High-temperature testing device for probe card

Abstract

The utility model discloses a high-temperature testing device for a probe card, which relates to the technical field of high-temperature testing of probe cards and comprises a high-temperature testing frame, a buffer connecting spring is fixedly connected to the bottom end in the high-temperature testing frame, and a probe card limiting chassis frame is fixedly connected to the top end of one side of the buffer connecting spring. A probe card to be tested at a high temperature is placed on a probe card limiting chassis frame, buffer connection springs at multiple positions are arranged between a high-temperature testing frame and the probe card limiting chassis frame, fixing and buffering operation is achieved, the position height of an extrusion adjusting threaded rod in a sliding connection disc is adjusted through rotation of a rotating disc, and the high-temperature testing efficiency is improved. The position of the fixed chassis is directly adjusted, the probe card is limited and buckled by using the fixed chassis at multiple positions, and the sliding connecting disc is adjusted on the surface of the top end of the connecting arm, so that extrusion fixing operation at different sites can be realized, and the detection stability of the probe card is improved.

Description

TECHNICAL FIELD

[0001] The utility model relates to probe card high temperature test technical field especially relates to a probe card's high temperature testing device. BACKGROUND

[0002] In the method of manufacturing semiconductor integrated circuit device, the semiconductor chip is usually obtained by forming a large number of integrated circuits on the wafer and cutting the wafer, in order to test the electrical properties, usually need to carry out probe test to the semiconductor chip in the wafer state, in the state of being cut into individual semiconductor chips or in the packaging state before being sealed with resin, in the engineering test, the wafer level test needs to be tested at high temperature 85 DEG C / 125 DEG C, the probe card used in the test is passive to reach the test temperature point by the contact with the wafer, which needs the test engineer to judge according to experience, and it is time-consuming and laborious and has great randomness to operate.Moreover, when the wafer is replaced, the probe card and the wafer are separated for a long time, the temperature of the probe drops rapidly to the ambient temperature, the probe starts to test without the intervention of the engineer when it is far from the test requirement, which affects the reliability and stability of the test data, therefore, we redesign a kind of probe card's high temperature testing device. SUMMARY

[0003] The utility model discloses a kind of probe card's high temperature testing device.

[0004] To solve the above technical problems, the utility model provides the following technical scheme: a kind of probe card's high temperature testing device, including high temperature test frame, the inside bottom end of the high temperature test frame is fixedly connected with buffer connecting spring, the side top of the buffer connecting spring is fixedly connected with probe card limiting bottom disc frame, the side top outer wall of the high temperature test frame is fixedly installed with connecting base, the top of the connecting base is fixedly installed with connecting arm, the side top surface of the connecting arm is equipped with limit sliding slot, the side top surface of the limit sliding slot is detachably installed with sliding connection disc, the inside of the sliding connection disc is movably installed with extrusion adjusting screw rod, the side top of the extrusion adjusting screw rod is fixedly connected with rotating disc, the side bottom of the extrusion adjusting screw rod is fixedly connected with fixed bottom disc.

[0005] Preferably, the number of buffer connecting springs is several, the buffer connecting springs are arranged in matrix between the high temperature test frame and the probe card limiting bottom disc frame, the extrusion adjusting screw rod penetrates the inside of the sliding connection disc, the connection between the extrusion adjusting screw rod and the sliding connection disc is screw connection, the extrusion adjusting screw rod is located in the inside of the limit sliding slot, the sliding connection disc is located on the top surface of the connecting arm, and the sliding connection between the sliding connection disc and the connecting arm is sliding connection.

[0006] Preferably, the high-temperature test frame is fixedly installed with a test adjusting frame on the outer wall of the side top end, a main control device is fixedly installed on the side back of the test adjusting frame, a data display is fixedly installed on the front top end of the main control device, a control setting disc is arranged on the front bottom end of the main control device, and a remote signal transmitter is fixedly installed on the side top end surface of the main control device.

[0007] Preferably, a sliding adjusting limiting groove is arranged on the top end surface of the test adjusting frame, a driving threaded rod is detachably installed in the sliding adjusting limiting groove, a driving sliding disc is movably installed on the side surface of the driving threaded rod, a driving motor is fixedly installed on the side top end of the test adjusting frame, and a remote control connector is fixedly installed on the side top end of the driving motor.

[0008] Preferably, a telescopic controller is fixedly installed on the side top end of the driving sliding disc, a telescopic adjusting column is movably installed on the side bottom end of the driving sliding disc, a connecting block is fixedly connected on the side bottom end of the telescopic adjusting column, a heating base plate is fixedly installed on the side bottom end of the connecting block, a heating controller is fixedly installed on the side top end surface of the heating base plate, a heating base is fixedly connected on the side bottom end surface of the heating base plate, and a test probe is fixedly connected on the side bottom end of the heating base.

