LED light source, backlight module and electronic equipment

Abstract

The utility model relates to the field of LEDs, and provides an LED light source, a backlight module and electronic equipment, the LED light source comprises a substrate, a light-emitting light source and a transparent shell, the substrate is provided with a light-emitting circuit, the light-emitting light source is arranged above the substrate and electrically connected with the light-emitting circuit, the transparent shell is connected to the substrate and covers the light-emitting light source, hollow microspheres are arranged in the transparent shell, and the hollow microspheres are electrically connected with the light-emitting circuit. The hollow microspheres are transparent spheres and cover the light-emitting front faces of the light-emitting light sources. Light rays emitted by the light-emitting light source are acted by the hollow microspheres in the transparent shell, the propagation path of the light rays is effectively adjusted, the reflection frequency of the light rays in the LED light source is reduced, and therefore the diffusion angle of the light rays is remarkably increased.

Description

TECHNICAL FIELD

[0001] The application belongs to the technical field of LED, and more particularly relates to an LED light source, a backlight module and an electronic device. BACKGROUND

[0002] With the rapid development of semiconductor lighting technology, LED (light-emitting diode) as a new generation of high-efficiency energy-saving light source has been widely used in daily lighting, display technology, automobile lighting and other fields. In recent years, the performance improvement and cost reduction of LED have greatly promoted its market penetration, and the packaging technology of LED light source plays a crucial role.

[0003] In the application process of the LED light source, in order to improve the uniformity of illumination and expand the illumination range, it is usually necessary to increase the light-emitting angle of the LED light source. In the prior art, one method is to add a reflection layer on the packaging layer of the LED light source, so that the light is scattered out of the light source after multiple reflections inside the light source, thereby realizing the expansion of the light-emitting angle of the LED light source. However, this way inevitably causes the problem of excessive light energy loss.

[0004] Therefore, the prior art still needs to be improved and developed. CONTENT OF THE INVENTION

[0005] The purpose of the present application is to provide an LED light source to solve the technical problem of excessive light loss when increasing the diffusion angle of the LED light source in the prior art.

[0006] To achieve the above purpose, the technical scheme adopted by the present application is to provide an LED light source, comprising:

[0007] a substrate, the substrate having a light-emitting circuit;

[0008] a light-emitting light source, the light-emitting light source being arranged above the substrate and being electrically connected to the light-emitting circuit;

[0009] a transparent shell, the transparent shell being connected to the substrate and covering the light-emitting light source, the inside of the transparent shell being provided with hollow microspheres, the hollow microspheres being transparent spheres and covering the light-emitting front surface of the light-emitting light source.

[0010] Further, the shape of the hollow microspheres includes any one or a combination of a spherical shape and an ellipsoidal shape.

[0011] Further, the arrangement mode of the hollow microspheres inside the transparent shell includes random dispersion arrangement.

[0012] Further, the arrangement mode of the hollow microspheres inside the transparent shell includes array arrangement.

[0013] Further, the LED light source further comprises a transparent adhesive layer, the transparent adhesive layer is arranged between the transparent shell and the light emitting source in a sealing mode, and the refractive index of the transparent adhesive layer is greater than that of the transparent shell.

[0014] Further, the transparent shell further comprises an anti-reflection film, the anti-reflection film is arranged on the outer surface of the transparent shell in a circumferential mode.

[0015] Further, the transparent shell comprises an injection shell, the injection shell is a hard shell made by an injection molding process.

[0016] Further, the hollow microsphere has a shell, and the refractive index of the shell is equal to that of the transparent shell.

[0017] According to the second aspect of the embodiments of the present disclosure, a backlight module is further provided, which comprises the LED light source of the above technical solution.

[0018] According to the second aspect of the embodiments of the present disclosure, an electronic device is further provided, which comprises the backlight module of the above technical solution.

