Thermal insulation structure of reaction furnace, manipulator and process equipment

Abstract

The utility model discloses a thermal insulation structure of a reaction furnace, a manipulator and process equipment. The reaction furnace comprises a reaction cavity, the thermal insulation structure comprises at least one thermal insulation channel, the thermal insulation channel is arranged corresponding to the reaction cavity, and the thermal insulation channel is provided with a first opening for a carrier to go in and out; and at least one heating assembly is arranged in the heat preservation channel. According to the utility model, the temperature in the heat preservation channel is raised to a preset temperature value through the heating assembly, and then the carrier which leaves the reaction cavity enters the heat preservation channel immediately, so that the problem that the temperature of the carrier which leaves the reaction cavity drops suddenly is avoided, and the reaction cavity can carry out process treatment on the next batch of carriers filled with silicon wafers to be subjected to process treatment; therefore, the whole process time is shortened, the production efficiency of the reaction furnace is improved, and the energy consumption and the investment cost of customers are reduced.

Description

TECHNICAL FIELD

[0001] The utility model relates to a semiconductor device technical field especially relates to a reaction furnace's heat preservation structure, mechanical hand and process equipment. BACKGROUND

[0002] The current photovoltaic industry's diffusion, oxidation, annealing, doping, PECVD, LPCVD etc. Process production has vertical furnace and horizontal furnace two types, the structure of the two types of furnace all need to be loaded in the specific carrier in the reaction cavity of the furnace and be transmitted to carry out the process, through the specific reaction gas that the reaction cavity is passed in, thereby realizing specific coating, diffusion, oxidation and thin film deposition etc. Process to the silicon wafer or wafer.

[0003] After the process is completed, the carrier filled with the silicon wafer that has completed the process is at a high temperature, if immediately enters the quenching state, will lead to the change of the surface state of the silicon wafer, influences the process effect of the silicon wafer, thereby influences the yield of the silicon wafer. Therefore, the industry usually passes nitrogen gas in the reaction chamber and reduces the temperature or carries out the longer natural cooling process, until the temperature is reduced to the specified temperature, the furnace door can be opened, the next step of the boat action is carried out, then the boat is cooled for a certain time on the paddle, and the mechanical hand is grabbed to the temporary storage position and is cooled.

[0004] However, along with the continuous promotion of the process temperature, the time of the temperature reduction to the specified temperature after the process is completed is also increasing, which will lead to the increasing of the time of the carrier filled with the silicon wafer that has completed the process in the reaction cavity, thereby the whole process time is increasing, reduces the production efficiency of the reaction furnace, and increases the energy consumption and the investment cost of the customer. UTILITY MODEL CONTENTS

[0005] The utility model provides a reaction furnace's heat preservation structure, mechanical hand and process equipment for solving the low production efficiency of the reaction furnace in the prior art, the problem of increasing the energy consumption and the investment cost of the customer.

[0006] The technical scheme of the utility model is a kind of heat preservation structure of reaction furnace, and reaction furnace includes reaction cavity;Heat preservation structure includes:

[0007] At least one heat preservation channel, heat preservation channel is correspondingly arranged with reaction cavity, and heat preservation channel is equipped with the first opening for the in and out of carrier;And at least one heating assembly is arranged in heat preservation channel.

[0008] Further, the heat preservation channel includes a first cavity and a second cavity that are in communication, and the length of the first cavity along a first direction is greater than the length of the second cavity along the first direction.

[0009] Further, at least one heating assembly is arranged in the first cavity and / or the second cavity.

[0010] Further, the reaction furnace further comprises a lifting assembly located at one side of the heat preservation channel along the first direction, and the lifting assembly is used for extending or retracting the carrier in the heat preservation channel from the first opening.

[0011] Further, the heat preservation channel is further provided with a support connected with the lifting end of the lifting assembly, and the support is used for fixing the carrier so as to lift the carrier.

[0012] Further, the first opening of the heat preservation channel is matched with a first baffle used for matching and covering the corresponding first opening.

[0013] Further, one end or both ends of the heat preservation channel along the second direction are provided with a second opening, and each second opening is matched with a second baffle.

