Tool testing fixture for sealing and testing semiconductor

Abstract

The utility model provides a tool testing fixture for sealing and testing a semiconductor, which comprises a sleeve, an overturning assembly, a limiting assembly, a movable seat, a connecting assembly and a probe main body, and is characterized in that the overturning assembly is arranged on the surface of the sleeve and comprises an overturning cover, a rotating frame and two fixing blocks, the rotating frame is connected to the surface of the overturning cover, and the limiting assembly is arranged on the rotating frame; the two fixing blocks are rotationally connected to the left side and the right side of the rotating frame through rotating shafts. The limiting assembly is arranged between the sleeve and the overturning cover, the movable seat is arranged in the sleeve, the connecting assembly is arranged on one side of the movable seat, and the probe body is arranged on one side of the connecting assembly. According to the tool testing fixture for sealing and testing the semiconductor, the overturning cover is arranged on one side of the surface of the sleeve, the rotating frame with the two fixing blocks and the limiting assembly are operated in a matched mode, when the probe body is connected with the movable seat, the overturning cover can be opened conveniently, the movable seat can be manually fixed conveniently in the installation process, and the detection efficiency is improved. Therefore, the connection convenience can be improved.

Description

Technical Field

[0001] This utility model relates to the field of semiconductor packaging and testing, and in particular to a tooling fixture for semiconductor packaging and testing. Background Technology

[0002] The semiconductor manufacturing process consists of wafer manufacturing, wafer testing, chip packaging, and post-packaging testing. Semiconductor packaging and testing refers to the process of processing wafers that have passed testing into individual chips according to product models and functional requirements. By testing semiconductor products before packaging, faulty products can be detected in a timely manner, reducing subsequent losses.

[0003] The prior art patent application with publication number CN222189365U describes a method that uses a reliable buffer mounting unit to effectively install and fix the buffer, preventing displacement of the buffer inside the sleeve. A plug is inserted into the lower end of the buffer, and a locking block locks the buffer from below, thereby applying the elastic force of the buffer to the socket, so that the probe can have an automatic reset restoring force when it retracts.

[0004] It features a reliable probe stabilizing unit, a connecting short rod for installing arc-shaped clamps, and three arc-shaped clamps that clamp together on the outside of the cylindrical socket, thereby ensuring smooth sliding of the socket in the vertical direction.

[0005] It features a reliable buffer mounting unit that effectively installs and secures the buffer, preventing displacement of the buffer inside the sleeve. A plug is inserted into the lower end of the buffer, and a locking block secures the buffer from below, thus applying the elastic force of the buffer to the socket. This allows the probe to have an automatic reset force when retracted. It also features a reliable probe stabilizing unit. A connecting short rod is used for the installation of arc-shaped clamps. The three arc-shaped clamps together hold the outer side of the cylindrical socket, ensuring smooth vertical sliding of the socket.

[0006] However, current devices install probes internally via a plug-and-play method. The internal mounting components of the sleeve are movable, which can hinder convenient probe installation. Therefore, it is necessary to provide a semiconductor packaging and testing fixture to solve the aforementioned technical problems. Utility Model Content

[0007] This utility model provides a tooling fixture for semiconductor packaging and testing, which solves the problem that current devices install probes by plugging and unplugging them inside the device. However, the mounting components inside the sleeve are movable connections, which can easily make it difficult to install the probes.

[0008] To solve the above-mentioned technical problems, this utility model provides a semiconductor packaging and testing fixture, comprising:

[0009] The device comprises a sleeve, a flipping assembly, a limiting assembly, a movable seat, a connecting assembly, and a probe body. The flipping assembly is disposed on the surface of the sleeve and includes a flipping cover, a rotating frame, and two fixing blocks. The rotating frame is connected to the surface of the flipping cover, and the two fixing blocks are rotatably connected to the left and right sides of the rotating frame via a rotating shaft.

[0010] The limiting component is disposed between the sleeve and the flip cover;

[0011] The movable seat is disposed inside the sleeve, the connecting component is disposed on one side of the movable seat, and the probe body is disposed on one side of the connecting component.

