Wedge bonding tool and wire bonding system

Abstract

A wedge bonding tool is provided. The wedge bonding tool includes a body portion and a tip portion at an end of the body portion. The tip portion includes a groove surface defining a groove. The recess is configured to receive a wire during a wire bonding operation. The groove surface includes a plurality of laser scribed recesses.

Description

[0001] Cross-references to related applications

[0002] This application claims the benefit of U.S. Provisional Application No. 63 / 549,989, filed February 5, 2024, the contents of which are incorporated herein by reference. Technical Field

[0003] This utility model relates to a wedge bonding tool and related methods for wire bonding systems. Background Technology

[0004] In the assembly of electronic devices, wire bonding continues to be the primary method for providing electrical interconnections between two locations, such as between a die pad on a semiconductor die and a lead on a lead frame. More specifically, a wire bonding system (also known as a wire bonding machine) is used to form wire loops between corresponding locations to be electrically interconnected. The main methods for forming wire loops are ball bonding and wedge bonding. Different types of bonding energies can be used when forming a wire bond between (a) the end of a wire loop and (b) the bonding location (e.g., die pad, lead, etc.). These include, for example, ultrasonic energy, thermosonic energy, thermocompression energy, etc. Wire bonding systems are also used to form conductive bumps from portions of the leads.

[0005] In wedge bonding applications, certain types of wire bonding tools are used. For example, wedge bonding tools that include grooves (e.g., U-grooves, V-grooves, etc.) can be used in certain applications (e.g., aluminum wire bonding applications, copper wire bonding applications, etc.). These grooves allow the wedge bonding tool to couple to the wire, thereby transferring tool tip movement from the wedge bonding tool to the wire during wire bonding. U.S. Patent No. 8,820,609 (titled “WIRE BONDING TOOL”), assigned to Kulicke and Soffa Industries, Inc., illustrates an example of such a wedge bonding tool.

[0006] An improved wedge bonding tool is desired, comprising a wedge bonding tool that defines a groove at the tip portion of the tool. Utility Model Content

[0007] According to an exemplary embodiment of the present invention, a wedge bonding tool is provided. The wedge bonding tool includes a body portion and an end portion located at the end of the body portion. The end portion includes a groove surface defining a recess. The groove is configured to receive a lead during a wire bonding operation. The groove surface includes a plurality of laser-scribed recesses.

[0008] According to another exemplary embodiment of the present invention, another wedge bonding tool is provided. The wedge bonding tool includes a body portion and an end portion located at the end of the body portion. The end portion includes a groove surface defining a recess. The groove is configured to receive a lead during a wire bonding operation. The groove surface includes a plurality of laser-etched recesses. The wedge bonding tool includes a coating applied to the groove surface.

[0009] According to another exemplary embodiment of the present invention, a wire bonding system is provided. The wire bonding system includes a bonding head assembly, a support structure for supporting a workpiece, and a wedge bonding tool configured to be carried by the bonding head assembly. The wedge bonding tool has a body portion and an end portion located at the end of the body portion. The end portion includes a groove surface defining a groove configured to receive a wire during wire bonding operations. The groove surface includes a plurality of laser-etched recesses.

[0010] According to other embodiments of the present invention, the wedge bonding tool and wire bonding system described in the preceding three paragraphs may have any one or more of the following features: a portion of the groove surface, including a plurality of laser-scribed recesses, has a surface texture, said surface texture having a mean area roughness (S0.03-1.5 μm. a The surface of the groove, including a portion of the plurality of laser-etched recesses, has a surface texture, the surface texture having an average regional roughness (S) of 0.1-0.9 μm. a The surface of the groove, including a portion of the plurality of laser-etched recesses, has a surface texture, the surface texture having an average regional roughness (S) of 0.3-1.5 μm. aThe end portion comprises a carbide material; the end portion comprises a cubic boron nitride material; a coating is applied to the surface of the groove; the coating has a thickness of 0.5-10 μm; the coating has a thickness of 5-10 μm; the coating has a thickness of 1-5 μm; the coating has a thickness of 1-20 μm; the coating has a thickness of 10-20 μm; the coating comprises a diamond-like carbon material and has a thickness of 0.5-5 μm; the coating comprises a cubic boron nitride material and has a thickness of 10-100 μm; the coating comprises a tetrahedral amorphous carbon material and has a thickness of 1-50 μm; the coating comprises a cubic boron nitride material and has a thickness of 1-10 μm; the coating comprises a tetrahedral amorphous carbon material and has a thickness of 0.5-6 μm. The coating has a thickness of 1-10 μm; the coating comprises titanium nitride material and has a thickness of 0.2-7 μm; the coating comprises chromium nitride material and has a thickness of 1-15 μm; the depth of each of the plurality of laser-etched recesses extends along an axis substantially perpendicular to the surface of the groove; the depth of each of the plurality of laser-etched recesses is at least ten times greater than the width of each of the plurality of laser-etched recesses; a portion of the groove surface including the plurality of laser-etched recesses has a surface texture, wherein a plurality of peaks included in the portion of the groove surface each have a width of 2-50 μm; and a portion of the groove surface including the plurality of laser-etched recesses has a first surface texture, and another portion of the groove surface has a second surface texture different from the first surface texture.

[0011] According to another exemplary embodiment of the present invention, a method for processing a wedge bonding tool is provided. The method includes the following steps: (a) providing a wedge bonding tool having a body portion and an end portion located at an end of the body portion, the end portion including a groove surface defining a groove configured to receive a lead during a wire bonding operation; and (b) forming a plurality of recesses in the groove surface using a laser beam orthogonal to the groove surface to form each of the plurality of recesses.

[0012] According to another exemplary embodiment of the present invention, a different method for processing a wedge bonding tool is provided. The method includes the following steps: (a) providing a wedge bonding tool having a body portion and an end portion located at an end of the body portion, the end portion including a groove surface defining a groove configured to receive a lead during a wire bonding operation; (b) forming a plurality of recesses in the groove surface using a laser beam; and (c) applying a coating to the groove surface.

