Crystal ingot stripping device

Abstract

The utility model discloses a crystal ingot stripping device, and relates to the technical field of crystal ingot stripping, the crystal ingot stripping device comprises an ultrasonic mechanism, a self-adaptive adsorption mechanism and a displacement mechanism, the ultrasonic mechanism comprises an ultrasonic generator and a vibration plate, and the ultrasonic generator is connected with the vibration plate to drive the vibration plate to generate ultrasonic vibration; the self-adaptive adsorption mechanism comprises a supporting plate, a guide rod, an elastic piece and a first adsorption piece, the supporting plate is provided with a guide channel, the guide rod is movably connected with the guide channel, one end of the guide rod is connected to the first adsorption piece, and the other end of the guide rod is provided with a limiting part to limit the guide rod to leave the guide channel; a gap is formed between the inner wall of the guide channel and the outer wall of the guide rod, one end of the elastic piece is connected with the first adsorption piece, the other end of the elastic piece is connected with the supporting plate, and the first adsorption piece is used for adsorbing crystal ingots; and the displacement mechanism is connected with the self-adaptive adsorption mechanism. According to the technical scheme provided by the utility model, the crystal ingot can be stripped with higher quality and higher efficiency.

Description

TECHNICAL FIELD

[0001] The utility model relates to crystal ingot stripping technical field, especially crystal ingot stripping device. BACKGROUND

[0002] At present, the method of crystal ingot stripping mainly is first using laser modification, then through mechanical drawing or ultrasonic vibration to realize crystal ingot stripping, but both ways have obvious shortcomings.

[0003] Among them, mechanical drawing needs complex viscose and degumming process, is difficult to realize automatic operation, and uneven stress is prone to in drawing process and causes wafer rupture.

[0004] In the process of ultrasonic separation, if the emission surface of ultrasonic device is less than crystal ingot, then needs to increase scanning operation, time -consuming is longer, and it is easy to cause local stress too large and causes wafer rupture, so the emission surface of ultrasonic device is generally set to be greater than crystal ingot, but the flatness of the emission surface is difficult to control under the condition, will affect the transmission of ultrasonic energy to crystal ingot, causes partial area to be difficult to separate, and the stripping effect is poor, and the stripping efficiency is low. UTILITY MODEL CONTENTS

[0005] The main purpose of the utility model is to propose a kind of crystal ingot stripping device, to be able to more high-quality and efficient to the crystal ingot stripping.

[0006] To achieve the above object, the crystal ingot stripping device provided by the utility model comprises:

[0007] Ultrasonic mechanism, the ultrasonic mechanism includes ultrasonic generator and vibration plate, the ultrasonic generator is connected with the vibration plate, to drive the vibration plate to generate ultrasonic vibration;

[0008] Self-adapting adsorption mechanism, the self-adapting adsorption mechanism includes support plate, guide rod, elastic member and first suction accessory, the support plate is equipped with guide channel, the guide rod is movably connected the guide channel, one end of the guide rod is connected to the first suction accessory, the other end of the guide rod is equipped with limit portion, to limit the guide rod from the guide channel, there is gap between the inner wall of the guide channel and the outer wall of the guide rod, one end of the elastic member is connected with the first suction accessory, the other end of the elastic member is connected with the support plate, and the first suction accessory is used to adsorb crystal ingot;And

[0009] Displacement mechanism, the displacement mechanism is connected with the self-adapting adsorption mechanism, and can drive the self-adapting adsorption mechanism to move to the ultrasonic mechanism.

[0010] In an embodiment, the outer diameter of the guide rod gradually decreases from the limit portion to the first suction accessory.

[0011] In an embodiment, the adaptive adsorption mechanism further comprises a force sensor, the force sensor is arranged on the support plate, and the displacement mechanism is connected with the force sensor.

[0012] In an embodiment, the force sensor is a six-dimensional force sensor.

[0013] In an embodiment, the elastic member is a spring, the spring is sleeved on the guide rod, one end of the spring abuts against the first adsorption member, and the other end of the spring abuts against the support plate.

[0014] In an embodiment, the adaptive adsorption mechanism further comprises a guide sleeve, the support plate is provided with a mounting hole, the guide sleeve is detachably connected to the mounting hole, and the guide sleeve is internally provided with the guide channel.

[0015] In an embodiment, the vibration plate is internally provided with a plurality of vibration elements, and the plurality of vibration elements are regularly distributed in the vibration plate.

