Multifunctional semiconductor metal product precision machining integrated device
By designing a multifunctional integrated precision machining device for semiconductor metal products, which integrates a moving plate and a laser, the problem of cumbersome operation and low efficiency caused by the separate design of existing equipment is solved, and efficient and flexible precision machining is achieved.
Patent Information
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- Filing Date
- 2025-04-16
- Publication Date
- 2026-03-20
AI Technical Summary
Existing precision processing equipment for semiconductor metal products is mostly designed in a split manner, which is cumbersome to operate, has low processing efficiency, and high labor costs.
Design a multifunctional integrated precision machining device for semiconductor metal products, including a movable plate, a clamping plate, a laser engraver, and a laser cutter. The movable plate is driven to rotate by an electric motor to achieve multi-process integrated machining, and the device is combined with a slide rail and slider structure for all-round adjustment.
It enables comprehensive precision machining of semiconductor metal products, reducing manpower and material resources, shortening processing time, and improving production efficiency and flexibility.
Smart Images
Figure CN224011467U_ABST
Abstract
Description
TECHNICAL FIELD
[0001] The utility model relates to the technical field related to semiconductor metal product precision machining, especially to a multifunctional semiconductor metal product precision machining integrated device. BACKGROUND
[0002] Semiconductor metal product precision machining refers to using high-precision machining technology to process semiconductor metal products to ensure that they achieve extremely high precision and quality. This processing method is particularly important in the semiconductor industry because it directly affects the performance and reliability of semiconductor devices. In the semiconductor industry, precision machining technology is widely used in wafer processing, etching, lithography and other fields, and can produce high-performance semiconductor devices.
[0003] Most of the existing semiconductor metal product precision machining equipment is designed in multiple steps. Each processing method needs to be completed independently by a dedicated device, which is cumbersome to operate and has low processing efficiency. It also increases the cost of labor use. Therefore, we need to upgrade and modify the existing technology to overcome the existing problems and deficiencies. UTILITY MODEL CONTENT
[0004] The utility model aims at providing a multifunctional semiconductor metal product precision machining integrated device to solve the problems raised in the background technology.
[0005] To achieve the above-mentioned purpose, the utility model provides the following technical scheme:
[0006] A multifunctional semiconductor metal product precision machining integrated device is designed, which includes a device body. The device body contains a workbench and an adjusting assembly. An electric motor is fixed inside the center of the workbench, and a movable disc is connected to the driving end of the electric motor. The movable disc rotates on the workbench. Multiple sets of clamping discs are arranged in a ring array on the surface of the movable disc. Three sets of side supports are arranged on the outside of the workbench. Two sets of side supports have adjusting assemblies on the inside. A laser engraver and a laser cutter are installed at the lower end of each adjusting assembly. A laser positioner is installed at the lower end of the other side support.
[0007] Preferably, the adjusting assembly includes a first sliding rail, a first sliding block is slidingly installed at the lower end of the first sliding rail, a second sliding rail is fixed at the lower end of the first sliding block, and a second sliding block is slidingly installed at the front end of the second sliding rail.
[0008] Preferably, the second sliding block is provided with a connecting plate at the front end, and a connecting hole is formed in the second sliding block and the connecting plate. A connecting bolt is screwed and fixed in the connecting hole.
[0009] Preferably, the movable disc surface is provided with a plurality of sets of insertion pegs, the clamping disc side is provided with an insertion slot, and the insertion pegs are correspondingly connected in the insertion slot.
[0010] Preferably, a nut is screwed on the upper end of the insertion peg, and the nut is embedded in the upper end groove of the insertion slot.
[0011] Preferably, the workbench surface is provided with a guide sliding groove, and the lower end of the movable disc is provided with two sets of guide sliding blocks which are slidingly located in the guide sliding groove.
[0012] Compared with the prior art, the utility model has the beneficial effects that:
[0013] 1. The utility model discloses a semiconductor metal product processing device, which comprises a workbench, a movable disc, a clamping disc, a guide sliding groove, guide sliding blocks, a motor, a laser positioner, a laser engraver and a laser cutter.
[0014] 2. The utility model discloses a semiconductor metal product processing device, which comprises a workbench, a movable disc, a clamping disc, a guide sliding groove, guide sliding blocks, a motor, a laser positioner, a laser engraver and a laser cutter.
