Silicon wafer inserting and taking device

Abstract

The utility model discloses a silicon wafer inserting and taking device, and belongs to the technical field of silicon wafer processing, the silicon wafer inserting and taking device is used for inserting and taking a silicon wafer plate material, the silicon wafer inserting and taking device comprises an inserting and taking assembly, the inserting and taking assembly comprises a main body piece and a plurality of supporting pieces arranged at intervals in the first direction, and the supporting pieces are located on one side of the main body piece and connected with the main body piece; and the plurality of supporting pieces are used for supporting the silicon wafer plate material. The multiple supporting pieces are arranged, so that the whole silicon wafer plate is supported by the multiple supporting pieces, the silicon wafer plate is driven to move, and the silicon wafer plate is moved out from a proper position in the cutting equipment. The silicon wafer plate is supported and moved through a mechanical structure, so that the stability and sustainability are high, the silicon wafer plate can be always kept at a proper height to horizontally move, the silicon wafer plate is prevented from moving up and down, the risk that the bottom of a silicon wafer on the silicon wafer plate collides with other structures can be greatly reduced, and the production efficiency is improved. And the safety of the silicon wafer is ensured.

Description

TECHNICAL FIELD

[0001] The application belongs to the technical field of silicon wafer processing, and particularly relates to a silicon wafer inserting and taking device. BACKGROUND

[0002] A silicon wafer is a thin piece made of high-purity silicon crystal and is usually cut from a single crystal silicon ingot. The cut silicon wafers are arranged in sequence and are bonded at the top end to a strip-shaped bonding structure to form a silicon wafer plate material. The silicon wafer plate material is usually taken out from the inside of the equipment by manual taking, and the silicon wafers on the silicon wafer plate material are prone to collision with other structures and damage during the taking process. CONTENT OF THE UTILITY MODEL

[0003] The utility model aims to overcome the technical problem that the silicon wafers on the silicon wafer plate material are prone to collision with other structures and damage during the manual taking process.

[0004] TECHNICAL SCHEME: The silicon wafer inserting and taking device provided by the embodiment of the application is used for inserting and taking a silicon wafer plate material, and comprises:

[0005] An inserting and taking assembly comprises a main body and a plurality of support members arranged at intervals in a first direction. The plurality of support members are located on one side of the main body and are connected to the main body. The plurality of support members are used for supporting the silicon wafer plate material.

[0006] The support member comprises a body and a connecting portion. The body is connected to one side of the main body and extends in a second direction. The second direction intersects the first direction. The connecting portion is located on the side of the body away from the main body and is detachably connected to the body.

[0007] In some embodiments, the support member comprises:

[0008] A flexible portion is located on at least one side of the body in a third direction and is connected to the body. The flexible portion extends in the second direction. The third direction intersects the second direction and the first direction. The side of the flexible portion away from the body is an arc-shaped surface.

[0009] In some embodiments, the connecting portion comprises a connecting head. The connecting head is detachably connected to the body. The connecting head has a thickness H1. In the direction from the body to the connecting portion, the thickness H1 of the connecting head decreases.

[0010] In some embodiments, the thickness of the side of the connecting head facing the body is the same as the thickness of the body.

[0011] In some embodiments, the connecting portion comprises a blocking piece, the blocking piece is detachably connected with the body, and the blocking piece extends perpendicularly to the second direction.

[0012] In some embodiments, the main body has a middle region on one side of the support, and one end of the at least one support is arranged on the middle region to support the middle of the wafer sheet.

[0013] In some embodiments, the wafer inserting device satisfies N≥3.

[0014] Wherein, N is the number of the supports.

[0015] In some embodiments, the main body comprises:

[0016] a middle portion, a plurality of the supports are connected to one side of the middle portion;

[0017] a mounting portion, the mounting portion is located on the side of the middle portion away from the plurality of the supports, and is connected with the middle portion.

[0018] In some embodiments, the mounting portion has a receiving cavity, and at least one through hole in communication with the receiving cavity, the through hole penetrates the side wall of the mounting portion;

[0019] The main body comprises at least one assembly portion, the assembly portion is arranged in one of the through holes.

[0020] In some embodiments, the main body comprises a plurality of the mounting portions, and the plurality of the mounting portions are arranged at intervals along the first direction.

