Shielding structure, circuit board assembly and electronic equipment

Abstract

The utility model provides a shielding structure, a circuit board assembly and electronic equipment. The shielding structure comprises an electro-deformation layer and a shielding layer, and the electro-deformation layer deforms under the action of current. The shielding layer is arranged on at least one side of the electro-deformation layer in the deformation direction, so that the shielding structure is extruded by deformation acting force in the deformation direction to change the thickness when the shielding structure is located in the limiting space. Wherein the material of the shielding layer comprises one of a two-dimensional layered transition metal carbide, a two-dimensional layered transition metal nitride and a two-dimensional layered transition metal carbonitride, and the conductivity of the shielding layer is matched with the thickness size of the shielding layer in the deformation direction. Therefore, by utilizing the characteristic that the conductivity of the shielding layer is matched with the thickness size of the shielding layer in the deformation direction, the shielding effect of the shielding layer can be adjusted by means of the extrusion force acting on the shielding layer after the deformation of the electrically-induced deformation layer, so that the shielding capability of the shielding structure in the circuit board assembly and the electronic equipment can be dynamically adjusted according to requirements; and the shielding performance is optimized.

Description

TECHNICAL FIELD

[0001] The present disclosure relates to the technical field of electronics, and in particular, to a shielding structure, a circuit board assembly, and an electronic device. BACKGROUND

[0002] In the use process of the circuit board assembly, the distribution of the mainboard, the expansion board, and the electronic components can cause electromagnetic interference to the functional module.

[0003] In the related art, conductive foam is usually used to ground the electrical connectors of the functional components to reduce electromagnetic interference. However, the shielding effect of the conductive foam is fixed and cannot be adjusted according to the specific electromagnetic interference strength. UTILITY MODEL CONTENT

[0004] The present disclosure provides a shielding structure, a circuit board assembly, and an electronic device to solve the problems in the related art.

[0005] According to a first aspect of the present disclosure, a shielding structure is provided, comprising:

[0006] An electro-deformation layer deforms under the action of an electric current;

[0007] A shielding layer is arranged on at least one side of the electro-deformation layer in the deformation direction to change the thickness when the shielding structure is pressed in the deformation direction by a deformation force in a limited space; wherein the material of the shielding layer includes one of two-dimensional layered transition metal carbide, two-dimensional layered transition metal nitride, and two-dimensional layered transition metal carbonitride, and the electrical conductivity of the shielding layer matches the thickness dimension of the shielding layer in the deformation direction.

[0008] Optionally, the electro-deformation layer includes a first side surface and a second side surface arranged oppositely in the deformation direction, and the first side surface and the second side surface are respectively assembled with the shielding layer.

[0009] Optionally, the materials of the shielding layers assembled on the first side surface and the second side surface are the same.

[0010] Optionally, the shielding layer covers the electro-deformation layer.

[0011] Optionally, the electro-deformation layer includes one of piezoelectric material and high polymer material.

[0012] Optionally, the electro-deformation layer and the shielding layer are fixedly bonded.

[0013] According to a second aspect of the present disclosure, a circuit board assembly is provided, which includes any of the shielding structures of the first aspect.

[0014] Optionally, the circuit board assembly further comprises a main board, an extension board and a functional support; the extension board is provided with a first grounding structure, the functional support is provided with a second grounding structure in electrically conductive connection with the first grounding structure, and the main board is provided with a functional connector; the shielding structure is assembled between the functional support and the functional connector in abutment.

[0015] When the extension board is connected, the second grounding structure generates a first current acting on the electro-deformation layer to increase the conductivity of the shielding structure.

[0016] Optionally, the circuit board assembly further comprises at least one electronic component arranged on the main board and / or the extension board; when the electronic component is connected, a second current acting on the electro-deformation layer is generated to increase the conductivity of the shielding structure.

[0017] According to a third aspect of the present disclosure, an electronic device is provided, which comprises any of the shielding structures of the first aspect or any of the circuit board assemblies of the second aspect.