[0019] The LED light source provided in the present application has at least the following beneficial effects: the LED light source comprises a substrate, a light emitting source, and a transparent shell, the substrate has a light emitting circuit, the light emitting source is arranged above the substrate and connected with the light emitting circuit, the transparent shell is connected to the substrate and covers the light emitting source, the inside of the transparent shell is provided with a hollow microsphere, the hollow microsphere is a transparent sphere and covers the light emitting front surface of the light emitting source.

[0020] When the LED light source is connected to a circuit, the light generated by the light emitting element reaches the hollow microsphere region of the transparent shell, and the propagation path is changed due to the effect of the hollow microsphere, so that the originally directly emitted light is diffused to the surrounding, thereby effectively increasing the beam diffusion angle of the LED light source. Further, by introducing the design of the hollow microsphere, not only the light diffusion range is expanded, but also the number of internal reflections of the light is reduced, so that the LED light source increases the diffusion angle while improving the light penetration efficiency of the light, and effectively reduces the light energy loss. BRIEF DESCRIPTION OF DRAWINGS

[0021] In order to more clearly illustrate the technical solutions in the embodiments of the present application, the following will briefly introduce the drawings needed to be used in the embodiments or prior art description. Obviously, the drawings in the following description are only some embodiments of the present application, and other drawings can be obtained by those skilled in the art without creative labor.

[0022] Figure 1 A vertical sectional view of the light emitting source provided in the embodiments of the present application when placed horizontally;

[0023] Figure 2Fig. 6 shows another vertical sectional view of the light emitting source provided by the embodiment of the present application when horizontally placed.

[0024] 101. substrate;

[0025] 102. light emitting source;

[0026] 103. transparent shell;

[0027] 104. hollow microsphere. DETAILED DESCRIPTION

[0028] In order to make the technical problems to be solved, technical solutions and beneficial effects of the present application clearer, the present application will be further described in detail below in combination with the drawings and embodiments. It should be understood that the specific embodiments described herein are only used to explain the present application and not intended to limit the present application.

[0029] It should be noted that when a component is referred to as "fixed to" or "disposed on" another component, it can be directly or indirectly on the other component. When a component is referred to as "connected to" another component, it can be directly or indirectly connected to the other component. The terms "up", "down", "left", "right", "front", "back", "vertical", "horizontal", "top", "bottom", "inner", "outer", etc. indicate the orientation or position based on the orientation or position shown in the drawings, and are only for the convenience of description, and cannot be understood as a limitation on the technical solutions. The terms "first", "second" are only for the convenience of description, and cannot be understood as indicating or implying relative importance or implicitly indicating the number of technical features. The meaning of "a plurality of" is two or more, unless otherwise specifically limited.

[0030] The LED light source of the embodiment of the present application will be described below in combination with the drawings.

[0031] Please refer to Figure 1 , Figure 1 Fig. 1 shows a vertical sectional view of the LED light source of the present application when horizontally placed.

[0032] An LED light source, comprising:

[0033] A substrate 101 having a light emitting circuit; a light emitting source 102 disposed above the substrate 101 and electrically connected to the light emitting circuit; a transparent shell 103 connected to the substrate 101 and covering the light emitting source 102, the transparent shell 103 having a hollow microsphere 104 inside, the hollow microsphere 104 being a transparent sphere and covering the light emitting front surface of the light emitting source 102.

[0034] The substrate 101 is the carrier of the light-emitting light source 102 and other electronic components, providing the necessary physical support and mounting platform to ensure that all components are firmly integrated together. The light-emitting circuit is the electronic circuit system in the LED light source responsible for driving the light-emitting light source 102 to emit light and controlling its working state. The transparent shell 103 of the light-emitting light source 102 serves as an optical medium, and the hollow microspheres 104 are added on the basis of the transparent adhesive layer to change the propagation path of light in the optical medium through the hollow microspheres 104. The hollow microspheres 104 are micro-sized hollow spheres.

[0035] By changing the light path of the light-emitting light source 102 in the transparent shell 103 through the hollow particles, the multiple reflections of light are reduced, and the light loss of the LED light source is reduced while increasing the diffusion angle of the LED.