[0016] In an embodiment, in a first direction, the plurality of vibration elements are arranged at intervals on the vibration plate and form a vibration element group, and a plurality of vibration element groups are arranged at intervals on the vibration plate along a second direction and are staggered, the second direction being perpendicular to the first direction.

[0017] In an embodiment, the plurality of vibration elements are arranged in a matrix in the vibration plate.

[0018] In an embodiment, the plurality of vibration elements are arranged in a radial manner from the center of the vibration plate to the outside of the vibration plate.

[0019] In an embodiment, vibration elements of the same power are arranged in a ring and form a vibration element group, a plurality of vibration element groups are arranged in a radial manner from the center of the vibration plate to the outside of the vibration plate, and powers of adjacent two vibration element groups are different.

[0020] In an embodiment, the ultrasonic mechanism further comprises a partition plate, a heat-conducting member, and a heat dissipation pipe, the partition plate is arranged in the vibration plate and divides the vibration plate into a first cavity and a second cavity, the vibration element is arranged in the first cavity, one end of the heat-conducting member is connected to the vibration element, the other end of the heat-conducting member is inserted into the second cavity, and the heat dissipation pipe is in communication with the second cavity.

[0021] In an embodiment, the displacement mechanism drives the adaptive adsorption mechanism to move in a first direction in the ultrasonic mechanism and to reciprocate in a second direction, the second direction being perpendicular to the first direction.

[0022] In an embodiment, the displacement mechanism drives the adaptive adsorption mechanism to perform circumferential motion in the ultrasonic mechanism.

[0023] In an embodiment, the displacement mechanism drives the adaptive adsorption mechanism to move in the ultrasonic mechanism, and simultaneously drives the adaptive adsorption mechanism to rotate.

[0024] In an embodiment, the crystal ingot stripping device further comprises a separation mechanism, and the separation mechanism comprises a second adsorption member for adsorbing the wafer.

[0025] In an embodiment, the separation mechanism further comprises a limiting member and two guide members, the second adsorption member is provided with an adsorption area, the two guide members are respectively arranged on two sides of the adsorption area and form a guide groove, and the limiting member is arranged on one side of the adsorption area, and the wafer can enter the adsorption area along the guide groove and abut against the limiting member.

[0026] In the technical scheme of the utility model, the adaptive adsorption mechanism is used for adsorbing the crystal ingot, the displacement mechanism is used for driving the crystal ingot to move to the ultrasonic mechanism, and the ultrasonic mechanism is used for realizing the most basic crystal ingot stripping function.In the process of stripping the crystal ingot, the displacement mechanism drives the adaptive adsorption mechanism to move downward, so that the lower surface of the crystal ingot abuts against the upper surface of the vibration plate.If the upper surface of the vibration plate is flat, when the displacement mechanism drives the adaptive adsorption mechanism to press downward, the crystal ingot can be uniformly attached to the surface of the vibration plate, at this time, the support plate and the first adsorption member are in parallel, the position of the first adsorption member is adjusted through the displacement mechanism, so that the pressure on the crystal ingot is avoided to be too large, and flexible stripping can be realized.If the upper surface of the vibration plate is not flat, after the displacement mechanism drives the adaptive adsorption mechanism to press downward, since there is a gap between the inner wall of the guide channel and the outer wall of the guide rod, the first adsorption member can also be deflected relative to the support plate in the process of pressing downward, and the elastic member can drive the first adsorption member to push the crystal ingot, so that the crystal ingot can be uniformly attached to the surface of the vibration plate, and the crystal ingot can uniformly receive ultrasonic vibration.

[0027] The utility model discloses a technical scheme, in the face of uneven vibration plate, can realize the automatic adjustment of the position of the first adsorption member through the guide rod, guide channel and elastic member, so that the crystal ingot can be uniformly attached to the surface of the vibration plate, the crystal ingot can uniformly receive ultrasonic vibration, improve stripping effect, can more high qualityly strip the crystal ingot, and does not need to operate repeatedly to strip repeatedly, effectively improves the stripping efficiency of the crystal ingot. BRIEF DESCRIPTION OF DRAWINGS

[0028] In order to more clearly illustrate the technical solutions of the embodiments of the present application or the prior art, the drawings needed to be used in the description of the embodiments or the prior art will be briefly introduced as follows. Obviously, the drawings in the following description only constitute some embodiments of the present application, and other drawings can also be obtained according to the structures shown in the drawings without creative labor for those skilled in the art.

