Heat dissipation unit and server comprising same
By designing a liquid guiding channel and a gravity circulation heat dissipation unit, the problem of low cooling efficiency of the transverse fins was solved, realizing a heat dissipation method that combines efficient immersion liquid cooling and spray liquid cooling, thereby improving cooling efficiency and reducing coolant consumption.
Patent Information
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- Filing Date
- 2025-02-10
- Publication Date
- 2026-03-17
AI Technical Summary
Traditional horizontally arranged heat sink fins result in poor liquid spraying and low cooling efficiency. Furthermore, full immersion liquid cooling wastes coolant and increases server upgrade costs.
Design a heat dissipation unit including a housing, a heat-generating device, a heat transfer component, and a liquid guiding channel. The liquid guiding channel collects the coolant and circulates it by gravity to achieve efficient immersion liquid cooling of the coolant. Combined with sprayed coolant, it dissipates heat from other heat-generating devices.
It increases the convergence speed and flow rate of coolant, enhances cooling efficiency, reduces coolant consumption, meets the heat dissipation needs of different heat-generating components, and reduces server upgrade costs.
Smart Images
Figure CN224006952U_ABST
Abstract
Description
Technical Field
[0001] This utility model relates to the field of heat-generating device cooling technology, and more specifically, to a heat dissipation unit and a server including the same. Background Technology
[0002] In actual server retrofits, some servers have GPU cards with heat sink fins arranged horizontally rather than vertically. In this case, the liquid sprayed from the traditional spray module cannot be effectively sprayed onto the entire fin due to the horizontal arrangement of the heat sink fins, resulting in low cooling efficiency. On the other hand, using a full immersion liquid cooling method would waste coolant and increase the cost of server retrofits. Utility Model Content
[0003] The present invention aims to overcome at least one of the defects of the prior art and provide a liquid-cooled server to solve the problem of low liquid cooling efficiency.
[0004] The first aspect of this utility model is to provide a heat dissipation unit, including a housing, a heating element, a heat transfer element, and a liquid guiding groove. The housing is provided with a liquid inlet and a liquid outlet. The heat transfer element and the heating element are both disposed inside the housing, and the heat transfer element and the heating element are thermally connected.
[0005] The liquid guiding groove is connected to the outer surface of the housing and the interior of the liquid guiding groove is in communication with the liquid inlet hole, with the opening of the liquid guiding groove facing upward.
[0006] In this design, external spray equipment sprays coolant into the opening of the liquid guide tank. The coolant gathers in the tank and enters the housing through the inlet. The coolant immerses the heat transfer components and / or heating elements inside the housing, providing direct or indirect immersion liquid cooling. During this process, the coolant, heated by absorbing heat, flows out of the housing through the outlet. The externally sprayed low-temperature coolant continuously replenishes the housing through the liquid guide tank, thus efficiently cooling the heating elements. When this heat dissipation unit is in the spray liquid cooling system, the liquid guide tank increases the gathering speed of the sprayed coolant, increasing the flow rate of coolant into the housing. This allows the heating elements inside the heat dissipation unit to achieve immersion liquid cooling, while other heating elements in the spray liquid cooling system are cooled by the sprayed coolant. In this way, the heat dissipation needs of different heating elements can be met with a small amount of coolant, improving heat dissipation efficiency.
[0007] In some embodiments, the inlet hole is positioned higher than the outlet hole.
[0008] This design helps the coolant to exit the casing by its own gravity, promoting heat exchange between the coolant inside the casing and the external sprayed coolant.
[0009] In some embodiments, the liquid inlet and the liquid outlet are respectively located on two far apart sides of the housing.
[0010] This design increases the distance between the inlet and outlet ports, which helps improve the heat exchange between the coolant and the heat-generating components.
[0011] In some embodiments, the diameter of the inlet hole is larger than the diameter of the outlet hole.
[0012] In this design, the coolant flows into the housing through the inlet hole by gravity and flows out of the housing through the outlet hole by gravity. By simply setting the hole size, the inlet flow rate can be greater than the outlet flow rate, ensuring that the coolant can submerge the heat transfer components and / or heat-generating devices inside the housing.
[0013] In some embodiments, the lowest point of the liquid inlet is lower than the upper end face of the liquid guide groove.