[0021] Beneficial effects: the wafer inserting device of the embodiments of the present application is used for inserting a wafer sheet, and the wafer inserting device comprises an inserting assembly, which comprises a main body and a plurality of supports arranged at intervals along a first direction, the plurality of supports are located on one side of the main body and connected with the main body, and the plurality of supports are used for supporting the wafer sheet; the support comprises a body and a connecting portion, the body is connected to one side of the main body and extends along a second direction, a third direction intersects the second direction and the first direction, the connecting portion is located on the side of the body away from the main body and is detachably connected with the body. By arranging the plurality of supports, the plurality of supports support the entire wafer sheet and move the wafer sheet to move out from a suitable position in the inside of a cutting device. Since the wafer sheet is supported and moved by a mechanical structure, the wafer sheet has high stability and sustainability, can always be kept at a suitable height for horizontal movement, avoids up and down movement of the wafer sheet, can greatly reduce the risk of the bottom of the wafer on the wafer sheet colliding with other structures, and ensures the safety of the wafer. BRIEF DESCRIPTION OF DRAWINGS

[0022] In order to more clearly illustrate the technical solutions in the embodiments of the present application, the drawings needed to be used in the embodiments description will be briefly introduced. Obviously, the drawings in the following description only represent some of the embodiments of the present application, and all other drawings obtained by those skilled in the art without creative effort based on these drawings also belong to the protection scope of the present application.

[0023] Figure 1 It is a perspective view of the silicon wafer inserting device in the embodiments of the present application.

[0024] Figure 2 It is a perspective view of the inserting assembly in the embodiments of the present application.

[0025] Figure 3 It is a side view of the inserting assembly in the embodiments of the present application.

[0026] Figure 4 It is a structural schematic view of the support in the embodiments of the present application, wherein the connecting part is a connecting head.

[0027] Figure 5 It is a structural schematic view of the support in the embodiments of the present application, wherein the connecting part is a blocking sheet.

[0028] Figure 6 It is a perspective structural schematic view of the body and the flexible part in the embodiments of the present application.

[0029] Figure 7 It is a side view structural schematic view of the body and the flexible part in the embodiments of the present application.

[0030] The drawings are as follows: 10-inserting assembly; 11-main body; 111-intermediate part; 112-mounting part; 1121-receiving cavity; 1122-through hole; 1123-side wall; 113-assembling part; 114-middle area; 12-support; 121-body; 122-connecting part; 1221-connecting head; 1222-blocking sheet; 123-flexible part; 20-driving assembly; 30-silicon wafer plate; 31-silicon wafer; X-first direction; Y-second direction. DETAILED DESCRIPTION

[0031] The technical solutions in the embodiments of the present application will be described clearly and completely in combination with the drawings in the embodiments of the present application. Obviously, the described embodiments only represent some of the embodiments of the present application, rather than all the embodiments. Based on the embodiments in the present application, all other embodiments obtained by those skilled in the art without creative effort also belong to the protection scope of the present application.

[0032] In the description of the present application, it should be understood that the terms "first", "second" are used only for the purpose of description, and cannot be understood as indicating or implying relative importance or implicitly indicating the number of the indicated technical features. Therefore, the features defined as "first", "second" can explicitly or implicitly include one or more features. In the description of the present application, the meaning of "multiple" is two or more, at least one of which can be one, two or more, unless otherwise specifically limited.

[0033] The silicon wafer is a thin piece made of high-purity silicon crystal, which is usually cut from a single crystal silicon ingot. The cut silicon wafers are arranged in sequence, and the top end is bonded to a strip-shaped bonding structure to form a silicon wafer plate material, and the adjacent two silicon wafers on the silicon wafer plate material are not connected. The silicon wafer plate material is generally taken out from the inside of the equipment by manual taking, and when the silicon wafer plate material is extracted from the inside of the equipment, the problem of plate material falling off may occur, and the falling plate material collides with the structure, which can cause damage to the silicon wafers on the plate material. At the same time, manual taking generally involves tying a steel wire rope at both ends of the silicon wafer plate material to lift the plate material, but due to the heavy weight of the plate material and the softness of the strip-shaped bonding structure thereon, the middle part of the silicon wafer plate material will be concave downward, that is, the silicon wafers in the middle part of the plate material are located lower, and when the plate material is moved horizontally during manual handling, the silicon wafers in the middle part of the plate material are prone to collide with other structures and be damaged.

[0034] Therefore, the embodiments of the present application provide a silicon wafer inserting and taking device to overcome at least one of the above technical problems.