[0012] Preferably, the limiting component includes a movable limiting sleeve, two limiting blocks, and two limiting grooves. The two limiting blocks are symmetrically connected to both sides of the inner wall of the movable limiting sleeve, and the two limiting grooves are symmetrically opened between the sleeve and the flip cover. The movable limiting sleeve is used to limit the flip cover.

[0013] Preferably, the connecting assembly includes a connecting sleeve and a connecting head, the connecting head being threaded to one end of the connecting sleeve, and the connecting sleeve being connected to the center position of one side of the movable seat. The connecting sleeve and the connecting head are used to connect the probe body and the movable seat.

[0014] Preferably, a buffer is fitted on the surface of the movable seat, and multiple limiting blocks are connected inside the sleeve and below the movable seat.

[0015] Preferably, one end of the sleeve is provided with a disassembly cap.

[0016] Preferably, a movable component is provided between the flip cover and the rotating frame. The movable component includes a fixed rod, a movable sleeve, an L-shaped fixed rod, a fixing bolt, and a stop. The movable sleeve is fitted onto the surface of the fixed rod, the L-shaped fixed rod is connected to one side of the movable sleeve, and the L-shaped fixed rod is connected to one side of the flip cover.

[0017] Preferably, the fixing bolt is disposed between the movable sleeve and the fixing rod, and the stop block is connected to one end of the fixing rod.

[0018] Compared with related technologies, the semiconductor packaging and testing fixture provided by this utility model has the following advantages:

[0019] This utility model provides a tooling fixture for semiconductor packaging and testing. A flip cover, a rotating frame with two fixing blocks, and a limiting component are provided on one side of the sleeve surface to cooperate in operation. When the probe body is connected to the movable seat, the flip cover can be opened to facilitate manual fixing of the movable seat during the installation process, thereby increasing the convenience of connection. Attached Figure Description

[0020] Figure 1 This is a schematic diagram of the structure of a first embodiment of a semiconductor packaging and testing fixture provided by this utility model;

[0021] Figure 2 for Figure 1 The enlarged schematic diagram of part A shown below;

[0022] Figure 3 for Figure 1 A three-dimensional structural diagram of the tooling and inspection fixture shown;

[0023] Figure 4 for Figure 3 The enlarged schematic diagram of section B is shown below;

[0024] Figure 5 This is a schematic diagram of the second embodiment of a semiconductor packaging and testing fixture provided by this utility model;

[0025] Figure 6 for Figure 5 The enlarged schematic diagram of section C is shown.

[0026] Labels in the diagram: 1. Sleeve;

[0027] 2. Flip-over assembly; 21. Flip-over cover; 22. Rotating frame; 23. Fixing block;

[0028] 3. Limiting component; 31. Movable limiting sleeve; 32. Limiting block; 33. Limiting groove;

[0029] 4. Limit block; 5. Movable seat;

[0030] 6. Connecting components; 61. Connecting sleeve; 62. Connector;

[0031] 7. Probe body; 8. Buffer; 9. Removable cover;

[0032] 10. Movable component; 101. Fixing rod; 102. Movable sleeve; 103. L-shaped fixing rod; 104. Fixing bolt; 105. Stop block. Detailed Implementation

[0033] The present invention will be further described below with reference to the accompanying drawings and embodiments.

[0034] First Embodiment

[0035] Please refer to the following: Figure 1 , Figure 2 , Figure 3 and Figure 4 ,in, Figure 1This is a schematic diagram of the structure of a first embodiment of a semiconductor packaging and testing fixture provided by this utility model; Figure 2 for Figure 1 The enlarged schematic diagram of part A shown below; Figure 3 for Figure 1 A three-dimensional structural diagram of the tooling and inspection fixture shown; Figure 4 for Figure 3 The enlarged schematic diagram of section B is shown. A semiconductor packaging and testing fixture includes:

[0036] The sleeve 1, the flipping assembly 2, the limiting assembly 3, the movable seat 5, the connecting assembly 6, and the probe body 7 are provided. The flipping assembly 2 is disposed on the surface of the sleeve 1. The flipping assembly 2 includes a flipping cover 21, a rotating frame 22, and two fixing blocks 23. The rotating frame 22 is connected to the surface of the flipping cover 21, and the two fixing blocks are rotatably connected to the left and right sides of the rotating frame 22 through a rotating shaft.