[0013] According to other embodiments of the present invention, the method described in the preceding two paragraphs may have any one or more of the following features: step (b) includes reflecting a laser beam by at least one optical element before contacting the groove surface; step (b) includes pulse-firing the laser beam while causing relative movement between the laser beam and the groove surface to form the plurality of recesses; step (b) includes pulse-firing the laser beam while moving the laser beam relative to the groove surface to form the plurality of recesses; step (b) includes forming the plurality of recesses to have a depth extending along an axis substantially perpendicular to the groove surface; step (b) includes forming the plurality of recesses to have a depth at least ten times greater than the width of each of the plurality of recesses; step (b) includes forming the plurality of recesses such that the groove surface including the plurality of recesses has a surface texture, wherein each of the plurality of peaks included in the portion of the groove surface has a 2-50° surface texture. The plurality of recesses are wide; step (b) includes forming the plurality of recesses such that the groove surface including the plurality of recesses has a first surface texture, and another portion of the groove surface has a second surface texture different from the first surface texture; step (b) includes pulse-emitting the laser beam while moving the groove surface relative to the laser beam to form the plurality of recesses; the groove surface includes a first wall portion and a second wall portion, and step (b) includes a sub-step (b1) of forming a first portion of the plurality of recesses in the first wall portion, and a sub-step (b2) of forming a second portion of the plurality of recesses in the second wall portion; step (b) includes providing relative movement between the laser beam and the groove surface after step (b1) and before step (b2) such that during step (b2) the second wall portion is perpendicular to the laser beam; step (b) includes forming the plurality of recesses such that the surface texture of the groove surface including a portion of the plurality of recesses has an average regional roughness (S) between 0.03 and 1.5 μm. a Step (b) includes forming the plurality of recesses such that the surface texture of the recess surface, including a portion of the plurality of recesses, has an average regional roughness (S) between 0.1 and 0.9 μm. aStep (b) includes forming the plurality of recesses such that the surface texture of the recess surface, including a portion of the plurality of recesses, has an average regional roughness (S) between 0.3 and 1.5 μm. a The steps are as follows: (a) forming a groove for the wedge bonding tool using a laser before step (b); (c) applying a coating to the surface of the groove after step (b); step (c) includes applying the coating by chemical vapor deposition; step (c) includes applying the coating by physical vapor deposition; step (c) includes applying the coating by thermal spraying; step (c) includes applying the coating to a thickness of 0.5-10 μm; step (c) includes applying the coating to a thickness of 5-10 μm; step (c) includes applying the coating to a thickness of 1-5 μm; step (c) includes applying the coating to a thickness of 1-20 μm; step (c) includes applying the coating to a thickness of 10-20 μm; step (c) includes applying a coating comprising diamond-like carbon material to a thickness of 0.5-5 μm; step (c) includes applying the coating comprising cubic boron nitride material to a thickness of 10-100 μm; step (c) includes applying a coating comprising cubic boron nitride material to a thickness of 1-50 μm. Step (c) includes applying a coating comprising cubic boron nitride material to a thickness of 1-10 μm; Step (c) includes applying a coating comprising tetrahedral amorphous carbon material to a thickness of 0.5-6 μm; Step (c) includes applying a coating comprising titanium nitride material to a thickness of 1-10 μm; Step (c) includes applying a coating comprising chromium nitride material to a thickness of 0.2-7 μm; Step (c) includes applying a coating comprising chromium nitride material to a thickness of 1-15 μm; and during step (b), the laser beam contacts the groove surface orthogonally to the groove surface to form each of the plurality of recesses. Attached Figure Description

[0014] The present invention is best understood from the following detailed description when read in conjunction with the accompanying drawings. It should be emphasized that, by convention, the various features in the drawings are not drawn to scale. Instead, the dimensions of the various parts have been arbitrarily expanded or reduced for clarity. The drawings include the following views:

[0015] FIGS. 1A-1B These are front and side views of a wedge bonding tool used to illustrate various exemplary embodiments of the present invention;

[0016] FIG. 2A This is a block diagram perspective end view of a tool blank for forming a wedge bonding tool according to an exemplary embodiment of the present invention;

[0017] FIG. 2B It is in response toFIG. 2A A perspective end view of the block diagram of a wedge bonding tool after the tool blank has been processed;

[0018] FIG. 2C This is according to an exemplary embodiment of the present invention. FIG. 2B The wedge bonding tool is a perspective end view of the block diagram after multiple recesses are formed in the groove surface;

[0019] FIG. 2D This is according to an exemplary embodiment of the present invention. FIGS. 2B-2C A side view of the wedge bonding tool after the coating has been applied;

[0020] FIGS. 3A-3D These are a series of block diagrams illustrating a method for forming a plurality of recesses in the grooved surface of a wedge bonding tool according to exemplary embodiments of the present invention;

[0021] FIGS. 4A-4C This is a series of block diagrams illustrating another method for forming a plurality of recesses in the groove surface of a wedge bonding tool according to another exemplary embodiment of the present invention;

[0022] FIGS. 5A-5C This is a series of block diagrams illustrating yet another method of forming a plurality of recesses in the groove surface of a wedge bonding tool according to another exemplary embodiment of the present invention;

[0023] FIGS. 6A-6B This is a block diagram perspective end view of a wedge bonding tool according to various exemplary embodiments of the present invention, showing various patterns of recesses in the groove surface of the wedge bonding tool;

[0024] FIG. 7 This is a block diagram illustrating a wire bonding system according to an exemplary embodiment of the present invention; and

[0025] FIG. 8 This is a flowchart illustrating a method for processing a wedge bonding tool according to an exemplary embodiment of the present invention. Detailed Implementation

[0026] According to various exemplary embodiments of the present invention, texturing of the groove surface of a wedge bonding tool (e.g., a wedge bonding tool configured for bonding copper wires, a wedge bonding tool configured for bonding aluminum wires, etc.) is performed using a laser beam (e.g., by laser micromachining). After texturing, a coating (e.g., a low-friction coating) can be applied to the groove surface.

