Anti-blocking tin dissolving screen plate
By incorporating conical holes in the stencil, the problem of solder particle blockage is solved, enabling rapid unblocking of the stencil, ensuring a stable supply of solder ions, and preventing production interruptions and quality losses.
Patent Information
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- Filing Date
- 2025-03-31
- Publication Date
- 2026-03-17
AI Technical Summary
Existing molten solder stencils are prone to clogging when solder particles move at high speeds, resulting in insufficient supply of solder ions, which affects production efficiency and product quality. Furthermore, existing unclogging methods are time-consuming, labor-intensive, and may cause oxidation and cost waste.
The stencil body features a conical hole design, with the larger hole end located on the upper surface and the smaller hole end on the lower surface. The cone angle ranges from 10 to 50 degrees, designed to prevent solder particles from getting stuck and ensure that the solder particles detach quickly under liquid impact.
It effectively prevents stencil blockage, reduces manpower and material consumption, ensures tin ion supply, avoids product quality defects and downtime, and reduces cost waste.
Smart Images
Figure CN223995824U_ABST
Abstract
Description
Technical Field
[0001] This utility model belongs to the technical field of electroplating tin equipment, specifically relating to an anti-clogging molten tin mesh. Background Technology
[0002] In the tin-dissolving process of tin-plating sheet production, tin granules are added to a tin-dissolving tank for dissolution. There are two stages in the tin-dissolving process where the tin-dissolving stencil is prone to clogging.
[0003] During the dissolution process, these tin particles are lifted and suspended high above the stencil by the high-speed, upward-flowing liquid. These tin particles are dissolved into tin ions (Sn). 2+ As the amount of solder decreases, the circulation needs to be stopped and the solder granules replenished after a period of time. When the circulation stops, tons of solder granules, no longer supported by the liquid, fall rapidly from a high position onto the molten solder stencil, which is the first stage where the molten solder stencil is prone to clogging.
[0004] After adding solder, circulation needs to be started to melt the solder. At this time, the solder that has leaked to the bottom of the melting stencil, as well as the solder that was previously brought to the bottom of the melting stencil by the circulation, will be pushed upwards by the high-speed liquid towards the melting stencil. This is the second stage where the melting stencil is prone to clogging.
[0005] Currently available solder stencils are made by drilling cylindrical holes in a metal plate. When solder particles are thrown downwards and pushed upwards towards the stencil, they can easily get stuck in these cylindrical holes, clogging the stencil. If this clogging is not addressed, tin ions (Sn) will... 2+ Insufficient or even halted supply can lead to product quality defects, forced speed reductions, or even shutdowns in production lines.
[0006] Once the solder stencil becomes clogged, there are only two solutions: one is to remove the tons of solder from the solder pot, remove the solder stencil from the solder pot, and then poke or drill open the thousands of holes in the solder stencil one by one before reinstalling the solder stencil and solder; the other is to adjust the soldering parameters and continue soldering to slowly dissolve and clear the solder in the holes of the solder stencil.
[0007] Obviously, the first method requires a significant amount of manpower, resources, and a full day. During this time, the tin-dissolving system is completely inoperable, and the production line will quickly shut down due to a complete lack of tin ion supply. Therefore, this method is generally not used. The second method also takes several hours to about a day, providing the production line with a small amount of tin ions, but it also carries the risk of product quality defects, forced speed reduction, or even shutdown. Furthermore, a large amount of oxygen will accumulate under the tin-dissolving stencil during this process. This excess oxygen will inevitably destroy the expensive tin ions (Sn) in the solution that are about to be used for electroplating. 2+ It oxidizes into worthless or even harmful tin sludge, resulting in huge cost waste and quality loss.
[0008] In summary, dealing with stencil blockage requires a significant amount of time, which may lead to product quality defects, forced speed reductions, or even shutdowns, resulting in substantial cost waste and quality losses. Utility Model Content
[0009] In view of this, the purpose of this utility model is to provide an anti-clogging molten solder mesh to solve the problems existing in the prior art.
[0010] To achieve the above objectives, the present invention adopts the following technical solution:
[0011] A stencil for preventing clogging includes a circular stencil body, which is fixedly installed inside a solder melting pot. Multiple conical holes are evenly arranged in the middle of the stencil body, with the large and small ends of the conical holes located on the upper and lower surfaces of the stencil body after actual installation.
[0012] In a preferred embodiment of this utility model, the plurality of conical holes are evenly distributed on the mesh plate body in a regular hexagonal honeycomb pattern.
[0013] In a preferred embodiment of this utility model, the cone angle of the conical hole ranges from 10 to 50 degrees.
[0014] In a preferred embodiment of this utility model, the mesh plate body is machined from a single piece of 316L stainless steel.