[0035] Please refer to Figure 1 In the embodiments of the present application, the silicon wafer inserting and taking device is used to insert and take the silicon wafer plate material 30, and the silicon wafer inserting and taking device comprises an inserting assembly 10 and a driving assembly 20.

[0036] The inserting assembly 10 comprises a main body 11 and a plurality of support members 12 arranged at intervals along a first direction X, the plurality of support members 12 are located on one side of the main body 11 and connected with the main body 11, and the plurality of support members 12 are used to support the silicon wafer plate material 30. The driving assembly 20 is located on the side of the main body 11 away from the plurality of support members 12 and connected with the main body 11, and the driving assembly 20 is used to move the inserting assembly 10.

[0037] It can be understood that when the wafer plate 30 inside the device is extracted, the main body 11 on the plug-in assembly 10 can be connected with the driving assembly 20, and the plug-in assembly 10 is driven by the driving assembly 20 to move, so that the plurality of supports 12 on the plug-in assembly 10 are embedded into the inside of the cutting device. Each support 12 can be moved in the second direction Y under the drive of the driving assembly 20 until each support 12 is embedded between the adjacent two wafers 31 on the wafer plate 30. Each support 12 is a plate-shaped structure or a sheet-shaped structure, has a small thickness, is convenient to pass between the adjacent two wafers 31, and can reduce damage to the wafers 31. Then the plurality of supports 12 are driven by the driving assembly 20, so that the plurality of supports 12 support the entire wafer plate 30 and drive the wafer plate 30 to move, so that the wafer plate 30 is removed from the inside of the device from a suitable position. Since the wafer plate 30 is supported and moved by the mechanical structure, it has high stability and sustainability, can keep the wafer plate 30 always at a suitable height for horizontal movement, avoids the wafer plate 30 moving up and down, can greatly reduce the risk of the bottom of the wafer 31 on the wafer plate 30 colliding with other structures, and ensures the safety of the wafer 31 (when the wafer plate 30 is manually transported, since human operation has uncertainty, the wafer plate 30 cannot always be kept at a suitable height for movement, and when the staff is exhausted, the height of the wafer plate 30 will be lowered, so that the wafer 31 thereon collides with other structures on the device and is damaged).

[0038] Please refer to Figure 2 and Figure 3 , in combination with the above embodiments, in some embodiments, the support 12 includes a body 121 and a connecting portion 122.

[0039] The body 121 is connected to one side of the main body 11, and the body 121 extends in the second direction Y intersecting the first direction X. The connecting portion 122 is located on the side of the body 121 away from the main body 11, and is detachably connected with the body 121.

[0040] It can be understood that the arrangement direction of the plurality of silicon wafers 31 on the silicon wafer plate 30 is the same as the arrangement direction of the plurality of supporting members 12, and each of the plurality of supporting members 12 is arranged along the first direction X, and the body 121 on each of the plurality of supporting members 12 extends along the second direction Y, wherein the first direction X intersects with the second direction Y, and preferably, the first direction X is perpendicular to the second direction Y. Meanwhile, the driving assembly 20 can drive the plurality of bodies 121 to move along the second direction Y, so that the body 121 can penetrate between two adjacent silicon wafers 31 on the silicon wafer plate 30, facilitating the plurality of bodies 121 to support the strip-shaped bonding structure on the silicon wafer plate 30, thereby supporting the entire silicon wafer plate 30. The body 121 can be a plate structure or a sheet structure, which facilitates the penetration between the two adjacent silicon wafers 31 and avoids damaging the silicon wafers. The connecting portion 122 can be arranged at one end of the body 121 away from the main body 11, and the connecting portion 122 is detachably connected with the body 121 through buckling, bolts or other structures, so that the connecting portion 122 can be easily replaced when damaged. The connecting portion 122 can play an auxiliary role, and the supporting member 12 can more conveniently and quickly penetrate between the two adjacent silicon wafers 31 through the connecting portion 122, or the silicon wafer plate 30 can be blocked after the body 121 penetrates between the two adjacent silicon wafers 31, thereby preventing the silicon wafer plate 30 from sliding off the supporting member 12.

[0041] Please refer to 1、 Figure 6 and Figure 7 , in combination with the above embodiments, in some embodiments, the supporting member 12 comprises a flexible portion 123. The flexible portion 123 is located on at least one side of the body 121 along the third direction Z and is connected with the body 121, the flexible portion 123 extends along the second direction Y, the third direction Z intersects with the second direction Y and the first direction X, and preferably, the third direction Z is perpendicular to the second direction Y and the first direction X, and the side of the flexible portion 123 away from the body 121 is an arc surface.