[0036] The transparent shell 103 adjusts the light-emitting path with the embedded hollow microspheres 104 inside, aiming to reduce the reflection of light inside the LED light source while widening the diffusion angle of the light source. Specifically, the transparent shell 103 serves as the outer protective layer of the LED light source, not only enhancing the protection performance, but also improving the packaging effect through its special design. The hollow microspheres 104 are embedded in the transparent shell 103, which are spherical or approximately spherical in shape, can randomly guide light to change the propagation direction, enhance the scattering and diffusion effect of light, and thus improve the extraction efficiency and uniformity of light.

[0037] The hollow microspheres 104, as a key material, are integrated into the manufacturing process of the transparent shell 103, which are usually made of high molecular materials, glass or ceramic materials, etc., with a solid shell and an internal gas-filled cavity. In the production of the transparent shell 103, the hollow microspheres 104 are used as fillers, mixed with the raw materials of the transparent shell 103, and then molded by point gluing and curing or injection molding technology, and then the hollow microspheres 104 are integrated into the structure of the transparent shell 103, forming an internal structure with light scattering function, optimizing the optical performance. In addition, the production of the transparent shell 103 also includes directly generating the structure of the hollow microspheres 104 in the manufacturing process of the transparent shell 103 or the lens, which can be achieved by using chemical foaming agents to induce the generation of bubbles or directly injecting gas, finally obtaining a transparent lens with the structure of the hollow microspheres 104, further enhancing the scattering effect of light and the overall optical performance.

[0038] Because the hollow microspheres 104 are in the transparent lens, the light path of the light emitting source 102 can be changed, aiming to weaken the central light intensity of the light emitting source 102, so more or larger hollow microspheres 104 are arranged in the central region of the transparent lens, which effectively scatters and attenuates the strong light emitted from the center of the light emitting source 102, avoiding the central light spot being too concentrated, and gradually reducing or using smaller microspheres in the edge region, which can maintain a higher light transmittance in the edge region, so that the edge light can pass through more smoothly, thereby improving the edge illumination intensity and uniformity of the entire lens.

[0039] In the existing scheme of increasing the diffusion angle of the LED light source, a high-reflectivity material is coated or attached outside the LED light source packaging layer as a reflection layer. Through the action of the external reflection layer, the originally straight light is reflected back to the inside of the package, increasing the travel path of the light in the packaging material, causing the light to experience more scattering and reflection in the packaging material. The light guided by the reflection layer is reflected multiple times inside, reducing the concentration of light in the center of the light source, promoting the distribution of light to the surrounding, and improving the diffusion angle of the light. Due to material absorption, scattering loss, and possible total internal reflection causing light trapping effect, which leads to energy loss of light reflection inside the LED light source, reducing the energy utilization rate of the LED light source. The present scheme increases hollow microspheres 104 in the packaging layer of the LED light source. The hollow microspheres 104 can cause random scattering of the passing light, rather than relying entirely on multiple reflections on the surface or inside of the packaging material, so that the light exits the packaging layer more quickly and at a wider angle, reducing the energy loss caused by multiple internal reflections, thereby reducing the travel distance of light in the packaging material, which helps the light to escape more easily outside the package, reducing the light trapping caused by total internal reflection, thereby improving the light extraction efficiency.

[0040] The substrate 101 serves as a carrier platform for the optical elements, providing necessary physical support and mounting interface for the elements, and also serving as a heat sink for the electronic elements, achieving the heat management function of the LED light source. The PCB substrate can be used and the heat dissipation function can be achieved by multi-layer design of the PCB substrate, adding heat dissipation fins, using heat-conducting pads, or selecting a PCB material with higher thermal conductivity to increase mechanical strength and heat dissipation capacity. The structure and design of the PCB substrate in this embodiment are not limited and can be designed according to actual conditions. For example, a multi-layer PCB is used as the substrate 101. The multi-layer circuit board (PCB) includes signal layers, power layers, ground layers, and heat dissipation layers stacked in a predetermined order, and the electrical interconnection between the layers is achieved through holes or blind buried holes. The signal layer is separated from the power layer, reducing electromagnetic interference and improving signal integrity. The heat dissipation layer material can be a metal heat dissipation layer, such as a copper foil layer, forming a large-area ground or power plane to increase the heat conduction area and speed up the heat transfer from the light-emitting source 102 to the external heat sink. The heat dissipation fins can be directly attached to the back of the PCB substrate or below the light-emitting source 102, and are in close contact through fasteners, heat-conducting pads, or adhesives to ensure effective heat transfer. The heat-conducting pads are placed between key contact surfaces that require heat conduction, such as between the light-emitting source 102 and the substrate 101, to improve heat conduction efficiency.