[0029] Figure 1 The structural schematic diagram of an embodiment of the crystal ingot stripping device provided by the present application is shown in the figure.

[0030] Figure 2 The structural schematic diagram of an embodiment of the self-adaptive adsorption mechanism provided by the present application is shown in the figure.

[0031] Figure 3 The internal structural schematic diagram of an embodiment of the self-adaptive adsorption mechanism provided by the present application is shown in the figure.

[0032] Figure 4 The distribution of the vibrator on the vibration plate provided by the present application is shown in the figure. Figure 1 ;

[0033] Figure 5 The distribution of the vibrator on the vibration plate provided by the present application is shown in the figure. Figure 2 ;

[0034] Figure 6 The distribution of the vibrator on the vibration plate provided by the present application is shown in the figure. Figure 3 ;

[0035] Figure 7 The distribution of the vibrator on the vibration plate provided by the present application is shown in the figure. Figure 4 ;

[0036] Figure 8 The structural schematic diagram of an embodiment of the vibration plate provided by the present application is shown in the figure.

[0037] Figure 9 The internal structural schematic diagram of an embodiment of the vibration plate provided by the present application is shown in the figure.

[0038] Figure 10 The movement path of the crystal ingot provided by the present application is shown in the figure. Figure 1 ;

[0039] Figure 11 The movement path of the crystal ingot provided by the present application is shown in the figure. Figure 2 ;

[0040] Figure 12 The side view of an embodiment of the separation mechanism provided by the present application is shown in the figure.

[0041] Figure 13The utility model provides a top view of the separation mechanism one embodiment.

[0042] Explanation of reference numerals:

[0043] 100, crystal ingot stripping device, 1, ultrasonic mechanism, 11, vibration plate, 12, vibrator, 13, working groove, 14, partition, 15, heat conducting piece, 16, heat dissipation pipe, 2, self-adaptive adsorption mechanism, 21, support plate, 22, guide rod, 221, limiting part, 23, elastic piece, 24, first suction accessory, 25, guide channel, 26, force sensor, 27, guide sleeve, 3, displacement mechanism, 4, separation mechanism, 41, second suction accessory, 42, limiting piece, 43, guide piece, 44, adsorption area, 5, crystal ingot, 6, wafer.

[0044] The utility model discloses the realization, functional characteristics and advantages will combine embodiment, refer to the further illustration of drawing. DETAILED DESCRIPTION

[0045] The technical solutions in the embodiments of the utility model will be clearly and completely described below with reference to the drawings in the embodiments of the utility model. Obviously, the described embodiments are only part of the embodiments of the utility model and not all the embodiments. Based on the embodiments in the utility model, all other embodiments obtained by those skilled in the art without creative labor belong to the protection scope of the utility model.

[0046] It should be noted that if the embodiments of the utility model involve directional indications (such as up, down, left, right, front, back, etc.), the directional indications are only used to explain the relative position relationship, movement condition, etc. between the components in a certain posture, and if the certain posture changes, the directional indications also change accordingly.

[0047] In addition, if the embodiments of the utility model involve descriptions of "first", "second", etc., the descriptions of "first", "second", etc. are only for description purposes and cannot be understood as indicating or implying the relative importance or implicitly indicating the number of the indicated technical features. Therefore, the features limited by "first" and "second" can explicitly or implicitly include at least one of the features. In addition, "and / or" or "and / or" appearing throughout the text means that the three parallel schemes are included, for example, "A and / or B" includes A scheme, or B scheme, or A and B simultaneously satisfy the scheme. In addition, the technical solutions of each embodiment can be combined with each other, but it must be based on the realization of ordinary skilled in the art, when the combination of technical solutions appears contradictory or unachievable, it should be considered that the combination of technical solutions does not exist, also not within the protection scope required by the utility model.

[0048] At present, the method for stripping the crystal ingot mainly comprises the following steps: firstly, laser modification is adopted, and then mechanical drawing or ultrasonic vibration is adopted to realize the stripping of the crystal ingot.

[0049] However, the mechanical drawing needs complex adhesive and degumming processes, and is difficult to realize automatic operation, and the crystal wafer is prone to be broken due to uneven stress in the drawing process.

[0050] In the process of ultrasonic separation, if the emitting surface of the ultrasonic device is smaller than the crystal ingot, the scanning operation needs to be increased, which is time-consuming and prone to cause local stress to be too large and cause the crystal wafer to be broken; therefore, the emitting surface of the ultrasonic device is generally set to be larger than the crystal ingot, but in this case, the flatness of the whole emitting surface is difficult to control, which affects the transmission of ultrasonic energy to the crystal ingot, and the crystal ingot is difficult to be separated in some areas, the stripping effect is poor, and the stripping efficiency is low.