[0042] It can be understood that the body 121 needs to be arranged between two adjacent silicon wafers 31, and the top of the body 121 can be rubbed and damaged, such as torn and cut, during the arrangement process. By arranging the flexible part 123 on at least one side of the body 121 along the third direction Z (the flexible part 123 can be arranged on one side of the body 121 along the third direction Z, the number of flexible parts 123 can be reduced to reduce costs; the flexible part 123 can be arranged on both sides of the body 121 along the third direction Z, which can prevent mistakes and does not need to consider which side is upward during installation of the body 121, which can improve installation efficiency), the body 121 can be directly contacted with the strip-shaped bonding structure along the third direction Z. By contacting the strip-shaped bonding structure with the flexible part 123 with soft texture, damage to the strip-shaped bonding structure can be prevented. At the same time, the side of the flexible part 123 away from the body 121 is arranged as an arc surface structure. When the flexible part 123 contacts the strip-shaped bonding structure, the contact area between the arc surface and the strip-shaped bonding structure is small, which can reduce damage to the strip-shaped bonding structure during movement, thereby reducing the risk of silicon wafers 31 falling off the strip-shaped bonding structure. The flexible part 123 can be a flexible structure such as rubber or silicone.

[0043] Please refer to Figure 4 In some embodiments, the connecting part 122 includes a connecting head 1221, which is detachably connected with the body 121. The connecting head 1221 has a thickness H1, which gradually decreases in the direction from the body 121 to the connecting part 122.

[0044] It can be understood that the connecting part 122 can be a connecting head 1221, which can be detachably connected with the body 121 by a buckle, a bolt or the like, so as to be easily detached from the body 121 for replacement of other structures. Figure 4 In the direction from the body 121 to the connecting part 122, the thickness H1 of the connecting head 1221 gradually decreases, so that the thickness of the end of the connecting head 1221 away from the body 121 is small, and the thickness of the end of the connecting head 1221 toward the body 121 is large. When the support 12 moves along the second direction Y, the end of the connecting head 1221 with small thickness can first contact the silicon wafer sheet 30, and the end of the connecting head 1221 with small thickness can be easily embedded between two adjacent silicon wafers 31, so that the entire support 12 can be easily embedded between two adjacent silicon wafers 31, which is beneficial to the silicon wafer picking device to quickly support the entire silicon wafer sheet 30.

[0045] Please refer to Figure 4In some embodiments, the thickness of the connecting head 1221 towards the body 121 is the same as the thickness of the body 121.

[0046] It can be understood that the body 121 on the support 12 can be a plate structure or a sheet structure, and the thickness of the body 121 is H2, and the thickness of the connecting head 1221 towards the body 121 is the same as H2. After the connecting head 1221 passes between two adjacent silicon wafers 31, the body 121 can also pass between the two adjacent silicon wafers 31 smoothly, which is beneficial to quickly support the silicon wafer plate 30 by the body 121. If the thickness of the connecting head 1221 towards the body 121 is less than H2, the body 121 will abut against the adjacent two silicon wafers 31 when moving along the second direction Y, which can cause damage to the silicon wafers 31. If the thickness of the connecting head 1221 towards the body 121 is greater than H2, the spacing between the adjacent two silicon wafers 31 will be too large, which can also cause damage to the silicon wafers 31.

[0047] Please refer to Figure 5 In some embodiments, the connecting part 122 includes a blocking sheet 1222, and the blocking sheet 1222 is detachably connected with the body 121, and the blocking sheet 1222 extends perpendicularly to the second direction Y.

[0048] It can be understood that after the body 121 passes between the adjacent two silicon wafers, the connecting head 1221 can be detached from one end of the body 121, and the blocking sheet 1222 is replaced, and the blocking sheet 1222 is detachably connected with the body 121 by buckling, bolts or the like. The blocking sheet 1222 extends along a direction perpendicular to the second direction Y, so that the width of the blocking sheet 1222 is greater than the spacing between the adjacent two silicon wafers 31. If the silicon wafer plate 30 slides in the direction from the body 121 to the connecting part 122 during the movement of the silicon wafer plate 30 by the silicon wafer inserting and taking device, the blocking sheet 1222 can block the silicon wafer plate 30 with a tendency to slide, so as to prevent the silicon wafer plate 30 from sliding off the support 12, and ensure the stability of the silicon wafer plate 30 during the movement.