[0037] The limiting component 3 is disposed between the sleeve 1 and the flip cover 21;

[0038] The movable seat 5 is disposed inside the sleeve 1, the connecting component 6 is disposed on one side of the movable seat 5, and the probe body 7 is disposed on one side of the connecting component 6.

[0039] The limiting component 3 includes a movable limiting sleeve 31, two limiting blocks 32 and two limiting grooves 33. The two limiting blocks 32 are symmetrically connected to both sides of the inner wall of the movable limiting sleeve 31, and the two limiting grooves 33 are symmetrically opened between the sleeve 1 and the flip cover 21. The movable limiting sleeve 31 is used to limit the flip cover 21.

[0040] The limiting block 32 and the limiting groove 33 are T-shaped and matched. The limiting groove 33 is opened between the sleeve 1 and the flip cover 21. One end of the two limiting blocks 32 is attached to the surface of the sleeve 1. A placement groove matching the flip cover 21 is opened on the surface of the sleeve 1. A through hole is opened at one end of the sleeve 1 and the flip cover 22 to facilitate the movement of the probe body 7.

[0041] The connecting component 6 includes a connecting sleeve 61 and a connecting head 62. The connecting head 62 is threaded to one end of the connecting sleeve 61. The connecting sleeve 61 is connected to the center position of one side of the movable seat 5. The connecting sleeve 61 and the connecting head 62 are used to connect the probe body 7 and the movable seat 5.

[0042] The surface of the movable seat 5 is fitted with a buffer member 8, and a plurality of limiting blocks 4 are connected inside the sleeve 1 and below the movable seat 5.

[0043] One end of the sleeve 1 is provided with a disassembly cover 9.

[0044] The working principle of the semiconductor packaging and testing fixture provided by this utility model is as follows:

[0045] When using the probe body 7, first, by pulling the movable limiting sleeve 31, it moves to one side of the sleeve 1 under the action of the limiting block 32 and the limiting groove 33. After the movable limiting sleeve 31 separates from the flip cover 21, the flip cover 21 is flipped open under the action of the rotating frame 22. After the flip cover 21 is opened, the connector 62 at one end of the probe body 7 is threadedly connected to the connecting sleeve 61 on one side of the movable seat 5.

[0046] Compared with related technologies, the semiconductor packaging and testing fixture provided by this utility model has the following advantages:

[0047] This utility model provides a tooling fixture for semiconductor packaging and testing. A flip cover 21, a rotating frame 22 with two fixing blocks 23, and a limiting component 3 are provided on one side of the surface of the sleeve 1. When the probe body 7 is connected to the movable seat 5, the flip cover 21 can be opened to facilitate manual fixing of the movable seat 5 during the installation process, thereby increasing the convenience of connection.

[0048] Second Embodiment

[0049] Please refer to the following: Figure 5 and Figure 6 Based on the semiconductor packaging and testing fixture provided in the first embodiment of this application, the second embodiment of this application proposes another semiconductor packaging and testing fixture. The second embodiment is merely a preferred embodiment of the first embodiment, and the implementation of the second embodiment will not affect the separate implementation of the first embodiment.

[0050] Specifically, the difference in the semiconductor packaging and testing fixture provided in the second embodiment of this application is that a movable component 10 is provided between the flip cover 21 and the rotating frame 22. The movable component 10 includes a fixed rod 101, a movable sleeve 102, an L-shaped fixed rod 103, a fixing bolt 104, and a stop block 105. The movable sleeve 102 is sleeved on the surface of the fixed rod 101. The L-shaped fixed rod 103 is connected to one side of the movable sleeve 102 and to one side of the flip cover 21.