[0009] Preferably, the driving threaded rod penetrates the inside of the driving sliding disc, the connection relationship between the driving threaded rod and the driving sliding disc is a threaded driving connection, the connection relationship between the telescopic controller and the telescopic adjusting column is a driving connection, the side surface of the telescopic controller is provided with a remote control connector, the side top end of the heating base plate is provided with a remote control connector, the connection relationship between the remote control connector and the remote signal transmitter is a remote signal connection, the heating base and the test probe are in one-to-one correspondence, the heating bases are equidistantly distributed on the bottom end surface of the heating base plate, and the connection relationship between the heating controller and the heating base is a power control connection.

[0010] Compared with the related art, the high-temperature test device for the probe card has the following beneficial effects:

[0011] 1. The high-temperature test device for the probe card is provided, the probe card to be tested is placed on the probe card limiting base plate frame, a plurality of position buffer connecting springs are arranged between the high-temperature test frame and the probe card limiting base plate frame, the position height of the extrusion adjusting threaded rod in the sliding connecting disc is adjusted by the rotation of the rotating disc, thereby directly adjusting the position of the fixed base plate, the probe card is installed by a plurality of position fixed base plates, the sliding connecting disc is adjusted on the top end surface of the connecting arm, the extrusion fixing operation of different positions can be realized, and the detection stability of the probe card is improved.

[0012] 2, the utility model provides a high temperature testing device of probe card, through setting up main control unit direct control drive motor's opening, utilize drive motor control drive screw rod's rotation operation, drive drive sliding disc to slide in the position inside sliding adjustment limiting groove, for the horizontal position adjustment of detection device, telescopic controller control telescopic adjusting column's telescopic, adjust heating base plate's position height, realize starting operation through heating controller for multiple position heating base, utilize heating base for the heating operation of test probe, through test probe carries out high temperature contact test operation, the wireless connection between remote control connector and remote signal transmitter, convenient buffer connecting spring direct control for heating base plate, for the direct control of drive motor, also convenient for the direct control of telescopic controller, improve the control convenience of device. BRIEF DESCRIPTION OF DRAWINGS

[0013] Figure 1 It is the three-dimensional structure schematic diagram of the utility model;

[0014] Figure 2 It is high temperature test stand inside the overhead view structure schematic diagram of the utility model;

[0015] Figure 3 It is the A place enlarged structure schematic diagram of the utility model Figure 1 ;

[0016] Figure 4 It is the device overall side view structure schematic diagram of the utility model.

[0017] Marked number in drawing: 1, high temperature test stand; 2, buffer connecting spring; 3, probe card limiting base stand; 4, connecting base; 5, connecting arm; 6, limiting sliding groove; 7, sliding connection disc; 8, extrusion adjusting screw rod; 9, rotation disc; 10, fixed base plate; 11, test adjusting stand; 12, main control unit; 13, data display; 14, control setting disc; 15, remote signal transmitter; 16, sliding adjustment limiting groove; 17, drive screw rod; 18, drive sliding disc; 19, drive motor; 20, remote control connector; 21, telescopic controller; 22, telescopic adjusting column; 23, connecting block; 24, heating base plate; 25, heating controller; 26, heating base; 27, test probe. DETAILED DESCRIPTION

[0018] Example one:

[0019] Please refer to Figures 1-4This utility model provides a technical solution: a high-temperature testing device for a probe card, including a high-temperature testing frame 1. A buffer connecting spring 2 is fixedly connected to the bottom of the high-temperature testing frame 1. A probe card limiting base frame 3 is fixedly connected to the top of one side of the buffer connecting spring 2. A connecting base 4 is fixedly installed on the outer wall of the top of one side of the high-temperature testing frame 1. A connecting arm 5 is fixedly installed on the top of the connecting base 4. A limiting sliding groove 6 is formed on the top surface of one side of the connecting arm 5. A sliding connecting plate 7 is detachably installed on the top surface of one side of the limiting sliding groove 6. A compression adjusting threaded rod 8 is movably installed inside the sliding connecting plate 7. A rotating disk 9 is fixedly connected to the top of one side of the adjusting threaded rod 8, and a fixed base 10 is fixedly connected to the bottom of one side of the pressing adjusting threaded rod 8. There are several buffer connecting springs 2, which are arranged in a matrix between the high temperature test frame 1 and the probe card limiting base frame 3. The pressing adjusting threaded rod 8 passes through the interior of the sliding connecting disk 7. The connection between the pressing adjusting threaded rod 8 and the sliding connecting disk 7 is a threaded connection. The pressing adjusting threaded rod 8 is located inside the limiting sliding groove 6. The sliding connecting disk 7 is located on the top surface of the connecting arm 5. The connection between the sliding connecting disk 7 and the connecting arm 5 is a sliding connection.