[0014] This design ensures that the coolant collected in the liquid guide channel is pumped into the housing by gravity.
[0015] In some embodiments, the internal space of the liquid guiding groove is a cone shape that is wider at the top and narrower at the bottom.
[0016] This solution can reduce the internal space of the liquid guiding channel while keeping the opening area unchanged, increase the speed at which the liquid guiding channel gathers coolant, and accelerate the efficiency of delivering coolant into the shell.
[0017] In some embodiments, the heat transfer element includes a plurality of fins that are thermally connected to the heating device, the fins having an extension length in the horizontal direction, and the plurality of fins being spaced apart in the vertical direction.
[0018] The liquid inlet and the liquid outlet are respectively located on both sides of the length direction of the plurality of fins.
[0019] This solution can reduce the space occupied by the fins in the horizontal direction, thereby reducing the size of the heat dissipation unit in the horizontal direction. In addition, the gap formed between adjacent fins can act as a coolant flow channel. The coolant collected in the liquid guide groove is input into the housing through the liquid inlet hole. The coolant fully absorbs the heat of the fins through the coolant flow channel and then flows out of the housing through the liquid outlet hole, thereby achieving immersion liquid cooling of the heat-generating device and significantly improving the cooling rate.
[0020] In some embodiments, the housing also includes connectors for securing external devices.
[0021] The second aspect of this utility model is to provide a server, including a chassis, a spray plate and the aforementioned heat dissipation unit, wherein the chassis has an upward-facing opening, the heat dissipation unit is disposed inside the chassis, and the spray plate covers the opening;
[0022] The spray plate has a plurality of spraying mechanisms on its surface facing the inside of the housing, and at least one of the spraying mechanisms faces the opening of the liquid guide tank to spray coolant.
[0023] Compared with the prior art, the beneficial effects of this utility model are as follows: the liquid guide groove can improve the convergence speed of the sprayed coolant and increase the flow rate of coolant into the housing, so that the heat-generating device located inside the heat dissipation unit can achieve immersion liquid cooling and improve heat dissipation efficiency; by setting the liquid inlet hole higher than the heat transfer component and / or liquid outlet hole, it helps the coolant to immerse the heat transfer component and promotes coolant circulation. Attached Figure Description
[0024] Figure 1 The structure of Example 1 Figure 1 .
[0025] Figure 2 The structure of Example 1 Figure 2 .
[0026] Figure 3 This is an exploded view of the structure of Example 1.
[0027] Figure 4 The structure of Example 2 Figure 1 .
[0028] Figure 5 The structure of Example 2 Figure 2 .
[0029] Reference numerals: heat dissipation unit 100, housing 110, liquid inlet 111, liquid outlet 112, substrate 113, cover 114, hollow structure 115, baffle 116, heating element 120, heat transfer element 130, fins 131, liquid guide groove 140, connector 150, through port 151, embedding port 152, box 200, opening 210, spray plate 300, spray mechanism 310. Detailed Implementation
[0030] The accompanying drawings are for illustrative purposes only and should not be construed as limiting the scope of this invention. To better illustrate the following embodiments, some components in the drawings may be omitted, enlarged, or reduced, and do not represent the actual dimensions of the product. It is understandable to those skilled in the art that some well-known structures and their descriptions may be omitted in the drawings.
[0031] Example 1
[0032] like Figure 1-3As shown, this embodiment proposes a heat dissipation unit, including a housing 110, a heating element 120, a heat transfer element 130, and a liquid guiding groove 140. The housing 110 is provided with a liquid inlet 111 and a liquid outlet 112. The heat transfer element 130 and the heating element 120 are both disposed inside the housing 110 and are thermally connected. The liquid guiding groove 140 is connected to the outer surface of the housing 110 and its interior communicates with the liquid inlet 111. The opening of the liquid guiding groove 140 faces upward. The housing is made of a material with good thermal conductivity, such as aluminum or copper.
