Supporting device and supporting assembly

Abstract

The embodiment of the utility model provides a supporting device and a supporting assembly, the supporting device is used for supporting a wafer cut from a crystal bar, the supporting device comprises an adsorption device, the adsorption device is provided with an adsorption area which is round on the whole and is used for adsorbing one main surface of the wafer to be cut from the crystal bar; and the bracket is used for fixedly supporting the adsorption device. The supporting device can provide stable supporting in the process of cutting the wafer from the crystal bar so as to ensure that the wafer is kept in situ in the cutting process, and therefore the wafer which is uniform in thickness and complete is obtained. In addition, the supporting device can still provide support after the wafer is separated from the crystal bar, so that the wafer is prevented from being damaged due to falling or slipping, and the processing reliability and the yield are improved.

Description

TECHNICAL FIELD

[0001] The utility model relates to the field of semiconductor manufacturing, especially support device and support assembly. BACKGROUND

[0002] Wafer is an important basic material in the semiconductor industry, and is widely used in the manufacture of integrated circuits, power devices and optoelectronic devices. The wafer is usually obtained by cutting a crystal bar. Because different parts of the crystal bar may have differences in composition, structure or crystal defects, before cutting the wafer, the crystal bar usually needs to be cut off first to divide it into multiple crystal bar segments for classification and use and to optimize the subsequent processing process. The cut-off crystal bar segment can not only be used for wafer production, but also can be used for material performance detection to ensure the quality stability of the subsequent process.

[0003] At present, the crystal bar is mainly cut to obtain the crystal bar segment and the wafer by using the wire cutting technology. The wire cutting is a precision machining method, and its basic principle is to fix the crystal bar and cut it along the diameter direction of the crystal bar through the high-speed reciprocating movement of the cutting wire, so as to obtain the crystal bar segment or the wafer. This technology is suitable for machining of single crystal materials with large diameter and high hardness, and can ensure the cutting precision and surface quality to a large extent. Therefore, the wire cutting process has become one of the widely used machining methods in semiconductor manufacturing.

[0004] However, there are still some problems in the process of cutting the wafer from the crystal bar by using the wire cutting technology. For example, the cut wafer may have defects such as uneven thickness and edge cracking, and the wear of the cutting wire and the wafer is serious during the cutting process. In addition, because the wafer lacks effective fixing measures after cutting, it is easy to be damaged due to falling. Therefore, how to optimize the wire cutting process and improve the quality and processing stability of the wafer is one of the important technical problems to be solved at present. UTILITY MODEL CONTENTS

[0005] To solve the above technical problems, the utility model embodiment expects to provide a support device and a support assembly. The support device can provide stable support during the process of cutting the wafer from the crystal bar, so as to ensure that the wafer remains in place during the cutting process, thereby obtaining a wafer with uniform thickness and integrity. In addition, the support device can still provide support after the wafer is separated from the crystal bar, preventing the wafer from being damaged due to falling or sliding, and improving the processing reliability and yield.

[0006] The technical scheme of the utility model is as follows:

[0007] In a first aspect, the utility model embodiment provides a support device for supporting a wafer cut from a crystal bar, the support device comprising:

[0008] An adsorption device having an overall circular adsorption area for adsorbing a main surface of a wafer to be cut from a crystal bar;

[0009] A support for fixedly supporting the adsorption device.

[0010] In some optional examples, the adsorption device comprises a plurality of adsorption ports, the adsorption area is formed by arrangement of the plurality of adsorption ports, and the adsorption area is arranged in a plurality of concentric annular shapes.

[0011] In some optional examples, the plurality of adsorption ports are arranged to be capable of independently applying adsorption force to the wafer.

[0012] In some optional examples, a position of the adsorption device in a vertical direction relative to the support is adjustable.

[0013] In some optional examples, the support comprises a guide rail arranged in the vertical direction and a locking member, wherein the adsorption device is arranged to be capable of sliding along the guide rail, and the locking member is used to lock the adsorption device at any position in the guide rail.

[0014] In some optional examples, the adsorption device is arranged on the support in a detachable manner.

[0015] In some optional examples, the adsorption device is in communication with a vacuum device.

[0016] In a second aspect, the embodiments of the utility model provide a support assembly, the support assembly comprises:

[0017] The support device according to the first aspect;

[0018] A carrying table for carrying a crystal bar.

[0019] In some optional examples, the carrying table is used to carry the crystal bar in a horizontal direction and is capable of lifting in a vertical direction.