[0051] In order to solve the above technical problems, the utility model provides a crystal ingot stripping device which can strip the crystal ingot more qualitatively and efficiently.

[0052] Please refer to Figures 1 to 13 In an embodiment of the utility model, the crystal ingot stripping device 100 comprises an ultrasonic mechanism 1, a self-adaptive adsorption mechanism 2 and a displacement mechanism 3.

[0053] Specifically, the ultrasonic mechanism 1 comprises an ultrasonic generator and a vibration plate 11, the ultrasonic generator is connected with the vibration plate 11 to drive the vibration plate 11 to produce ultrasonic vibration, so that the most basic crystal ingot 5 stripping function can be realized.

[0054] Please refer to Figures 1 to 3 The self-adaptive adsorption mechanism 2 comprises a support plate 21, a guide rod 22, an elastic piece 23 and a first adsorption accessory 24, the support plate 21 is provided with a guide channel 25, the guide rod 22 is movably connected with the guide channel 25, one end of the guide rod 22 is connected with the first adsorption accessory 24, the other end of the guide rod 22 is provided with a limiting portion 221 to limit the guide rod 22 from leaving the guide channel 25, there is a gap between the inner wall of the guide channel 25 and the outer wall of the guide rod 22, one end of the elastic piece 23 is connected with the first adsorption accessory 24, the other end of the elastic piece 23 is connected with the support plate 21, and the first adsorption accessory 24 is used for adsorbing the crystal ingot 5.

[0055] Further, the support plate 21 is rectangular as a whole, the support plate 21 is provided with four guide channels 25, the four guide channels 25 are arranged at four corners of the support plate 21, and the number of the guide rods 22 is also four, the four guide rods 22 are correspondingly arranged in the four guide channels 25, and the first adsorption accessory 24 can be more stably supported.

[0056] It can be understood that the number of the guide rods 22 can be adjusted according to actual conditions, which is not limited herein.

[0057] Further, one end of the guide rod 22 is fixed on the first suction accessory 24 by screw connection, and the other end of the guide rod 22 penetrates the guide channel 25 upward and is installed on the support plate 21 through the limiting part 221, specifically, the size of the limiting part 221 is larger than the size of the guide channel 25, so that the guide rod 22 can be prevented from being separated from the support plate 21.

[0058] In addition, the displacement mechanism 3 is connected with the adaptive suction mechanism 2 and can drive the adaptive suction mechanism 2 to move to the ultrasonic mechanism 1.

[0059] In an embodiment of the utility model, the first suction accessory 24 is a suction plate, a plurality of suction holes are arranged on the suction plate, the suction plate is connected with an external vacuum equipment, the vacuum equipment performs vacuumizing work, so that the crystal ingot 5 is adsorbed on the suction plate through the suction holes, and the adsorption effect is better.

[0060] In another embodiment of the utility model, the first suction accessory 24 includes a mounting plate and a vacuum chuck, the mounting plate is connected with the guide rod 22, the vacuum chuck is arranged on the mounting plate and is connected with an external vacuum equipment, the vacuum equipment performs vacuumizing work, so that the crystal ingot 5 is adsorbed on the suction plate through the vacuum chuck, and the adsorption function can also be realized.

[0061] In the technical scheme of the utility model, the adaptive suction mechanism 2 is used for adsorbing the crystal ingot 5, the displacement mechanism 3 is used for driving the crystal ingot 5 to move to the ultrasonic mechanism 1, and the ultrasonic mechanism 1 is used for realizing the most basic crystal ingot 5 stripping function.

[0062] If the upper surface of the vibration plate 11 is flat, when the displacement mechanism 3 drives the adaptive suction mechanism 2 to press downward, the crystal ingot 5 can be uniformly attached to the surface of the vibration plate 11, at this time, the support plate 21 and the first suction accessory 24 are in parallel state, the position of the first suction accessory 24 is adjusted through the displacement mechanism 3, the pressure on the crystal ingot 5 is avoided to be too large, and it is ensured that flexible stripping can be realized.

