Corrosion-resistant and organic solvent-resistant pressure sensor

Abstract

The utility model belongs to the technical field of pressure sensors, and particularly relates to an anti-corrosion and anti-organic solvent pressure sensor, which comprises an upper air nozzle, and a lower shell is adhered to the lower end of the upper air nozzle. A layer of polyimide film is sprayed on silica gel, so that organic solvent volatile gas with relatively strong solubility and volatile gas with strong oxidizing property are prevented from being in direct contact with the silica gel, the silica gel is modified by virtue of excellent chemical resistance of polyimide, and the service life of the device in an environment with relatively strong corrosivity is prolonged; the limiting block is driven to move by pulling the handle, after the limiting block moves to the designated position, the upper air nozzle is moved to drive the limiting block and other components to move to the designated position on the lower shell, then the handle is loosened to reset, the limiting block is moved into the sliding groove, then the upper air nozzle and the lower shell are limited, and connection of the device is more stable.

Description

TECHNICAL FIELD

[0001] The utility model relates to pressure sensor technical field, concretely is a kind of anticorrosive pressure sensor of organic solvent. BACKGROUND

[0002] MEMS pressure sensor works by detecting the change of atmospheric pressure, and its core component is a small pressure sensing element, usually composed of a suspended membrane, which converts the pressure signal into an electrical signal by measuring the deformation of the diaphragm under pressure. Current MEMS pressure sensor is widely used in various fields due to its relatively mature manufacturing process and low cost, including wearable devices, industrial applications and asset tracking, etc.

[0003] Most of the current popular MEMS pressure sensors on the market work in non-corrosive environments such as air and inert gases. Although some manufacturers have designed waterproof, dustproof and oil-proof designs by using silicon gel during the packaging process, they cannot meet the complex and more demanding use environment. The main reason is that the current market's potting protective glue cannot withstand organic solvents or strong oxidizing volatile substances, and cannot protect the chip from damage for a long time. For example, with the rapid development of the new energy industry, MEMS pressure sensors are gradually used for air pressure safety monitoring in the chamber of new energy batteries. However, the volatile substances of ethylene carbonate (EMC), dimethyl carbonate (DMC) and methyl ethyl carbonate (EMC) solvents in liquid battery solution can cause irreversible damage to the silicon gel body, thereby losing the protective effect on the chip, resulting in a shorter service life of the MEMS pressure sensor and increased customer costs. Therefore, improvement is needed. UTILITY MODEL CONTENT

[0004] The utility model aims at providing a kind of anticorrosive pressure sensor of organic solvent, solve the problem that the current market's potting protective glue cannot withstand organic solvents or strong oxidizing volatile substances, and cannot protect the chip from damage for a long time.

[0005] In order to achieve the above object, the utility model provides the following technical scheme: A pressure sensor of anticorrosive and organic solvent resistance, including upper air nozzle, the lower end of upper air nozzle is bonded with lower casing, the inside bottom end of lower casing is bonded with MEMS silicon base pressure chip, the inside bottom end of lower casing is bonded with ASIC circuit conditioning chip, the inside of lower casing is provided with silicon gel covering MEMS silicon base pressure chip, ASIC circuit conditioning chip and gold wire, the upper surface of silicon gel is provided with polyimide film, the inside of lower casing is provided with lower casing wiring layer, gold wire is arranged between MEMS silicon base pressure chip and ASIC circuit conditioning chip and between ASIC circuit conditioning chip and lower casing wiring layer, the upper end of lower casing is fixedly connected with connecting block, connecting block is in contact with upper air nozzle, the inside of upper air nozzle is provided with limiting mechanism.

[0006] Preferably, the limiting mechanism includes a sliding groove, the connecting block has a sliding groove formed therein, the sliding groove has a limiting block slidably connected therein, the limiting block is slidably connected with the upper air nozzle, one end of the limiting block away from the sliding groove is fixedly connected with a support ring, the support ring has a pull rod fixedly connected to a side away from the limiting block, the upper air nozzle has a spring arranged therein, the upper air nozzle has the pull rod slidably connected therein, the pull rod has a sliding block fixedly connected to an outer side thereof, the sliding block is in contact with the upper air nozzle, the sliding block has a clamping groove formed therein, the clamping groove has a clamping block slidably connected therein, the upper air nozzle has a resilient sponge arranged therein, the upper air nozzle has a sliding groove formed therein, and the clamping block is slidably connected with the upper air nozzle. By pulling the limiting block to move, the limiting block is moved to a specified position, then the upper air nozzle is moved to drive the limiting block and other components to a specified position on the lower casing, then the limiting block is moved into the sliding groove, so that the upper air nozzle and the lower casing are limited, and the device connection is more stable.

