Clamp type plating line anode plate and device based on rectangular splicing structure

Abstract

The embodiment of the utility model provides a clip type plating line anode plate and device based on a rectangular splicing structure. The anode plate comprises a supporting layer and an anode layer covering the surface of one side of the supporting layer, the anode layer is formed by splicing at least two rectangular anode regions; the at least two rectangular anode regions are in clearance fit to form an abutted seam, and the rectangular anode regions are electrically connected with each other.

Description

Technical Field

[0001] This utility model relates to the field of composite copper foil electroplating, and in particular to a clip-type electroplating line anode plate and device based on a rectangular splicing structure. Background Technology

[0002] In current composite copper foil electroplating production lines, a type of edge-conductive electroplating equipment has emerged. This equipment features numerous conductive clamps that hold the composite copper foil at both edges. A steel belt conveyor and opening / closing mechanism enable continuous movement and opening / closing of the clamps, allowing for continuous production of the composite copper foil. A common characteristic of these clamp-type electroplating lines on the market is that the conductive cathode clamps and anode plates are positioned parallel to the direction of movement of the copper foil being plated. This results in the current flowing from the anode to the cathode perpendicular to the copper foil's movement. The problem is that the uniformity of the copper foil surface is uneven in the direction perpendicular to the mechanical movement, and this unevenness is difficult to compensate for during the electroplating process. In existing conductive clamp examples in the industry, each anode is typically composed of five trapezoidal anode plates. In actual production, the plating layer tends to be thinner at the trapezoidal seam and thicker further away from the seam, making it difficult to meet the minimum uniformity requirement of ±3 milliohms for composite copper foil products, let alone the high-quality requirement of ±1 milliohms.

[0003] In the process of developing this utility model, the applicant discovered at least the following problems in the prior art:

[0004] During the electroplating process, the uniformity of the copper foil surface is unevenly distributed in the direction perpendicular to the mechanical operation, making it difficult to meet the minimum uniformity requirement of ±3 milliohms for composite copper foil products. Utility Model Content

[0005] This utility model provides an anode plate and device for a clip-type electroplating line based on a rectangular splicing structure, which solves the problem that the uniformity of the copper foil surface is unevenly distributed in the direction perpendicular to the mechanical operation during the electroplating process of the clip-type electroplating line, making it difficult to meet the minimum uniformity requirement of ±3 milliohms for composite copper foil products.

[0006] To achieve the above objectives, on the one hand, this utility model embodiment provides a clip-type electroplating line anode plate based on a rectangular splicing structure, the anode plate comprising: a support layer and an anode layer covering one side surface of the support layer;

[0007] The anode layer is composed of at least two rectangular anode regions joined together.

[0008] The at least two rectangular anode areas are fitted together to form a seam, and the rectangular anode areas are electrically connected to each other.

[0009] On the other hand, this utility model embodiment provides a clip-type electroplating line anode plate device based on a rectangular splicing structure, including: a first anode plate group, the first anode plate group including: multiple anode plates as described above;

[0010] In the first anode plate group, the front faces of multiple anode plates face the same direction, and the plate surfaces are arranged parallel to each other at a preset interval. The seam of the rectangular anode area of ​​one of the two adjacent anode plates is aligned with the center line of the rectangular anode area of ​​the other anode plate.

[0011] The above technical solution has the following beneficial effects: By splicing small rectangular anode areas to form an anode plate, and utilizing the symmetry of the small rectangular anode areas and the 90-degree angle between the rectangular sides, the distribution of the electroplating current across the entire anode plate is made more uniform. When multiple anode plates are used as anodes, the thinner joints are utilized, and the splicing of multiple small rectangular structures creates a sinusoidal distribution curve of the plating thickness in the direction perpendicular to the mechanical movement. The combined current action of adjacent anode plates achieves the effect of two sinusoidal waves overlapping by half a cycle. More anode plates result in more overlapping sinusoidal waves, thus achieving consistent thickness uniformity. This allows the clamp-type electroplating equipment to meet the high-quality requirement of ±3 milliohms or even ±1 milliohm in the composite copper foil electroplating process. Attached Figure Description

[0012] To more clearly illustrate the technical solutions in the embodiments of this utility model or the prior art, the drawings used in the description of the embodiments or the prior art will be briefly introduced below. Obviously, the drawings described below are only some embodiments of this utility model. For those skilled in the art, other drawings can be obtained based on these drawings without creative effort.

[0013] Figure 1 This is a schematic diagram of the splicing of a rectangular anode area of ​​the anode layer of the anode plate in one embodiment of this utility model;

[0014] Figure 2 This is a schematic diagram of the plate structure of an anode plate according to one embodiment of the present utility model;

[0015] Figure 3 This is another schematic diagram of the rectangular anode area of ​​the anode layer of the anode plate in one embodiment of this utility model;

[0016] Figure 4 This is a schematic diagram showing the positional relationship of multiple anode plates located on the same side of the workpiece to be plated, according to one embodiment of the present invention.