[0063] If the upper surface of the vibration plate 11 is not flat, after the displacement mechanism 3 drives the adaptive suction mechanism 2 to press downward, because there is a gap between the inner wall of the guide channel 25 and the outer wall of the guide rod 22, the first suction accessory 24 can also be deflected relative to the support plate 21 in the process of pressing downward, and the elastic member 23 can drive the first suction accessory 24 to push the crystal ingot 5, so that the crystal ingot 5 can be uniformly attached to the surface of the vibration plate 11 and can uniformly receive ultrasonic vibration.

[0064] The utility model discloses a technical scheme, in the face of uneven vibration plate 11, can realize the automatic adjustment of the position of first suction accessory 24 through guide rod 22, guide channel 25 and elastic part 23, thereby make crystal ingot 5 can evenly adhere on the surface of vibration plate 11, make crystal ingot 5 can evenly receive ultrasonic vibration, promote the peeling effect, can more high quality to crystal ingot 5 is peeled, and do not need multiple operations repeatedly peeling, effectively improved the peeling efficiency of crystal ingot 5.

[0065] In an embodiment of the utility model, please refer to Figure 3 The outer diameter of the self-limiting portion 221 of the guide rod 22 gradually decreases in the direction of the first suction accessory 24. Specifically, the guide rod 22 is generally cylindrical, the diameter of the upper end of the guide rod 22 is slightly larger than the diameter of the lower end, and the upper end of the guide rod 22 can closely fit the inner wall of the guide channel 25. There is a gap between the middle part of the guide rod 22 and the inner wall of the guide channel 25. If the upper surface of the vibration plate 11 is uneven, after the displacement mechanism 3 drives the self-adaptive suction mechanism 2 to press down, the first suction accessory 24 can also swing relative to the support plate 21 during the pressing process because there is a gap between the inner wall of the guide channel 25 and the outer wall of the guide rod 22. In addition, when peeling the crystal ingot 5 on the vibration plate 11 with a flat surface, the swinging of the guide rod 22 can also be minimized because the upper end of the guide rod 22 can closely fit the inner wall of the guide channel 25.

[0066] In an embodiment of the utility model, please refer to Figures 1 to 3 The self-adaptive suction mechanism 2 also includes a force sensor 26, which is arranged on the support plate 21, and the displacement mechanism 3 is connected to the force sensor 26. Specifically, when the displacement mechanism 3 drives the self-adaptive suction mechanism 2 to move downward, the force sensor 26 can detect the pressure on the support plate 21 in real time, thereby obtaining the pressure on the first suction accessory 24 and the pressure on the crystal ingot 5. According to the pressure detected by the force sensor 26, the position of the self-adaptive suction mechanism 2 can be adjusted by the displacement mechanism 3, that is, the positions of the first suction accessory 24 and the crystal ingot 5 can be adjusted, so as to avoid excessive pressure on the crystal ingot 5 and ensure flexible peeling and improve the quality of peeling the crystal ingot 5.

[0067] In an embodiment of the utility model, the force sensor 26 is a six-dimensional force sensor 26, which is a sensor capable of detecting six-dimensional forces (Fx, Fy, Fz, Mx, My, Mz) in space, and can more accurately detect the pressure on the crystal ingot 5. Specifically, when the six-dimensional force sensor 26 reaches a certain pressure value, which is about 2N to 20N, the ultrasonic peeling work is performed again, thereby achieving flexible peeling.

[0068] In another embodiment of the present application, the force sensor 26 can also use other types of sensors, such as strain sensors, piezoelectric sensors, capacitive sensors, piezoresistive sensors, etc.

[0069] In an embodiment of the present application, the elastic member 23 is a spring, the spring is sleeved on the guide rod 22, one end of the spring abuts against the first suction member 24, and the other end of the spring abuts against the support plate 21. Specifically, when the crystal ingot 5 is stripped, if the upper surface of the vibration plate 11 is uneven, after the displacement mechanism 3 drives the self-adaptive suction mechanism 2 to press down, since there is a gap between the inner wall of the guide channel 25 and the outer wall of the guide rod 22, the first suction member 24 can also be deflected relative to the support plate 21 during the pressing process, and the spring can drive the first suction member 24 to push the crystal ingot 5, so that the crystal ingot 5 can be uniformly attached to the surface of the vibration plate 11, and the crystal ingot 5 can uniformly receive ultrasonic vibration.

[0070] In another embodiment of the present application, the elastic member 23 can also be a rubber or a spring piece with elasticity.

