IC element batch detection device

By introducing an upper pressure component and a limiting structure into the IC component testing device, the problem of inaccurate pressure control during component movement is solved, enabling reliable component placement and efficient testing.

CN224005216UActive Publication Date: 2026-03-17HON PRECISION TECH (SUZHOU) LTD
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Patent Information

Authority / Receiving Office
CN · China
Patent Type
Utility models(China)
Current Assignee / Owner
Filing Date
2025-01-22
Publication Date
2026-03-17

AI Technical Summary

Technical Problem

Existing IC component testing devices have difficulty accurately controlling the downward pressure during the downward movement process, which causes the component to fail to make full contact with the test socket, resulting in test failure.

Method used

The system employs an upper pressure assembly and a limiting structure, including an upper pressure cylinder, a movable frame, an upper pressure block, and an upper pressure rod, combined with a conveyor rail and limiting posts, to ensure accurate placement and fixation of components within the test fixture.

Benefits of technology

It improves the success rate of IC component testing, reduces the probability of testing failure, and enables reliable placement and accurate testing of components.

✦ Generated by Eureka AI based on patent content.

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Abstract

The utility model relates to an IC element batch detection device which comprises a material moving plate, a test plate and a material disc, a material moving mechanical arm drives the test plate below to move in the vertical direction, and a suction cup used for grabbing elements is installed at the bottom of the test plate right above a test seat; an upper pressing assembly is arranged on the material moving plate and comprises an upper pressing air cylinder, a movable frame, an upper pressing block and an upper pressing rod. According to the utility model, through the structure of the upper pressing assembly, after an element is placed in the test seat, downward pressing processing is carried out, so that the element can be better placed in the test seat, and the probability of detection failure is reduced.
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Description

Technical Field

[0001] This utility model relates to the field of electronic component testing technology, and in particular to a batch testing device for IC components. Background Technology

[0002] With continuous research and innovation in technology, tasks that previously required the combination of many large electronic circuits have been completely replaced by integrated circuits (ICs). Since ICs undergo multiple processing steps during production, manufacturers conduct circuit testing after the ICs are manufactured to ensure product quality and detect any damage that may have occurred during the manufacturing process, thereby identifying defective products.

[0003] like Figure 1 As shown in reference document 1 of the prior art, the transfer plate is located directly above the test plate, the test plate is mounted on the test base below, and several test seats for testing components are evenly distributed on the test plate. The transfer robot arm drives the test plate below to move in the vertical direction, and a suction cup for gripping components is installed at the bottom of the test plate directly above the test seats.

[0004] Existing testing devices use suction cups to grab components, then the transfer plate moves downwards and places the components in the test holder below for testing. However, considering that the downward pressure is difficult to control precisely during the downward movement, the components may not be able to fully contact the test holder, leading to test failure.

[0005] In view of the above-mentioned shortcomings, the designer actively researched and innovated in order to create a batch testing device for IC components, making it more valuable for industrial use. Utility Model Content

[0006] To solve the above-mentioned technical problems, the purpose of this utility model is to provide a batch testing device for IC components.

[0007] To achieve the above objectives, the present invention adopts the following technical solution:

[0008] A batch testing device for IC components includes a transfer board, a test board, and a tray. The test board is mounted on a test base below, and a number of test sockets for testing components are evenly distributed on the test board.

[0009] The transfer plate is located directly above the test plate. A transfer robotic arm is installed at the top center of the transfer plate. The transfer robotic arm drives the test plate below to move vertically. A suction cup for gripping components is installed at the bottom of the test plate directly above the test base.

[0010] An upper pressing assembly is provided on the transfer plate. The upper pressing assembly includes an upper pressing cylinder, a movable frame, an upper pressing block, and an upper pressing rod. A cavity is provided inside the transfer plate, and a movable frame is provided inside the cavity. At least one upper pressing cylinder is provided on the transfer plate above the cavity. The upper pressing cylinder drives the movable frame below to move vertically inside the cavity. Upper pressing blocks are installed at the bottom of the movable frames on both sides of the suction cup, and upper pressing rods are installed at the bottom of the upper pressing blocks.