[0027] Textured and / or coated applications can provide: improved wedge bonding tool performance; improved wedge bonding tool wear resistance; improved coupling between the wedge bonding tool and the lead; and / or improved ability to form wire bonds on sensitive surfaces. While this invention is applicable to a wide variety of lead (wire) types and materials, aspects of this invention are particularly suitable for copper wire bonding and / or aluminum wire bonding.

[0028] According to various exemplary embodiments of the present invention, laser processing (e.g., laser micromachining) can be performed using a laser processing system including five-axis machining capabilities.

[0029] Laser texturing of the groove surface can enhance energy transfer from the wedge bonding tool to the wire (and the substrate to which the wire is being bonded). Some exemplary laser processing techniques may be referred to as "blasting." The selection of blasting density and laser parameters can be used to achieve a surface morphology suitable for specific wire bonding applications.

[0030] Applying a coating (e.g., a low-friction coating) to the groove surface can reduce damage to the bonding surfaces of the substrate (e.g., die pads) during peeling after wire bonding. Certain coatings can be used to: reduce static friction between the groove surface of the wedge bonding tool and the lead; reduce debris generation during wire bonding; and / or reduce tool wear.

[0031] Examples of coatings (e.g., low-friction coatings) that can be applied to the groove surface (and / or other parts of the wedge bonding tool) include, but are not limited to: diamond-like carbon (DLC) materials (with or without interlayers such as Cr), cubic boron nitride (c-BN) materials, tetrahedral amorphous carbon (ta-C) materials (with or without interlayers such as Cr), titanium nitride (TiN) materials, and / or chromium nitride (CrN) materials. The coating can be applied to any desired portion of the wedge bonding tool, such as: the groove surface, the end portion of the wedge bonding tool including the groove surface; and / or the entire wedge bonding tool. Techniques such as chemical vapor deposition (CVD), physical vapor deposition (PVD), thermal spraying, etc., can be used to apply the coating.

[0032] FIGS. 1A-1B A wedge bonding tool 100 is shown, which includes a body portion 102 and an end portion 104 at the end of the body portion 102. The end portion 104 includes a grooved surface 106 (described in more detail herein). The grooved surface 106 defines a groove 108. FIG. 1A This is the front view of the wedge bonding tool 100, and FIG. 1BThis is a side view of a wedge bonding tool 100. The wedge bonding tool 100 is used to bond wires to a bonding location in a wire bonding system. More specifically, a groove 108 is configured to receive a wire during wire bonding operations on the wire bonding system. The main difference between conventional wedge bonding tools and certain wedge bonding tools described herein involves the end portion 104, and more specifically the groove surface 106. The wedge bonding tools described below (i.e., wedge bonding tools 100a, 100b, 100c, 100d, 100e, and 100f) each represent different embodiments of the present invention. Similar components are indicated by similar reference numerals (e.g., in each embodiment, the end portion 104 may be designated as 104a, 104b, etc., all of which refer to different exemplary end portions).

[0033] Details of various examples of the wedge bonding tool 100, including the main body 102 (including different end portions 104), are in FIGS. 2B-2D (Wedge bonding tool 100a includes end portion 104a) FIGS. 3A-3D (Wedge bonding tool 100b includes end portion 104b) FIGS. 4A-4C (Among them, the wedge bonding tool 100c includes the end portion 104c.) FIGS. 5A-5C (Among them, the wedge bonding tool 100d includes the end part 104d) FIG. 6A (Wedge bonding tool 100e includes end portion 104e) and FIG. 6B (Among which the wedge bonding tool 100f includes the end portion 104f).

[0034] FIGS. 2A-2D An exemplary formation and processing of the wedge bonding tool 100a is shown. FIG. 2A A tool blank 10 configured for being processed (e.g., laser-processed) or otherwise modified into a wedge bonding tool is shown. The tool blank 10 can be formed from any type of desired material, such as carbide materials. For example, a laser system can be used to remove material from the tool blank 10 to form a groove. Alternatively, the tool blank 10 may include a body portion and be configured to be joined to an end portion (e.g., via brazing, welding, adhesive, etc.). FIG. 2B The diagram shows the end portion 104a of a wedge bonding tool 100a after a machining process removes material to create a grooved surface 106a in the end portion 104a. The grooved surface 106a defines a groove 108a. The grooved surface 106a includes a vertex 104a2 (i.e., a "peak" of the grooved surface, which may be "U", "V", etc.). The end portion 104a includes two legs 104a1 at the end of the end portion 104a.

[0035] FIG. 2C The illustration shows an end portion 104a after a plurality of laser-scribed recesses 106a1 have been formed on the groove surface 106a according to an embodiment of the present invention. (Due to the inclusion of the laser-scribed recesses, the groove surface 106a is now...) FIG. 2C (marked as groove surface 106a'). Although FIG. 2C Only one wall of the groove surface, including the laser-scribed recess, is shown, but it should be understood that such laser-scribed recess can be formed on any part of the groove surface (e.g., apex 104a2) and / or end portion (e.g., foot portion 104a1 of the end portion) as needed.

[0036] FIG. 2D The end portion 104a is shown after coating 120 has been applied to the end portion 104a (including a groove surface 106a' with multiple laser-scribed recesses 106a1, apex 104a2, each leg portion 104a1, and the outer surface of the end portion 104a). Although FIG. 2D The invention illustrates applying a coating after multiple laser-etched recesses 106a1 have been formed, but the invention is not limited thereto, as it is conceivable that the coating 120 may be applied to the groove surface 106a (i.e., the groove surface without laser-etched recesses, or the groove surface before the formation of laser-etched recesses) without departing from the scope of the invention.