[0007] Preferably, one end of the pull rod away from the support ring is fixedly connected with a handle, so as to facilitate pulling the pull rod by designing the handle.

[0008] Preferably, one end of the spring is fixedly connected with the support ring, and the other end of the spring is fixedly connected with the upper air nozzle, so that the support ring has a spring effect by designing the spring.

[0009] Preferably, one end of the resilient sponge is fixedly connected with the clamping block, and the other end of the resilient sponge is fixedly connected with the upper air nozzle, so that the clamping block has a spring effect by designing the resilient sponge.

[0010] Preferably, the sliding groove has a guide block slidably connected therein, and the guide block is fixedly connected with the clamping block, so as to guide the clamping block by designing the guide block.

[0011] The utility model has the advantages that:

[0012] The utility model discloses a through design silicon gel, polyimide film, connecting block, sliding slot, limit block and support ring etc. parts, through spraying a layer of polyimide film on the silicon gel, the direct contact of strong solubility organic solvent volatile gas, strong oxidizing volatile gas and silicon gel is isolated, with the outstanding chemical resistance of polyimide, the service life of the device in the environment of stronger corrosion is increased, through pulling handle drive limit block movement, limit block moves to the specified position after, then moves the air nozzle drive limit block etc. component moves to the specified position on the lower shell, then releases the handle reset and moves the limit block into the sliding slot, and then makes the upper air nozzle and lower shell get the location, makes the device connection more stable. BRIEF DESCRIPTION OF DRAWINGS

[0013] Figure 1 It is the structure schematic diagram of the utility model;

[0014] Figure 2 It is the front view of the utility model Figure 1 ;

[0015] Figure 3 It is the connecting block of the utility model Figure 2 Enlarged view;

[0016] Figure 4 It is the A place of the utility model Figure 3 Enlarged view.

[0017] In the drawing: 1, upper air nozzle;2, lower shell;3, MEMS silicon-based pressure chip;4, ASIC circuit conditioning chip;5, silicon gel;6, polyimide film;7, gold wire;8, lower shell wiring layer;9, connecting block;10, limit mechanism;101, sliding slot;102, limit block;103, support ring;104, pull rod;105, handle;106, spring;107, sliding block;108, clamping groove;109, clamping block;1010, elastic sponge;1011, sliding groove;1012, guide block. DETAILED DESCRIPTION

[0018] The technical scheme in the embodiments of the utility model will be described clearly and completely below in conjunction with the drawings in the embodiments of the utility model. Obviously, the described embodiments are only part of the embodiments of the utility model and not all the embodiments. Based on the embodiments in the utility model, all other embodiments obtained by those skilled in the art without creative labor fall within the scope of the utility model.

[0019] Please refer to Figures 1-4The application discloses a pressure sensor capable of preventing corrosion and organic solvents, which comprises an upper air nozzle 1, a lower shell 2 bonded to the lower end of the upper air nozzle 1, a MEMS silicon-based pressure chip 3 bonded to the inner bottom end of the lower shell 2, an ASIC circuit conditioning chip 4 bonded to the inner bottom end of the lower shell 2, silicon gel 5 arranged in the lower shell 2 and covering the MEMS silicon-based pressure chip 3, the ASIC circuit conditioning chip 4 and gold wires 7, a polyimide film 6 arranged on the upper surface of the silicon gel 5, a lower shell wiring layer 8 arranged in the lower shell 2, the gold wires 7 arranged between the MEMS silicon-based pressure chip 3 and the ASIC circuit conditioning chip 4 and between the ASIC circuit conditioning chip 4 and the lower shell wiring layer 8, a connecting block 9 fixedly connected to the upper end of the lower shell 2, the connecting block 9 being in contact with the upper air nozzle 1, and a limiting mechanism 10 arranged in the upper air nozzle 1.

