Circuit board, circuit board assembly and electronic equipment

Abstract

The utility model relates to a circuit board, a circuit board assembly and electronic equipment. The circuit board comprises a concave cavity which is recessed inwards from a first surface of the circuit board; the conductive shielding glue is at least attached to the inner side wall of the concave cavity in the circumferential direction, and the conductive shielding glue is grounded.

Description

Technical Field

[0001] This disclosure relates to the field of terminal technology, and in particular to a circuit board, circuit board assembly, and electronic device. Background Technology

[0002] Driven by the need to reduce thickness, cavity circuit boards (PCBs) have become widely used due to their advantage of accommodating electronic components within recesses and increasing layout space. However, when accommodating electronic devices on other circuit boards electrically connected to the cavity PCB, electromagnetic protection becomes a critical consideration. Utility Model Content

[0003] This disclosure provides a circuit board, a circuit board assembly, and an electronic device to address the shortcomings of the related art.

[0004] According to a first aspect of the present disclosure, a circuit board is provided, comprising:

[0005] A recessed cavity, the recessed cavity being recessed inward from the first surface of the circuit board;

[0006] A conductive shielding adhesive is attached to at least the inner sidewall of the cavity along the circumferential direction, and the conductive shielding adhesive is grounded.

[0007] Optionally, the conductive shielding adhesive covers a portion of the first surface of the circuit board and extends outward relative to the cavity.

[0008] Optionally, the conductive shielding adhesive covers at least a portion of the bottom wall of the cavity.

[0009] Optionally, the thickness of the conductive shielding adhesive is greater than or equal to 20 μm and less than or equal to 50 μm.

[0010] Optionally, the circuit board includes stacked trace layers and dielectric layers;

[0011] The bottom surface of the cavity is a dielectric layer or a wiring layer.

[0012] Optionally, it also includes a grounding hole that penetrates the bottom wall of the cavity, the conductive shielding adhesive is electrically connected to the grounding hole, and the grounding hole is located near the connection between the bottom wall and the inner side wall.

[0013] Optionally, the diameter of the grounding hole is greater than or equal to 0.15 mm and less than or equal to 0.3 mm.

[0014] Optionally, it may also include a first electronic device, which is electrically connected to a second surface of the circuit board, the second surface being disposed opposite to the first surface.

[0015] According to a second aspect of the present disclosure, a circuit board assembly is provided, comprising:

[0016] A first circuit board, wherein the first circuit board is the circuit board described in any of the foregoing embodiments;

[0017] The second circuit board includes a second electronic device, the second circuit board is soldered to the first circuit board, and each cavity contains at least one of the second electronic devices.

[0018] According to a third aspect of the present disclosure, an electronic device is provided, including a circuit board assembly as described in any of the foregoing embodiments.

[0019] The technical solutions provided by the embodiments of this disclosure may include the following beneficial effects:

[0020] As can be seen from the above embodiments, compared with the solutions of related technologies, the technical solution disclosed herein does not require the design of a shielding cover on the radio frequency circuit board. Electronic devices can be directly housed in the cavity, and electromagnetic protection can be achieved through conductive shielding adhesive. This is beneficial to reducing the thickness of the components composed of the circuit board and the radio frequency circuit board, and also helps to reduce weight.

[0021] It should be understood that the above general description and the following detailed description are exemplary and explanatory only, and are not intended to limit this disclosure. Attached Figure Description

[0022] The accompanying drawings, which are incorporated in and form a part of this specification, illustrate embodiments consistent with this disclosure and, together with the description, serve to explain the principles of this disclosure.

[0023] Figure 1 This is a schematic diagram of the connection between the cavity circuit board and the radio frequency circuit board in related technologies.

[0024] Figure 2 This is a schematic cross-sectional view of a circuit board according to an exemplary embodiment.

[0025] Figure 3 This is a schematic cross-sectional view of another circuit board according to an exemplary embodiment.

[0026] Figure 4 This is a schematic cross-sectional view of a circuit board assembly according to an exemplary embodiment. Detailed Implementation

[0027] Exemplary embodiments will now be described in detail, examples of which are illustrated in the accompanying drawings. When the following description relates to the drawings, unless otherwise indicated, the same numerals in different drawings denote the same or similar elements. The embodiments described in the following exemplary embodiments do not represent all embodiments consistent with this disclosure. Rather, they are merely examples of apparatuses and methods consistent with some aspects of this disclosure as detailed in the appended claims.

[0028] The terminology used in this disclosure is for the purpose of describing particular embodiments only and is not intended to be limiting of the disclosure. The singular forms “a,” “the,” and “the” as used in this disclosure and the appended claims are also intended to include the plural forms unless the context clearly indicates otherwise. It should also be understood that the term “and / or” as used herein refers to and includes any and all possible combinations of one or more of the associated listed items.