[0020] In some optional examples, a part of the carrying table for contacting a circumferential surface of the crystal bar has a shape partially conforming to the circumferential surface of the crystal bar.

[0021] The embodiment of the utility model provides a support device and support assembly. The support device includes adsorption device and support. Adsorption device can form stable connection with wafer through adsorbing exposed main surface of wafer to be cut from crystal bar, and can be fixedly connected to support to provide support to wafer during cutting and after cutting. Through the structure, the support device can not only maintain the stability of the wafer during cutting, prevent swinging or displacement caused by cutting force, ensure cutting precision and obtain wafer with uniform thickness and integrity, but also can continue to support the wafer after the wafer is separated from the crystal bar, avoid damage caused by falling or sliding. BRIEF DESCRIPTION OF DRAWINGS

[0022] Figure 1 It is a schematic view of crystal bar.

[0023] Figure 2 It is a schematic view of truncated crystal bar and wafer.

[0024] Figure 3 It is a schematic view of conventional wire cutting equipment.

[0025] Figure 4 It is a schematic view of support device provided by the embodiment of the utility model.

[0026] Figure 5 It is a front view of support device provided by the embodiment of the utility model.

[0027] Figure 6 It is a partial enlarged view of support device. Figure 5

[0028] Figure 7 It is a rear view of support device provided by the embodiment of the utility model.

[0029] Figure 8 It is a side view of support device provided by the embodiment of the utility model.

[0030] Figure 9 It is a schematic view of support assembly provided by the embodiment of the utility model.

[0031] Figure 10 It is a schematic view of part of support assembly provided by the embodiment of the utility model. DETAILED DESCRIPTION

[0032] The technical scheme in the embodiment of the utility model will be described clearly and completely in combination with the drawings in the embodiment of the utility model.

[0033] The embodiments of the utility model will be described in detail in combination with the drawings.

[0034] Figure 1 ​A conventional crystal bar S is shown, which is generally cylindrical in shape and can be divided into a head portion S1 and a tail portion S2 at two ends along the axial direction, and an equal-diameter portion S3 between the two. The head portion S1 and the tail portion S2 are generally conical in shape, while the equal-diameter portion S3 is substantially cylindrical in shape. The crystal quality, doping concentration and crystal defect distribution of the three portions can be different, and even within the equal-diameter portion S3, the characteristics of different axial positions can also be different. Since different portions of the crystal bar are suitable for different application scenarios, and the overall crystal bar S is large in size, it is not conducive to directly process wafers, so it is usually necessary to first divide the crystal bar S into multiple crystal bar segments during production, and then cut wafers W from each crystal bar segment, as shown in Figure 2 In addition, in order to evaluate the material properties of the crystal bar segment, a wafer W is usually cut from the crystal bar segment as a sample, and the physical, electrical and chemical properties of the wafer W are tested to infer the overall performance of the crystal bar segment, thereby guiding subsequent processing and application.

[0035] At present, wire cutting technology has been widely used in the processing of crystal bars. As shown in Figure 3 A wire cutting device 100 can include a cutting wire 101 and a wire spool 102 for supporting and driving the movement of the cutting wire 101. The cutting wire 101 is wound on the wire spool 102 in turn, and approaches the crystal bar or the crystal bar segment while feeding along the diameter direction of the crystal bar or the crystal bar segment at a high speed reciprocating along its extension direction, until it is completely cut through, thereby obtaining a crystal bar segment or a wafer. The wire cutting device 100 can also include a carrying table 103 for supporting and fixing the crystal bar S, so that the crystal bar S remains in a stable and horizontal placement state. During the cutting process, the carrying table 103 not only supports the crystal bar S, but also continues to support the crystal bar segment or the wafer after the cutting is completed to prevent it from falling accidentally.

[0036] Although the above-mentioned wire cutting device 100 can provide necessary support for the crystal bar during the cutting process, there is still a further support requirement for the crystal bar segment or the wafer, especially the wafer, which has been cut down. Specifically, when the cutting wire 101 cuts the wafer W from the crystal bar S, due to the low thickness and rigidity of the wafer W, it can not effectively resist the cutting force exerted by the cutting wire 101, and thus can swing during the cutting process. This swing can cause the cutting trajectory to deviate, thereby affecting the cutting accuracy, and in some cases, can cause the wafer that is being cut halfway to break. In addition, the wafer W after cutting can not be able to stand stably on the carrying table 103 due to its small thickness, but will be tilted on the carrying table 103, and even can slide off the carrying table 103. This tilting or sliding not only can cause damage to the wafer, but also can affect the subsequent wafer transfer and processing flow. Therefore, in the existing wire cutting device, how to provide more stable support during the cutting process and prevent the wafer from falling and being damaged is still a key problem that needs to be further optimized.