[0014] The second opening is used for the carrier to enter or exit, and the second baffle is used for matching and covering the corresponding second opening.

[0015] Further, the other side of the heat preservation channel away from the first opening is matched with a sliding assembly used for moving the carrier out of the heat preservation channel.

[0016] The utility model further provides a mechanical hand, the mechanical hand includes above-mentioned heat preservation structure, and the mechanical hand is used for sending the heat preservation structure into the reaction cavity or taking out from the reaction cavity.

[0017] The utility model further provides a process equipment, and the process equipment comprises the heat preservation structure.

[0018] Compared with the prior art, the utility model has at least the following beneficial effects:

[0019] The utility model discloses a heat preservation structure, which comprises a reaction cavity, a heat preservation channel and a carrier, wherein the heat preservation channel is arranged in the reaction cavity, and the carrier is arranged in the heat preservation channel. BRIEF DESCRIPTION OF DRAWINGS

[0020] Unless otherwise defined, all technical and scientific terms used herein have the same meaning as commonly understood by one of ordinary skill in the art to which this application belongs; the terminology used in the description herein is for describing particular embodiments only and is not intended to be limiting of the application; the description herein and the claims of the application and the above description of the drawings herein is not intended to be complete descriptions of all features of the application; the terminology used herein is for the purpose of describing particular embodiments only and is not intended to limit the scope of the application. Numerous specific embodiments of the application are described herein. These specific embodiments are examples of the application and do not limit the scope of the application. Embodiments described herein can include various components configured to perform certain steps or operations. These components can be physically present in a single device or distributed across several devices. Various embodiments of the application can include additional components not specifically described herein.

[0021] In order to more clearly illustrate the technical solutions in the embodiments of the application, the following will briefly introduce the drawings needed to be used in the embodiments or prior art description. Obviously, the drawings in the following description are only some embodiments of the application, and for those skilled in the art, other drawings can also be obtained from these drawings without creative labor.

[0022] Figure 1 Partially sectional view of the reaction furnace and the corresponding heat preservation structure according to the application;

[0023] Figure 2 Internal structure schematic view of the heat preservation structure according to the application;

[0024] Figure 3 Structure schematic view of the heat preservation structure according to the application.

[0025] Reference signs:

[0026] 10, reaction cavity;

[0027] 20, heat preservation channel; 201, first opening; 202, first cavity; 203, second cavity; 204, second opening;

[0028] 30, heating assembly;

[0029] 40, lifting assembly;

[0030] 50, support;

[0031] 60, second baffle;

[0032] 70, sliding assembly; 701, fixing member;

[0033] 80, small furnace door assembly;

[0034] 90, second actuator;

[0035] 100, carrier. DETAILED DESCRIPTION

[0036] In order to make the technical problems, technical solutions and beneficial effects of the utility model clearer and more apparent, the utility model will be further described in detail below in combination with the drawings and embodiments. It should be understood that the specific embodiments described herein are only used to explain the utility model and are not used to limit the utility model. Therefore, one feature mentioned in the specification will be used to explain one feature of one embodiment of the utility model, and it is not implied that each embodiment of the utility model must have the explained feature. In addition, it should be noted that the specification describes many features. Although certain features can be combined together to show possible system designs, these features can also be used in other combinations that are not explicitly explained. Therefore, unless otherwise stated, the explained combinations are not intended to be limiting.

[0037] The principle and structure of the utility model will be described in detail below in combination with the drawings and embodiments.

[0038] The utility model includes the furnace door, heating furnace body, air inlet and outlet structure and the like that the existing reaction furnace should have, which are not limited here.

[0039] Among them, the existing technology needs to realize specific film plating, diffusion, oxidation and thin film deposition and other processes on the silicon wafer or wafer, which all need to load the silicon wafer or wafer into a specific carrier and transmit it into the reaction cavity of the reaction furnace, and process the specific reaction gas input into the reaction cavity.