[0033] In a specific implementation, for ease of assembly, the housing 110 includes a substrate 113 and a cover 114. The heat-generating device 120 can specifically be a flat GPU card, which is mounted on the substrate 113. The heat transfer element 130 is thermally connected to the surface of the GPU card. The cover 114 covers the substrate 113, and together with the substrate 113, they form a hollow housing 110. The cover 114 has a liquid inlet hole 111, and a liquid guide groove 140 is detachably disposed on the surface of the cover 114 or the substrate 113 near the liquid inlet hole 111. To ensure internal heat dissipation, a conventional GPU card housing 110 has a perforated structure 115 that extends through the interior. Specifically, refer to... Figure 3 The perforated structure 115 is formed on the cover 114. In addition, if the perforated structure 115 is used as the outlet channel of the coolant, the outlet flow rate will be too large, and the coolant will be difficult to fill the internal space of the housing 110. Therefore, this embodiment also provides a baffle 116, which blocks the perforated structure 115. The baffle 116 has a small-diameter through hole as the outlet hole 112 of the housing 110, and the baffle 116 is sealed around its perimeter so that the coolant inside the housing 110 can only flow out through the outlet hole 112. The outlet flow rate is small, so that the coolant inside the housing 110 can be immersed in the heat transfer element 130 and / or the heating element 120 by spraying coolant.
[0034] In practical applications, external spraying equipment sprays coolant into the opening of the liquid guide tank 140. The coolant gathers in the liquid guide tank 140 and enters the interior of the housing 110 through the liquid inlet 111. The coolant immerses the heat transfer element 130 and / or the heating element 120 inside the housing 110, directly or indirectly immersing the heating element 120 for liquid cooling. During this process, the coolant that has absorbed heat and heated up flows out of the housing 110 through the liquid outlet 112. The low-temperature coolant sprayed externally can continuously replenish the housing 110 through the liquid guide tank 140, thereby efficiently cooling the heating element 120. When this heat dissipation unit is in the spray liquid cooling system, the liquid guide groove 140 can increase the convergence speed of the sprayed coolant and increase the flow rate of coolant entering the housing 110. Thus, the heat-generating device 120 located inside the heat dissipation unit can achieve immersion liquid cooling, while other heat-generating devices 120 in the spray liquid cooling system dissipate heat through spraying. In this way, the heat dissipation needs of different heat-generating devices 120 can be met with a small amount of coolant, thereby improving heat dissipation efficiency.
[0035] like Figure 3 As shown, to ensure smooth flow of coolant out of the housing 110, the inlet hole 111 is positioned higher than the outlet hole 112. It is easy to understand that in this embodiment, the coolant circulates within the housing 110 primarily due to gravity. Therefore, by positioning the inlet hole 111 higher than the outlet hole 112, a coolant channel is created that allows the coolant to flow from a higher to a lower position, promoting heat exchange between the coolant inside the housing 110 and the externally sprayed coolant. It can be understood that simply ensuring the inlet flow rate is greater than the outlet flow rate—for example, by reducing the outlet flow rate by setting a small-diameter outlet hole 112, and by setting the diameter of the inlet hole 111 to be larger than the diameter of the outlet hole 112—ensures that the coolant completely submerges the heat transfer element 130.
[0036] like Figure 3 As shown, to improve the heat exchange level between the coolant and the heat transfer element 130 and the heating element 120, the inlet hole 111 and the outlet hole 112 are respectively provided on two far apart sides of the housing 110. Specifically, the housing 110 is an elongated cuboid, and the inlet hole 111 and the outlet hole 112 are respectively provided on two surfaces on both sides of the length direction of the cuboid. In this way, when the heating element 120 and the heat transfer element 130 are located in the middle of the cuboid, the distance between the inlet hole 111 and the outlet hole 112 can be increased, prolonging the contact time between the coolant and the heat transfer element 130 and the heating element 120, and enabling sufficient heat exchange.
[0037] refer to Figure 2The lowest point of the inlet hole 111 is lower than the upper end face of the guide channel 140. In specific implementation, the sprayed coolant first gathers inside the guide channel 140 through its opening until the coolant level in the guide channel 140 is higher than the inlet hole 111. Then, the coolant can be guided into the housing 110 by its own gravity. To increase the rate at which the coolant enters the housing 110, the internal space of the guide channel 140 is a cone shape that is wider at the top and narrower at the bottom. In this way, the internal space of the guide channel 140 can be reduced while keeping the opening area the same. This allows the sprayed coolant to be received through the opening with a larger area, while also increasing the speed at which the coolant gathers in the guide channel 140, thus accelerating the efficiency of coolant delivery into the housing 110.