[0018] The technical solutions provided by the present disclosure can achieve at least the following beneficial effects:

[0019] The material of the shielding layer comprises one of two-dimensional layered transition metal carbide, two-dimensional layered transition metal nitride and two-dimensional layered transition metal carbonitride, so that the shielding effect of the shielding layer can be adjusted by means of the extrusion force acting on the shielding layer after the deformation of the electro-deformation layer, by matching the conductivity of the shielding layer with the thickness dimension of the shielding layer in the deformation direction, so that the shielding ability of the shielding structure in the circuit board assembly and the electronic device can be dynamically adjusted according to the demand, and the shielding performance is optimized.

[0020] It should be understood that the foregoing general description and the following detailed description are only exemplary and explanatory, and cannot limit the present specification. BRIEF DESCRIPTION OF DRAWINGS

[0021] The accompanying drawings incorporated in the specification and forming a part thereof illustrate embodiments consistent with the present specification and together with the description serve to explain the principles of the present specification.

[0022] Figure 1 is a cross-sectional structure schematic diagram of a shielding structure in an example embodiment of the present disclosure;

[0023] Figure 2 is a cross-sectional structure schematic diagram of a shielding structure in another example embodiment of the present disclosure;

[0024] Figure 3 is a cross-sectional structure schematic diagram of a circuit board assembly in an example embodiment of the present disclosure;

[0025] Figure 4 is a perspective exploded structure diagram of a circuit board assembly in an example embodiment of the present disclosure;

[0026] Figure 5 is a perspective structure diagram of a circuit board assembly in an example embodiment of the present disclosure.

[0027] Reference Signs:

[0028] shield structure 1;

[0029] electrodeformation layer 11; first side 111; second side 112; shield layer 12; limiting space 13;

[0030] circuit board assembly 2; main board 21; function connector 22; function support 23; expansion board 24. DETAILED DESCRIPTION

[0031] The example embodiments will now be described in detail with reference to the accompanying drawings. If the description of the example embodiments relates to the accompanying drawings, the same numbers in different drawings represent the same or similar elements. The following example embodiments are not representative of all embodiments consistent with the present specification. Rather, they are merely examples of apparatuses and methods consistent with some aspects of the present specification as detailed in the appended claims.

[0032] The terminology used in the present disclosure is for the purpose of describing particular example embodiments only and is not intended to be limiting of the present disclosure. Unless otherwise defined, technical and scientific terms used in the present specification and claims are intended to have the same meaning as commonly understood by one of ordinary skill in the art to which this present disclosure pertains. The use of the terms "first", "second", and "like" in the present specification and claims does not imply any order, quantity, or importance, but is merely used to distinguish one element from another. Also, the use of the terms "one" or "a" does not restrict the quantity to one but means "one or more". "Plural" or "a plurality" means two or more. Unless otherwise indicated, the terms "front", "back", "up", "down", and / or the like in the present specification and claims are used for convenience and are not limiting of the position or spatial orientation of the device. The use of the terms "include", "includes", "including", and / or the like means the inclusion of one or more elements or components, but not the exclusion of other elements or components. The use of the terms "connected", "coupled", and / or the like means the connection or coupling between two or more elements or components, which can be direct or indirect, mechanical or electronic, and / or the like.

[0033] The terminology used in this description is for the purpose of describing particular embodiments only and is not intended to be limiting of the disclosure. As used in this description and the appended claims, the singular forms "a," "an" and "the" are intended to include the plural forms as well, unless the context clearly indicates otherwise. It will also be understood that the term "and / or," as used herein, refers to and encompasses any and all possible combinations of one or more of the associated listed items.

[0034] During the use of the circuit board assembly, electromagnetic interference to the functional module can be generated due to the distribution of the main board, the expansion board and the electronic components. In the related art, conductive foam is usually used to ground the electrical connectors of the functional components to reduce electromagnetic interference. However, the shielding effect of the conductive foam is fixed and cannot be adjusted according to the specific electromagnetic interference intensity.