[0029] It should be understood that although the terms first, second, third, etc., may be used in this disclosure to describe various information, such information should not be limited to these terms. These terms are used only to distinguish information of the same type from one another. For example, without departing from the scope of this disclosure, first information may also be referred to as second information, and similarly, second information may also be referred to as first information. Depending on the context, the word "if" as used herein may be interpreted as "when," "when," or "in response to determination."

[0030] Currently, such as Figure 1 As shown, the circuit board assembly consisting of a recessed cavity circuit board 101 and an RF circuit board 102 has been widely used in various smart terminals, such as mobile phones or tablets. However, since the inner wall of the recess 103 of the recessed cavity circuit board 101 is typically difficult to metallize, a shielding cover 104 still needs to be soldered onto the RF circuit board 102. This shielding cover 104, along with the electronic components 105, is then housed within the recess 103 to prevent electromagnetic interference and RF interference. However, the design of the shielding cover 104 makes it difficult to reduce its thickness, placing higher demands on the volume of the recess 103, which in turn places greater demands on the dimensions of the recessed cavity circuit board and negatively impacts the weight of the entire circuit board assembly.

[0031] like Figure 2As shown, the circuit board includes a recessed cavity 1 and a conductive shielding adhesive 2. The recessed cavity 1 is formed by recessing inward from the first surface 3 of the circuit board. The conductive shielding adhesive 2 is attached to at least the inner sidewall of the recessed cavity 1 along the circumferential direction, and the conductive shielding adhesive 2 is grounded. Based on this, compared with the solutions of related technologies, there is no need to design a shielding cover on the subsequent radio frequency circuit board. Electronic devices can be directly housed in the recessed cavity 1, and electromagnetic protection is achieved through the conductive shielding adhesive 2. This is beneficial for reducing the thickness of the components composed of the circuit board and the radio frequency circuit board, and also helps to reduce weight.

[0032] The conductive shielding adhesive 2 can be formed by dispensing onto the inner wall of the cavity 1 and then curing, or it can be formed by coating onto the inner wall of the cavity 1, or it can be a conductive tape, which is at least adhered to the inner wall of the cavity 1. The conductive shielding adhesive 2 can include conductive rubber or conductive silicone, etc. The thickness of the conductive shielding adhesive 2 can be greater than or equal to 20 mm and less than or equal to 50 mm to avoid the conductive shielding adhesive 2 being too thick and affecting the volume of the cavity 1. The thickness of the conductive shielding adhesive 2 can be equal at all locations, thus obtaining a flat conductive shielding adhesive 2, reducing the probability of short circuits between the conductive shielding adhesive 2 and electronic devices located in the cavity 1; or the conductive shielding adhesive 2 can be uneven, i.e., the surface is not flat, to reduce process requirements and simplify processing. When the circuit board includes multiple cavities 1, one or more of the cavities 1 can be treated with conductive shielding adhesive 2 for electromagnetic protection. When multiple cavities 1 are all protected against electromagnetic interference by using conductive shielding adhesive 2, the coverage area, thickness and other parameters of the conductive shielding adhesive 2 in the multiple cavities 1 can be the same or different.

[0033] In some embodiments, the conductive shielding adhesive 2 may cover a portion of the first surface 3 of the circuit board, and the conductive shielding adhesive 2 extends outward relative to the cavity 1. The support of the conductive shielding adhesive 2 by the first surface 3 helps to improve the strength of the conductive shielding adhesive 2. The extension dimension of the conductive shielding adhesive 2 on the first surface 3 can be designed according to design requirements.

[0034] In some embodiments, the conductive shielding adhesive 2 may also cover at least a portion of the bottom wall of the cavity 1, for example... Figure 2 As shown, the conductive shielding adhesive 2 forms a ring-shaped structure, such as a circular ring or a square ring, on the bottom wall of the cavity 1. The design can be adapted to the shape of the bottom wall of the cavity 1, and this disclosure does not impose any limitations on this. The conductive shielding adhesive 2 partially covers the bottom wall of the cavity 1, which is beneficial for balancing shielding effectiveness and weight; of course, the conductive shielding adhesive 2 can also completely cover the bottom wall of the cavity 1, which is beneficial for improving the shielding effect.