[0011] As a further improvement of this utility model, a conveying track is installed between the transfer plate and the test plate. The conveying track drives the material tray above to move on the conveying track, and several material slots that are adapted to the suction cups are evenly distributed on the material tray.

[0012] As a further improvement of this utility model, the conveyor track drives the upper tray to move in the front-back direction or the left-right direction.

[0013] As a further improvement of this utility model, the contact end at the bottom of the upper pressure rod has a smooth spherical structure.

[0014] As a further improvement of this utility model, sliding grooves distributed along the vertical direction are provided on both the left and right sides of the cavity, and both sides of the movable frame are connected to the sliding grooves by sliders.

[0015] As a further improvement of this utility model, upper limit posts are installed on both the left and right sides of the bottom of the transfer plate, and lower limit posts adapted to the upper limit posts are installed on the test base directly below the upper limit posts.

[0016] As a further improvement of this utility model, an upper limit block is provided at the bottom of the upper limit post, and a lower limit groove adapted to the upper limit block is provided on the inner side of the top of the lower limit post directly below the upper limit block.

[0017] As a further improvement of this utility model, an elastic structure is installed in the lower limit groove.

[0018] By means of the above solution, this utility model has at least the following advantages:

[0019] This invention, through the structure of the upper pressure component, allows for the lower pressure process after the component is placed in the test socket, ensuring that the component can be better placed in the test socket and reducing the probability of test failure.

[0020] This invention, through the mutual adaptation of the upper and lower limit posts, can limit the movement stroke of the transfer plate, making the movement process controllable.

[0021] The above description is only an overview of the technical solution of this utility model. In order to better understand the technical means of this utility model and to implement it in accordance with the contents of the specification, the following are the preferred embodiments of this utility model and are described in detail with reference to the accompanying drawings. Attached Figure Description

[0022] To more clearly illustrate the technical solutions of the embodiments of this utility model, the drawings used in the embodiments will be briefly introduced below. It should be understood that the following drawings only show some embodiments of this utility model and should not be regarded as a limitation on the scope. For those skilled in the art, other related drawings can be obtained based on these drawings without creative effort.

[0023] Figure 1 This is a structural schematic diagram of prior art reference document 1;

[0024] Figure 2 This is a schematic diagram of the structure of a batch testing device for IC components according to this utility model;

[0025] Figure 3 yes Figure 2 Schematic diagram of the structure of the central material transfer plate section;

[0026] Figure 4 yes Figure 2 A schematic diagram of the structure of the test base.

[0027] The meanings of the labels in the figures are as follows.

[0028] 1. Transfer plate; 2. Test plate; 3. Material tray; 4. Transfer robotic arm; 5. Suction cup; 6. Component; 7. Conveyor track; 8. Test base; 9. Test seat; 10. Upper pressure assembly; 11. Upper limit post; 12. Lower limit post; 13. Upper pressure cylinder; 14. Cavity; 15. Movable frame; 16. Slide groove; 17. Slider; 18. Upper pressure block; 19. Upper limit block; 20. Lower limit groove; 21. Elastic structure; 22. Detailed Implementation

[0029] The specific embodiments of this utility model will be described in further detail below with reference to the accompanying drawings and examples. The following examples are used to illustrate this utility model, but are not intended to limit its scope.

[0030] To enable those skilled in the art to better understand the present invention, the technical solutions of the present invention will be clearly and completely described below with reference to the accompanying drawings of the embodiments of the present invention. Obviously, the described embodiments are only a part of the embodiments of the present invention, and not all of them. The components of the embodiments of the present invention described and shown in the accompanying drawings can generally be arranged and designed in various different configurations. Therefore, the following detailed description of the embodiments of the present invention provided in the accompanying drawings is not intended to limit the scope of the claimed invention, but merely to illustrate selected embodiments of the present invention. All other embodiments obtained by those skilled in the art based on the embodiments of the present invention without inventive effort are within the scope of protection of the present invention.