[0017] Figure 5 This is a schematic diagram showing the positional relationship of multiple anode plates located on both sides of the workpiece to be plated, which is one embodiment of this utility model.

[0018] The reference numerals in the attached figures are as follows: 1, rectangular anode area; 2, anode plate; 21, support layer; 22, anode layer; 4, first anode plate group; 5, second anode plate group. Detailed Implementation

[0019] The technical solutions of the present utility model will be clearly and completely described below with reference to the accompanying drawings of the embodiments. Obviously, the described embodiments are only some embodiments of the present utility model, and not all embodiments. Based on the embodiments of the present utility model, all other embodiments obtained by those of ordinary skill in the art without creative effort are within the protection scope of the present utility model.

[0020] On the one hand, such as Figure 1 and Figure 2 As shown, this utility model embodiment provides a clip-type electroplating line anode plate based on a rectangular splicing structure. The anode plate 2 includes: a support layer 21 and an anode layer 22 covering one side surface of the support layer 21.

[0021] The anode layer 22 is composed of at least two rectangular anode regions 1 joined together;

[0022] The at least two rectangular anode regions 1 are fitted together with a gap to form a joint, and the rectangular anode regions 1 are electrically connected to each other.

[0023] The rectangular anode area is made of conductive material, and its four sides are perpendicular. The sides are perpendicular or parallel to the direction of the electroplating current, avoiding obtuse or acute angles and preventing uneven electroplating current distribution. The regular shape of the rectangular anode area facilitates splicing into larger anode plates. It also allows for the alignment of the seams of the rectangular anode areas on one anode plate with the center of the rectangular anode areas on adjacent anode plates when multiple anode plates are stacked. This creates a superimposed effect of multiple sine waves at the alternating seams and centers of the rectangular anode areas, resulting in more uniform electroplating.

[0024] Furthermore, all rectangular anode regions 1 have the same dimensions.

[0025] Using rectangular anode areas of the same size can simplify the manufacturing process.

[0026] Furthermore, all rectangular anode areas 1 are squares with a side length of 10 centimeters.

[0027] In some embodiments, the range of the current is 5 cm extending from the seam to both sides. Setting the rectangular anode area as a square with a side length of 10 cm can ensure that the current is evenly distributed.

[0028] Furthermore, such as Figure 3 As shown, adjacent rectangular anode areas 1 are joined together with their adjacent edges aligned.

[0029] Furthermore, such as Figure 1 As shown, the seams of the two downward rectangular anode areas 1 in the at least two rectangular anode areas 1 are aligned with the center line of the upward rectangular anode area 1.

[0030] Furthermore, the anode plate 2 has a rectangular structure and the width of the anode plate 2 is smaller than the width of the copper foil to be plated.

[0031] On the other hand, such as Figure 4 As shown, this utility model embodiment provides a clip-type electroplating line anode plate device based on a rectangular splicing structure, including: a first anode plate group 4, the first anode plate group 4 including: multiple anode plates 2 as described above;

[0032] In the first anode plate group 4, the front faces of multiple anode plates 2 are facing the same direction, and the plate surfaces are arranged parallel to each other at a preset interval. The seam of the rectangular anode area of ​​one anode plate 2 in two adjacent anode plates is aligned with the center line of the rectangular anode area 1 of the other anode plate 2.

[0033] Taking advantage of the thinner joints, the coating thickness is distributed in a sinusoidal shape in the direction of vertical mechanical movement by splicing together multiple small rectangular anode areas. The adjacent large anode plates will achieve the overlap of two sinusoidal waves separated by half a cycle. More large anode plates will form more sinusoidal wave overlaps, thus achieving uniform thickness. The front side of anode plate 2 is the side where the anode layer is located, which is also the side facing the workpiece being plated.

[0034] Furthermore, such as Figure 5 As shown, the device further includes: a second anode plate group 5, which includes: multiple anode plates 2 as described above;

[0035] In the second anode plate group 5, the front faces of multiple anode plates 2 are facing the same direction, and the plate surfaces are arranged parallel to each other at a preset interval. The seam of the rectangular anode area 1 of one anode plate 2 in two adjacent anode plates 2 is aligned with the center line of the rectangular anode area 1 of the other anode plate 2.

[0036] The front of the anode plate 2 in the second anode plate group 5 is parallel to the front of the anode plate 2 in the first anode plate group 4, and a space is provided between the second anode plate group 5 and the first anode plate group 4 to accommodate the workpiece to be plated.

[0037] According to the equipment structure, the anode plates are arranged perpendicular to the running direction of the copper foil on the workpiece, and are arranged horizontally with an overall width smaller than the width of the copper foil, forming a rectangular structure. In some embodiments, the anode plate is formed by dispersing and splicing multiple small rectangular anode areas, with a maximum of 2 rectangular anode areas, and a recommended number of 11. The number of rectangular anode areas can be determined by first determining the width of the anode plate based on the width of the copper foil, and then calculating the number of rectangular anode areas based on the width of the anode plate and the dimensions of the rectangular anode areas. Dozens of large rectangular anode plates are arranged in parallel throughout the electroplating tank, and the seams of the rectangular anode areas in each pair of adjacent large rectangular anode plates cannot overlap. The front side of anode plate 2 is the side where the anode layer is located, which is also the side facing the workpiece to be plated.