[0015] In a preferred embodiment of this utility model, a plurality of bolt mounting holes are evenly provided near the periphery of the mesh plate body.
[0016] Compared with the prior art, the present invention has the following beneficial effects:
[0017] This invention solves the stencil blockage problem by providing multiple conical holes on the stencil body. Because these holes have a conical angle of 10-50 degrees and the openings face upwards, the solder particles stuck in the holes are easily detached from the stencil under the high-speed, upward-flowing liquid impact after circulation begins, thus quickly resolving the stencil blockage issue. This eliminates the need for extensive time, manpower, and resources for unblocking, thereby ensuring the integrity of the tin ions (Sn). 2+ The supply of ( ) can reduce or avoid product quality defects, forced speed reduction, or even shutdown caused by blockages. Attached Figure Description
[0018] Figure 1 This is a schematic diagram of the main structure of this utility model;
[0019] Figure 2 yes Figure 1 A schematic diagram of the cross-sectional structure at point AA;
[0020] Figure 3 yes Figure 1 A magnified structural diagram at point B;
[0021] Figure 4 yes Figure 2 A magnified structural diagram of C.
[0022] In the diagram: 1. Mesh plate body; 2. Conical hole; 201. Large hole end; 202. Small hole end; 3. Bolt mounting hole. Detailed Implementation
[0023] To make the objectives, technical solutions, and advantages of the embodiments of this utility model clearer, the technical solutions of the embodiments of this utility model will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only some embodiments of this utility model, and not all embodiments. The components of the embodiments of this utility model described and shown in the accompanying drawings can generally be arranged and designed in various different configurations.
[0024] The present invention will be further described below with reference to the accompanying drawings and specific embodiments.
[0025] Please refer to Figure 1-4 As shown, an embodiment of this application provides an anti-clogging solder stencil, including a single machined stencil body 1 made of 316L stainless steel. The stencil body 1 has multiple conical holes 2. The larger end 201 of the conical holes 2 is located on the upper surface of the stencil body 1 after actual installation, and the smaller end 202 of the conical holes 2 is located on the lower surface of the stencil body 1 after actual installation. The multiple conical holes 2 are evenly distributed on the stencil body 1 and are distributed in a hexagonal honeycomb pattern. That is, except for the outermost conical hole 2, any conical hole 2 is surrounded by 6 conical holes 2 at equal angles and distances. The conical angle of the conical holes 2 ranges from 10 to 50 degrees. The stencil body 1 has multiple bolt mounting holes 3. The stencil body 1 is installed into the solder stencil pot through bolts and bolt mounting holes 3.
[0026] Specifically, the stencil body 1 is provided with multiple conical holes 2. When the solder pot stops circulating, solder particles fall downwards onto the stencil body 1, or when circulation starts and solder particles are pushed upwards onto the solder pot, they may get stuck in the conical holes 2 of the stencil body 1. Since the conical holes 2 are set with a cone angle of 10 to 50 degrees and the cone opening faces upwards, after circulation starts, the solder particles stuck in the conical holes 2 are easily detached from the solder pot under the high-speed, upward liquid impact, thus quickly solving the stencil blockage problem. This eliminates the need for a lot of time, manpower, and resources to clear the blockage, thereby ensuring the integrity of the solder ions (Sn). 2+ The supply of ( ) can reduce or avoid product quality defects, forced speed reduction, or even shutdown caused by blockages.
[0027] Finally, it should be noted that the above description is merely a preferred embodiment of this utility model and is not intended to limit the scope of protection of this utility model. Any modifications, equivalent substitutions, improvements, etc., made within the spirit and principles of this utility model should be included within the scope of protection of this utility model.
Claims
1. A clogging-preventing soldering mesh screen comprising a mesh screen body (1) in a circular shape, which is fixedly installed inside a soldering pot, characterized in that: The middle part of the screen plate body (1) is uniformly arranged with a plurality of conical holes (2), the large hole end (201) and the small hole end (202) of the conical hole (2) are located on the upper surface and the lower surface of the screen plate body (1) after actual installation respectively.
2. The anti-jamming tin melting mesh screen according to claim 1, characterized in that: A plurality of the conical holes (2) are uniformly distributed in a regular hexagonal honeycomb shape on the screen plate body (1).
3. The anti-jamming tin melting mesh screen according to claim 2, characterized in that: The conical angle of the conical hole (2) ranges from 10 to 50 degrees.
4. The anti-jamming tin melting mesh screen according to claim 3, characterized in that: The screen plate body (1) is made of a whole piece of 316L stainless steel material.
5. The anti-jamming tin melting mesh screen of claim 4, wherein: A plurality of bolt mounting holes (3) are uniformly arranged near the periphery of the screen plate body (1).