[0071] In an embodiment of the present application, please refer to Figure 2 and Figure 3 The self-adaptive suction mechanism 2 further comprises a guide sleeve 27, the support plate 21 is provided with a mounting hole, the guide sleeve 27 is detachably connected to the mounting hole, and the inside of the guide sleeve 27 is provided with a guide channel 25. Specifically, the guide sleeve 27 is in a T-shaped structure as a whole, the guide sleeve 27 is inserted into the support plate 21 and is fixed to the support plate 21 through screws, and the guide rod 22 is movably connected to the guide channel 25 of the guide sleeve 27, and the guide sleeve 27 can be more conveniently disassembled by being arranged.

[0072] In an embodiment of the present application, please refer to Figure 1 The ultrasonic mechanism 1 further comprises a working groove 13, and the vibration plate 11 is arranged in the working groove 13, the working groove 13 contains ultrasonic liquid, and the liquid level of the ultrasonic liquid is 112mm to 10mm higher than the vibration plate 11, so that the ultrasonic stripping work can be better performed.

[0073] In an embodiment of the present application, the inside of the vibration plate 11 is provided with a plurality of vibrators 12, the plurality of vibrators 12 are regularly distributed in the inside of the vibration plate 11, and the distribution of the vibrators 12 can be changed according to different stripping requirements, so that the crystal ingot 5 can be stripped in high quality and high efficiency.

[0074] In an embodiment of the present application, please refer to Figure 4In the first direction, the plurality of vibrators 12 are arranged at intervals on the vibration plate 11 and form a vibrator group, and a plurality of vibrator groups are arranged at intervals on the vibration plate 11 along a second direction and are staggered, the second direction is perpendicular to the first direction, and the staggered arrangement can make the energy density of the vibration plate 11 reach the highest, and the area coverage of the crystal ingot 5 is the largest.

[0075] In an embodiment of the utility model, please refer to Figure 5 , the plurality of vibrators 12 are arranged in a matrix in the vibration plate 11, and the matrix arrangement can cover the vibrator 12 on the edge of the vibration plate 11, which facilitates the reinforcement of the emission surface of the vibrator 12 and makes it not easy to deform.

[0076] In an embodiment of the utility model, please refer to Figure 6 , the plurality of vibrators 12 are arranged in a radial manner from the center of the vibration plate 11 to the outside in the vibration plate 11, and the radial arrangement can make the outer circle of the wafer 6 of different sizes be at the emission center of the vibrator 12, and the adaptability is better.

[0077] In an embodiment of the utility model, please refer to Figure 7 , the plurality of vibrators 12 of the same power are arranged in a ring and form a vibrator 12 group, the plurality of vibrator 12 groups are arranged in a radial manner from the center of the vibration plate 11 to the outside, and the power of the adjacent two vibrator 12 groups is different, and through such combined arrangement, the crystal ingot 5 of different sizes can be subjected to ultrasonic on the vibrator 12 of different power, and the adaptability is better.

[0078] In an embodiment of the utility model, please refer to Figure 8 and Figure 9 , the ultrasonic mechanism 1 further comprises a partition plate 14, a heat conduction piece 15 and a heat dissipation pipe 16, the partition plate 14 is arranged in the interior of the vibration plate 11 and divides the interior of the vibration plate 11 into a first cavity and a second cavity, the vibrator 12 is arranged in the first cavity, one end of the heat conduction piece 15 is connected to the vibrator 12, the other end of the heat conduction piece 15 is inserted into the second cavity, and the heat dissipation pipe 16 is communicated with the second cavity. Specifically, the interior of the heat dissipation pipe 16 can be injected with flowing water, so as to be capable of performing water cooling heat dissipation work on the heat conduction piece 15, and the interior of the heat dissipation pipe 16 can also be injected with flowing air, so as to be capable of performing air cooling heat dissipation work on the heat conduction piece 15, that is, it can be used in water and directly used in a dry environment, and has a good heat dissipation function, which can help the vibrator 12 dissipate heat and also improve the ultrasonic energy transmission effect.

[0079] The heat dissipation pipe 16 is arranged to provide heat dissipation effect for the vibrator 12, and in an embodiment of the utility model, the frequency range of a single vibrator 12 used can be 40Khz-200Khz, and the power can be 20W-80W, and the efficiency is higher.