[0040] After the process is completed, the carrier filled with silicon wafers with completed process is at a high temperature, and if it immediately enters the quenching state, it will cause the surface state of the silicon wafer to change, affecting the process effect of the silicon wafer, thereby affecting the yield of the silicon wafer. Therefore, the industry usually introduces nitrogen into the reaction chamber for cooling or carries out a longer natural cooling process until the temperature is cooled to a specified temperature, and then the furnace door can be opened for the next boat-out action, and then the boat is cooled on the paddle for a certain period of time, and the mechanical hand grabs the boat to the temporary storage position for cooling.

[0041] However, as the process temperature continues to rise, the time for cooling to a specified temperature after the process is completed also continues to increase, which will cause the carrier filled with silicon wafers with completed process to stay in the reaction cavity for a longer time, thereby continuously increasing the entire process time, reducing the production efficiency of the reaction furnace, and increasing the energy consumption and the investment cost of the customer.

[0042] Therefore, in order to solve the problem that the carrier filled with silicon wafers with completed process stays in the reaction cavity for too long, thereby continuously increasing the entire process time, reducing the production efficiency of the reaction furnace, and increasing the energy consumption and the investment cost of the customer, in one embodiment, with reference to the accompanying Figure 1 and 3The utility model provides a kind of heat preservation structure of reaction furnace, reaction furnace includes reaction cavity 10, and reaction furnace is equipped with large furnace door to one end corresponding reaction cavity 10, and multiple small furnace door components 80 are equipped on large furnace door, so that the carrier 100 filled with silicon wafer enters reaction cavity 10 by opening small furnace door component 80 and carries out process treatment.

[0043] The heat preservation structure comprises:

[0044] At least one heat preservation channel 20, the heat preservation channel 20 is correspondingly arranged with the reaction cavity 10, and the heat preservation channel 20 is provided with a first opening 201 for the carrier 100 to enter and exit; and at least one heating assembly 30 is arranged in the heat preservation channel 20.

[0045] Specifically, the first opening 201 of the embodiment is located at the top of the heat preservation channel 20, and the top of the reaction cavity 10 is provided with an opening for the carrier 100 to enter and exit.

[0046] It should be noted that the reaction furnace of the embodiment further comprises a transmission mechanical hand and a control unit, and the control unit can be electrically connected with the heating assembly 30, the small furnace door component 80 and the transmission mechanical hand respectively. The heat preservation channel 20 of the embodiment is composed of a frame structure of multiple metal sealing plates.

[0047] The first direction of the embodiment is the Y-axis direction, the second direction is the X-axis direction, and the lifting direction of the lifting assembly 40 is the Z-axis direction.

[0048] In this way, when the carrier 100 filled with silicon wafers located in the reaction furnace completes the process, the control unit starts the heating assembly 30 to raise the temperature in the heat preservation channel 20 to a preset temperature value; then the control unit opens the small furnace door component 80, and the transmission mechanical hand is inserted into the reaction cavity 10 through the opening, so as to take out the carrier 100 in the reaction cavity 10 and quickly place it in the heat preservation channel 20, thereby avoiding the problem of temperature drop affecting the quality of silicon wafers, and the carrier 100 after completing the process does not need to be cooled in the reaction cavity 10, but is cooled to a specified temperature in the heat preservation channel 20, and then performs subsequent boat-out action, so that the reaction cavity 10 can process the carrier 100 filled with silicon wafers to be completed after the carrier 100 is moved to the heat preservation channel 20, thereby reducing the cooling time of the carrier 100 in the reaction cavity 10, shortening the entire process time, improving the production efficiency of the reaction furnace, and reducing energy consumption and customer investment cost.

[0049] In some embodiments, there may be one heat preservation channel. When the carrier 100 filled with silicon wafers in the reactor completes the process, the control unit will open the corresponding small furnace door assembly 80, and then the robotic arm will reach into the opened small furnace door assembly 80 to move the removed carrier 100 into the heat preservation channel 20. At the same time, the control unit will also activate the heating assembly 30 to raise the temperature in the heat preservation channel 20 to a preset temperature value, thereby avoiding the problem of a sudden temperature drop in the silicon wafers moved into the heat preservation channel 20, which would affect the quality of the silicon wafers.