[0037] To solve the above problems, the embodiments of the utility model provide support device and support assembly, this support device can provide stable support in the process of cutting wafer from crystal bar, ensure that wafer keeps in position in the cutting process, obtain the wafer of uniform thickness and integrity. In addition, the support device can still provide support after the wafer is separated from the crystal bar, prevent the wafer from being damaged due to falling or sliding, improve the processing reliability and yield.

[0038] Specifically, refer to Figure 4 , it shows the support device 1 provided by some embodiments of the utility model. The support device 1 can be used to support wafer W in the process of cutting wafer W from crystal bar S (as shown by the dotted line in Figure 4 ), and the support device 1 can include suction device 11 and support 12. Refer to Figure 5 , suction device 11 can have a suction area that is overall circular, for adsorbing the exposed main surface of wafer. The support 12 can be used to fixedly support the suction device.

[0039] It can be understood that each wafer W includes two opposite main surfaces. The main surface of wafer generally refers to the main working surface for subsequent processing, manufacturing or application. Generally, in the cutting process of wafer, as shown in Figure 4 , one end of crystal bar S is cut to form wafer W, so the end face of the end part constitutes one main surface W1 of wafer W to be cut, and the main surface W1 has been exposed before the cutting operation is performed.

[0040] The suction device 11 forms a stable connection with wafer W by exerting suction force on the exposed main surface W1 of wafer W, thereby providing support. The suction area of suction device 11 can partially cover or completely cover the main surface W1 to reduce the impact on the wafer surface while providing sufficient support force. By adopting a circular suction area and aligning its center with the center of main surface W1 of wafer W, it can ensure that the suction force is evenly distributed, avoiding wafer warping or deformation caused by uneven support, thereby further improving cutting accuracy.

[0041] The support 12 can be fixedly connected to the adsorption device 11 and provide stable support to the wafer W through the adsorption device 11. During the cutting process, the adsorption force of the adsorption device 11 can provide additional fixation, so that the wafer W can always remain stable during the cutting process, thereby reducing the swing or displacement caused by the cutting force. Compared with the fixation mode relying only on the wafer S itself, the support device 1 provided by the utility model can significantly improve the stability of the cutting process, reduce the thickness error of the wafer W caused by uneven stress, and reduce the risk of breakage, thereby ensuring the cutting precision. In addition, after the wafer W is completely cut from the wafer S, the adsorption device 11 can still adsorb the wafer W, thereby preventing the wafer from falling due to gravity, and reducing the risk of damage to the wafer caused by falling.

[0042] Further, since the adsorption device 11 adsorbs the surface of the wafer which is originally exposed and does not interfere with the cutting operation, the adsorption device 11 can be connected to the wafer before the cutting starts and continue to adsorb after the cutting ends. This design not only ensures the stability of the entire cutting process, but also enables the wafer after cutting to be kept on the support device 1 in a stable manner, facilitating subsequent processing, detection or transportation. Especially in the case of multiple cutting or surface treatment of the wafer, the continuous support of the support device 1 can effectively reduce human intervention, improve the degree of automation, and reduce the risk of damage during processing.

[0043] Some embodiments of the utility model provide a support device 1, which comprises an adsorption device 11 and a support 12. The adsorption device 11 can form a stable connection with the wafer W by adsorbing the exposed main surface W1 of the wafer W to be cut from the wafer S, and can be fixedly connected to the support 12 to continuously support the wafer W during the cutting process and after the cutting is completed. Through this structure, the support device 1 can not only maintain the stability of the wafer W during the cutting process, prevent swing or displacement caused by the cutting force, and thus ensure the cutting precision and obtain a wafer with uniform and complete thickness, but also can continue to support the wafer W after the wafer W is separated from the wafer S, thereby avoiding damage caused by falling or sliding.

[0044] In some embodiments of the utility model, referring to Figure 5 , the adsorption device 11 can comprise a plurality of adsorption ports 110. The plurality of adsorption ports 110 are arranged to form an adsorption area, and the adsorption area is arranged in a plurality of concentric annular shapes, i.e. composed of a plurality of adsorption rings, and the adsorption ports 110 in each adsorption ring are uniformly distributed along the circumferential direction. Compared with the random distribution or single annular adsorption mode, this arrangement can more evenly distribute the adsorption force, so that the adsorption device 11 can more stably adsorb the wafer W, thereby preventing the wafer from warping, swinging or displacing due to insufficient local adsorption force, and thus improving the cutting precision.