[0035] The present disclosure provides a shielding structure. Figure 1 is a schematic diagram of a cross-section structure of a shielding structure in an exemplary embodiment of the present disclosure, as Figure 1 As shown in the figure, the shielding structure 1 includes an electro-deformation layer 11 and a shielding layer 12. The electro-deformation layer 11 deforms under the action of current. The shielding layer 12 is arranged on at least one side of the electro-deformation layer 11 in the deformation direction, so as to change the thickness when being pressed by the deformation force in the deformation direction when the shielding structure 1 is in the limiting space 13. The material of the shielding layer 12 includes one of two-dimensional layered transition metal carbide, two-dimensional layered transition metal nitride and two-dimensional layered transition metal carbonitride, and the conductivity of the shielding layer 12 matches the thickness dimension of the shielding layer 12 in the deformation direction.

[0036] In the above embodiment, the material of the shielding layer 12 includes one of two-dimensional layered transition metal carbide, two-dimensional layered transition metal nitride and two-dimensional layered transition metal carbonitride. Therefore, by using the characteristic that the conductivity of the shielding layer 12 matches the thickness dimension of the shielding layer 12 in the deformation direction, the shielding effect of the shielding layer 12 can be adjusted by the pressing force acting on the shielding layer 12 after the deformation of the electro-deformation layer 11. Thus, the shielding ability of the shielding structure 1 in the circuit board assembly 2 and the electronic device can be dynamically adjusted according to the demand, and the shielding performance is optimized.

[0037] In some embodiments, the electrodeformable layer 11 includes a first side surface 111 and a second side surface 112 disposed opposite to each other in the deformation direction, and a shielding layer 12 is respectively assembled on the first side surface 111 and the second side surface 112. When the shielding structure 1 is assembled in the limiting space 13, the side of the shielding layer 12 facing away from the electrodeformable layer 11 abuts against the upper and lower side walls of the limiting space 13. The electrodeformable layer 11 can undergo deformation with increased size in the deformation direction due to the current. The deformation of the electrodeformable layer 11 causes compression of the shielding layers 12 on both sides, resulting in a decrease in the spacing of the two-dimensional layered structure inside the shielding layer 12 material, an increase in conductivity, and a stronger shielding effect. When the external current decreases or disappears when the shielding layer 12 is under compression, the electrodeformable layer 11 can undergo deformation with reduced size in the deformation direction, which reduces the compressive force acting on the shielding layer 12, increases the spacing of the two-dimensional layered structure inside the shielding layer 12 material, reduces conductivity, and decreases the shielding effect.

[0038] In other embodiments, such as Figure 2 As shown, the electrodeformable layer 11 includes a first side surface 111 and a second side surface 112 disposed opposite each other in the deformation direction. A shielding layer 12 is assembled on the first side surface 111. When the shielding structure 1 is assembled in the limiting space 13, the side of the shielding layer 12 facing away from the electrodeformable layer 11 abuts against the upper sidewall of the limiting space 13, and the second side surface 112 of the electrodeformable layer 11 abuts against the lower sidewall of the limiting space 13. The electrodeformable layer 11 can undergo deformation with increased size in the deformation direction due to the current. The deformation of the electrodeformable layer 11 causes compression of the shielding layer 12, resulting in a decrease in the spacing of the two-dimensional layered structure inside the shielding layer 12 material, an increase in conductivity, and a stronger shielding effect. When the external current decreases or disappears when the shielding layer 12 is under compression, the electrodeformable layer 11 can undergo deformation with decreased size in the deformation direction, resulting in a decrease in the compressive force acting on the shielding layer 12, an increase in the spacing of the two-dimensional layered structure inside the shielding layer 12 material, a decrease in conductivity, and a decrease in the shielding effect.