[0050] In some embodiments, there can be two heat preservation channels. When the carrier 100 filled with silicon wafers in the reactor completes the process, the control unit will open the two corresponding small furnace door assemblies 80. Then, two transmission robotic arms will extend into the opened small furnace door assemblies 80 to move the removed carrier 100 into the corresponding heat preservation channel 20. At the same time, the control unit will also activate the heating assembly 30 to raise the temperature in the heat preservation channel 20 to a preset temperature value, thereby avoiding the problem of a sudden temperature drop in the silicon wafers moved into the heat preservation channel 20, which would affect the quality of the silicon wafers.

[0051] It should be noted that in this embodiment, the number of insulation channels 20 in the insulation structure can be 1, 2, 3, etc., which can be set according to the number of small furnace door components 80 in the large furnace door, so that multiple carriers 100 removed from the small furnace door components 80 can enter multiple insulation channels 20 of the insulation structure for insulation, thereby improving the working efficiency of the insulation structure.

[0052] Among them, refer to the appendix Figure 1 The reactor also includes a lifting assembly 40, which is located on one side of the insulation channel 20 along the first direction. The lifting assembly 40 is used to extend or retract the carrier in the insulation channel 20 from the first opening 201.

[0053] In this way, the control unit controls the lifting assembly 40 to extend out from the first opening 201, and at the same time, the control unit controls the transmission manipulator to extend into the reaction chamber 10, thereby taking out the carrier 100 in the reaction chamber 10 and quickly placing it on the lifting assembly 40. Then, the control unit controls the lifting assembly 40 to descend, so as to smoothly move the carrier 100 into the heat preservation channel 20, thereby avoiding the problem of sudden temperature drop affecting the quality of silicon wafers.

[0054] Among them, refer to the appendix Figure 1 The insulation channel 20 is also equipped with a support member 50, which is connected to the lifting end of the lifting assembly 40. The support member 50 is used to fix the carrier 100 so that the carrier 100 can be lifted.

[0055] It should be noted that the shape of the support 50 is preferably a square rod, and the length of the support 50 is arranged along the Y-axis direction. The side wall of the heat preservation channel 20 corresponding to the lifting assembly 40 is provided with a vertical notch, so that the lifting end of the lifting assembly 40 can move up and down in the heat preservation channel 20. In order to prevent the heat in the heat preservation channel 20 from flowing out of the notch, the notch is also matched with high-temperature-resistant sealing material. Of course, the sealing material will not hinder the lifting assembly 40 from lifting the support 50.

[0056] In this way, when the lifting assembly 40 lifts the support 50 to the upper part of the first cavity 202 and below the first opening corresponding to the reaction cavity 10, the mechanical hand driven by the transmission mechanism takes out the carrier 100 in the reaction cavity 10 and places it on the support 50. At this time, the support 50 penetrates the carrier 100, so that the carrier 100 is carried on the support 50, so that the support 50 supports and fixes the carrier 100, and avoids the carrier 100 from contacting the inner side wall of the heat preservation channel 20 when entering and leaving the heat preservation channel 20, which causes damage to the silicon wafer in the carrier 100.

[0057] Specifically, the lifting assembly 40 includes a base, the height of the base is at least flush with the height of the heat preservation channel 20, the top of the base is provided with a lifting motor, the lifting end of the lifting motor extends into the notch and is connected with the support 50; and the side of the base facing the heat preservation channel 20 is provided with a guide rail along the Z-axis direction, so that the lifting motor can drive the support 50 to move up and down along the guide rail.

[0058] Wherein, referring to the accompanying drawings Figures 1-2 The heat preservation channel 20 includes a first cavity 202 and a second cavity 203 that are communicated, and the length of the first cavity 202 along the first direction is greater than the length of the second cavity 203 along the first direction.

[0059] It should be noted that the connection between the first cavity 202 and the second cavity 203 is provided with a through hole along the X-axis direction, so that the first cavity 202 and the second cavity 203 are communicated, and the heat generated by the heating assembly 30 can be more quickly spread to the whole heat preservation channel 20, so that the heat preservation channel 20 can more quickly reach the preset temperature value required for the carrier 100 to be preserved, thereby improving the efficiency of the carrier 100 processing.