[0020] In the implementation plan, the probe card to be tested at high temperature is placed on the probe card limiting chassis frame 3. Multiple buffer connecting springs 2 are set between the high temperature test frame 1 and the probe card limiting chassis frame 3 to provide a fixed buffer operation. By rotating the rotating disk 9, the position height of the extrusion adjusting threaded rod 8 inside the sliding connecting disk 7 is adjusted, thereby directly adjusting the position of the fixed chassis 10. The fixed chassis 10 at multiple positions is used to limit and snap the probe card. The sliding connecting disk 7 is adjusted on the top surface of the connecting arm 5, which can realize the extrusion and fixing operation at different points and improve the detection stability of the probe card.

[0021] Example 2:

[0022] Please see Figures 1-4The utility model provides a kind of technical scheme: a high temperature testing device of probe card, including the side top outer wall fixed mounting of high temperature test frame 1 is equipped with test adjusting frame 11, the side back of test adjusting frame 11 is fixedly installed with main controler 12, the front top of main controler 12 is fixedly installed with data display 13, the front bottom of main controler 12 is provided with control setting disc 14, the side top surface of main controler 12 is fixedly installed with remote signal transmitter 15, the top surface of test adjusting frame 11 is equipped with sliding adjustment limiting groove 16, driving screw rod 17 is detachably installed in the inside of sliding adjustment limiting groove 16, the side surface of driving screw rod 17 is movably installed with driving sliding disc 18, the side top of test adjusting frame 11 is fixedly installed with driving motor 19, the side top of driving motor 19 is fixedly installed with remote control connector 20, the side top of driving sliding disc 18 is fixedly installed with telescopic controller 21, the side bottom of driving sliding disc 18 is movably installed with telescopic adjusting column 22, the side bottom of telescopic adjusting column 22 is fixedly connected with connecting block 23, the side bottom of connecting block 23 is fixedly installed with heating base plate 24, the side top surface of heating base plate 24 is fixedly installed with heating controller 25, the side bottom surface of heating base plate 24 is fixedly connected with heating base 26, the side bottom of heating base 26 is fixedly connected with test probe 27, driving screw rod 17 penetrates the inside of driving sliding disc 18, the connection of driving screw rod 17 and driving sliding disc 18 is screw driving connection, the connection of telescopic controller 21 and telescopic adjusting column 22 is driving connection, the side of telescopic controller 21 is provided with remote control connector 20, the side top of heating base plate 24 is provided with remote control connector 20, the connection of remote control connector 20 and remote signal transmitter 15 is remote signal connection, the position of heating base 26 and test probe 27 is one to one correspondence, heating base 26 is equidistantly distributed at the bottom surface of heating base plate 24, the connection of heating controller 25 and heating base 26 is power control connection.

[0023] In the embodiment, by setting main controler 12 directly control the opening of driving motor 19, utilize driving motor 19 control the rotation operation of driving screw rod 17, drive driving sliding disc 18 to slide in the position inside sliding adjustment limiting groove 16, for the horizontal position adjustment of detection device, telescopic controller 21 control telescopic adjusting column 22 to stretch out or draw back, adjust the position height of heating base plate 24, realize starting operation through heating controller 25 for multiple position heating base 26, utilize heating base 26 for the heating operation of test probe 27, through test probe 27 carries out high temperature contact test operation, the wireless connection between remote control connector 20 and remote signal transmitter 15, the control of heating base plate 24 is directly convenient for buffer connecting spring 2, for the direct control of driving motor 19, also convenient for the direct control of telescopic controller 21, improve the control convenience of device.

[0024] Working principle:

[0025] By setting the probe card limiting chassis 3 placed on the need for high temperature test probe card, set between the high temperature test frame 1 and the probe card limiting chassis 3 of the multiple position buffer connecting spring 2, play fixed buffer work, using the rotating disc 9 rotation, adjusting the extrusion adjusting screw rod 8 in the sliding connection disc 7 inside the position height, thus directly adjusting the position of the fixed chassis 10, using multiple position fixed chassis 10 for probe card limiting buckle installation, sliding connection disc 7 in the top surface of the connecting arm 5 adjustment, can realize different site extrusion fixed work, improve the detection stability of the probe card;

[0026] By setting the main control unit 12 directly control the opening of the drive motor 19, using the drive motor 19 control drive screw rod 17 rotation work, drive sliding disc 18 in the sliding adjustment limit groove 16 inside the position sliding, for the horizontal position adjustment of the detection device, telescopic controller 21 control telescopic adjusting column 22 telescopic, adjust the position of the heating chassis 24, through the heating controller 25 for multiple position heating base 26 to realize the start work, using the heating base 26 for the heating work of the test probe 27, through the test probe 27 high temperature contact test work, remote control connector 20 and remote signal transmitter 15 between the wireless connection, convenient buffer connecting spring 2 directly for the control of the heating chassis 24, for the direct control of the drive motor 19, also convenient for the direct control of the telescopic controller 21, improve the control convenience of the device.