[0038] By taking advantage of the thinner seam, the coating thickness is distributed in a sinusoidal shape in the direction of vertical mechanical movement by splicing together multiple small rectangular anode areas. The adjacent large anode plates will achieve the overlap of two sinusoidal waves separated by half a cycle. More large anode plates will form more sinusoidal wave overlaps, thus achieving uniform thickness.

[0039] It should be understood that the specific order or hierarchy of steps in the disclosed process is an example of an exemplary method. Based on design preferences, it should be understood that the specific order or hierarchy of steps in the process may be rearranged without departing from the scope of this disclosure. The appended method claims provide elements of various steps in an exemplary order and are not intended to limit the scope to the specific order or hierarchy described.

[0040] In the above detailed description, various features are combined together in a single embodiment to simplify this disclosure. This approach to disclosure should not be construed as reflecting an intention that embodiments of the claimed subject matter require more features than are explicitly stated in each claim. Rather, as reflected in the appended claims, the invention is presented with fewer features than all of the features in a single disclosed embodiment. Therefore, the appended claims are hereby explicitly incorporated into the detailed description, with each claim representing a separate preferred embodiment of the invention.

[0041] The disclosed embodiments have been described above to enable any person skilled in the art to implement or use this invention. Various modifications to these embodiments will be apparent to those skilled in the art, and the general principles defined herein can be applied to other embodiments without departing from the spirit and scope of this disclosure. Therefore, this disclosure is not limited to the embodiments given herein, but is consistent with the widest scope of the principles and novel features disclosed in this application.

[0042] The foregoing description includes examples of one or more embodiments. It is certainly impossible to describe all possible combinations of components or methods in order to describe the above embodiments, but those skilled in the art will recognize that further combinations and arrangements of the various embodiments are possible. Therefore, the embodiments described herein are intended to cover all such changes, modifications, and variations falling within the scope of the appended claims. Furthermore, the term "comprising" as used in the specification or claims is covered in a manner similar to the term "including". Additionally, the use of any term "or" in the specification of the claims is intended to mean "non-exclusive or".

[0043] The specific embodiments described above further illustrate the purpose, technical solution, and beneficial effects of this utility model. It should be understood that the above description is only a specific embodiment of this utility model and is not intended to limit the scope of protection of this utility model. Any modifications, equivalent substitutions, improvements, etc., made within the spirit and principles of this utility model should be included within the scope of protection of this utility model.

Claims

1. A clip-type electroplating line anode plate based on a rectangular splicing structure, characterized in that, The anode plate (2) includes: a support layer (21) and an anode layer (22) covering one side surface of the support layer (21); The anode layer (22) is composed of at least two rectangular anode regions (1) joined together; The at least two rectangular anode regions (1) are fitted together to form a seam, and the rectangular anode regions (1) are electrically connected to each other; All rectangular anode regions (1) have the same dimensions; All rectangular anode areas (1) are squares with a side length of 10 cm; Adjacent rectangular anode areas (1) are joined together by aligning adjacent edges.

2. The clip-type electroplating line anode plate based on a rectangular splicing structure as described in claim 1, characterized in that, The seams of the two downward rectangular anode areas (1) of the at least two rectangular anode areas (1) are aligned with the center line of the upward rectangular anode area (1).

3. The clip-type electroplating line anode plate based on a rectangular splicing structure as described in claim 1, characterized in that, The anode plate (2) has a rectangular structure and the width of the anode plate (2) is smaller than the width of the copper foil to be plated.

4. A clamp-type electroplating line anode plate device based on a rectangular splicing structure, characterized in that, include: The first anode plate group (4) includes: a plurality of anode plates (2) as described in any one of claims 1-3; The front faces of the multiple anode plates (2) in the first anode plate group (4) are facing the same direction, and the plate surfaces are arranged parallel to each other at a preset interval. The seam of the rectangular anode area (1) of one of the two adjacent anode plates (2) is aligned with the center line of the rectangular anode area (1) of the other anode plate (2).

5. The clamp-type electroplating line anode plate device based on a rectangular splicing structure as described in claim 4, characterized in that, Also includes: The second anode plate group (5) includes: a plurality of anode plates (2) as described in claim 1; The front faces of the multiple anode plates (2) in the second anode plate group (5) are facing the same direction, and the plate surfaces are arranged parallel to each other at a preset interval. The seam of the rectangular anode area (1) of one of the two adjacent anode plates (2) is aligned with the center line of the rectangular anode area (1) of the other anode plate (2). The front of the anode plate (2) in the second anode plate group (5) is parallel to the front of the anode plate (2) in the first anode plate group (4), and a space is provided between the second anode plate group (5) and the first anode plate group (4) to accommodate the plated part.

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