[0031] Example

[0032] like Figure 1 As shown in reference document 1 of the prior art, a test plate 2 is mounted on a test base 8 below, and several test seats 9 for testing components 6 are evenly distributed on the test plate 2. A transfer plate 1 is located directly above the test plate 2, and a transfer robotic arm 4 is installed at the top center of the transfer plate 1. The transfer robotic arm 4 drives the test plate 2 below to move vertically. A suction cup 5 for gripping the component 6 is installed at the bottom of the test plate 2 directly above the test seats 9. After the suction cup grips the component, the transfer plate moves downward as a whole and places the component in the test seat below for testing. However, considering that the downward pressure is difficult to control precisely during the downward movement, the component may not be able to fully contact the test seat, resulting in test failure.

[0033] like Figures 2-4 As shown,

[0034] A batch testing device for IC components includes a transfer plate 1, a test plate 2, and a tray 3. The test plate 2 is mounted on a test base 8 below, and a plurality of test seats 9 for testing components 6 are evenly distributed on the test plate 2. The transfer plate 1 is located directly above the test plate 2, and a transfer robotic arm 4 is installed at the top center of the transfer plate 1. The transfer robotic arm 4 drives the test plate 2 below to move vertically. A suction cup 5 for gripping components 6 is installed at the bottom of the test plate 2 directly above the test seats 9.

[0035] A conveyor rail 7 is installed between the transfer plate 1 and the test plate 2. The conveyor rail 7 drives the upper material tray 3 to move on the conveyor rail 7, and the material tray 3 has several material slots evenly distributed on it, which are adapted to the suction cups 5 mentioned above. The conveyor rail 7 drives the upper material tray 3 to move in the front-back direction or the left-right direction.

[0036] In addition, sensor units are installed on the transfer plate 1 and the tray 3 to allow the transfer plate 1 to sense the position of the tray 3.

[0037] 1. A pressing assembly 10 is provided on the transfer plate 1. The pressing assembly 10 includes a pressing cylinder 13, a movable frame 15, a pressing block 18, and a pressing rod 19. A cavity 14 is provided inside the transfer plate 1, and the movable frame 15 is provided inside the cavity 14. At least one pressing cylinder 13 is provided on the transfer plate 1 above and outside the cavity 14. The pressing cylinder 13 drives the movable frame 15 below to move vertically within the cavity 14. Slide grooves 16 distributed vertically are provided on both the left and right sides of the cavity 14. The left and right sides of the movable frame 15 are connected to the slide grooves 16 through sliders 17. Pressing blocks 18 are installed at the bottom of the movable frame 15 on both sides of the suction cup 5, and pressing rods 19 are installed at the bottom of the pressing blocks 18. The contact end of the bottom of the pressing rod 19 has a smooth spherical structure, which can greatly reduce the damage to the surface of the component caused by the pressing rod 19.

[0038] 2. Upper limit posts 11 are installed on both the left and right sides of the bottom of the transfer plate 1. Lower limit posts 12 that are compatible with the upper limit posts 11 are installed on the test base 8 directly below the upper limit posts 11.

[0039] An upper limit block 20 is provided at the bottom of the upper limit post 11, and a lower limit groove 21 adapted to the upper limit block 20 is provided on the inner side of the top of the lower limit post 12 directly below the upper limit block 20. An elastic structure 22, such as a spring, is installed in the lower limit groove 21.

[0040] Brief description of the working process of this utility model:

[0041] The transfer plate 1 moves down, and then the suction cup 5 picks up the component located on the lower tray 3. Then the transfer plate 1 moves up, and then the tray 3 moves out of the current position under the drive of the conveyor track 7.

[0042] The transfer plate 1 moves down and places the component into the test holder 9. Then the upper pressure assembly 10 starts to work, moving down and contacting the component through the upper pressure rod 19 to ensure that the component can be completely placed into the test holder 9 and start the test.

[0043] After the test is completed, the upper pressure component 10 returns to its original position, and the transfer plate 1 moves upward;

[0044] The material tray 3 returns to the feeding station under the drive of the conveyor track 7, and then the transfer plate 1 moves down to place the component in the material tray 3. Then the material tray 3 moves out of the current position under the drive of the conveyor track 7.

