Air-cooled heat dissipation shell, domain controller and vehicle
By using an inclined fan and an air-cooled heatsink housing with staggered heat dissipation fins, the problem of low heat dissipation efficiency of domain controllers is solved, achieving efficient heat dissipation and volume reduction within a limited space.
Patent Information
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- Filing Date
- 2025-03-13
- Publication Date
- 2026-03-24
AI Technical Summary
Existing air-cooling methods cannot efficiently dissipate heat in domain controllers, and large fans cannot be placed in limited spaces, resulting in low heat dissipation efficiency.
The air-cooled heat dissipation housing is designed with an inclined fan, and the fan rotation axis forms an acute angle with the second surface. Combined with the staggered heat dissipation fins and components, a cooling airflow is formed, and the fan airflow blows directly to the heat source concentration area. Heat dissipation fins are erected around the fan housing area to increase the heat dissipation area.
Improve heat dissipation efficiency within a limited space, reduce the size of the domain controller, enhance heat dissipation uniformity and efficiency, and reduce costs.
Smart Images
Figure CN224037687U_ABST
Abstract
Description
Technical Field
[0001] This utility model relates to a heat dissipation structure, and more particularly to a heat dissipation housing for a domain controller. Background Technology
[0002] As the application areas of domain controllers continue to expand, the requirements for domain controllers are becoming more diversified, and the pace of updates and iterations is very rapid. Currently, low-end domain controllers are increasingly evolving into mid-to-high-end models, and the corresponding thermal power consumption is also increasing. Therefore, it is particularly important to know how to quickly and evenly dissipate heat from the domain controller to meet its operating temperature requirements and ensure stable operation.
[0003] Currently, domain controllers are typically cooled using either air cooling or liquid cooling. Liquid cooling solutions have limitations because they require internal piping within the vehicle. Current air cooling solutions usually involve axial fans blowing directly from the side of the domain controller housing or from the top downwards. This configuration occupies considerable space, limiting the placement of higher-power or larger fans within the limited size of the domain controller. Utility Model Content
[0004] One of the purposes of this invention is to provide a wind-cooled heat dissipation housing that can accommodate a larger fan within a limited space, thereby improving heat dissipation efficiency.
[0005] To achieve the above objectives, this utility model proposes a wind-cooled heat dissipation housing, which has a first surface facing the electronic device and a second surface opposite to the first surface. The second surface has a fan housing area, in which a fan is provided. The rotation axis of the fan forms an acute angle with the second surface.
[0006] Furthermore, in the air-cooled heat dissipation housing described in this utility model, a plurality of heat dissipation fins are vertically arranged around the fan housing area.
[0007] Furthermore, in the air-cooled heat dissipation housing described in this utility model, the height of the fan is lower than or equal to the height of the heat dissipation fins.
[0008] Furthermore, in the air-cooled heat dissipation housing described in this utility model, each heat dissipation fin is arranged parallel to each other to form a cooling airflow channel between adjacent heat dissipation fins.
[0009] Furthermore, in the air-cooled heat dissipation housing described in this utility model, the second surface is also provided with a plurality of heat dissipation elements, the heat dissipation elements comprising a plurality of columns respectively disposed in the cooling air duct, wherein the heat dissipation elements in each column are arranged non-collinearly and alternately.
[0010] Furthermore, in the air-cooled heat dissipation housing described in this utility model, the rotation axis of the fan points from top to bottom towards the area where the heat dissipation element is located.
[0011] Furthermore, in the air-cooled heat dissipation housing described in this utility model, the second surface is also provided with a plurality of heat dissipation elements, and the rotation axis of the fan points from top to bottom to the area where the heat dissipation elements are located.
[0012] Furthermore, in the air-cooled heat dissipation housing described in this utility model, the heat dissipation element includes a heat dissipation column.
[0013] Furthermore, in the air-cooled heat dissipation housing of this utility model, the first surface has a heat dissipation boss for heat exchange connection with electronic devices, and the heat dissipation element is disposed on the second surface at a position corresponding to the heat dissipation boss.
[0014] Furthermore, in the air-cooled heat dissipation housing described in this utility model, a heat-conducting element is provided on the heat dissipation protrusion.
[0015] Another objective of this invention is to provide a domain controller with excellent heat dissipation performance and a compact structure.