[0060] The length of the first cavity 202 along the first direction is greater than the length of the second cavity 203 along the first direction, because the first cavity 202 is used to place the small furnace door assembly 80 and part of the carrier 100, and the second cavity 203 is used to place the remaining part of the carrier 100. The small furnace door assembly 80 is placed in the first cavity 202 because part of the structure of the small furnace door assembly 80 cannot withstand a sudden temperature drop. Therefore, to avoid damage to the small furnace door assembly 80, the small furnace door assembly 80 will automatically enter the first cavity 202 for heat preservation treatment after being opened. Of course, at this time, the small furnace door assembly 80 in the first cavity 202 will not hinder the carrier 100 from being lowered by the lifting assembly 40.

[0061] The shapes of the first cavity 202 and the second cavity 203 are preferably connected rectangles, so that the heat in the heat preservation channel 20 can be better circulated, and the heat preservation effect of the heat preservation channel 20 on the carrier 100 is better. The shape of the second cavity 203 is similar to that of the carrier 100, which can reduce the space volume of the heat preservation channel 20, so that the heat preservation channel 20 can quickly reach the preset temperature value required for heat preservation of the carrier 100, avoiding unnecessary energy waste caused by excessive space.

[0062] At least one heating assembly 30 is arranged in the first cavity 202 and / or the second cavity 203, so that the temperature in the first cavity 202 and the second cavity 203 can quickly reach the preset temperature value.

[0063] In some embodiments, referring to the accompanying drawings Figure 1 Only at least one heating assembly 30 is arranged in the second cavity 203.

[0064] It should be noted that the heating assembly 30 is arranged around the inner side wall of the second cavity 203, so as to more quickly raise the temperature in the second cavity 203.

[0065] Because the first cavity 202 is closer to the small furnace door assembly 80, the heat in the reaction chamber 10 can be transferred to the first cavity 202 after the small furnace door assembly 80 is opened. Therefore, the first cavity 202 can not be provided with a heating assembly 30, thereby simplifying the structural design of the first cavity 202 and reducing the manufacturing cost of the heat preservation structure.

[0066] At this time, the heat generated by the heating assembly 30 in the second cavity 203, part of which flows into the first cavity 202, and the heat transferred to the first cavity 202 from the reaction chamber 10 can make the heat preservation channel 20 play a heat preservation role on the carrier 100, avoiding a sudden temperature drop, oxidation of the surface of the silicon wafer, contact with dust and other adverse conditions, thereby affecting the performance of the silicon wafer after processing.

[0067] In some embodiments (not shown in the drawings), at least one heating assembly 30 is arranged in the first cavity 202 and the second cavity 203.

[0068] It should be noted that the heating assembly 30 is arranged around the inner side wall of the first cavity 202 and the second cavity 203, so as to more quickly raise the temperature in the first cavity 202 and the second cavity 203, and make the temperature in the first cavity 202 and the second cavity 203 reach the preset temperature value more quickly.

[0069] In some embodiments, in order to prevent the heat in the heat preservation channel 20 from flowing out of the first opening 201, the first opening 201 of the heat preservation channel 20 is matched with a first baffle (not shown in the drawings, the same below), which is used to match and seal the corresponding first opening 201.

[0070] It should be noted that each first baffle is connected with the output end of the first actuator, so that the control unit can control the first baffle to open relative to the first opening 201 through the first actuator, so as to drive the carrier 100 to retract from the first opening 201 by the lifting assembly 40; and when the first actuator controls the first baffle to seal and cover the first opening 201, the heat in the heat preservation channel 20 is prevented from flowing out of the first opening 201.

[0071] And the first opening 201 of the present embodiment is arranged on the side wall of the first cavity 202 away from the second cavity 203.