[0039] It should be noted that when the shielding structure 1 is assembled into the limiting space 13, the shielding layer 12 and the side wall of the limiting space 13 can be in a squeezing relationship or a non-squeezing contact relationship, which can be set according to the specific settings. This disclosure does not limit this.

[0040] In some embodiments, the shielding layer 12 assembled on the first side 111 and the second side 112 may be made of the same material, so that when the shielding layers 12 on both sides are subjected to the same deformation force, the interlayer spacing inside the material changes by the same scale, thereby improving the convenience of controlling the conductivity of the shielding layers 12 on both sides.

[0041] Alternatively, in other embodiments, different materials can be selected for the shielding layer 12 of the first side 111 and the shielding layer 12 of the second side 112 according to specific shielding effect requirements.

[0042] In some embodiments, the shielding layer 12 can cover the electro-deformation layer 11, so that the shielding performance of the shielding structure 1 is consistent in different areas, and the overall shielding effect is improved.

[0043] In the above embodiments, the electro-deformation layer 11 and the shielding layer 12 are bonded and fixed to simplify the assembly process of the shielding structure 1 and improve the assembly convenience. Since the material of the shielding layer 12 is one of two-dimensional layered transition metal carbide, two-dimensional layered transition metal nitride, and two-dimensional layered transition metal carbonitride, i.e., MXenes material, the bonding and fixing of the electro-deformation layer 11 and the shielding layer 12 can be achieved by using the bonding property of the MXenes material itself.

[0044] It should be noted that the electro-deformation layer 11 includes one of piezoelectric material and polymer material, for example, acrylate material. In addition, the MXenes material of the shielding layer 12 can be Ti3C2Tx, etc.

[0045] The present disclosure further provides a circuit board assembly 2, as shown in Figure 3 、 Figure 4 、 Figure 5 The circuit board assembly 2 includes the above shielding structure 1.

[0046] In some embodiments, the circuit board assembly 2 further includes a main board 21, an expansion board 24, and a functional support 23. The expansion board 24 is provided with a first grounding structure, the functional support 23 is provided with a second grounding structure in conductive connection with the first grounding structure, the main board 21 is provided with a functional connector 22, and the shielding structure 1 is assembled in abutment between the functional support 23 and the functional connector 22. When the expansion board 24 is connected, a first current acting on the electro-deformation layer 11 is generated at the second grounding structure, so that the conductivity of the shielding structure 1 is increased.

[0047] The above functional support 23 can be an antenna support or a support structure of other components, and the above functional connector 22 can be a camera connector or an electrical connector of other components. Taking the functional support 23 as an antenna support and the functional connector 22 as a camera connector as an example:

[0048] When the device of the extension board 24 needs to be grounded, the exposed copper area of the extension board 24 will be in contact with the exposed steel sheet area of the antenna support, and an electric current signal will be transmitted to the steel sheet of the antenna support when grounded. When the current flows through the steel sheet of the antenna support, the adjacent exposed steel sheet area will also receive the current, which is transmitted to the shielding structure 1 between the camera connector and the antenna support. After the current signal is received inside the electro-deformation layer 11, it will expand outward. At this time, since the spacing between the antenna support and the camera connector remains constant, a limiting space 13 is formed, and the electro-deformation layer 11 will compress the shielding layer 12 on both sides. After the material of the shielding layer 12 is compressed, the spacing between the two-dimensional layers inside will be reduced, thereby changing the electromagnetic absorption / shielding ability and enhancing the grounding performance of the camera connector.

[0049] Further, the circuit board assembly 2 further comprises at least one electronic component arranged on the main board 21 and / or the extension board 24. When the electronic component is connected, a second current acting on the electro-deformation layer 11 is generated to increase the conductivity of the shielding structure 1. As the power consumption of the above-mentioned electronic component increases, external interference is strengthened, and at this time, the second current for grounding increases, and the deformation of the electro-deformation layer 11 in the shielding structure 1 increases to compress the shielding layer 12 on both sides. The electromagnetic absorption / shielding ability of the shielding layer 12 is enhanced, and the electromagnetic interference is reduced.