[0016] To achieve the above objectives, the present invention also provides a domain controller, which includes a heat dissipation housing as described above and a printed circuit board assembly disposed within the heat dissipation housing, wherein the printed circuit board assembly includes a printed circuit board and electronic devices disposed thereon.
[0017] Another object of this invention is to provide a vehicle having a domain controller as described above.
[0018] The air-cooled heat dissipation housing described in this utility model can accommodate a larger fan within a limited space, thereby improving heat dissipation efficiency. Attached Figure Description
[0019] Figure 1 The image shows a top view of one embodiment of the air-cooled heat dissipation housing described in this utility model.
[0020] Figure 2 for Figure 1 Sectional view at point AA.
[0021] Figure 3 The diagram shows a partial schematic of the split structure of the air-cooled heat dissipation housing according to one embodiment of the present invention.
[0022] Figure 4 The diagram shows a three-dimensional structural schematic of the air-cooled heat dissipation housing according to one embodiment of the present invention.
[0023] Figure 5 The diagram shows a split structure of the domain controller described in this invention in one embodiment. Detailed Implementation
[0024] The air-cooled heat dissipation housing, domain controller, and vehicle described in this utility model will be further explained and described below with reference to the accompanying drawings and specific embodiments. However, such explanation and description do not constitute an undue limitation on the technical solution of this utility model.
[0025] Currently, domain controllers that use air cooling typically employ axial fans that blow air directly from the side or from the top down to dissipate heat.
[0026] However, for domain controllers with concentrated heat sources, neither direct airflow method can concentrate the airflow towards the heat source, thus failing to efficiently utilize thermal convection for heat dissipation. Moreover, in the relatively confined space where domain controllers are placed, either side-blowing or top-down direct airflow methods require a larger domain controller volume.
[0027] To address the aforementioned problems, this utility model proposes an air-cooled heat dissipation shell in one embodiment.
[0028] Figure 1 The image shows a top view of one embodiment of the air-cooled heat dissipation housing described in this utility model.
[0029] Figure 2 for Figure 1 Sectional view at point AA.
[0030] like Figure 1 and Figure 2 As shown, in some embodiments, the air-cooled heat sink 100 has a first surface 101 facing the electronic device and a second surface 102 opposite to the first surface.
[0031] like Figure 3 As shown, the second surface 102 has a fan accommodating region P, such as Figure 1 and Figure 2As shown, a fan 200, such as an axial fan, is provided within the fan housing area. The rotation axis Z of the fan 200 forms an acute angle α with the second surface 102. That is, in this embodiment, the fan is tilted, rather than blowing directly onto the second surface from the side or from top to bottom. This arrangement allows for efficient heat dissipation of the domain controller through thermal convection and significantly reduces the fan housing area required for the fan. This allows for increasing the size of the fan, especially the fan blades, within the same space, thereby improving heat dissipation power. Alternatively, the volume of the air-cooled heatsink housing can be reduced while using a fan of the same specifications, thus saving space occupied by the domain controller.
[0032] like Figure 3 As shown, in some more specific embodiments, the fan 200 can be disposed in the fan receiving area of the second surface via a connector 201, such as a fastening bolt.
[0033] like Figure 3 As shown, in some more specific embodiments, a number of heat dissipation fins 300 are vertically provided around the fan housing area P, thereby further increasing the heat dissipation area of the air-cooled heat dissipation housing.
[0034] like Figure 2 As shown, in some more specific embodiments, the height of the fan 200, located within the fan housing area, is lower than or equal to the height of the heat sink 300. Since the fan 200 is placed at an angle within the space enclosed by the heat sink 300, it does not encroach on the PCB (printed circuit board) area of the domain controller. This reduces the overall height requirement for the heat sink fins, further reducing the housing volume and thus compressing the overall size of the domain controller, while simultaneously lowering product costs.
[0035] like Figure 1 , Figure 3 and Figure 4 As shown, in some more specific embodiments, in the air-cooled heat dissipation housing of this utility model, each heat dissipation fin 300 is arranged parallel to each other to form a cooling airflow channel Q between adjacent heat dissipation fins.
[0036] like Figure 1 , Figure 2 ,like Figure 3 and Figure 4 As shown, in some preferred embodiments, the second surface 102 of the air-cooled heat sink is further provided with a plurality of heat dissipation elements 400. The heat dissipation elements 400 can further increase the heat dissipation surface area of the air-cooled heat sink, thereby further improving the heat dissipation effect.