[0045] Although the suction port 110 is circular in the example, the shape thereof is not limited thereto. For example, the suction port 110 can be polygonal in structure to adapt to different process requirements. In addition, referring to Figure 6 , a flexible material ring 110A, such as a rubber ring, can be arranged around the suction port 110. When the suction device 11 suctions the wafer W, the flexible material ring can be in direct contact with the wafer W, on the one hand, to play a buffering role and prevent the suction device 11 from causing damage to the wafer W due to direct contact, and on the other hand, to improve the sealing performance and ensure that the suction device 11 forms a stable sealed connection with the wafer W, thereby improving the efficiency of negative pressure suction.

[0046] In some embodiments of the present application, referring to Figure 4 and Figure 5 , the suction device 11, especially the suction port 110, can be in communication with the vacuumizing device C to provide a negative pressure suction force to enable the wafer W to be stably attached to the surface of the suction device 11.

[0047] In other embodiments of the present application, the plurality of suction ports 110 are arranged to be able to independently apply a suction force to the wafer. That is, the plurality of suction ports 110 can be independently controlled, that is, some or all of the suction ports 110 can be selectively enabled, and each suction port 110 can provide the same or different size of suction force. For example, when suctioning wafers W of different sizes, the corresponding suction rings can be selectively enabled. Specifically, for wafers W of larger diameters, the outer suction rings can be enabled, while for wafers W of smaller diameters, only the inner suction rings can be used, thereby improving the adaptability of the suction device 11 to be compatible with wafers of different specifications, while reducing unnecessary energy consumption and improving the efficiency of the equipment operation.

[0048] Further, through the multi-ring suction structure, the stress state of the wafer W during the cutting process can be optimized. During the online cutting process, the wafer W can be offset due to gravity, cutting force or external force, especially when the cutting is about to be completed, the connection between the wafer W and the crystal bar S is only a small part, at this time, it is easy to fall off or shift due to lack of effective support. By uniformly distributing the suction force in different radius ranges, the multi-ring suction structure can ensure that the wafer W remains stably attached during the entire cutting process, avoiding abnormal movement or damage due to uneven stress, thereby improving the cutting precision and processing stability.

[0049] In addition, the adsorption method can also reduce the impact on the wafer W surface. Since the adsorption area is composed of a plurality of discrete adsorption ports 110, rather than a continuous closed adsorption surface, during the adsorption process, the uniform distribution of air flow can reduce the local vacuum pressure difference, thereby reducing the risk of wafer W surface deformation or micro-cracks caused by excessive adsorption force, improving processing precision and product yield. At the same time, in terms of adsorption force control, the adsorption force distribution can be optimized according to the wafer material, thickness and surface characteristics to ensure the integrity and stability of the wafer during cutting and subsequent processing.

[0050] In some embodiments of the present application, the position of the adsorption device 11 relative to the support 12 in the vertical direction is adjustable to accommodate different diameters of the crystal bar S, improving the applicability of the support device 1.

[0051] In some embodiments of the present application, the vertical position of the adsorption device 11 is adjustable to accommodate different application requirements. Referring to Figure 4 In the case of horizontally placed crystal bar S, the height of the adsorption device 11 can be adjusted in the vertical direction to align the center with the ideal adsorption position on the axial end surface of the crystal bar S, i.e. with the ideal adsorption position on the main surface W1 of the wafer W to be cut from the crystal bar S. Such an adjustment mechanism ensures that the adsorption device 11 is always in the best support position, improving the adsorption stability of the wafer W, thereby optimizing the cutting effect.

[0052] The vertical adjustment of the adsorption device 11 can be achieved by a mechanical adjustment mechanism, such as a lead screw mechanism, a threaded lifting mechanism or a sliding rail mechanism, etc. Specifically, in some embodiments of the present application, referring to Figure 7 and Figure 8 The support 12 can include a guide rail 121 extending in the vertical direction and a locking member 122, wherein the adsorption device 11 is arranged to be slidable along the guide rail 121, and the locking member 122 is used to lock the adsorption device 11 at any position in the guide rail 121.