[0038] like Figure 3 As shown, the heat transfer element 130 includes several fins 131 that are thermally connected to the heating device 120. The fins 131 have an extension length in the horizontal direction. The several fins 131 are spaced apart in the vertical direction, that is, the fins 131 are arranged vertically. The liquid inlet hole 111 and the liquid outlet hole 112 are located on both sides of the length direction of the several fins 131.
[0039] It is understandable that vertically arranging the fins 131 reduces the space they occupy in the horizontal plane, thus helping to reduce the horizontal dimensions of the heat dissipation unit and the space it occupies within the server. However, at the same time, if the spraying liquid is sprayed from top to bottom, [refer to...] Figure 3 The upper fins 131 block the lower fins 131, making it difficult for the sprayed coolant to contact all the fins 131. Therefore, the heat dissipation unit of this invention needs to be set up, wherein the grooves formed between adjacent fins 131 are arranged from top to bottom, and the openings at both ends of the grooves are connected to the inlet hole 111 and the outlet hole 112, respectively. Thus, the grooves can act as coolant channels. The coolant collected by the guide groove 140 enters the housing 110 through the inlet hole 111. The coolant flows through the grooves between the fins 131 to fully absorb the heat of the fins 131. After absorbing the heat, the heated coolant flows out of the housing 110 through the outlet hole 112. In this way, immersion liquid cooling can be achieved for the heat-generating device 120, significantly improving the cooling rate.
[0040] like Figure 1-3 As shown, the housing 110 also includes a connector 150 for fixing and connecting external devices. In a specific implementation, the connector 150 is a handle strip fixedly provided on the housing 110. Specifically, refer to... Figure 3The handle strip can be clamped onto the baffle 116 and the cover 114. At this time, the middle part of the handle strip has a through hole 151 for connecting the hollow structure 115 of the cover and the liquid outlet hole 112 on the baffle 116. The lower part of the handle strip is provided with an embedding hole 152. By embedding the embedding hole 152 into the corresponding protrusion in the server, the heat dissipation unit can be stably installed in the server.
[0041] Example 2
[0042] like Figure 4-5 As shown, this embodiment provides a server, including a housing 200, a spray plate 300, and a heat dissipation unit 100 as described in Embodiment 1. The housing 200 has an upward-facing opening 210, and the heat dissipation unit 100 is disposed inside the housing 200. The spray plate 300 covers the opening 210. The surface of the spray plate 300 facing the interior of the housing 200 is provided with a plurality of spraying mechanisms 310, at least one of which sprays coolant towards the opening of the guide liquid tank 140. In specific implementation, the spraying mechanism 310 can be implemented using a plurality of densely distributed spray holes. In addition, in some embodiments, in order to improve the cooling rate, a plurality of spraying mechanisms 310 can be provided to spray coolant towards the surface of the housing 110 of the heat dissipation unit 100, thereby indirectly promoting the heat dissipation of the internal heat-generating devices 120 by cooling the housing 110. Continuing with the reference, several heat dissipation units 100 are provided, and each heat dissipation unit 100 is provided with a liquid guiding groove 140. At this time, corresponding to the liquid guiding groove 140 of each heat dissipation unit 100, at least one spraying mechanism 310 is provided to spray coolant toward the opening of the liquid guiding groove 140.
[0043] In practical applications, the spray plate 300 is connected to an external coolant supply device. The spray plate 300 sprays low-temperature coolant towards the opening of the guide tank 140 through the spray mechanism 310. When the coolant level in the guide tank 140 reaches the inlet hole 111, the low-temperature coolant can be guided into the interior of the housing 110 by its own gravity. By setting the outflow rate of the outlet hole 112 to be less than the inflow rate of the inlet hole, the coolant can basically fill the internal space of the housing 110, providing immersion liquid cooling for the heat transfer component 130 and the heat-generating device 120. At the same time, other heat-generating devices in the server are cooled by spray liquid cooling. In this way, different heat-generating devices can be sprayed or immersed in liquid cooling based on a single spray liquid cooling system, reducing the amount of coolant used, avoiding excessive coolant load on the server, and achieving efficient heat dissipation for different heat-generating devices.