[0020] Please refer to Figure 3 The limiting mechanism 10 comprises a sliding groove 101, the sliding groove 101 is arranged in the connecting block 9, a limiting block 102 is slidably connected in the sliding groove 101, the limiting block 102 is slidably connected with the upper air nozzle 1, a supporting ring 103 is fixedly connected to the end of the limiting block 102 away from the sliding groove 101, a pull rod 104 is fixedly connected to the side of the supporting ring 103 away from the limiting block 102, a handle 105 is fixedly connected to the end of the pull rod 104 away from the supporting ring 103, the handle is designed to facilitate pulling the pull rod 104, a spring 106 is arranged in the upper air nozzle 1, one end of the spring 106 is fixedly connected with the supporting ring 103, and the other end of the spring 106 is fixedly connected with the upper air nozzle 1, the spring 106 is designed to make the supporting ring 103 have elastic force.

[0021] Please refer to Figure 3 , Figure 4The inside of the upper air nozzle 1 is slidably connected with a pull rod 104, the outer side of the pull rod 104 is fixedly connected with a sliding block 107, the sliding block 107 is in contact with the upper air nozzle 1, the inside of the sliding block 107 is provided with a clamping groove 108, the inside of the clamping groove 108 is slidably connected with a clamping block 109, the inside of the upper air nozzle 1 is provided with an elastic sponge 1010, one end of the elastic sponge 1010 is fixedly connected with the clamping block 109, the other end of the elastic sponge 1010 is fixedly connected with the upper air nozzle 1, by designing the elastic sponge 1010, the clamping block 109 has elastic force, the inside of the upper air nozzle 1 is provided with a sliding groove 1011, the inside of the sliding groove 1011 is slidably connected with a guide block 1012, the guide block 1012 is fixedly connected with the clamping block 109, by designing the guide block 1012, the clamping block 109 can be guided, the clamping block 109 is slidably connected with the upper air nozzle 1, by pulling the handle 105 to drive the limiting block 102 to move, after the limiting block 102 moves to a specified position, then the upper air nozzle 1 is moved to drive the limiting block 102 and other components to move to a specified position on the lower shell 2, then the handle 105 is loosened to reset the limiting block 102 to move to the sliding groove 101, and then the upper air nozzle 1 and the lower shell 2 are limited, so that the device connection is more stable.

[0022] The utility model discloses a specific implementation process as follows: when the device is used, the MEMS silicon base pressure chip 3 is attached to the lower shell 2 with the ASIC circuit conditioning chip 4, the MEMS silicon base pressure chip 3, the ASIC circuit conditioning chip 4 are connected with the lower shell 2 through organic silica gel, the whole of the MEMS silicon base pressure chip 3, the ASIC circuit conditioning chip 4 and the lower shell 2 is put into the high temperature oven 150 DEG C and solidifies 30 minutes, then the ASIC circuit conditioning chip 4 is connected with the lower shell wiring layer 8 through the gold wire 7, the MEMS silicon base pressure chip 3 is connected with the ASIC circuit conditioning chip 4 through the gold wire 7, the silicon gel 5 is injected into the lower shell 2, the silicon gel 5 completely covers the MEMS silicon base pressure chip 3, the ASIC circuit conditioning chip 4 and the gold wire 7, the vacuum oven is used to vacuumize, the silicon gel 5 is completely solidified for 30 minutes with 150 DEG C, finally the liquid polyimide before solidification is sprayed and covered on the silicon gel 5, finally the polyimide film 6 is formed by solidifying 2h at 220 DEG C, the handle 105 is moved to the direction away from the upper air nozzle 1, the handle 105 moves to drive the pull rod 104 to move, the pull rod 104 moves to drive the sliding block 107 and the support ring 103 to move, the sliding block 107 moves to drive the clamping groove 108 to move, the clamping groove 108 moves and the clamping block 109 are dislocated, and then the clamping block 109 moves to the direction close to the elastic sponge 1010, the clamping block 109 moves to drive the guide block 1012 to move, the clamping block 109 moves to make the elastic sponge 1010 compress, the support ring 103 moves to drive the limiting block 102 to move, the support ring 103 moves to make the spring 106 compress, after the limiting block 102 moves to the specified position, the elastic force of the elastic sponge 1010 pushes the clamping block 109 to move, the clamping block 109 drives the guide block 1012 to move to the specified position, then the upper air nozzle 1 moves to drive the handle 105 and the limiting block 102 and other components to move to the specified position on the lower shell 2, then the handle 105 is loosened, the elastic force of the spring 106 pushes the support ring 103 to move, the support ring 103 moves to drive the pull rod 104 and the limiting block 102 to move, the pull rod 104 moves to drive the sliding block 107 and the handle 105 to move, the sliding block 107 moves to drive the clamping groove 108 to move, the sliding block 107 moves and contacts the clamping block 109, and then the clamping block 109 moves to the direction close to the elastic sponge 1010, the clamping block 109 moves to drive the guide block 1012 to move, the clamping block 109 moves to make the elastic sponge 1010 compress, after the limiting block 102 moves into the sliding slot 101, the elastic force of the elastic sponge 1010 pushes the clamping block 109 to move into the clamping groove 108, and then the upper air nozzle 1 and the lower shell 2 are limited, the device connection is more stable, the lower shell 2 is bonded with the upper air nozzle 1 with epoxy resin glue, finally put into the high temperature oven 120 DEG C and solidifies 1 hour, make the direct contact of the silicon gel 5 with the organic solvent volatile gas of strong solubility and the strong oxidizing volatile gas, the silicon gel 5 is modified with the excellent chemical resistance of polyimide,Increase the service life of the device in the more corrosive environment.