[0053] Specifically, the support 12 can include a guide rail 121 in the form of a through slot. The guide rail 121 extends in the vertical direction and is opposite to the axial end surface to be cut of the horizontally placed crystal bar S. The adsorption device 11 is generally disc-shaped, and one axial end portion 11A thereof can be inserted from one side of the guide rail 121 and extended from the other side, thereby ensuring the adjustability of the adsorption device 11 in the vertical direction. The arrangement of the guide rail 121 limits the movement of the adsorption device 11 to the vertical direction, thereby preventing unnecessary displacement and ensuring accurate alignment of the adsorption position of the wafer W.

[0054] The locking member 122 can adopt a threaded locking structure, such as a locking nut. The locking member 122 can be threadedly connected to the axial end 11A of the adsorption device 11, and after the adsorption device 11 is adjusted to the target height, the locking member 122 is rotated to abut against the support 12, thereby stably fixing the adsorption device 11 at the current position of the guide rail 121. When a crystal bar S of a different diameter needs to be processed, the operator can loosen the locking member 122, adjust the adsorption device 11 to the appropriate height, and then lock it again to ensure that it is accurately aligned with the axial end face of the crystal bar S. This adjustability improves the applicability of the support device 1, enabling it to be compatible with different sizes of workpieces without the need to replace the adsorption device 11 or the support 12.

[0055] Referring to Figure 4 By vertically adjusting the adsorption device 11, it can be ensured that the adsorption device 11 is always correctly aligned with the main surface W1 of the wafer W to be cut and provides stable adsorption support regardless of the diameter of the crystal bar S. This not only avoids insufficient adsorption or uneven support due to height errors, but also ensures that the wafer W is in a stable state during cutting, avoiding slight vibrations or shifts due to cutting forces, thereby improving cutting accuracy and ensuring that the cut wafer W is uniform in thickness and complete in surface.

[0056] Further, the vertical adjustment of the adsorption device 11 can optimize the stress state during cutting, especially when the cutting is almost complete, the wafer W may be displaced or tilted due to its own weight or external forces. By accurately adjusting the height of the adsorption device 11 to always align with the main surface W1 of the wafer W during the entire cutting process, the slight vibrations or shifts of the wafer W during cutting can be effectively reduced.

[0057] In some embodiments of the present application, the adsorption device 11 is detachably mounted on the support 12 to improve the flexibility of the equipment and facilitate disassembly, replacement or maintenance. For example, when the adsorption area of the adsorption device 11 cannot match the radial size of the current crystal bar S to be cut, or the adsorption device 11 cannot work normally due to wear or failure, the entire support 12 does not need to be replaced, but only the adsorption device 11 is disassembled and replaced, so that the support device 1 can quickly recover to the working state, improving the adaptability and production efficiency of the equipment.

[0058] Specifically, the detachability of the adsorption device 11 can be achieved through various connection methods, such as threaded connection, quick-release buckle, magnetic connection, or slot installation, etc. In some embodiments, as shown in the foregoing embodiments, the support 12 can include vertical guide rails 121, and the axial end 11A of the adsorption device 11 can be inserted along the guide rails 121 and fixed at the target position. When it is necessary to replace or maintain the adsorption device 11, the locking member 122 can be loosened, for example, unscrewed, and then the adsorption device 11 can be moved to separate it from the support 12, thereby completing the disassembly operation. When installing a new adsorption device 11, it can be reinserted into the guide rails 121 and fixed at the target height by using the locking member 122, so that it is aligned with the axial end surface of the crystal bar S.

[0059] The advantages brought by such a detachable design not only lie in the flexible adaptation to crystal bars S of different diameters, but also in the optimization of the maintenance and cleaning process of the equipment. In the long-term use process, the adsorption port 110 of the adsorption device 11 may be affected by the accumulation of dust, cutting debris or other small particles, thereby affecting the adsorption effect. The detachable structure enables the operator to easily remove the adsorption device 11 for cleaning and inspection, ensures stable adsorption performance, and prolongs the service life of the equipment. In addition, if the adsorption device 11 needs to be replaced due to wear or damage, the operator can directly install a new adsorption device 11 without replacing the entire support 12, thereby reducing maintenance costs and improving the long-term stable operation ability of the equipment.

[0060] Referring to Figure 9 Some embodiments of the utility model also provide a support assembly 2. The support assembly can include the foregoing support device 1 and a carrying table 3 for carrying the crystal bar. The carrying table 3 can be used to support the crystal bar S in the horizontal direction and can be lifted in the vertical direction to adapt to crystal bars S of different diameters and optimize the position adjustment of the crystal bar S in the cutting process.