[0041] Further, during the operation of the LED light source, part of the electrical energy is converted into light energy, and the remaining energy is converted into heat energy and released. When the heat cannot be effectively dissipated, the junction temperature of the LED will rise, which will cause the bandgap of the semiconductor material to decrease and the non-radiative recombination phenomenon to intensify, resulting in a decrease in photoelectric conversion efficiency and damage to the brightness and light efficiency of the LED. Therefore, it is crucial to implement effective heat dissipation measures for the LED light source. In addition, to ensure that the LED chip and other electronic components are not damaged by external impact and vibration, the substrate 101 needs to have sufficient mechanical strength.

[0042] In some embodiments, the substrate 101 is set as a metal substrate, which has excellent heat conduction performance and can efficiently conduct the heat generated by the LED to the external environment, effectively suppressing the negative impact of temperature on the brightness of the LED light source and improving the working efficiency of the LED light source. In addition, due to its high hardness and high strength characteristics, it can also meet the mechanical support requirements of the LED light source.

[0043] Further, the substrate 101 also includes a ceramic substrate, the material of the ceramic substrate includes metal oxide and metal nitride, the ceramic substrate can effectively transfer phonons due to the tight crystal structure and strong interatomic bonding, thereby facilitating the rapid transfer of thermal energy and further improving the heat dissipation capacity of the substrate 101 for the LED light source. In addition, the ceramic material in the ceramic substrate contains a large number of ionic bonds and covalent bonds in its molecular structure, which is not easy to conduct electricity, forming a good electrical insulation barrier to ensure the safety and efficient operation of electronic components. The crystal lattice structure of the ceramic material is not easy to change when it is subjected to temperature changes, thus ensuring the precise alignment between components and long-term mechanical reliability.

[0044] The light-emitting circuit is an electronic circuit system responsible for driving the LED light source to emit light and controlling its working state, including a power interface, a rectification and filtering circuit, a voltage stabilizing circuit, a constant current driving circuit, a protection circuit, and a control circuit. The specific power interface is used to connect an external power supply to provide power for the entire light-emitting circuit; the rectification and filtering circuit converts alternating current into direct current to ensure the normal operation of the LED light source; the voltage stabilizing circuit is used to stabilize the voltage to ensure that the LED light source operates at a constant voltage and prevents voltage fluctuations from damaging the LED light source; the constant current driving circuit adjusts the current according to the needs of the LED light source, ensuring that the current flowing through the LED light source remains constant even if the power voltage fluctuates; the protection circuit includes overvoltage protection, overcurrent protection, and thermal protection to prevent external abnormal conditions from damaging the LED light source or the circuit; for LED applications that require dimming, color changing, or responding to external signals, the control circuit can receive signals and adjust the working state of the LED light source accordingly. The light-emitting circuit ensures the working state of the LED light source through current control and protection measures, both to realize its potential for high efficiency and energy saving and to ensure safety and reliability in use.