[0044] Obviously, the above embodiments of this utility model are merely examples for clearly illustrating the technical solution of this utility model, and are not intended to limit the specific implementation of this utility model. Any modifications, equivalent substitutions, and improvements made within the spirit and principles of the claims of this utility model should be included within the protection scope of the claims of this utility model.
Claims
1. A heat dissipating unit, characterized by, The heat dissipation unit comprises a shell, a heating device, a heat transfer member and a liquid guide groove, the shell is provided with an inlet hole and an outlet hole, the heat transfer member and the heating device are arranged inside the shell and are in thermal conduction connection; The liquid guide groove is connected to the outer surface of the shell and the interior of the liquid guide groove is in communication with the inlet hole, and the opening of the liquid guide groove faces upward.
2. The heat dissipating unit according to claim 1, characterized in that The position of the inlet hole is higher than that of the outlet hole.
3. The heat dissipating unit according to claim 1, wherein The inlet hole and the outlet hole are arranged on two opposite sides of the shell.
4. The heat dissipating unit according to claim 1, wherein The aperture of the inlet hole is larger than that of the outlet hole.
5. The heat dissipating unit according to claim 1, wherein The lowest point of the inlet hole is lower than the upper end surface of the liquid guide groove.
6. The heat dissipating unit according to claim 1, wherein The interior space of the liquid guide groove is in the shape of a taper with a wide upper part and a narrow lower part.
7. The heat dissipating unit according to any one of claims 1 to 6, characterized in that, The heat transfer member comprises a plurality of fins in thermal conduction connection with the heating device, the fins have a length in the horizontal direction, and a plurality of the fins are arranged in gaps in the vertical direction. The inlet hole and the outlet hole are respectively located on both sides of the length direction of a plurality of the fins.
8. The heat dissipating unit according to any one of claims 1 to 6, characterized in that The shell further comprises a connecting member for fixedly connecting an external device.
9. A server, characterized by The heat dissipation unit comprises a shell, a heating device, a heat transfer member and a liquid guide groove, the shell is provided with an inlet hole and an outlet hole, the heat transfer member and the heating device are arranged inside the shell and are in thermal conduction connection; The liquid guide groove is connected to the outer surface of the shell and the interior of the liquid guide groove is in communication with the inlet hole, and the opening of the liquid guide groove faces upward. The position of the inlet hole is higher than that of the outlet hole. The inlet hole and the outlet hole are arranged on two opposite sides of the shell. The aperture of the inlet hole is larger than that of the outlet hole. The lowest point of the inlet hole is lower than the upper end surface of the liquid guide groove. The interior space of the liquid guide groove is in the shape of a taper with a wide upper part and a narrow lower part. The heat transfer member comprises a plurality of fins in thermal conduction connection with the heating device, the fins have a length in the horizontal direction, and a plurality of the fins are arranged in gaps in the vertical direction. The inlet hole and the outlet hole are respectively located on both sides of the length direction of a plurality of the fins. The shell further comprises a connecting member for fixedly connecting an external device. The heat dissipation unit comprises a shell, a heating device, a heat transfer member and a liquid guide groove, the shell is provided with an inlet hole and an outlet hole, the heat transfer member and the heating device are arranged inside the shell and are in thermal conduction connection; The liquid guide groove is connected to the outer surface of the shell and the interior of the liquid guide groove is in communication with the inlet hole, and the opening of the liquid guide groove faces upward. The position of the inlet hole is higher than that of the outlet hole. The inlet hole and the outlet hole are arranged on two opposite sides of the shell. The aperture of the inlet hole is larger than that of the outlet hole. The lowest point of the inlet hole is lower than the upper end surface of the liquid guide groove. The interior space of the liquid guide groove is in the shape of a taper with a wide upper part and a narrow lower part. The heat transfer member comprises a plurality of fins in thermal conduction connection with the heating device, the fins have a length in the horizontal direction, and a plurality of the fins are arranged in gaps in the vertical direction. The inlet hole and the outlet hole are respectively located on both sides of the length direction of a plurality of the fins. The shell further comprises a connecting member for fixedly connecting an external device.