[0015] The specific embodiments of the utility model are disclosed in detail in the following description and drawings, and the principle of the utility model can be adopted. It should be understood that the embodiments of the utility model are not limited in scope. The embodiments of the utility model include many changes, modifications and equivalents within the scope of the appended claims and clauses. BRIEF DESCRIPTION OF DRAWINGS
[0016] The accompanying drawings are used to provide a further understanding of the utility model, and constitute a part of the specification, and are used to explain the utility model together with embodiments of the utility model, and do not constitute a limitation on the utility model. In the drawings:
[0017] Figure 1 It is a schematic diagram of the overall structure according to the utility model;
[0018] Figure 2 It is an exploded view of the workbench structure according to the utility model;
[0019] Figure 3 is a exploded view of the movable disc structure according to the utility model;
[0020] Figure 4 is an exploded view of the adjusting assembly according to the utility model.
[0021] In the figure: 1, device body; 2, workbench; 21, movable disc; 22, clamping disc; 23, guide sliding groove; 24, guide sliding block; 25, motor; 26, plug-in bolt; 27, nut; 28, plug-in slot; 3, side support; 4, laser positioner; 5, laser engraver; 6, laser cutter; 7, adjusting assembly; 71, first sliding rail; 72, first sliding block; 73, second sliding rail; 74, second sliding block; 75, connecting plate; 76, connecting hole; 77, connecting bolt. DETAILED DESCRIPTION
[0022] In order to make the technical means, creative features, purposes and effects achieved by the utility model easy to understand, the utility model is further described below in combination with specific embodiments.
[0023] As Figure 1 shown in FIG. 4, the multifunctional semiconductor metal product precision machining integrated device provided by the embodiment includes a device body 1, the device body 1 contains a workbench 2 and an adjusting assembly 7 inside, a motor 25 is fixed inside the center of the workbench 2 and the driving end of the motor 25 is connected with a movable disc 21, the movable disc 21 rotates on the workbench 2, a plurality of clamping discs 22 are arranged in an annular array on the surface of the movable disc 21, three groups of side supports 3 are arranged on the outside of the workbench 2, the inside of two groups of side supports 3 is respectively provided with an adjusting assembly 7, a laser engraver 5 and a laser cutter 6 are respectively installed at the lower end of the two groups of adjusting assemblies 7, and a laser positioner 4 is installed at the lower end of the other group of side supports 3.
[0024] In the embodiment, the adjusting assembly 7 contains a first sliding rail 71, a first sliding block 72 is slidingly installed at the lower end of the first sliding rail 71, a second sliding rail 73 is fixed at the lower end of the first sliding block 72, a second sliding block 74 is slidingly installed at the front end of the second sliding rail 73, a connecting plate 75 is arranged at the front end of the second sliding block 74, connecting holes 76 are respectively arranged on the second sliding block 74 and the connecting plate 75, and a connecting bolt 77 is screw-fixed in the connecting holes 76, the first sliding block 72 drives the second sliding rail 73 to move at the lower end of the first sliding rail 71, the second sliding block 74 drives the connecting plate 75 to move at the front end of the second sliding rail 73, and then the laser engraver 5 and the laser cutter 6 can be controlled to move and adjust in all directions, so that the semiconductor metal product can be subjected to precision machining operation in all directions, the operation is simple and convenient, different machining requirements can be adapted to, and the flexibility of the device is improved.
[0025] In this embodiment, the surface of the movable disc 21 is provided with a plurality of groups of plug pins 26, the side of the clamping disc 22 is provided with plug slots 28, the plug pins 26 are connected in the plug slots 28 correspondingly, nuts 27 are screwed on the upper ends of the plug pins 26, the nuts 27 are embedded in the recesses on the upper ends of the plug slots 28, guide sliding grooves 23 are formed on the surface of the workbench 2, two groups of guide sliding blocks 24 are arranged at the lower end of the movable disc 21, the guide sliding blocks 24 are slidably located in the guide sliding grooves 23, the clamping disc 22 is positioned and installed through the plug pins 26 and the plug slots 28, is fixed through the nuts 27, the movable disc 21 is driven to rotate through the motor 25, the stability of the movable disc 21 is maintained through the guide sliding grooves 23 and the guide sliding blocks 24, and then the rotation control of the plurality of clamping discs 22 can be realized, the position replacement of the clamping disc 22 is facilitated, the integrated processing of the semiconductor metal products is facilitated, a plurality of processes are combined into one process, the investment of manpower, material resources and financial resources is reduced, the processing time is shortened, and the production efficiency is improved.