[0072] In some embodiments, referring to the accompanying drawings Figure 3 The heat preservation channel 20 is provided with a second opening 204 at one end or both ends in the second direction thereof, and each second opening 204 is matched with a second baffle 60;

[0073] The second opening 204 is used for the carrier 100 to enter and exit, so that the carrier 100 in the heat preservation channel 20, which is lowered to the preset temperature value, is removed from the second opening 204, and the next batch of carriers 100 filled with silicon wafers with completed processes are moved into the heat preservation channel 20; and the second baffle 60 is used to match and seal the corresponding second opening 204, so as to prevent the heat in the heat preservation channel 20 from flowing out of the second opening 204.

[0074] It should be noted that each second baffle 60 of the present embodiment is correspondingly provided with a second actuator 90, and each second baffle 60 is respectively connected with the output end of the corresponding second actuator 90, so that the control unit can control the second baffle 60 to open relative to the second opening 204 through the second actuator 90, so as to drive the carrier 100 to move out of the heat preservation channel 20 from the second opening 204; and when the second actuator 90 controls the second baffle 60 to seal and cover the second opening 204, the heat in the heat preservation channel 20 is prevented from flowing out of the second opening 204. It should be noted that each second baffle 60 of the present embodiment is correspondingly provided with a second actuator 90, and each second baffle 60 is respectively connected with the output end of the corresponding second actuator 90, so that the control unit can control the second baffle 60 to open relative to the second opening 204 through the second actuator 90, so as to drive the carrier 100 to move out of the heat preservation channel 20 from the second opening 204; and when the second actuator 90 controls the second baffle 60 to seal and cover the second opening 204, the heat in the heat preservation channel 20 is prevented from flowing out of the second opening 204.

[0075] In some embodiments, to enable the carrier 100 to be moved out of the heat preservation channel 20 more quickly, with reference to the accompanying drawings Figure 1 The other side of the heat preservation channel 20 away from the first opening 201 is matched with a sliding assembly 70, and the sliding assembly 70 is used to drive the carrier 100 to move out of the heat preservation channel 20.

[0076] It should be noted that the sliding direction of the sliding assembly 70 is the X-axis direction.

[0077] At this time, the lifting assembly 40 drives the carrier 100 to descend until the carrier 100 is connected with a fixing part 701 of the sliding assembly 70, the fixing part 701 can fix the carrier 100 to prevent the carrier 100 from tilting and shaking, and then the actuator of the sliding assembly 70 drives the carrier 100 to move out of the heat preservation channel 20 through the fixing part 701.

[0078] In another embodiment, the utility model also provides a mechanical hand, the mechanical hand includes the heat preservation structure, and the mechanical hand is used to send the heat preservation structure into the reaction cavity 10 or take out from the reaction cavity 10.

[0079] In this way, the carrier 100 filled with the silicon wafer to be processed is first fixed in the heat preservation channel 20 in the mechanical hand, then the control unit controls the whole mechanical hand to enter the reaction cavity 10 of the reaction furnace to carry out the process, after the process is completed, the control unit controls the mechanical hand to leave the reaction cavity 10, so that the next batch of mechanical hand enters the reaction cavity 10 to carry out the process, which can shorten the whole process time, improve the production efficiency of the reaction furnace, reduce the energy consumption and the investment cost of the customer, and the mechanical hand that has completed the process and left the reaction cavity 10 starts the heating assembly 30 to prevent the temperature of the environment where the carrier 100 is located from suddenly dropping, so that the surface of the silicon wafer after the process is completed is oxidized, dust is contacted and other adverse conditions are avoided, so that the performance of the silicon wafer after processing is affected.

[0080] In some embodiments, the mechanical hand can send the whole heat preservation structure into the reaction cavity 10 to carry out the process, after the process is completed, the mechanical hand takes out the heat preservation structure from the reaction cavity 10, and then the next batch of heat preservation structure is sent into the reaction cavity 10.

[0081] In another embodiment, the utility model also provides a process equipment, the process equipment includes the heat preservation structure, the mechanical hand moves the carrier 100 filled with the silicon wafer to be processed into the reaction cavity 10 of the reaction furnace to carry out the process, and the mechanical hand can also move the carrier 100 filled with the silicon wafer after the process is completed out of the reaction cavity 10 of the reaction furnace.