[0045] In the description of this utility model, it should be understood that the terms "center," "longitudinal," "lateral," "upper," "lower," "front," "rear," "left," "right," "vertical," "horizontal," "top," "bottom," "inner," and "outer," etc., indicating orientation or positional relationships, are based on the orientation or positional relationships shown in the accompanying drawings and are only for the convenience of describing this utility model and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation, and therefore should not be construed as a limitation of this utility model. Furthermore, the terms "first," "second," etc., are used for descriptive purposes only and should not be construed as indicating or implying relative importance or implying the number of indicated technical features. Thus, features defined with "first," "second," etc., may explicitly or implicitly include one or more of that feature. In the description of this utility model, unless otherwise stated, "a plurality of" means two or more.

[0046] In the description of this utility model, it should be noted that, unless otherwise explicitly specified and limited, the terms "installation", "connection" and "connection" should be interpreted broadly. For example, they can be fixed connections, detachable connections, or integral connections; they can be mechanical connections or electrical connections; they can be direct connections or indirect connections through an intermediate medium; and they can be internal connections between two components.

[0047] The above description is only a preferred embodiment of the present utility model and is not intended to limit the present utility model. It should be noted that for those skilled in the art, several improvements and modifications can be made without departing from the technical principles of the present utility model, and these improvements and modifications should also be considered within the protection scope of the present utility model.

Claims

1. An IC component batch detection device, comprising a material moving plate (1), a test plate (2) and a material tray (3), the test plate (2) is installed on a lower test base (8), and a plurality of test seats (9) for testing components (6) are uniformly distributed on the test plate (2); the material moving plate (1) is located directly above the test plate (2), a material moving mechanical arm (4) is installed at the middle position of the top of the material moving plate (1), the material moving mechanical arm (4) drives the test plate (2) below to move in the vertical direction, and a suction disc (5) for grabbing components (6) is installed at the bottom of the test plate (2) directly above the test seat (9); characterized in that: an upper pressing assembly (10) is arranged on the material moving plate (1), the upper pressing assembly (10) comprises an upper pressing cylinder (13), a movable frame (15), an upper pressing block (18) and an upper pressing rod (19), a cavity (14) is arranged in the material moving plate (1), the movable frame (15) is arranged in the cavity (14), at least one upper pressing cylinder (13) is arranged on the material moving plate (1) above the cavity (14), the upper pressing cylinder (13) drives the movable frame (15) below to move in the vertical direction in the cavity (14), the upper pressing block (18) is installed at the bottom of the movable frame (15) on both sides of the suction disc (5), and the upper pressing rod (19) is installed at the bottom of the upper pressing block (18). A conveying track (7) is installed at the position between the material moving plate (1) and the test plate (2), the conveying track (7) drives the material tray (3) above to move on the conveying track (7), and a plurality of material grooves matched with the suction disc (5) are uniformly distributed on the material tray (3). The conveying track (7) drives the material tray (3) above to move in the front-back direction or in the left-right direction. The contact end of the bottom of the upper pressing rod (19) is a smooth spherical surface structure.

2. The IC device batch inspection apparatus according to claim 1, wherein Sliding grooves (16) distributed in the vertical direction are arranged on both sides in the cavity (14), and the movable frame (15) is connected with the sliding grooves (16) through sliding blocks (17) on both sides.

3. The IC device batch inspection apparatus according to claim 2, wherein Upper limiting columns (11) are installed on both sides at the bottom of the material moving plate (1), and lower limiting columns (12) matched with the upper limiting columns (11) are installed on the test base (8) directly below the upper limiting columns (11).

4. The IC device batch inspection apparatus of claim 1, wherein An upper limiting block (20) is arranged at the bottom of the upper limiting column (11), and a lower limiting groove (21) matched with the upper limiting block (20) is arranged at the top of the lower limiting column (12) directly below the upper limiting block (20).

5. The IC device batch inspection apparatus according to claim 1, wherein An elastic structure (22) is installed in the lower limiting groove (21).

6. The IC device batch inspection apparatus according to claim 1, wherein ​ 7. The IC device batch testing apparatus according to claim 6, wherein ​ 8. The IC device batch inspection apparatus according to claim 7, wherein ​