Claims

1. A high-temperature testing device for a probe card, comprising a high-temperature testing frame (1), wherein a buffer connecting spring (2) is fixedly connected to the bottom of the inner part of the high-temperature testing frame (1), characterized in that: The top of one side of the buffer connecting spring (2) is fixedly connected to the probe card limiting chassis frame (3). The top of one side of the high temperature test frame (1) is fixedly installed with the connecting base (4). The top of the connecting base (4) is fixedly installed with the connecting arm (5). The top of one side of the connecting arm (5) is provided with a limiting sliding groove (6). The top of one side of the limiting sliding groove (6) is detachably installed with a sliding connecting plate (7). The sliding connecting plate (7) is movably installed with a compression adjusting threaded rod (8). The top of one side of the compression adjusting threaded rod (8) is fixedly connected with a rotating disk (9). The bottom of one side of the compression adjusting threaded rod (8) is fixedly connected with a fixed chassis (10).

2. The high-temperature testing device for a probe card according to claim 1, characterized in that, The number of buffer connecting springs (2) is several, and the several buffer connecting springs (2) are arranged in a matrix between the high temperature test frame (1) and the probe card limiting chassis frame (3). The extrusion adjusting threaded rod (8) passes through the interior of the sliding connecting plate (7). The connection relationship between the extrusion adjusting threaded rod (8) and the sliding connecting plate (7) is a threaded connection. The extrusion adjusting threaded rod (8) is located inside the limiting sliding groove (6). The sliding connecting plate (7) is located on the top surface of the connecting arm (5). The connection relationship between the sliding connecting plate (7) and the connecting arm (5) is a sliding connection.

3. The high-temperature testing device for a probe card according to claim 1, characterized in that, A test adjustment frame (11) is fixedly installed on the outer wall of the top side of the high temperature test frame (1). A main controller (12) is fixedly installed on the back side of one side of the test adjustment frame (11). A data display (13) is fixedly installed on the top front side of the main controller (12). A control setting panel (14) is provided at the bottom front side of the main controller (12). A remote signal transmitter (15) is fixedly installed on the top side surface of one side of the main controller (12).

4. The high-temperature testing device for a probe card according to claim 3, characterized in that, The top surface of the test adjustment frame (11) is provided with a sliding adjustment limit groove (16). A drive threaded rod (17) is detachably installed inside the sliding adjustment limit groove (16). A drive sliding disk (18) is movably installed on one side surface of the drive threaded rod (17). A drive motor (19) is fixedly installed on one side top of the test adjustment frame (11). A remote control connector (20) is fixedly installed on the side top of the drive motor (19).

5. The high-temperature testing device for a probe card according to claim 4, characterized in that, A telescopic controller (21) is fixedly installed on one side of the top of the drive sliding disk (18), a telescopic adjustment column (22) is movably installed on one side of the bottom of the drive sliding disk (18), a connecting block (23) is fixedly connected to one side of the bottom of the telescopic adjustment column (22), a heating base (24) is fixedly installed on one side of the bottom of the connecting block (23), a heating controller (25) is fixedly installed on one side of the top surface of the heating base (24), a heating base (26) is fixedly connected to one side of the bottom surface of the heating base (24), and a test probe (27) is fixedly connected to one side of the bottom of the heating base (26).

6. The high-temperature testing device for a probe card according to claim 5, characterized in that, The drive threaded rod (17) passes through the interior of the drive sliding disk (18). The drive threaded rod (17) and the drive sliding disk (18) are connected by a threaded drive connection. The telescopic controller (21) and the telescopic adjustment column (22) are connected by a drive connection. A remote control connector (20) is provided on the side of the telescopic controller (21). A remote control connector (20) is provided on the top side of the heating chassis (24). The remote control connector (20) and the remote signal transmitter (15) are connected by a remote signal connection. The heating base (26) and the test probe (27) are positioned in a one-to-one correspondence. The heating bases (26) are evenly distributed on the bottom surface of the heating chassis (24). The heating controller (25) and the heating base (26) are connected by an electric control connection.

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