[0037] like FIG. 2D As shown, coating 120 has a thickness t. Exemplary ranges for thickness t include: 0.5-10 μm, 5-10 μm, 1-5 μm, 1-20 μm, and 10-20 μm. In exemplary embodiments of the present invention, the thickness t may depend on the type of coating. For example, a diamond-like carbon (DLC) coating may have an exemplary thickness of 0.5-5 μm; a cubic boron nitride (c-BN) coating may have an exemplary thickness of 10-100 μm, 1-50 μm, or 1-10 μm; a tetrahedral amorphous carbon (ta-C) coating may have an exemplary thickness of 0.5-6 μm; a titanium nitride (TiN) coating may have an exemplary thickness of 1-10 μm; and a chromium nitride (CrN) coating may have an exemplary thickness of 0.2-7 μm or 1-15 μm.

[0038] although FIG. 2D The coating applied to the entire end portion 104a is shown, but the invention is not limited thereto. For example, the coating may be applied to selected portions of the end portion 104a as needed (e.g., all or part of the groove surface 106a, each leg portion 104a1, the outer surface of the end portion 104a, etc.).

[0039] although FIGS. 2A-2D The overview of this utility model is shown, but FIGS. 3A-3D , FIGS. 4A-4C , FIGS. 5A-5C as well as FIGS. 6A-6B More specifically shown FIG. 2B and FIG. 2C The steps involved in this process created multiple laser-etched recesses. FIGS. 3A-3D In the diagram, the end portion 104b of the wedge bonding tool 100b is shown in the laser processing system 310 at the beginning of forming a laser scribing recess. The laser processing system 310 includes an optical element 312 and a laser source 314. FIGS. 3A-3D Throughout the process shown, the laser source 314 and the optical element 312 are fixed in place.

[0040] exist FIG. 3A In this process, laser source 314 emits laser beam 314a toward optical element 312. Optical element 312 reflects and / or focuses laser beam 314a toward a first wall portion 106b1 of a groove surface 106b of end portion 104b. Laser beam 314a contacts the first wall portion 106b1 orthogonally (i.e., perpendicularly) to the groove surface 106b. Laser beam 314a removes material from the first wall portion 106b1 to create a recess. Because laser beam 314a strikes the first wall portion 106b1 at a right angle, the recess has a depth extending along an axis substantially perpendicular to the first wall portion 106b1.

[0041] exist FIG. 3B In the middle, the end portion 104b has been moved to the left, as indicated by the arrow. The laser source 314 and optical element 312 remain fixed, thus achieving relative movement between the laser beam 314a and the groove surface 106b. During this movement, the laser source 314 continuously emits the laser beam 314a in pulses, each pulse creating another laser-etched recess in the first wall portion 106b1, thereby creating multiple laser-etched recesses in the first wall portion 106b1. FIG. 3C In this configuration, the end portion 104b has been moved (e.g., rotated 180°) so that the laser beam 314a is now incident on the second wall portion 106b2. FIG. 3D In the middle, the end portion 104b has been moved to the right, as indicated by the arrow. During the movement, the laser source 314 continuously emits a laser beam 314a in pulses, wherein each pulse creates a recess, thereby creating multiple laser-etched recesses in the second wall portion 106b2.

[0042] although FIGS. 3A-3D A single optical element (i.e., optical element 312) is shown, but the present invention is not limited thereto. Exemplary laser processing systems may include multiple optical elements (e.g., see...).FIGS. 5A-5C This includes mirrors and / or lenses for controlling the laser beam (e.g., reflection, focusing, etc.). Similarly, a laser processing system may not include optical elements at all (e.g., see [reference needed]). FIGS. 4A-4C Furthermore, this invention is not limited to keeping the laser source and / or optical components fixed, as further described below.

[0043] For example, FIGS. 4A-4C A laser processing system 410 including a laser source 414 is shown. The laser source 414 is used to form a plurality of recesses on the groove surface 106c of the end portion 104c of the wedge bonding tool 100c. FIG. 4A In this configuration, the laser source 414 is aligned such that the laser beam 414a, when emitted from the laser source 414, contacts the groove surface 106c orthogonally (i.e., perpendicularly to the groove surface 106c). The laser source 414 is... FIG. 4A The image shows a laser beam 414a being emitted to form a recess in a groove surface 106c. Because the laser beam 414a strikes the groove surface 106c at a right angle, the recess has a depth extending along an axis substantially perpendicular to the groove surface 106c.

[0044] exist FIG. 4B In this process, the laser source 414 has been moved (e.g., diagonally) so that the laser beam 414a contacts another portion of the groove surface 106c. FIG. 4A and FIG. 4B Between the positions shown, the laser source 414 continuously emits a laser beam 414a in pulses during the movement, wherein each pulse creates another laser-etched recess in the groove surface 106c, thereby creating multiple laser-etched recesses in the groove surface 106c.

[0045] exist FIG. 4C In this process, the laser source 414 has been continuously moving to complete the treatment of the groove surface 106c. FIGS. 4A-4C Throughout the process shown, the laser source 414 is aligned such that the laser beam 414a contacts the groove surface 106c orthogonally. In some embodiments, the entire groove surface 106c includes multiple laser-etched recesses, but the present invention is not limited thereto; only a portion of the groove surface may include laser-etched recesses.