[0051] The fixing rod 101 is connected to one side of the rotating frame 22. A fixing hole adapted to the fixing bolt 104 is provided on the surface of the fixing rod 101. The use of the stop block 105 can prevent the movable sleeve 102 from falling off.

[0052] The fixing bolt 104 is disposed between the movable sleeve 102 and the fixing rod 101, and the stop block 105 is connected to one end of the fixing rod 101.

[0053] The working principle of the semiconductor packaging and testing fixture provided by this utility model is as follows:

[0054] In use, when the flip cover 21 is separated from the sleeve 1, the fixing bolt 104 between the fixing rod 101 and the movable sleeve 102 is first removed. After the fixing bolt 104 is removed, the flip cover 21 is pulled to drive the L-shaped fixing rod 103 to move the movable sleeve 102 on the surface of the fixing rod 101. When a distance is created between the flip cover 21 and the sleeve 1, the flip cover 21 can be opened using the rotating frame 22.

[0055] Compared with related technologies, the semiconductor packaging and testing fixture provided by this utility model has the following advantages:

[0056] This utility model provides a tooling fixture for semiconductor packaging and testing. An active component 10 is provided between the flip cover 21 and the rotating frame 22 to facilitate the flip cover 21 to be pulled apart from the sleeve 1 when the flip cover 21 is opened, so as to facilitate the flip cover 21 to be flipped.

[0057] The above description is merely an embodiment of this utility model and does not limit the patent scope of this utility model. Any equivalent structural or procedural transformations made based on the content of this utility model specification and drawings, or direct or indirect applications in other related technical fields, are similarly included within the patent protection scope of this utility model.

Claims

1. A tooling fixture for semiconductor packaging and testing, characterized in that, Include: The sleeve, the turnover assembly, the limiting assembly, the movable seat, the connecting assembly and the probe main body, the turnover assembly is arranged on the surface of the sleeve, the turnover assembly includes turnover cover, rotating frame and two fixed blocks, the rotating frame is connected to the surface of the turnover cover, two fixed blocks are rotatably connected to the left and right sides of the rotating frame through rotating shaft; The limiting assembly is arranged between the sleeve and the turnover cover; The movable seat is arranged in the sleeve, the connecting assembly is arranged on one side of the movable seat, and the probe main body is arranged on one side of the connecting assembly.

2. The semiconductor package tooling gauge of claim 1, wherein: The limiting assembly includes an active limiting sleeve, two limiting blocks and two limiting grooves, two limiting blocks are symmetrically connected to the inner wall of the active limiting sleeve, two limiting grooves are symmetrically arranged between the sleeve and the turnover cover, and the active limiting sleeve is used for limiting the turnover cover.

3. The semiconductor package tooling gauge of claim 1, wherein: The connecting assembly includes a connecting sleeve and a connecting head, the connecting head is threadedly connected to one end of the connecting sleeve, the connecting sleeve is connected to the center of one side of the movable seat, and the connecting sleeve and the connecting head are used for connecting the probe main body and the movable seat.

4. The tool gauge for semiconductor packaging according to Claim 1, wherein The surface of the movable seat is provided with a buffer, and a plurality of limiting blocks are connected to the inside of the sleeve below the movable seat.

5. The semiconductor package tooling gauge of claim 1, wherein: One end of the sleeve is provided with a dismounting cover.

6. The semiconductor package tooling gauge of claim 1, wherein: The turnover cover and the rotating frame are provided with an active assembly, the active assembly includes a fixed rod, an active sleeve, an L-shaped fixed rod, a fixed bolt and a stopper, the active sleeve is sleeved on the surface of the fixed rod, the L-shaped fixed rod is connected to one side of the active sleeve, and the L-shaped fixed rod is connected to one side of the turnover cover.

7. The semiconductor package tooling fixture of claim 6, wherein: The fixed bolt is arranged between the active sleeve and the fixed rod, and the stopper is connected to one end of the fixed rod.

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