[0045] According to the technical solution provided by the present application, the structure of the LED light source includes a substrate 101, a light-emitting light source 102, and a transparent shell 103. The substrate 101 has a light-emitting circuit, the light-emitting light source 102 is arranged above the substrate 101 and is electrically connected to the light-emitting circuit, and the transparent shell 103 is connected to the substrate 101 to cover the light-emitting light source 102. The transparent shell 103 is internally provided with hollow microspheres 104, which are transparent spheres and are arranged on the front face of the light-emitting light source 102. When the current reaches the light-emitting light source 102 through the circuit on the substrate 101, the semiconductor material in the chip is excited to emit light. The emitted light enters the transparent shell 103 provided with the hollow microspheres 104, and the hollow microspheres 104 uniformly distribute the light in all directions through scattering, thereby improving the emission efficiency and illumination uniformity of the light source.

[0046] In some embodiments, the shape of the hollow microspheres 104 includes any one or a combination of spherical and ellipsoidal shapes.

[0047] Specifically, the hollow microspheres 104 as a unique structural element inside the transparent shell 103, its morphology plays a decisive role in the manipulation of light. When the hollow microspheres 104 are spherical, it ensures the isotropic scattering process, that is, regardless of the angle of incidence of light, it will experience similar scattering path, so as to achieve a full and uniform scattering effect, significantly enhance the diffuse reflection characteristics of the light source, effectively reduce the spot and shadow phenomenon, and improve the uniformity of illumination. The ellipsoidal hollow microspheres exert different directional scattering effects on light due to the difference in length of the major and minor axes. By adjusting the axis ratio of the ellipsoid, the light intensity in the central region can be effectively weakened. At the same time, by regulating the morphology layout of the ellipsoid, the light can be directed to the specific demand area, which can alleviate the central hot spot problem and enhance the brightness of the edge region.

[0048] According to the technical scheme provided by the embodiments of the present application, the shape of the hollow microspheres 104 inside the transparent shell 103 is spherical or ellipsoidal. The spherical hollow microspheres are used to uniformly scatter light in all directions, and the ellipsoidal hollow microspheres are used to directionally adjust light according to the difference in axis ratio. By carefully configuring the two types of hollow microspheres, efficient scattering and uniform distribution of light are realized, the edge brightness is enhanced, and the central hot spot is reduced.

[0049] In addition, the hollow microspheres 104 are uniformly distributed inside the transparent shell 103, and the distance between them remains relatively constant. This arrangement is beneficial to the uniformity of light source scattering, effectively suppresses the formation of light spots, and improves the uniformity of illumination.

[0050] In some embodiments, multiple layers of hollow microspheres 104 are arranged inside the transparent shell 103, and each layer of microspheres has different sizes, shapes or densities, realizing fine optical adjustment. For example, multiple hollow microspheres 104 form a first layer region and a second layer region in the transparent shell 103, the first layer region is close to the light source, and the second layer region is far from the light source. The density of the hollow microspheres 104 in the first layer region is greater than that in the second layer region. The microspheres with small size or high density arranged close to the light source can promote the preliminary extensive diffusion of light, and the microspheres with large size or low density arranged in the outer layer of the transparent shell 103 can further smooth the light field. In addition, the hollow microspheres 104 are specially arranged in the region with high central light intensity, which can strengthen the diffusion of light in this region, effectively expand the diffusion angle of light, and improve the optical output quality.

[0051] In some embodiments, the arrangement of the hollow microspheres 104 inside the transparent shell 103 includes random dispersion arrangement.

[0052] Specifically, the hollow microspheres 104 are arranged in a random dispersion manner inside the transparent shell 103, which means that the microspheres are randomly distributed in the medium of the transparent shell 103 without a fixed arrangement order or pattern during the manufacturing process. Due to the random distribution of the microspheres, the chances and angles of the light rays encountering the hollow microspheres 104 are different when the light rays pass through the transparent shell 103, which leads to the light rays being scattered in random directions, helps to eliminate the strong light in a single direction, reduces the light spot, and makes the light distribution of the light source more uniform.

[0053] According to the technical scheme provided by the embodiments of the present application, the arrangement manner of the hollow microspheres 104 inside the transparent shell 103 includes a random dispersion manner, and the randomly distributed microspheres help to multiple scattering of light, increase the scattering angle of the light source, reduce the glare phenomenon caused by direct transmission of light, and also reduce the shadow effect caused by direct irradiation of the light source, thereby improving the visual comfort.