[0046] FIGS. 5A-5C Another laser processing system 510 is shown. The laser processing system 510 includes a laser source 514 and optical elements 512 and 513. The laser source 514 is configured to emit a laser beam 514a. FIG. 5AIn this process, laser source 514 is emitting laser beam 514a toward optical element 512. Optical element 512 is aligned such that it reflects laser beam 514a so that laser beam 514a is orthogonal to (i.e., perpendicular to) the groove surface 106d (of the end portion 104d of wedge bonding tool 100d) and contacts groove surface 106d. FIG. 5B In this process, optical element 512 has been moved (e.g., upwards) to guide laser beam 514a to different positions on groove surface 106d. FIG. 5A and FIG. 5B During this period, the optical element 512 continuously moves, as indicated by the arrow, and the laser source 514 pulses a laser beam 514a to create multiple laser-etched recesses in the groove surface 106d. FIG. 5C In this process, optical element 512 has been moved (e.g., rotated) to reflect laser beam 514a toward optical element 513. Optical element 513 reflects laser beam 514a toward different portions of groove surface 106d.

[0047] although FIGS. 3A-3D , FIGS. 4A-4C as well as FIGS. 5A-5C Only one component of the laser processing system in motion is shown, but the invention is not limited thereto. Multiple components of the laser processing machine that are movable to create relative motion between the groove surface and the laser beam (e.g., where optical elements and the laser source are in motion) are also within the scope of this invention.

[0048] FIGS. 3A-3D , FIGS. 4A-4C and FIGS. 5A-5C A two-dimensional block diagram of laser scribing is shown. To more clearly illustrate aspects of this invention, FIG. 6A and FIG. 6B Perspective views of wedge bonding tools 100e and 100f are shown. FIG. 6A A laser source 614 and an end portion 104e of a wedge bonding tool 100e are shown. The laser source 614 is emitting a laser beam 614a toward a grooved surface 106e of the end portion 104e. The laser beam 614a contacts the grooved surface 106e orthogonally (i.e., perpendicularly) to it. A motion profile 600 is shown on the grooved surface 106e. At least one of the laser source 614, the end portion 104e, and an optical system (not shown) is moved to achieve relative motion between the laser beam 614a and the grooved surface 106e (e.g., as shown in the image). FIGS. 3A-3D , FIGS. 4A-4C and FIGS. 5A-5C(As described in any of them). When there is relative motion, the laser 614 pulses a laser beam 614a, wherein each pulse creates a laser-etched recess in the groove surface 106e. Because the laser beam 614a strikes the groove surface 106e at a right angle, each recess has a depth extending along an axis substantially perpendicular to the groove surface 106e. FIG. 6A As shown, (for example, the movement of the laser beam 614a along the groove surface 106e) is a predetermined motion profile, but the present invention is not limited thereto. FIG. 6B As shown, a motion profile 602 is implemented on the groove surface 106f of the end portion 104f. The motion profile 602 is random (or pseudo-random).

[0049] The various methods described herein produce wedge-shaped bonding tools having multiple laser-scribed recesses on at least a portion of a grooved surface. The portion of the grooved surface including the multiple laser-scribed recesses has a surface texture. According to an exemplary embodiment of the present invention, the surface texture may have a mean area roughness (S...). a Average regional roughness (S) a The exemplary ranges for S are: 0.03-1.5 μm, 0.1-0.9 μm, and 0.3-1.5 μm. Specific embodiments may have different S values. a Range. For example, a wedge bonding tool including a cubic boron nitride (c-BN) end portion can have exemplary S values ​​of 0.1-0.9 μm, 0.3-1.5 μm, or 0.4-1.5 μm. a Wedge bonding tools including carbide (e.g., tungsten carbide) ends can have exemplary S values ​​of 0.03-0.15 μm, 0.1-0.9 μm, 0.3-1.5 μm, or 0.4-1.5 μm. a Specific tools can be selected for specific applications. a The range (e.g., a different range for bonding copper wires compared to the range used for bonding aluminum wires may be desirable). An average regional roughness (S) is conceivable. a Other ranges. The recess may have a depth, for example, at least ten times larger than its width / diameter.

[0050] In conjunction with various aspects of this invention, material is typically removed from the surface of a groove to form multiple laser-scribed recesses. By removing this material, multiple "peaks" are formed in the surface texture of the groove surface. For example, each of the multiple peaks included in the groove surface can have a width of 2-50 μm. The combination of the multiple laser-scribed recesses and the resulting multiple peaks can be considered as the surface texture defining the treated area of ​​the groove surface.

[0051] Although various aspects of the present invention have been described as having a single surface texture, the present invention is not limited thereto. It is conceivable that a wedge bonding tool can give a portion of the groove surface a first surface texture and another portion of the groove surface a second surface texture different from the first surface texture (e.g., the first surface texture has an average regional roughness different from the second surface texture, etc.).

[0052] The wedge bonding tool described herein, or other tools within the scope of this invention, can be used in conjunction with wire bonding operations on a wire bonding system. FIG. 7 An exemplary wire bonding system 710 is shown. The wire bonding system 710 includes a bonding head assembly 712 and a support structure 720. The support structure 720 is shown as supporting a workpiece 110 (e.g., a semiconductor element, a die, etc.). The bonding head assembly 712 includes a transducer 714 configured to receive a wedge bonding tool 100 (e.g., any one of wedge bonding tools 100a, 100b, 100c, 100d, 100e, 100f or any other wedge bonding tool within the scope of this invention). The wedge bonding tool 100 is configured to be carried by the bonding head assembly 712, wherein the wedge bonding tool 100 includes a body portion 102 and an end portion 104 at the end of the body portion 102. The end portion 104 includes a groove surface 106 defining a recess 108 configured to receive a lead during a wire bonding operation, and the groove surface 106 includes a plurality of laser-scribed recesses (not shown). As described above, each of the laser-scribed recesses has a depth extending along an axis substantially perpendicular to the groove surface 106.

[0053] Combination FIGS. 2A-2D , FIGS. 3A-3D , FIGS. 4A-4C , FIGS. 5A-5C and FIGS. 6A-6B The method for forming wedge bonding tools described in [the document], in FIG. 8 A flowchart is provided. As those skilled in the art will understand, some steps included in the flowchart may be omitted; some additional steps may be added; and the order of the steps may be changed from the order shown within the scope of this invention.