[0080] In an embodiment of the utility model, displacement mechanism 3 drives self -adaptation adsorption mechanism 2 moves in ultrasonic mechanism 1 along first direction, and reciprocating motion is carried out along second direction, and second direction is perpendicular with first direction, specifically, displacement mechanism 3 drives crystal ingot 5 to move through self -adaptation adsorption mechanism 2, and the movement path of crystal ingot 5 is as shown in Figure 10 , and crystal ingot 5 moves along a tortuous path, so that the vibrator 12 of the whole vibration plate 11 can be used to the maximum extent, and the crystal ingot 5 can be moved by the vibrator 12 of the whole vibration plate 11.

[0081] In another embodiment of the utility model, displacement mechanism 3 drives self -adaptation adsorption mechanism 2 to carry out circumferential motion in ultrasonic mechanism 1, specifically, displacement mechanism 3 drives crystal ingot 5 to move through self -adaptation adsorption mechanism 2, and the movement path of crystal ingot 5 is as shown in Figure 11 , and through circumferential motion, the whole crystal ingot 5 can be uniformly subjected to the action of the vibrator 12.

[0082] In an embodiment of the utility model, please refer to Figure 10 And Figure 11 , displacement mechanism 3 drives self -adaptation adsorption mechanism 2 to move in ultrasonic mechanism 1, and simultaneously drives self -adaptation adsorption mechanism 2 to rotate, specifically, displacement mechanism 3 drives crystal ingot 5 to move along a certain path through self -adaptation adsorption mechanism 2, and simultaneously, self -adaptation adsorption mechanism 2 will be driven to rotate, that is, drives crystal ingot 5 to rotate, so that the whole crystal ingot 5 can be uniformly subjected to the action of the vibrator 12.

[0083] In an embodiment of the utility model, after an ultrasonic cycle, whether wafer 6 on crystal ingot 5 is successfully peeled off can be detected by visual camera, and the detection effect is better.

[0084] Specifically, if wafer 6 is successfully peeled off after an ultrasonic cycle, other mechanisms can be used to take away wafer 6, and if wafer 6 is not successfully peeled off after an ultrasonic cycle, it is necessary to carry out the peeling work of an ultrasonic cycle again.

[0085] In an embodiment of the utility model, please refer to Figure 12 And Figure 13 , the crystal ingot peeling device 100 further comprises a separation mechanism 4, and the separation mechanism 4 comprises a second suction member 41 for adsorbing wafer 6, specifically, sometimes wafer 6 is successfully peeled off, but will adhere to the lower surface of crystal ingot 5 due to water, therefore, the separation mechanism 4 is needed to separate the two, displacement mechanism 3 drives self -adaptation adsorption mechanism 2 to drive crystal ingot 5 to move to second suction member 41, second suction member 41 adsorbs wafer 6, first suction member 24 adsorbs crystal ingot 5, displacement mechanism 3 drives self -adaptation adsorption mechanism 2 to move horizontally, and the two are separated through the side pulling mode, and the separation effect is better.

[0086] In the embodiment of the utility model, the second suction accessory 41 is a suction plate, a plurality of suction holes are arranged on the suction plate, the suction plate is connected with the vacuum equipment outside, the vacuum equipment performs vacuumizing work, thereby the wafer 6 is adsorbed on the suction plate through the suction holes, and the adsorption effect is better.

[0087] In another embodiment of the utility model, the second suction accessory 41 includes a mounting plate and a vacuum chuck, the vacuum chuck is arranged on the mounting plate and is connected with the vacuum equipment outside, the vacuum equipment performs vacuumizing work, thereby the wafer 6 is adsorbed on the suction plate through the vacuum chuck, and the adsorption function can also be realized.

[0088] In the embodiment of the utility model, please refer to Figure 12 And Figure 13 The separation mechanism 4 further includes a limiting piece 42 and two guide pieces 43, which are arranged on the second suction accessory 41, the second suction accessory 41 is provided with a suction area 44, the two guide pieces 43 are arranged on the two sides of the suction area 44 and form guide grooves, the limiting piece 42 is arranged on one side of the suction area 44, the wafer 6 can enter the suction area 44 along the guide grooves and abut against the limiting piece 42. Specifically, the guide piece 43 is bent, and is bent towards the outside of the suction area 44, the displacement mechanism 3 drives the self-adaptive adsorption mechanism 2 to drive the crystal ingot 5 to move along the guide piece 43 to the suction area 44 and can abut against the limiting piece 42, the guide piece 43 and the limiting piece 42 can make the crystal ingot 5 and the wafer 6 move to the suction area 44, and are concentric as far as possible, and are easier to separate.

[0089] The above-mentioned is only the exemplary implementation of the utility model, and does not limit the patent range of the utility model, and the equivalent structure transformation made by using the utility model specification and the drawings contents, or direct / indirect application in other related technical fields are included in the patent protection range of the utility model.