[0061] Specifically, the carrying table 3 can be used to stably support the horizontally placed crystal bar S, ensuring that it does not displace or tilt unnecessarily during the cutting process, thereby improving the cutting precision. In addition, in order to adapt to crystal bars S of different sizes, the carrying table 3 can be designed as a liftable structure, so that it can be adjusted to an appropriate height according to the diameter of the crystal bar S, so that the crystal bar S is located within the predetermined cutting path range in the radial direction, thereby ensuring that the crystal bar S can be cut through in the diameter direction and complete wafers can be cut from it.

[0062] The lifting of the carrying table 3 can be achieved in various ways, such as screw lifting mechanism, hydraulic lifting mechanism or pneumatic lifting mechanism, etc. In some embodiments of the utility model, referring to Figure 9The bearing table 3 can include a bearing part 31 in direct contact with the crystal bar S and a supporting leg 32 for supporting the bearing part 31 from below. The crystal bar S can be placed on the upper surface of the bearing part 31 in a manner that the central axis is in the horizontal direction. The supporting leg 32 can have a telescopic structure so that its length is adjustable to support the bearing part 31 at different heights. By adjusting the length of the supporting leg 32, crystal bars S of different diameters can be flexibly adapted so that they are always in the appropriate cutting position.

[0063] Further, the height adjustment also enables the adsorption device 11 to accurately align the main surface W1 of the wafer W to be cut and provides stable adsorption support, avoiding the wafer W from shaking or falling off during the cutting process due to deviation of the adsorption position, and ensuring the stability of the cutting quality.

[0064] In some embodiments of the present application, the part of the bearing table 3 for contacting the peripheral surface of the crystal bar S can have a shape partially fitting the outer peripheral surface of the crystal bar S. For example, referring to Figure 10 The upper surface of the bearing part 31 can be designed as a concave arc shape with a radius matching the outer peripheral surface of the crystal bar S, so that the crystal bar S can be placed more stably on the bearing table 3. This structure not only improves the support stability of the crystal bar S during the cutting process, preventing it from deviating or vibrating due to uneven force or external disturbance, but also effectively limits the rolling of the crystal bar S, further reducing the risk of damage due to accidental falling.

[0065] In order to further reduce the mechanical damage to the crystal bar S during the bearing process, the surface of the bearing part 31 in contact with the crystal bar S can also be covered with a layer of flexible buffer material, such as a nylon or rubber layer. This buffer layer can effectively reduce the direct contact stress between the crystal bar S and the bearing part 31, avoiding damage to the surface of the crystal bar S due to excessive support or clamping force, and also reducing the cutting error caused by slight vibration during the cutting process.

[0066] It should be noted that the technical solutions described in the embodiments of the present application can be combined arbitrarily without conflict.

[0067] The above is only a specific implementation of the present application, but the protection scope of the present application is not limited thereto. Any person skilled in the art can easily think of changes or replacements within the technical range disclosed by the present application, which should be covered within the protection scope of the present application. Therefore, the protection scope of the present application should be subject to the protection scope of the claims.

Claims

1. A support device for supporting a wafer cut from a crystal ingot, characterized in that, The support device includes: An adsorption device having an overall circular adsorption area for adsorbing a main surface of a wafer to be cut from the crystal rod; A support frame is used to securely support the adsorption device.

2. The support device according to claim 1, characterized in that, The adsorption device includes multiple adsorption ports, the adsorption area is formed by arranging the multiple adsorption ports, and the adsorption area is arranged in multiple concentric rings.

3. The support device according to claim 2, characterized in that, The plurality of adsorption ports are configured to apply adsorption force to the wafer independently of each other.

4. The support device according to claim 1, characterized in that, The vertical position of the adsorption device relative to the support is adjustable.

5. The support device according to claim 4, characterized in that, The bracket includes a guide rail and a locking element arranged along the vertical direction, wherein the adsorption device is configured to slide along the guide rail, and the locking element is used to lock the adsorption device at any position in the guide rail.

6. The support device according to claim 4, characterized in that, The adsorption device is detachably mounted on the support.

7. The support device according to any one of claims 1 to 6, characterized in that, The adsorption device is connected to the vacuum pumping device.

8. A support component, characterized in that, The support components include: The support device according to any one of claims 1 to 7; A support platform used to support crystal rods.

9. The support component according to claim 8, characterized in that, The support platform is used to support the crystal rod in the horizontal direction and can be raised and lowered in the vertical direction.

10. The support component according to claim 8, characterized in that, The portion of the support stage that contacts the circumferential surface of the crystal rod has a shape that partially conforms to the circumferential surface of the crystal rod.

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