[0026] The use principle and use process of the utility model are as follows: when in use, a plurality of groups of semiconductor metal products are placed in the plurality of groups of clamping discs 22, the movable disc 21 is driven to rotate above the workbench 2 through the motor 25, so that one group of semiconductor metal products reaches the lower end of the laser positioner 4 for positioning detection, then the movable disc 21 continues to rotate, so that the positioned semiconductor metal products move to the lower end of the laser engraver 5 for etching operation, while a new group of semiconductor metal products is positioned at the lower end of the laser positioner 4 for positioning operation, after etching is completed, the movable disc 21 continues to rotate, so that the etched semiconductor metal products rotate to the lower end of the laser cutter 6 and perform cutting operation, the positioned semiconductor metal products rotate to the lower end of the laser engraver 5, and the new semiconductor metal products continue to perform positioning operation, a plurality of processing steps can be completed at one time, the processing time is shortened and the processing efficiency is improved.
[0027] In the description of the utility model, it should be explained that, unless otherwise explicitly specified and limited, the terms "installation", "provided with", "connection" and the like should be understood broadly, for example, "connection" can be fixed connection, can also be detachable connection, or integral connection, can be mechanical connection, can also be electrical connection, can be directly connected, can also be indirectly connected through an intermediate medium, can be the communication inside two elements. For ordinary skilled in the art, the specific meaning of the above terms in the utility model can be understood according to specific conditions.
[0028] In the description of the present embodiment, the terms "upper", "lower", "right", "left", and the like, are based on the orientation or positional relationship shown in the drawings, and are only for the convenience of description and simplification of operation, and do not indicate or imply that the devices or elements referred to must have a particular orientation, be constructed and operated in a particular orientation, and therefore cannot be understood as a limitation on the present utility model. In addition, the terms "first", "second" are only used to distinguish in description, and have no special meaning.
Claims
1. A multifunctional integrated precision machining device for semiconductor metal products, characterized in that: The device includes a main body (1), which contains a worktable (2) and an adjustment component (7). A motor (25) is fixed in the center of the worktable (2), and the drive end of the motor (25) is connected to a movable disk (21). The movable disk (21) rotates on the worktable (2). Multiple clamping disks (22) are arranged in a ring array on the surface of the movable disk (21). Three sets of side supports (3) are arranged on the outside of the worktable (2). Adjustment components (7) are respectively arranged on the inner side of two sets of side supports (3). A laser engraver (5) and a laser cutter (6) are respectively installed at the lower end of the two sets of adjustment components (7). A laser positioner (4) is installed at the lower end of the other set of side supports (3).
2. The multifunctional integrated precision machining device for semiconductor metal products according to claim 1, characterized in that: The adjustment component (7) includes a first slide rail (71), a first slider (72) is slidably mounted on the lower end of the first slide rail (71), a second slide rail (73) is fixed on the lower end of the first slider (72), and a second slider (74) is slidably mounted on the front end of the second slide rail (73).
3. The multifunctional integrated precision machining device for semiconductor metal products according to claim 2, characterized in that: The second slider (74) has a connecting plate (75) at its front end. The second slider (74) and the connecting plate (75) have corresponding connecting holes (76), and a connecting bolt (77) is screwed into the connecting hole (76).
4. The multifunctional integrated precision machining device for semiconductor metal products according to claim 1, characterized in that: The surface of the movable disc (21) is provided with multiple sets of plugs (26), and the side of the clamping disc (22) is provided with a plug groove (28), and the plugs (26) are connected to the plug groove (28).
5. The multifunctional integrated precision machining device for semiconductor metal products according to claim 4, characterized in that: The upper end of the plug (26) is screwed with a nut (27), which is embedded in the groove at the upper end of the plug slot (28).
6. The multifunctional integrated precision machining device for semiconductor metal products according to claim 1, characterized in that: The workbench (2) has a guide groove (23) on its surface, and the lower end of the movable disk (21) is provided with two sets of guide blocks (24), which slide within the guide groove (23).