[0049] Please refer to Figure 1 and Figure 2 In some embodiments, the main body 11 has a middle region 114 towards the support 12, and one end of at least one support 12 is arranged in the middle region 114 to support the middle of the silicon wafer plate 30.

[0050] It can be understood that the support 12 is generally arranged on the main body 11 near the two ends. The two ends of the silicon wafer plate 30 can be supported by the support 12 arranged at the two ends. This supporting mode can cause the middle part of the silicon wafer plate 30 to be depressed downward under the action of gravity. Since the middle part 114 of the main body 11 corresponds to the middle part of the silicon wafer plate 30, the middle part 114 of the main body 11 is connected with at least one support 12. The support 12 can penetrate the two silicon wafers 31 in the middle part of the silicon wafer plate 30 to support the middle part of the silicon wafer plate 30. The middle part of the silicon wafer plate 30 can be prevented from being depressed downward under the action of gravity. Thus, the bottom of the silicon wafer plate 30 has a high position, and the bottom of the silicon wafer plate 30 can be prevented from colliding with other structures to be damaged.

[0051] Please refer to Figure 1 and Figure 2 , in combination with the above embodiment, in some embodiments, the silicon wafer extraction device satisfies: N≥3; wherein N is the number of supports 12.

[0052] It can be understood that preferably, the number of supports 12 is at least three. The three or more supports 12 can be arranged at equal intervals along the first direction X. The plurality of supports 12 can support the silicon wafer plate 31 well. The silicon wafer plate 30 can be prevented from being depressed to a large extent downward. The bottom of the silicon wafer plate 30 has a high position. The bottom of the silicon wafer plate 30 can be prevented from colliding with other structures during movement. The risk of damage to the silicon wafers 31 on the silicon wafer plate 30 is reduced.

[0053] Please refer to Figure 2 and Figure 3 , in combination with the above embodiment, in some embodiments, the main body 11 includes a middle part 111 and a mounting part 112.

[0054] The plurality of supports 12 are connected to one side of the middle part 111. The mounting part 112 is located on the side of the middle part 111 away from the plurality of supports 12 and is connected with the middle part 111. The mounting part 112 is detachably connected with the driving assembly 20.

[0055] It can be understood that the plurality of supports 12 are connected to the middle part 111 of the main body 11, and the middle part 111 can be a plate-shaped structure extending along the first direction X, so as to facilitate the plurality of supports 12 arranged along the first direction X to be mounted on the middle part 111. The mounting part 112 is arranged on the side of the middle part 111 away from the supports 12, and is connected with the driving assembly 20 through the mounting part 112, so as to facilitate the driving assembly 20 to drive the plurality of supports 12 to move, thereby the plurality of supports 12 to carry and move the silicon wafer plate 30. The mounting part 112 can be provided with one or more mounting parts 112, and the mounting part 112 can be detachably connected with the driving assembly 20 through bolts, buckles or other structures.

[0056] Please refer to Figure 2 and Figure 3 , in combination with the above embodiments, in some embodiments, the mounting part 112 has a receiving cavity 1121, and at least one through hole 1122 in communication with the receiving cavity 1121, the through hole 1122 penetrates the side wall 1123 of the mounting part 112, and at least part of the driving assembly 20 is embedded in the receiving cavity 1121. The main body 11 comprises at least one assembly part 113, and the assembly part 113 is detachably connected with the driving assembly 20 through the through hole 1122.

[0057] It can be understood that the receiving cavity 1121 can be arranged on the mounting part 112, and the opening direction of the receiving cavity 1121 corresponds to the driving assembly 20. At least part of the driving assembly 20 can be embedded into the receiving cavity 1121, so that the driving assembly 20 and the mounting part 112 can be more firmly and stably connected. The driving assembly 20 can be a forklift (the forklift is a common carrying machine in the factory, and the forklift can be connected with the mounting part 112 without the need to purchase other driving structures, thereby reducing the cost), and the fork arm of the forklift can be embedded into the receiving cavity 1121 of the mounting part 112, and then the two are connected, and the support 12 is driven to move by the forklift. The driving assembly 20 can also be a telescopic rod or other structure, as long as it can drive the insertion assembly 10 to move in the required direction. After at least part of the driving assembly 20 is embedded into the receiving cavity 1121, the assembly part 113 can be connected with the driving assembly 20 by penetrating the corresponding through hole 1122. The assembly part 113 can be a bolt structure or a bayonet structure, and is detachably connected with the driving assembly 20 after penetrating the corresponding through hole 1122. The number of through holes 1122 on the mounting part 112 can be set as required. The more the number of through holes 1122, the more the number of assembly parts 113 required, and the more firmly the mounting part 112 and the driving assembly 20 are connected.