[0054] Now for reference FIG. 8 In optional step 800, a groove is formed at the end portion of the tool blank using a laser (see, for example, see...). FIGS. 2A-2BIn step 802, a wedge bonding tool is provided, or, if step 800 is performed, a wedge bonding tool from step 800 is provided. The provided wedge bonding tool, whether from step 800 or otherwise, has a body portion and an end portion located at the end of the body portion. The end portion includes a groove surface defining a recess, and the groove is configured to receive a lead during the wire bonding operation. At step 804, a plurality of recesses are formed in the groove surface using a laser beam (e.g., see...). FIGS. 2A-2D , FIGS. 3A-3D , FIGS. 4A-4C , FIGS. 5A-5C and FIGS. 6A-6B FIG. 8 FIG. 8 FIGS. 2A-2B FIGS. 2A-2D FIGS. 3A-3D FIGS. 4A-4C FIGS. 5A-5C FIGS. 6A-6B (The process for each of the recesses). In step 804, the laser beam contacts the recess surface perpendicularly to the recess surface to form each of the plurality of recesses; however, it should be understood that, according to some embodiments of the present invention, the laser beam may contact the recess surface at different angles. In an optional step 806, after step 804, a coating (e.g., a low-friction coating, a wear-resistant coating, etc.) is applied to the recess surface.

[0055] A laser system can be used in conjunction with this invention to form multiple recesses in a grooved surface in many different ways. For example, laser parameters can be selected based on multiple variables, such as the material of the tip portion of the wedge bonding tool, the desired depth / size of each recess, etc. Examples of such laser parameters include, for example, pulse frequency, pulse duration, amplitude, wavelength, etc. Specific laser parameters used to form a given number of recesses in a particular wedge bonding tool can be considered a laser recipe. As those skilled in the art will understand, multiple different laser recipes can be used in conjunction with the treatment of the grooved surface of the wedge bonding tool to achieve a desired surface texture.

[0056] The present invention is described in relation to a wedge-shaped bonding tool comprising (i) a body portion and (ii) an end portion located at the end of the body portion. As those skilled in the art will understand, such a wedge-shaped bonding tool may be formed from a single material (e.g., a carbide material such as tungsten carbide) or multiple materials. For example, multiple materials may include a body portion formed of a first material (e.g., a carbide material such as tungsten carbide) and an end portion formed of a second material (e.g., cubic boron nitride or any other suitable material). In such an example, the end portion may be joined to the body portion using any desired technique (e.g., brazing).

[0057] Although the present invention has been shown and described herein with reference to specific embodiments, it is not intended to be limited to the details shown. Rather, various modifications to the details may be made within the scope of the equivalents of the claims without departing from the present invention.

Claims

1. A wedge bonding tool, characterized in that, The wedge bonding tool includes: The main body; and The end portion located at the end of the main body portion, The end portion includes a groove surface defining a recess configured to receive a wire during a wire bonding operation. The groove surface includes multiple laser-etched recesses.

2. The wedge bonding tool according to claim 1, characterized in that, A portion of the groove surface, including the plurality of laser-etched recesses, has a surface texture, the surface texture having an average regional roughness (S0.03-1.5 μm. a ).

3. The wedge bonding tool according to claim 1, characterized in that, A portion of the groove surface, including the plurality of laser-etched recesses, has a surface texture, the surface texture having an average regional roughness (S0.1-0.9 μm. a ).

4. The wedge bonding tool according to claim 1, characterized in that, A portion of the groove surface, including the plurality of laser-etched recesses, has a surface texture, the surface texture having an average regional roughness (S0.3-1.5 μm. a ).

5. The wedge bonding tool according to claim 1, characterized in that, The end portion comprises a carbide material.

6. The wedge bonding tool according to claim 1, characterized in that, The end portion comprises cubic boron nitride material.

7. The wedge bonding tool according to claim 1, characterized in that, The wedge bonding tool also includes a coating applied to the surface of the groove.

8. The wedge bonding tool according to claim 7, characterized in that, The coating has a thickness of 0.5-10 μm.

9. The wedge bonding tool according to claim 7, characterized in that, The coating has a thickness of 5-10 μm.

10. The wedge bonding tool according to claim 7, characterized in that, The coating has a thickness of 1-5 μm.

11. The wedge bonding tool according to claim 7, characterized in that, The coating has a thickness of 1-20 μm.

12. The wedge bonding tool according to claim 7, characterized in that, The coating has a thickness of 10-20 μm.

13. The wedge bonding tool according to claim 7, characterized in that, The coating comprises a diamond-like carbon material and has a thickness of 0.5-5 μm.

14. The wedge bonding tool according to claim 7, characterized in that, The coating comprises cubic boron nitride material and has a thickness of 10-100 μm.

15. The wedge bonding tool according to claim 7, characterized in that, The coating comprises cubic boron nitride material and has a thickness of 1-50 μm.

16. The wedge bonding tool according to claim 7, characterized in that, The coating comprises cubic boron nitride material and has a thickness of 1-10 μm.

17. The wedge bonding tool according to claim 7, characterized in that, The coating comprises tetrahedral amorphous carbon material and has a thickness of 0.5-6 μm.

18. The wedge bonding tool according to claim 7, characterized in that, The coating comprises titanium nitride material and has a thickness of 1-10 μm.

19. The wedge bonding tool according to claim 7, characterized in that, The coating comprises chromium nitride and has a thickness of 0.2-7 μm.

20. The wedge bonding tool according to claim 7, characterized in that, The coating comprises chromium nitride material and has a thickness of 1-15 μm.

21. The wedge bonding tool according to claim 1, characterized in that, The depth of each of the plurality of laser-etched recesses extends along an axis perpendicular to the surface of the recess.