[0054] In some embodiments, the arrangement manner of the hollow microspheres 104 inside the transparent shell 103 includes an array arrangement.

[0055] Specifically, the hollow microspheres 104 are arranged in an array manner inside the transparent shell 103, which means that the microspheres are arranged in an organized manner according to a predetermined rule or pattern to form an ordered structure. For example, referring to Figure 2 , the transparent shell 103 includes a central region facing the light-emitting light source and a peripheral region surrounding the central region, and the density of the hollow microspheres 104 in the central region is greater than that of the hollow microspheres 104 in the peripheral region. It can be understood that in the array design, the density of the microspheres can be intentionally increased in the central region and reduced in the peripheral region, thereby effectively absorbing and scattering the strong light in the central region, while promoting the scattering of light in the edge region, thereby reducing the central light intensity and increasing the diffusion range of the light; and the arrangement of the microspheres is used to simulate the ring structure of the Fresnel lens to control the light and optimize the light path transmission. The Fresnel lens is based on its unique ring design, each ring is actually a small refractive or reflective surface, which can bend the light under the joint action. In the array of the hollow microspheres 104, the size, spacing and arrangement manner of the microspheres can be designed to simulate the effect of the ring, control the refractive or scattering direction of the light, use the phase difference generated by the interaction between the hollow microspheres 104 to guide the light to scatter at a wider angle, and effectively adjust the light intensity in the central region by precisely controlling the position and spacing of the microspheres.

[0056] According to the technical scheme provided in the embodiments of the present application, the arrangement mode of the hollow microspheres 104 inside the transparent shell 103 includes array arrangement, through accurate array design, it is ensured that the light can be efficiently scattered or focused according to the preset path when passing through the microsphere array, the utilization efficiency of light is optimized, the light uniformity is further improved, and the suppression effect on the central light intensity is enhanced, thereby improving the diffusion angle of the light.

[0057] In addition, in some embodiments, the LED light source further includes a transparent adhesive layer, the transparent adhesive layer is sealingly arranged between the transparent shell 103 and the light-emitting light source 102, and the refractive index of the transparent adhesive layer is greater than that of the transparent shell 103.

[0058] Specifically, the transparent adhesive layer is the packaging layer of the LED light source, the material is an elastic and tough transparent adhesive material, which can reduce mechanical stress and deform when subjected to external force, absorb and disperse energy, thereby reducing or preventing the external force from being directly transmitted to the light-emitting light source 102, and reducing the physical impact or vibration damage to the light-emitting light source 102. When the transparent adhesive layer is made by using the dispensing process, the formed transparent adhesive layer can further increase the connection strength of the light-emitting light source 102 and the substrate 101 after curing, fix the position of the light-emitting light source 102 on the substrate 101, and reduce the possibility of displacement or falling of the light-emitting light source 102. The refractive index of the transparent adhesive layer is different from that of air, the substrate 101 and the light-emitting light source material. By selecting appropriate adhesive layer material and thickness, the refraction and reflection of light at different medium interfaces can be controlled, so that part of the light that may have been totally internally reflected at the interface and cannot escape can be refracted out of the adhesive layer, thereby changing the direction of light propagation and increasing the diffusion range of light. The uniform coverage of the transparent adhesive layer can eliminate the hot spot effect of LED chip light emission, so that the light is more uniformly distributed in space, and the illumination intensity and coverage from different angles are increased.

[0059] The dispensing is a technology of accurately controlling and dispensing fluid or semi-fluid material to a specified position. The dispensing technology can ensure that the amount of glue applied to each LED light source remains constant by virtue of high precision, thereby improving the packaging quality. Specifically, by adjusting the specifications, dispensing rate and pressure of the dispensing needle and other variables, the shape of the glue can be finely controlled to ensure the consistency and high quality of the packaging of each LED light source. With the aid of an automatic control system, the dispensing equipment can efficiently complete the packaging task of a large number of LED light sources, significantly enhancing the production efficiency. In addition, the dispensing technology can also adjust the operating parameters according to specific requirements to meet the diversified needs of packaging different specifications and models of LED light sources, further ensuring the uniformity of the packaging quality of each product and enhancing the reliability and stability of the product.