[0058] Please refer to Figure 1In some embodiments, the body piece includes a plurality of mounting portions 112 arranged along the first direction X.

[0059] It can be understood that the number of mounting portions 112 can be multiple, and the driving assembly 20 and the intermediate portion 111 can be connected through the multiple mounting portions 112, so that the firmness of the connection between the driving assembly 20 and the intermediate portion 111 can be improved. The multiple mounting portions 112 are arranged along the first direction X at intervals, and preferably, the multiple mounting portions 112 are arranged at equal intervals along the first direction X, so that the force acting on the intermediate portion 111 can be more balanced, and damage of the intermediate portion 111 due to uneven force can be avoided.

[0060] In the above embodiments, the description of each embodiment has its own focus, and the parts not described in detail in a certain embodiment can be referred to the relevant description of other embodiments.

[0061] The silicon wafer inserting device provided by the embodiments of the present application is described in detail above, and the principle and implementation manner of the present application are described by using specific examples. The above embodiment is only used to help understand the technical solution and core idea of the present application. It should be understood by those skilled in the art that the technical solution recorded in each of the above embodiments can be modified, or some technical features can be replaced by equivalents; and these modifications or replacements do not make the essence of the corresponding technical solution deviate from the scope of the technical solution of the embodiments of the present application.

Claims

1. A silicon wafer insertion and removal device, characterized in that, For inserting silicon wafers (30), the silicon wafer insertion device includes: The insertion assembly (10) includes a main body (11) and a plurality of support members (12) spaced apart along a first direction (X). The plurality of support members (12) are located on one side of the main body (11) and connected to the main body (11). The plurality of support members (12) are used to support the silicon wafer (30). The support member (12) includes a body (121) and a connecting part (122). The body (121) is connected to one side of the main body member (11) and extends along a second direction (Y). The second direction (Y) intersects with the first direction (X). The connecting part (122) is located on the side of the body (121) away from the main body member (11) and is detachably connected to the body (121).

2. The silicon wafer insertion device according to claim 1, characterized in that, The support member (12) includes: The flexible part (123) is located on at least one side of the body (121) along a third direction (Z) and is connected to the body (121). The flexible part (123) extends along the second direction (Y). The third direction (Z) intersects the second direction (Y) and the first direction (X). The side of the flexible part (123) away from the body (121) is an arc-shaped surface.

3. The silicon wafer insertion device according to claim 1, characterized in that, The connecting part (122) includes a connector (1221), which is detachably connected to the body (121). The connector (1221) has a thickness H1, and the thickness H1 of the connector (1221) tends to decrease along the direction from the body (121) to the connecting part (122).

4. The silicon wafer insertion device according to claim 3, characterized in that, The thickness of the connector (1221) facing the body (121) is the same as the thickness of the body (121).

5. The silicon wafer insertion device according to claim 1, characterized in that, The connecting part (122) includes a blocking piece (1222), which is detachably connected to the body (121) and extends perpendicular to the second direction (Y).

6. The silicon wafer insertion device according to claim 1, characterized in that, The main body (11) has a central region (114) on the side facing the support (12), and at least one end of the support (12) is disposed in the central region (114) to support the center of the silicon wafer (30).

7. The silicon wafer insertion device according to claim 1, characterized in that, The silicon wafer insertion device satisfies: N≥3; Wherein, N is the number of the support members (12).

8. The silicon wafer insertion device according to claim 1, characterized in that, The main body component (11) includes: A middle section (111), wherein a plurality of the support members (12) are connected to one side of the middle section (111); Mounting part (112) is located on the side of the middle part (111) away from the plurality of support members (12) and is connected to the middle part (111).

9. The silicon wafer insertion device according to claim 8, characterized in that, The mounting portion (112) has a receiving cavity (1121) and at least one through hole (1122) communicating with the receiving cavity (1121), the through hole (1122) penetrating the side wall (1123) of the mounting portion (112); The main body (11) includes at least one assembly part (113) which passes through one of the through holes (1122).

10. The silicon wafer insertion device according to claim 8 or 9, characterized in that, The main body (11) includes a plurality of mounting portions (112), which are arranged at intervals along the first direction (X).

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