprising a pressing plate for pressing the substrate on the vacuum suction table and a third lifting module for driving the pressing plate, the pressing plate is located between the support table and the net frame.

3. A ball laying device according to claim 2, wherein Further comprising a detection mechanism for visually detecting whether the horizontal position of the substrate on the vacuum suction table deviates from the net body and a horizontal adjustment mechanism for adjusting the horizontal position of the substrate, the detection mechanism is located between the pressing plate and the net frame, the horizontal adjustment mechanism is arranged on the first linear drive module, and the support table is fixed on the horizontal adjustment mechanism.

4. A ball laying device according to claim 3, wherein The horizontal adjustment mechanism includes a lower plate, an upper plate, a second linear drive module for driving the upper plate to horizontally move forward and backward, and a rotation drive module for driving the support table to horizontally rotate, the lower plate is driven by the first linear drive module, the second linear drive module is fixed on the lower plate, and the rotation drive module is fixed on the upper plate.

5. A ball laying device according to claim 1, wherein The inner side surface of the side plate of the support flow channel is further provided with a blocking edge located above the supporting edge, and the rear end of the supporting edge is provided with a slope gradually rising from rear to front, which forms a flared portion with the rear end of the blocking edge.

6. A ball laying device according to claim 1, wherein The top of the side plate of the support flow channel is provided with a suction hole for sucking the net body.

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