22. The wedge bonding tool according to claim 1, characterized in that, The depth of each of the plurality of laser-etched recesses is at least ten times greater than the width of each of the plurality of laser-etched recesses.

23. The wedge bonding tool according to claim 1, characterized in that, A portion of the groove surface, including the plurality of laser-etched recesses, has a surface texture, wherein each of the plurality of peaks included in the portion of the groove surface has a width of 2-50 μm.

24. The wedge bonding tool according to claim 1, characterized in that, A portion of the groove surface, including the plurality of laser-etched recesses, has a first surface texture, and another portion of the groove surface has a second surface texture different from the first surface texture.

25. A wedge bonding tool, characterized in that, The wedge bonding tool includes: Main body; An end portion located at the end of the main body portion, the end portion including a groove surface defining a recess configured to receive a lead during a wire bonding operation, the groove surface including a plurality of laser-etched recesses; and The coating applied to the surface of the groove.

26. The wedge bonding tool according to claim 25, characterized in that, A portion of the groove surface, including the plurality of laser-etched recesses, has a surface texture, the surface texture having an average regional roughness (S0.03-1.5 μm. a ).

27. The wedge bonding tool according to claim 25, characterized in that, A portion of the groove surface, including the plurality of laser-etched recesses, has a surface texture, the surface texture having an average regional roughness (S0.1-0.9 μm. a ).

28. The wedge bonding tool according to claim 25, characterized in that, A portion of the groove surface, including the plurality of laser-etched recesses, has a surface texture, the surface texture having an average regional roughness (S0.3-1.5 μm. a ).

29. The wedge bonding tool according to claim 25, characterized in that, The end portion comprises a carbide material.

30. The wedge bonding tool according to claim 25, characterized in that, The end portion comprises cubic boron nitride material.

31. The wedge bonding tool according to claim 25, characterized in that, The depth of each of the plurality of laser-etched recesses extends along an axis perpendicular to the surface of the recess.

32. The wedge bonding tool according to claim 25, characterized in that, The depth of each of the plurality of laser-etched recesses is at least ten times greater than the width of each of the plurality of laser-etched recesses.

33. The wedge bonding tool according to claim 25, characterized in that, A portion of the groove surface, including the plurality of laser-etched recesses, has a surface texture, wherein each of the plurality of peaks included in the portion of the groove surface has a width of 2-50 μm.

34. The wedge bonding tool according to claim 25, characterized in that, A portion of the groove surface, including the plurality of laser-etched recesses, has a first surface texture, and another portion of the groove surface has a second surface texture different from the first surface texture.

35. A wire bonding system, characterized in that, The wire bonding system includes: Bonding head assembly; Support structures for supporting workpieces; and A wedge bonding tool configured to be carried by the bonding head assembly, wherein the wedge bonding tool has a body portion and an end portion located at the end of the body portion, the end portion including a groove surface defining a recess configured to receive a lead during a wire bonding operation, the groove surface including a plurality of laser-etched recesses.

36. The wire bonding system according to claim 35, characterized in that, A portion of the groove surface, including the plurality of laser-etched recesses, has a surface texture, the surface texture having an average regional roughness (S0.03-1.5 μm. a ).

37. The wire bonding system according to claim 35, characterized in that, A portion of the groove surface, including the plurality of laser-etched recesses, has a surface texture, the surface texture having an average regional roughness (S0.1-0.9 μm. a ).

38. The wire bonding system according to claim 35, characterized in that, A portion of the groove surface, including the plurality of laser-etched recesses, has a surface texture, the surface texture having an average regional roughness (S0.3-1.5 μm. a ).

39. The wire bonding system according to claim 35, characterized in that, The end portion comprises a carbide material.

40. The wire bonding system according to claim 35, characterized in that, The end portion comprises cubic boron nitride material.

41. The wire bonding system according to claim 35, characterized in that, The wire bonding system also includes a coating applied to the surface of the groove.

42. The wire bonding system according to claim 41, characterized in that, The coating has a thickness of 0.5-10 μm.

43. The wire bonding system according to claim 41, characterized in that, The coating has a thickness of 5-10 μm.

44. The wire bonding system according to claim 41, characterized in that, The coating has a thickness of 1-5 μm.

45. The wire bonding system according to claim 41, characterized in that, The coating has a thickness of 1-20 μm.

46. ​​The wire bonding system according to claim 41, characterized in that, The coating has a thickness of 10-20 μm.

47. The wire bonding system according to claim 41, characterized in that, The coating comprises a diamond-like carbon material and has a thickness of 0.5-5 μm.

48. The wire bonding system according to claim 41, characterized in that, The coating comprises cubic boron nitride material and has a thickness of 10-100 μm.

49. The wire bonding system according to claim 41, characterized in that, The coating comprises cubic boron nitride material and has a thickness of 1-50 μm.

50. The wire bonding system according to claim 41, characterized in that, The coating comprises cubic boron nitride material and has a thickness of 1-10 μm.

51. The wire bonding system according to claim 41, characterized in that, The coating comprises tetrahedral amorphous carbon material and has a thickness of 0.5-6 μm.

52. The wire bonding system according to claim 41, characterized in that, The coating comprises titanium nitride material and has a thickness of 1-10 μm.

53. The wire bonding system according to claim 41, characterized in that, The coating comprises chromium nitride and has a thickness of 0.2-7 μm.

54. The wire bonding system according to claim 41, characterized in that, The coating comprises chromium nitride material and has a thickness of 1-15 μm.

55. The wire bonding system according to claim 35, characterized in that, The depth of each of the plurality of laser-etched recesses extends along an axis perpendicular to the surface of the recess.

56. The wire bonding system according to claim 35, characterized in that, The depth of each of the plurality of laser-etched recesses is at least ten times greater than the width of each of the plurality of laser-etched recesses.