Claims

1. A crystal ingot stripping device, characterized in that, include: An ultrasonic mechanism, comprising an ultrasonic generator and a vibrating plate, wherein the ultrasonic generator is connected to the vibrating plate to drive the vibrating plate to generate ultrasonic vibrations; An adaptive adsorption mechanism includes a support plate, a guide rod, an elastic element, and a first adsorption element. The support plate has a guide channel, and the guide rod is movably connected to the guide channel. One end of the guide rod is connected to the first adsorption element, and the other end of the guide rod has a limiting part to restrict the guide rod from leaving the guide channel. There is a gap between the inner wall of the guide channel and the outer wall of the guide rod. One end of the elastic element is connected to the first adsorption element, and the other end of the elastic element is connected to the support plate. The first adsorption element is used to adsorb crystal ingots. as well as A displacement mechanism is provided, which is connected to the adaptive adsorption mechanism and can drive the adaptive adsorption mechanism to move to the ultrasonic mechanism.

2. The ingot stripping device as described in claim 1, characterized in that, The outer diameter of the guide rod gradually decreases from the limiting part toward the first adsorption element.

3. The ingot stripping apparatus as described in claim 1, characterized in that, The adaptive adsorption mechanism also includes a force sensor, which is disposed on the support plate, and the displacement mechanism is connected to the force sensor.

4. The ingot stripping apparatus as described in claim 3, characterized in that, The force sensor is a six-dimensional force sensor; And / or, the elastic element is a spring, the spring is sleeved on the guide rod, one end of the spring abuts against the first adsorption element, and the other end of the spring abuts against the support plate; And / or, the adaptive adsorption mechanism further includes a guide sleeve, the support plate is provided with a mounting hole, the guide sleeve is detachably connected to the mounting hole, and the guide sleeve is provided with a guide channel inside.

5. The ingot stripping apparatus according to any one of claims 1 to 4, characterized in that, The vibrating plate has multiple vibrators inside, and the multiple vibrators are distributed inside the vibrating plate in a regular manner; In the first direction, a plurality of the oscillators are spaced apart on the vibrating plate to form an oscillator group, and a plurality of the oscillator groups are spaced apart on the vibrating plate along the second direction and are arranged in a staggered manner, wherein the second direction is perpendicular to the first direction; Alternatively, multiple oscillators may be arranged in a matrix within the vibrating plate; Alternatively, multiple oscillators are arranged radially outward from the center of the vibrating plate within the vibrating plate; Alternatively, multiple oscillators of the same power are arranged in a ring to form an oscillator group, and the multiple oscillator groups are arranged radially outward from the center of the vibrating plate, with adjacent oscillator groups having different power.

6. The ingot stripping apparatus as described in claim 5, characterized in that, The ultrasonic mechanism further includes a partition, a heat-conducting component, and a heat dissipation pipe. The partition is located inside the vibrating plate and divides the inside of the vibrating plate into a first cavity and a second cavity. The vibrator is located in the first cavity. One end of the heat-conducting component is connected to the vibrator, and the other end of the heat-conducting component is inserted into the second cavity. The heat dissipation pipe is connected to the second cavity.

7. The ingot stripping apparatus according to any one of claims 1 to 4, characterized in that, The displacement mechanism drives the adaptive adsorption mechanism to move in the ultrasonic mechanism along a first direction and reciprocate along a second direction, the second direction being perpendicular to the first direction; Alternatively, the displacement mechanism drives the adaptive adsorption mechanism to perform circular motion within the ultrasonic mechanism.

8. The ingot stripping apparatus according to any one of claims 1 to 4, characterized in that, The displacement mechanism drives the adaptive adsorption mechanism to move within the ultrasonic mechanism, and simultaneously drives the adaptive adsorption mechanism to rotate.

9. The ingot stripping apparatus according to any one of claims 1 to 4, characterized in that, The ingot stripping device further includes a separation mechanism, which includes a second adsorption element for adsorbing wafers.

10. The ingot stripping apparatus as described in claim 9, characterized in that, The separation mechanism further includes a limiting member and two guide members, both disposed on the second adsorption member. The second adsorption member has an adsorption area, and the two guide members are respectively disposed on both sides of the adsorption area to form a guide groove. The limiting member is disposed on one side of the adsorption area. The wafer can enter the adsorption area along the guide groove and abut against the limiting member.

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