[0082] In another embodiment, the utility model also proposes another process equipment, process equipment includes the heat preservation structure above, the heat preservation structure does not enter reaction cavity 10 at this time, but sets up to the opening corresponding reaction cavity 10 bottom, so that the carrier 100 can enter the heat preservation passage 20 of heat preservation structure immediately after leaving reaction cavity 10, avoid the problem of the influence of the quality of silicon wafer caused by temperature sudden drop, and the carrier 100 after completing the process does not need to be in reaction cavity 10 for cooling, but is in heat preservation passage 20 and is cooled to the specified temperature, then carries out the subsequent boat action, so that reaction cavity 10 can carry out the process to the carrier 100 of the next batch full process to be completed silicon wafer after the carrier 100 moves to heat preservation passage 20, thereby reducing the cooling time of carrier 100 in reaction cavity 10, and then reducing the entire process time, improve the production efficiency of reaction furnace, reduce energy consumption and customer's investment cost.

[0083] Obviously, the above-described embodiments are only a part of the embodiments of the utility model, and are not all the embodiments, and the preferred embodiments of the utility model are given in the drawings, but do not limit the patent range of the utility model. The utility model can be realized in many different forms, and conversely, the purpose of providing these embodiments is to make the understanding of the disclosure of the utility model more thorough and comprehensive. Although the utility model is described in detail with reference to the foregoing embodiments, those skilled in the art can still modify the technical solutions recorded in the foregoing specific embodiments, or make equivalent replacement to part of the technical features. Any equivalent structure made by using the contents of the utility model specification and drawings, directly or indirectly used in other related technical fields, is also within the patent protection range of the utility model.

Claims

1. A heat retaining structure of a reaction furnace, the reaction furnace comprising a reaction chamber (10); characterized by, The heat preservation structure comprises: at least one heat preservation channel (20) corresponding to the reaction cavity (10), the heat preservation channel (20) being provided with a first opening (201) for the carrier to enter and exit; and at least one heating assembly (30) being arranged in the heat preservation channel (20).

2. The heat retaining structure of a reaction furnace according to claim 1, wherein The heat preservation channel (20) comprises a first cavity (202) and a second cavity (203) in communication, and the length of the first cavity (202) along a first direction is greater than the length of the second cavity (203) along the first direction.

3. The heat retaining structure of a reaction furnace according to claim 2, wherein At least one heating assembly (30) is arranged in the first cavity (202) and / or the second cavity (203).

4. The heat retaining structure of a reaction furnace according to claim 1, wherein The reaction furnace further comprises a lifting assembly (40) located on one side of the heat preservation channel (20) along the first direction, the lifting assembly (40) being used for extending or retracting the carrier in the heat preservation channel (20) from the first opening (201).

5. The heat retaining structure of a reaction furnace according to claim 4, wherein The heat preservation channel (20) is further provided with a support (50) connected to the lifting end of the lifting assembly (40), and the support (50) is used for fixing the carrier so as to lift the carrier.

6. The heat retaining structure of a reaction furnace according to claim 1, wherein The first opening (201) of the heat preservation channel (20) is matched with a first baffle, and the first baffle is used for matching and covering the corresponding first opening (201).

7. The heat retaining structure of a reaction furnace according to claim 1, wherein The heat preservation channel (20) is provided with a second opening (204) at one end or both ends along a second direction thereof, and each second opening (204) is matched with a second baffle (60). The second opening (204) is used for the carrier to enter and exit, and the second baffle (60) is used for matching and covering the corresponding second opening (204).

8. The heat retaining structure of a reaction furnace according to claim 7, wherein The heat preservation channel (20) is matched with a sliding assembly (70) on the other side away from the first opening (201), and the sliding assembly (70) is used for driving the carrier to move out of the heat preservation channel (20).

9. A robot, characterized in that The robot comprises the heat preservation structure according to any one of claims 1 to 8, and the robot is used for sending the heat preservation structure into the reaction cavity (10) or taking the heat preservation structure out of the reaction cavity (10).

10. A process plant, characterized by The process equipment comprises the heat preservation structure according to any one of claims 1 to 8.

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