[0035] In the above embodiments, the depth of the cavity 1 can be designed according to the height of the electronic device to be accommodated within the cavity 1. When the circuit board includes multiple cavities 1, the depths of the multiple cavities 1 can be equal or unequal. For example... Figure 3 As shown, the circuit board includes stacked trace layers 4 and dielectric layers 5. There can be multiple trace layers 4 and dielectric layers 5, with one or more dielectric layers 5 disposed between adjacent trace layers 4. The bottom surface of the cavity 1 can be either a dielectric layer 5 or a trace layer 4. In other words, the cavity 1 can be recessed up to any dielectric layer 5 or any trace layer 4; this disclosure does not impose any limitation on this.

[0036] Regarding the grounding configuration of the conductive shielding adhesive 2 in the above embodiments, the circuit board also includes a grounding hole, such as a metallized via that is conductive to the ground layer of the circuit board. The grounding hole penetrates the bottom wall of the cavity 1 and communicates with it. The conductive shielding adhesive 2 can contact the grounding hole to achieve electrical connection, thereby grounding the conductive shielding adhesive 2. Subsequent electromagnetic interference and static electricity can be discharged to the ground layer through this grounding hole. The grounding hole can be located near the connection between the bottom wall and the inner side wall of the cavity 1, that is, as close as possible to the edge of the cavity 1, reducing the occupation of the central area and facilitating the device layout of the circuit board to increase wiring space. The diameter of the grounding hole is greater than or equal to 0.15 mm and less than or equal to 0.3 mm.

[0037] In the technical solution disclosed herein, the circuit board further includes a first electronic device 6, which is electrically connected to a second surface 7 of the circuit board. The second surface 7 is disposed opposite to the first surface 3, thereby making reasonable use of the space wiring of the circuit board and saving internal space of the electronic device configured with the circuit board.

[0038] This disclosure also provides a circuit board assembly, such as Figure 4 As shown, the circuit board assembly includes a first circuit board 201 and a second circuit board 202. The first circuit board 201 is the circuit board described in any of the preceding embodiments. The second circuit board 202 includes a second electronic device 203. The second circuit board 202 is soldered to the first circuit board 201, and each cavity 1 of the first circuit board 201 contains at least one second electronic device 203. The conductive shielding adhesive 2 can provide electrostatic protection for the second electronic device disposed in the cavity 1.

[0039] This disclosure also provides an electronic device that may include the circuit board assembly described in any of the foregoing embodiments. The electronic device may include a mobile terminal, a wearable terminal, or a tablet terminal, etc.

[0040] Other embodiments of this disclosure will readily occur to those skilled in the art upon consideration of the specification and practice of the disclosure herein. This disclosure is intended to cover any variations, uses, or adaptations of this disclosure that follow the general principles of this disclosure and include common knowledge or customary techniques in the art not disclosed herein. The specification and examples are to be considered exemplary only, and the true scope and spirit of this disclosure are indicated by the following claims.

[0041] It should be understood that this disclosure is not limited to the precise structures described above and shown in the accompanying drawings, and various modifications and changes can be made without departing from its scope. The scope of this disclosure is limited only by the appended claims.

Claims

1. A circuit board, characterized by, The circuit board comprises: a cavity recessed inwardly from a first surface of the circuit board; a conductive shielding glue attached to at least an inner circumferential wall of the cavity, and the conductive shielding glue is grounded; a grounding hole, the conductive shielding glue is electrically connected with the grounding hole, and the grounding hole is a metallized hole in communication with a ground layer of the circuit board.

2. The circuit board of claim 1, wherein The conductive shielding glue covers a part of the first surface of the circuit board and extends outwardly relative to the cavity.

3. The circuit board of claim 1, wherein, The conductive shielding glue covers at least a part of a bottom wall of the cavity.

4. The circuit board of claim 1, wherein The thickness of the conductive shielding glue is greater than or equal to 20 um and less than or equal to 50 um.

5. The circuit board of claim 1, wherein, The circuit board comprises laminated trace layers and dielectric layers. The bottom surface of the cavity is a dielectric layer or a trace layer.

6. The circuit board of claim 1, wherein The grounding hole penetrates the bottom wall of the cavity, and the grounding hole is arranged close to a junction of the bottom wall and the inner circumferential wall.

7. The circuit board of claim 1, wherein The diameter of the grounding hole is greater than or equal to 0.15 mm and less than or equal to 0.3 mm.

8. The circuit board of claim 1, wherein, The circuit board further comprises a first electronic device electrically connected to a second surface of the circuit board, the second surface being arranged opposite to the first surface.

9. A circuit board assembly, characterized by The circuit board comprises: a first circuit board, the first circuit board being any one of the circuit boards in claims 1-8; a second circuit board comprising a second electronic device, the second circuit board being soldered with the first circuit board, and each cavity containing at least one second electronic device.

10. An electronic device, comprising: The circuit board assembly comprises the circuit board in claim 9.

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