[0023] Although the embodiments of the present application have been shown and described, it is to be understood that various changes, modifications, substitutions and alterations can be made to these embodiments without departing from the principles and spirit of the present application, the scope of which is defined by the appended claims and their equivalents.

Claims

1. A pressure sensor resistant to corrosion and to organic solvents, comprising an upper gas nozzle (1), characterized in that: The lower end of the upper air nozzle (1) is bonded with a lower shell (2), the inner bottom end of the lower shell (2) is bonded with a MEMS silicon-based pressure chip (3), the inner bottom end of the lower shell (2) is bonded with an ASIC circuit conditioning chip (4), the inside of the lower shell (2) is provided with a silica gel (5) covering the MEMS silicon-based pressure chip (3), the ASIC circuit conditioning chip (4) and the gold wire (7), the upper surface of the silica gel (5) is provided with a polyimide film (6), the inside of the lower shell (2) is provided with a lower shell wiring layer (8), the gold wire (7) is arranged between the MEMS silicon-based pressure chip (3) and the ASIC circuit conditioning chip (4), and between the ASIC circuit conditioning chip (4) and the lower shell wiring layer (8), the upper end of the lower shell (2) is fixedly connected with a connecting block (9), the connecting block (9) is in contact with the upper air nozzle (1), and the inside of the upper air nozzle (1) is provided with a limiting mechanism (10).

2. A corrosion and organic solvent resistant pressure sensor according to claim 1, wherein: The limiting mechanism (10) comprises a sliding groove (101), the inside of the connecting block (9) is provided with a sliding groove (101), the inside of the sliding groove (101) is slidably connected with a limiting block (102), the limiting block (102) is slidably connected with the upper air nozzle (1), one end of the limiting block (102) away from the sliding groove (101) is fixedly connected with a supporting ring (103), one side of the supporting ring (103) away from the limiting block (102) is fixedly connected with a pull rod (104), the inside of the upper air nozzle (1) is provided with a spring (106), the inside of the upper air nozzle (1) is slidably connected with the pull rod (104), the outer side of the pull rod (104) is fixedly connected with a sliding block (107), the sliding block (107) is in contact with the upper air nozzle (1), the inside of the sliding block (107) is provided with a clamping groove (108), the inside of the clamping groove (108) is slidably connected with a clamping block (109), the inside of the upper air nozzle (1) is provided with a resilient sponge (1010), the inside of the upper air nozzle (1) is provided with a sliding groove (1011), and the clamping block (109) is slidably connected with the upper air nozzle (1).

3. A corrosion and organic solvent resistant pressure sensor according to claim 2, wherein: One end of the pull rod (104) away from the supporting ring (103) is fixedly connected with a handle (105).

4. A corrosion and organic solvent resistant pressure sensor according to claim 2, wherein: One end of the spring (106) is fixedly connected with the supporting ring (103), and the other end of the spring (106) is fixedly connected with the upper air nozzle (1).

5. A corrosion and organic solvent resistant pressure sensor according to claim 2, wherein: One end of the resilient sponge (1010) is fixedly connected with the clamping block (109), and the other end of the resilient sponge (1010) is fixedly connected with the upper air nozzle (1).

6. A corrosion and organic solvent resistant pressure sensor according to claim 2, wherein: The inside of the sliding groove (1011) is slidably connected with a guide block (1012), and the guide block (1012) is fixedly connected with the clamping block (109).

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