[0060] When the light is diverted from the transparent adhesive layer with low refractive index to the transparent shell 103 with high refractive index, according to Snell's law, the light will be refracted towards the normal direction of the interface, which means that the light propagation path tends to be deflected outward, which helps the light to penetrate the shell more smoothly, reduces the loss of light energy caused by total internal reflection, and effectively improves the overall light extraction efficiency. In addition, the refraction of light when passing through the interface between materials with different refractive indices not only promotes the dispersion of light after leaving the light source 102, but also expands the angle distribution range of the light, further enhancing the diffusion effect of the light.

[0061] According to the technical scheme provided by the embodiment of the application, the LED light source further comprises a transparent shell 103, and the refractive index of the transparent shell 103 is greater than the refractive index of the transparent adhesive layer. When the light is emitted from the light source, since the refractive index of the transparent adhesive layer is less than the refractive index of the transparent shell 103, it helps the light to penetrate the transparent shell 103, improves the light extraction efficiency, and when the light passes through the medium layer between the transparent adhesive layer and the transparent shell 103, due to the difference in refractive index, it promotes the dispersion of the light after leaving the light source 102 and the expansion of the angle distribution range, and enhances the diffusion effect of the light.

[0062] In some embodiments, the transparent shell 103 further comprises an anti-reflection film, and the anti-reflection film is circumferentially arranged on the outer surface of the transparent shell 103.

[0063] Specifically, the anti-reflection film is an optical film, and its main function is to reduce the reflection of light at the interface between air and transparent material, thereby increasing the transmittance. When the anti-reflection film is circumferentially arranged on the transparent shell 103, the effect of reducing reflection is mainly concentrated in the edge area of the light transmission path. Compared with the uncoated surface, the light emitted from the LED light source and trying to pass through the edge of the transparent shell 103 greatly reduces the reflection loss encountered, so that more light can smoothly pass through the edge of the shell, enhancing the circumferential light intensity. The hollow microspheres 104 inside the transparent shell 103 mainly act on the scattering and diffusion of light, effectively reducing the concentration of light field intensity in the central area of the transparent shell 103, making the light distribution more uniform, and the deployment of the anti-reflection film in the circumference further improves the light transmission efficiency of the edge area. The combination of the two further improves the uniformity of the light emitted by the light source.

[0064] According to the technical scheme provided in the embodiment of the present application, the light-transmitting film is arranged in the circumferential direction of the transparent shell 103, the path of the light in the transparent shell 103 is changed by the hollow microspheres 104, the peak value of the light intensity at the center of the light source is reduced, the light-transmitting film is arranged in the circumferential direction of the transparent shell 103, the reflection of the light at the edge of the transparent shell 103 and the air contact surface is reduced, thereby increasing the exit efficiency of the light, directly enhancing the light intensity at the edge of the light source, and making the energy utilization of the overall light source more sufficient. Through the results of the hollow microspheres 104 and the light-transmitting film, the light diffusion angle is increased, and the energy utilization efficiency of the light source is significantly improved.

[0065] In some embodiments, the transparent shell 103 comprises an injection molded shell, which is a hard shell made by an injection molding process.

[0066] The injection molded shell is a hard shell made by an injection molding process, which is a high-efficiency mass production technology that can quickly and economically mass-produce shells. When the mold design of the transparent shell 103 is completed and verified, it is ensured that each manufactured shell is completely consistent in size and shape, which is beneficial to the standardization and modular implementation of the production process, thereby facilitating standardized quality control and convenient later maintenance and replacement. The highly automated nature of the injection molding process reduces human intervention, improves production efficiency, reduces labor costs, and promotes manufacturing accuracy and overall consistency of the LED light source.