[0037] like Figure 1 , Figure 2 ,like Figure 3 and Figure 4 As shown, in some preferred embodiments, the heat dissipation element 400 may include a heat dissipation column extending in the height direction, that is, the heat dissipation element is configured as a basically columnar structure. This structure can increase the heat dissipation area while providing a turbulence effect, thereby further improving the heat dissipation effect of the air-cooled airflow.
[0038] In some more specific implementations, such as Figure 1 , Figure 3 and Figure 4 As shown, these heat dissipation elements 400 are arranged in several columns, each column corresponding to a cooling air duct Q, wherein the heat dissipation elements 400 in each column are arranged non-collinearly and alternately. This arrangement can work in conjunction with the cooling air duct to further enhance the turbulence effect, thereby further improving the heat dissipation effect of the air-cooled airflow.
[0039] like Figure 2 As shown, in some more specific embodiments, the fan's rotation axis Z points downwards towards the area where the heat dissipation element 400 is located. This arrangement allows the airflow generated by the fan 200 to be quickly and directly directed towards the concentrated heat source, thereby improving the overall heat dissipation efficiency and capacity of the heat sink.
[0040] like Figure 2 As shown, in some more specific embodiments, the first surface 101 of the air-cooled heat sink 100 has heat dissipation protrusions 105 for thermally exchanging connections with electronic devices (not shown), such as the main chip of a printed circuit board. This arrangement allows for almost simultaneous cooling of various electronic devices on the printed circuit board, improving cooling efficiency and ensuring cooling uniformity. Simultaneously, heat dissipation elements 400 can be positioned on the second surface 102 corresponding to the heat dissipation protrusions 105. This arrangement effectively increases the heat dissipation area in regions with concentrated heat dissipation needs.
[0041] In some more specific embodiments, the surface of the heat dissipation boss 105 may also be provided with a heat-conducting element 500 for direct contact with electronic devices. The heat-conducting element can reduce thermal resistance, thereby further improving the heat conduction effect.
[0042] In some more specific embodiments, the thermally conductive element may include a thermally conductive silicone grease layer. Those skilled in the art can select the thermal conductivity of the thermally conductive grease according to actual needs; generally, the higher the thermal conductivity of the thermally conductive grease, the more beneficial it is for heat dissipation. Of course, in other more specific embodiments, the thermally conductive layer may also include thermally conductive putty, thermally conductive gel, thermally conductive double-sided adhesive, thermally conductive graphite sheet, or similar thermally conductive elements.
[0043] Therefore, it can be seen that the present invention adopts the method of tilting the fan, which allows for the placement of a larger fan in a limited space.
[0044] In some preferred embodiments, the tilted fan, in conjunction with multiple staggered heat dissipation elements, can specifically dissipate heat from concentrated heat sources, further improving heat dissipation efficiency.
[0045] In a preferred embodiment, the angled fan directs the staggered heat dissipation elements within the cooling airflow channel formed by the heat sink fins. This effectively directs the airflow generated by the fan quickly and directly towards the heat source concentration area, efficiently utilizing thermal convection to cool the domain controller. Furthermore, since the fan is angled within the heat sink fins of the domain controller, it does not encroach on the PCB board surface area, and the overall height requirement for the heat sink fins can be reduced, effectively compressing the overall size of the domain controller and achieving multiple beneficial effects.
[0046] In another embodiment, the present invention also provides a domain controller having a heat-dissipating housing as described above and a printed circuit board assembly disposed within the heat-dissipating housing.
[0047] Figure 5 The diagram shows a split structure of the domain controller described in this invention in one embodiment.
[0048] like Figure 5 As shown, the domain controller includes a heat sink housing and a printed circuit board assembly 600 disposed within the heat sink housing. The printed circuit board assembly 600 includes a printed circuit board and electronic devices 601 disposed thereon.
[0049] In this invention, the printed circuit board (PCB) of the domain controller can be a printed circuit board integrating various electronic components. Furthermore, the number of printed circuit boards in this invention is not limited to one; multiple printed circuit boards can be disposed within the housing.
[0050] In this invention, the electronic devices on the printed circuit board can be a system on a chip (SOC), or other electronic components that generate heat and consume power, such as resistors, capacitors, inductors, diodes, and transistors.
[0051] For ease of installation, the air-cooled heat dissipation housing includes an upper cover 110 and a lower cover 120 connected to the upper cover via a housing connector 130.