57. The wire bonding system according to claim 35, characterized in that, A portion of the groove surface, including the plurality of laser-etched recesses, has a surface texture, wherein each of the plurality of peaks included in the portion of the groove surface has a width of 2-50 μm.

58. The wire bonding system according to claim 35, characterized in that, A portion of the groove surface, including the plurality of laser-etched recesses, has a first surface texture, and another portion of the groove surface has a second surface texture different from the first surface texture.

59. A wedge bonding tool, characterized in that, The wedge bonding tool includes: The main body is formed of carbide materials; The end portion, formed of a carbide material at the end of the body portion, includes a groove surface defining a recess configured to receive a lead during a wire bonding operation. The groove surface includes a plurality of laser-scribed recesses having a surface texture with an average regional roughness (S0.03-1.5 μm. a );as well as The coating applied to the surface of the groove.

60. The wedge bonding tool according to claim 59, characterized in that, The surface texture has an average regional roughness (S) of 0.1-0.9 μm. a ).

61. The wedge bonding tool according to claim 59, characterized in that, The surface texture has an average regional roughness (S) of 0.4-1.5 μm. a ).

62. The wedge bonding tool according to claim 59, characterized in that, The surface texture has an average regional roughness (S) of 0.3-1.5 μm. a ).

63. The wedge bonding tool according to claim 59, characterized in that, The coating comprises diamond-like carbon and has a thickness of 0.5-5 μm.

64. The wedge bonding tool according to claim 59, characterized in that, The coating comprises tetrahedral amorphous carbon and has a thickness of 0.5-6 μm.

65. The wedge bonding tool according to claim 59, characterized in that, The coating comprises cubic boron nitride and has a thickness of 1-10 μm.

66. The wedge bonding tool according to claim 59, characterized in that, The coating comprises cubic boron nitride and has a thickness of 1-50 μm.

67. The wedge bonding tool according to claim 59, characterized in that, The coating comprises cubic boron nitride and has a thickness of 10-100 μm.

68. The wedge bonding tool according to claim 59, characterized in that, The coating comprises titanium nitride and has a thickness of 1-10 μm.

69. The wedge bonding tool according to claim 59, characterized in that, The coating comprises chromium nitride and has a thickness of 1-15 μm.

70. The wedge bonding tool according to claim 59, characterized in that, The coating comprises chromium nitride and has a thickness of 0.2-7 μm.

71. The wedge bonding tool according to claim 59, characterized in that, The depth of each of the plurality of laser-etched recesses extends along an axis perpendicular to the surface of the recess.

72. The wedge bonding tool according to claim 59, characterized in that, The depth of each of the plurality of laser-etched recesses is at least ten times greater than the width of each of the plurality of laser-etched recesses.

73. The wedge bonding tool according to claim 59, characterized in that, A portion of the groove surface, including the plurality of laser-etched recesses, has a surface texture, wherein each of the plurality of peaks included in the portion of the groove surface has a width of 2 μm-50 μm.

74. The wedge bonding tool according to claim 59, characterized in that, A portion of the groove surface, including the plurality of laser-etched recesses, has a first surface texture, and another portion of the groove surface has a second surface texture different from the first surface texture.

75. A wedge bonding tool, characterized in that, The wedge bonding tool includes: The main body is formed of carbide materials; The end portion, formed of cubic boron nitride at the end of the body portion, includes a groove surface defining a recess configured to receive a lead during a wire bonding operation. The groove surface includes a plurality of laser-scribed recesses having a surface texture with an average regional roughness (Si) of 0.1–0.9 μm. a );as well as The coating applied to the surface of the groove.

76. The wedge bonding tool according to claim 75, characterized in that, The surface texture has an average regional roughness (S) of 0.1-0.9 μm. a ).

77. The wedge bonding tool according to claim 75, characterized in that, The surface texture has an average regional roughness (S) of 0.4-1.5 μm. a ).

78. The wedge bonding tool according to claim 75, characterized in that, The surface texture has an average regional roughness (S) of 0.3-1.5 μm. a ).

79. The wedge bonding tool according to claim 75, characterized in that, The coating comprises diamond-like carbon and has a thickness of 0.5-5 μm.

80. The wedge bonding tool according to claim 75, characterized in that, The coating comprises tetrahedral amorphous carbon and has a thickness of 0.5-6 μm.

81. The wedge bonding tool according to claim 75, characterized in that, The coating comprises cubic boron nitride and has a thickness of 1-10 μm.

82. The wedge bonding tool according to claim 75, characterized in that, The coating comprises cubic boron nitride and has a thickness of 1-50 μm.

83. The wedge bonding tool according to claim 75, characterized in that, The coating comprises cubic boron nitride and has a thickness of 10-100 μm.

84. The wedge bonding tool according to claim 75, characterized in that, The coating comprises titanium nitride and has a thickness of 1-10 μm.

85. The wedge bonding tool according to claim 75, characterized in that, The coating comprises chromium nitride and has a thickness of 1-15 μm.

86. The wedge bonding tool according to claim 75, characterized in that, The coating comprises chromium nitride and has a thickness of 0.2-7 μm.

87. The wedge bonding tool according to claim 75, characterized in that, The depth of each of the plurality of laser-etched recesses extends along an axis perpendicular to the surface of the recess.

88. The wedge bonding tool according to claim 75, characterized in that, The depth of each of the plurality of laser-etched recesses is at least ten times greater than the width of each of the plurality of laser-etched recesses.

89. The wedge bonding tool according to claim 75, characterized in that, A portion of the groove surface, including the plurality of laser-etched recesses, has a surface texture, wherein each of the plurality of peaks included in the portion of the groove surface has a width of 2-50 μm.

90. The wedge bonding tool according to claim 75, characterized in that, A portion of the groove surface, including the plurality of laser-etched recesses, has a first surface texture, and another portion of the groove surface has a second surface texture different from the first surface texture.

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