[0050] The present disclosure further provides an electronic device comprising the above-mentioned shielding structure 1 or the above-mentioned circuit board assembly 2.

[0051] Since the material of the shielding layer 12 comprises one of the two-dimensional layered transition metal carbide, the two-dimensional layered transition metal nitride, and the two-dimensional layered transition metal carbonitride, the shielding effect of the shielding layer 12 can be adjusted by the extrusion force acting on the shielding layer 12 after the deformation of the electro-deformation layer 11, by utilizing the characteristics that the conductivity of the shielding layer 12 matches the thickness dimension of the shielding layer 12 in the deformation direction. The shielding ability of the shielding structure 1 in the circuit board assembly 2 and the electronic device can be dynamically adjusted according to the demand, and the shielding performance is optimized.

[0052] It should be noted that the above-mentioned electronic device can be a mobile phone, a tablet computer, a vehicle-mounted terminal, a medical terminal, a wearable device, a vehicle, a robot, and the like, and the present disclosure does not limit the same.

[0053] The above merely describes the preferred embodiments of the present disclosure and is not intended to limit the present disclosure in any form. Although the present disclosure has been disclosed as the above preferred embodiments, it is not intended to limit the present disclosure, and any person skilled in the art can make some changes or modifications to the above disclosed technical contents without departing from the scope of the technical solutions of the present disclosure to obtain equivalent embodiments with equivalent changes. Any simple modification, equivalent change and modification made to the above embodiments according to the technical essence of the present disclosure without departing from the technical solutions of the present disclosure shall still fall within the scope of the technical solutions of the present disclosure.

Claims

1. A shielding structure, characterized in that, include: Electrodeformable layers deform under the action of electric current; A shielding layer is disposed on at least one side of the electrodeformable layer in the deformation direction, so as to change its thickness by being squeezed by deformation force in the deformation direction when the shielding structure is in the confined space; wherein, the material of the shielding layer includes one of two-dimensional layered transition metal carbide, two-dimensional layered transition metal nitride and two-dimensional layered transition metal carbonitride, and the conductivity of the shielding layer matches the thickness dimension of the shielding layer in the deformation direction.

2. The shielding structure according to claim 1, characterized in that, The electrodeformable layer includes a first side and a second side disposed opposite to each other in the deformation direction, and the shielding layer is respectively assembled on the first side and the second side.

3. The shielding structure according to claim 2, characterized in that, The shielding layers assembled on the first side and the second side are made of the same material.

4. The shielding structure according to claim 1, characterized in that, The shielding layer covers the electrodeformation layer.

5. The shielding structure according to claim 1, characterized in that, The electrodeformable layer includes one of piezoelectric materials and polymer materials.

6. The shielding structure according to claim 1, characterized in that, The electrodeformation layer and the shielding layer are bonded and fixed together.

7. A circuit board assembly, characterized in that, Includes the shielding structure as described in any one of claims 1-6.

8. The circuit board assembly according to claim 7, characterized in that, It also includes a motherboard, an expansion board, and a functional bracket; the expansion board has a first grounding structure, the functional bracket has a second grounding structure that is electrically connected to the first grounding structure, the motherboard has a functional connector, and the shielding structure is abutted and assembled between the functional bracket and the functional connector; When the expansion plate is connected, a first current is generated in the second grounding structure that acts on the electrodeformation layer, thereby increasing the conductivity of the shielding structure.

9. The circuit board assembly according to claim 8, characterized in that, It also includes at least one electronic component disposed on the motherboard and / or the expansion board, which generates a second current acting on the electrodeformation layer when the electronic component is connected, thereby increasing the conductivity of the shielding structure.

10. An electronic device, characterized in that, Includes the shielding structure as described in any one of claims 1-6; or, the circuit board assembly as described in any one of claims 7-9.

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