[0052] In some more specific embodiments, the fan housing area P, fan 200, heat dissipation fins 300, and heat dissipation element 400 of the aforementioned air-cooled heat sink are all disposed on the upper cover. Of course, in other embodiments, these features may also be disposed on the lower cover.
[0053] In some more specific embodiments, a heat dissipation protrusion 105 is provided on the side of the top cover facing the printed circuit board, and a heat conduction element 500 is disposed between the electronic device and the heat dissipation protrusion to further reduce thermal resistance and thereby further improve the heat conduction effect.
[0054] In this invention, the domain controller can be a vehicle domain controller, which is used for vehicle status control and status monitoring, including but not limited to an in-vehicle mobile data center, a hardware monitor (HMI) that implements human-machine interface controller functions, an in-vehicle entertainment (IVI) controller, a body control module (BCM), and a vehicle control unit (VCU).
[0055] The domain controller described in this invention can be used in vehicles, for example, in the automated driving of intelligent vehicles. Intelligent vehicles may include electric vehicles or gasoline-powered vehicles that support unmanned driving, driver assistance systems (ADAS), intelligent driving, connected driving, intelligent network driving, and car sharing.
[0056] Therefore, in another embodiment, this invention also provides a vehicle having the domain controller described above. Since this invention does not improve other components of the vehicle, these components will not be described in detail here.
[0057] It should be noted that the prior art within the scope of protection of this utility model is not limited to the embodiments given in this utility model document. All prior art that does not contradict the solution of this utility model, including but not limited to prior patent documents, prior publications, prior public uses, etc., can be included in the scope of protection of this utility model.
[0058] Furthermore, the combination of the technical features in this case is not limited to the combination methods described in the claims of this case or the combination methods described in the specific embodiments. All technical features described in this case can be freely combined or combined in any way, unless they contradict each other.
[0059] It should also be noted that the embodiments listed above are merely specific embodiments of this utility model. Obviously, this utility model is not limited to the above embodiments, and any similar changes or modifications made thereto that can be directly derived or easily conceived by those skilled in the art from the content disclosed in this utility model should fall within the protection scope of this utility model.
Claims
1. A wind-cooled heat dissipation housing having a first surface (101) facing an electronic device and a second surface (102) opposite to the first surface, characterized in that, The second surface has a fan housing area (P), in which a fan (200) is provided, and the rotation axis (Z) of the fan forms an acute angle (α) with the second surface.
2. The air-cooled heat dissipation housing as described in claim 1, characterized in that, Several heat dissipation fins (300) are vertically arranged around the fan housing area.
3. The air-cooled heat dissipation housing as described in claim 1, characterized in that, The height of the fan is less than or equal to the height of the heat sink fins.
4. The air-cooled heat dissipation housing as described in claim 2, characterized in that, The heat dissipation fins are arranged parallel to each other to form a cooling airflow (Q) between adjacent heat dissipation fins.
5. The air-cooled heat dissipation housing as described in claim 4, characterized in that, The second surface is also provided with a plurality of heat dissipation elements (400) erected thereon. The heat dissipation elements include a plurality of columns respectively disposed in the cooling air duct, wherein the heat dissipation elements in each column are arranged non-collinearly and alternately.
6. The air-cooled heat dissipation housing as described in claim 5, characterized in that, The fan's rotation axis points downwards towards the area where the heat dissipation element is located.
7. The air-cooled heat dissipation housing as described in claim 1, characterized in that, The second surface is also provided with a plurality of heat dissipation elements (400) erected thereon, and the rotation axis of the fan points from top to bottom toward the area where the heat dissipation elements are located.
8. The air-cooled heat dissipation housing as described in claim 5 or 7, characterized in that, The heat dissipation element includes a heat dissipation column.
9. The air-cooled heat dissipation housing as described in claim 5 or 7, characterized in that, The first surface has a heat dissipation boss (105) for thermally exchanging with electronic devices, and the heat dissipation element is disposed on the second surface at a position corresponding to the heat dissipation boss.
10. The air-cooled heat dissipation housing as described in claim 9, characterized in that, The heat dissipation boss is provided with a heat-conducting element (500).
11. A domain controller, characterized in that, It includes a heat dissipation housing as described in any one of claims 1-10 and a printed circuit board assembly (600) disposed within the heat dissipation housing, the printed circuit board assembly including a printed circuit board and electronic devices (601) disposed thereon.
12. A vehicle, characterized in that, It has a domain controller as described in claim 11.