[0067] The transparent shell 103 manufactured by the injection molding process ensures the consistency of the lens layer specifications of all LED light source packages and the stability of the quality of the LED light source, which is convenient for unified control of the diffusion angle of each LED light source, thereby realizing precise regulation of light source distribution and ensuring the stability and consistency of light irradiation.

[0068] According to the technical scheme provided in the embodiment of the present application, the transparent shell 103 comprises an injection molded shell, which is a hard shell made by an injection molding process, and the transparent shell 103 is manufactured by the injection molding process and standardized production, which not only improves the production efficiency and quality control level of the LED light source package, but also ensures the stability and consistency of the light output.

[0069] In some embodiments, the hollow microspheres 104 have a shell, and the refractive index of the shell of the hollow microspheres 104 is equal to the refractive index of the transparent shell 103.

[0070] Specifically, when the refractive index between the hollow microsphere 104 and the transparent shell 103 is matched, the refraction and reflection of light on the interface between the two will be minimized, so that the energy loss of the light is reduced when the light passes through the shell and encounters the hollow microsphere, the light transmittance is improved, thereby improving the overall brightness and efficiency of the light source. Refractive index matching reduces interface scattering, and the air medium inside the hollow microsphere 104 can effectively scatter light, so that the light is uniformly distributed in the transparent shell 103, thereby increasing the light diffusion angle while reducing light loss, ensuring good uniform illumination effect. In addition, since the refractive index matching simplifies the material selection and manufacturing process, reduces the production problems that may be caused by material mismatch, and improves the quality and consistency of production.

[0071] According to the technical scheme provided by the embodiment of the present application, the shell refractive index of the hollow microsphere 104 is equal to the refractive index of the transparent shell 103, which reduces the light scattering loss on the interface, thereby ensuring that the light can be transmitted almost without obstacles when it penetrates the shell and encounters the structure of the hollow microsphere 104, reducing the energy loss. Directly promote the efficient transmission and distribution of light in the transparent lens, enhance the transmission brightness and diffusion efficiency of the light source. What is particularly important is that the gas medium inside the hollow microsphere 104 can more freely and uniformly scatter the received light, promoting the formation of a wide and uniform scattering network of light inside the transparent shell 103. Not only avoids unnecessary loss of light energy, but also widens the diffusion angle of light, ensures the uniformity and consistency of light coverage, and improves the illumination quality.

[0072] The above only describes the preferred embodiments of the present application and is not intended to limit the present application. Any modifications, equivalent replacements and improvements made within the spirit and principles of the present application shall be included in the protection scope of the present application.

Claims

1. An LED light source, characterized by The LED light source comprises: a substrate having light-emitting circuitry; a light-emitting light source disposed above the substrate and electrically connected to the light-emitting circuitry; a transparent shell connected to the substrate and covering the light-emitting light source, the interior of the transparent shell being provided with hollow microspheres, the hollow microspheres being transparent spheres and covering the light-emitting front surface of the light-emitting light source; a transparent adhesive layer sealingly disposed between the transparent shell and the light-emitting light source, the refractive index of the transparent adhesive layer being greater than that of the transparent shell; and 2. The LED light source of claim 1, wherein, the transparent shell further comprises an anti-reflection film, the anti-reflection film being peripherally attached to the outer surface of the transparent shell.

3. The LED light source of claim 1, wherein, The shape of the hollow microspheres includes any one of a spherical shape, an ellipsoidal shape, or a combination thereof.

4. The LED light source of claim 1, wherein, The arrangement of the hollow microspheres in the interior of the transparent shell includes random dispersion.

5. The LED light source of claim 1, wherein, The arrangement of the hollow microspheres in the interior of the transparent shell includes array arrangement.

6. The LED light source of claim 1, wherein, The transparent shell includes an injection-molded shell, which is a hard shell made by an injection molding process.

7. A backlight module, characterized in that, The hollow microspheres have a shell, the refractive index of the shell being equal to that of the transparent shell.

8. An electronic device, comprising: The LED light source according to any one of claims 1-6. The backlight module according to claim 7.

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