Polishing device for silicon wafer production
By using a cylinder to drive the polishing mechanism in conjunction with protective components and a pressure sensor, the problem of silicon wafer damage caused by inaccurate polishing head positioning is solved, achieving high-precision polishing and cost reduction.
Patent Information
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- Filing Date
- 2025-04-21
- Publication Date
- 2026-03-27
AI Technical Summary
In existing technologies, it is difficult to accurately position the polishing head at the height of the silicon wafer, which leads to damage to the silicon wafer surface, affects the polishing effect, and increases production costs.
The polishing mechanism is driven by a cylinder, combined with protective components and a pressure sensor. Through the cooperation of the ring and the threaded rod, the polishing head is kept at an appropriate distance from the silicon wafer surface to prevent damage from excessive pressure.
It effectively prevents the polishing head from excessively pressing on the silicon wafer surface, improves processing accuracy, reduces silicon wafer breakage, and lowers production costs.
Smart Images
Figure CN224043444U_ABST
Abstract
Description
Technical Field
[0001] This utility model relates to the field of silicon wafer polishing technology, and in particular to a polishing device for silicon wafer production. Background Technology
[0002] Polishing is the final processing step in silicon wafer production, and this step requires the use of polishing equipment.
[0003] In the prior art, when polishing silicon wafers, the wafers are fixed and clamped to ensure the stability of the polishing process. However, when the wafers are fixed, their position is fixed. If polishing is then performed, it is difficult for the polishing head to be accurately positioned at the height of the wafer, which can easily damage the surface of the wafer and affect the polishing effect.
[0004] In related technologies, by setting a movable limiting ring and a spring structure, when the polishing head is adjusted downwards, the polishing head contacts the top of the limiting ring, compressing the spring at the bottom of the limiting ring until the top of the limiting ring is at the same level as the top of the silicon wafer, reducing the squeezing force on the silicon wafer surface. However, during operation, since the limiting ring can move freely up and down inside the base, once the top of the limiting ring is at the same level as the silicon wafer, if the polishing head is adjusted downwards further, the spring at the bottom of the limiting ring cannot provide support, and the downward pressure of the polishing head will still be concentrated on the top of the silicon wafer, causing damage to the silicon wafer, resulting in a decrease in silicon wafer yield and an increase in production costs. Utility Model Content
[0005] The purpose of this invention is to provide a polishing device for silicon wafer production to solve the problems mentioned in the background art.
[0006] The technical solution adopted in this utility model is:
[0007] A polishing apparatus for silicon wafer production, comprising:
[0008] The frame is installed on top of the base;
[0009] The cylinder is fixedly installed on the top of the frame.
[0010] A polishing mechanism, located at the bottom of the cylinder, is used for polishing silicon wafers;
[0011] A protective component is provided below the polishing mechanism; the protective component includes:
[0012] The base body is fixedly connected to the top of the base and is used to support the silicon wafer;
[0013] A ring body is slidably connected to the top of the base and is arranged around the base body;
[0014] A first guide rod is fixedly connected to the inside of the base, and the first guide rod is in sliding connection with the ring body;
[0015] A spring is sleeved on the outside of the first guide rod to provide elastic force for upward resetting of the ring body;
[0016] A threaded rod is threadedly connected to one side of the ring body;
[0017] A collecting box is fixedly connected to the top of the base, the threaded rod penetrates through the collecting box and is in sliding fit with the collecting box, and the threaded rod is used for limiting the ring body.
[0018] Optionally, the auxiliary assembly is arranged on one side of the collecting box and is used for assisting in adjusting the height of the ring body.
[0019] Optionally, the auxiliary assembly comprises:
[0020] A sliding block is in sliding connection with the inside of the collecting box;
[0021] A second guide rod is fixedly connected to the inside of the collecting box, and the second guide rod is in sliding connection with the sliding block;
[0022] A plate body is fixedly connected to one side of the sliding block, and one end of the plate body extends to the outside of the collecting box and is in sliding connection with the collecting box;
[0023] A rod body is in sliding connection with one side of the collecting box, and the rod body is clamped by the sliding block in the inside of the collecting box.
[0024] Optionally, the bottom of the sliding block is provided with an inclined surface, and the top of the rod body is provided with a groove which is the same in size and shape as the bottom of the sliding block.
[0025] Optionally, the top of the collecting box is provided with a sliding groove which is the same in width as the rod body.
[0026] Optionally, one side of the rod body is fixedly connected with a rubber pad.
[0027] Optionally, the first guide rod and the spring form a group, and the bottom of the ring body is provided with a plurality of groups.
[0028] Optionally, one end of the threaded rod extends to the outside of the collecting box and is fixedly connected with an adjusting head, and the outside of the adjusting head is provided with a friction pad.
[0029] Optionally, the top of the ring body is fixedly provided with a pressure sensor.
[0030] Compared with the prior art, the utility model has the beneficial effects that:
[0031] After the silicon wafer is fixed, the ring body can drive the threaded rod to slide downward by pushing the ring body downward, when the top of the ring body is at the same height as the silicon wafer, the threaded rod is tightened, so that the adjusting head at one end of the threaded rod is tightly abutted against the edge of the collection box, thereby limiting the movement of the threaded rod and the ring body through the friction force, and then the top of the ring body and the silicon wafer are at the same height, during polishing, the ring body abuts against the bottom of the grinding disc at the bottom of the polishing mechanism under the limitation of the threaded rod, thereby preventing the grinding disc at the bottom of the polishing mechanism from being adjusted excessively, causing the surface of the silicon wafer to be damaged, effectively preventing the silicon wafer from being damaged due to excessive polishing pressure, and improving the processing precision. BRIEF DESCRIPTION OF DRAWINGS
[0032] In order to more clearly illustrate the technical solutions in the embodiments of the present application or the prior art, the drawings needed to be used in the embodiments or the prior art description will be briefly introduced below. Obviously, the drawings in the following description are only some embodiments of the present application, and other drawings can also be obtained by those skilled in the art without creative labor.
[0033] Fig. 1 It is a schematic diagram of the overall structure in the present application;
[0034] Fig. 2 It is a schematic diagram of the structure of one side in the present application;
[0035] Fig. 3 It is a schematic diagram of the internal structure of the protection assembly in the present application
[0036] Fig. 4 It is a schematic diagram of the structure when the rod body is used in the present application;
[0037] Fig. 5 It is a schematic diagram of the structure of the slide block, the second guide rod and the plate body in the present application;
[0038] Fig. 6 It is a schematic diagram of the structure of the polishing mechanism in the present application.
[0039] Reference signs:
[0040] 1, frame body; 2, air cylinder; 3, polishing mechanism;
[0041] 4, protection assembly; 41, seat body; 42, ring body; 43, first guide rod; 44, spring; 45, threaded rod; 46, collection box;
[0042] 5, auxiliary assembly; 51, slide block; 52, second guide rod; 53, plate body; 54, rod body;
[0043] 6, pressure sensor. DETAILED DESCRIPTION
[0044] In the description of the utility model, it is understood that the orientation or positional relationship indicated by the terms "center", "longitudinal", "transverse", "length", "width", "thickness", "upper", "lower", "front", "rear", "left", "right", "vertical", "horizontal", "top", "bottom", "inner", "outer", "clockwise", "counterclockwise", "axial", "radial", "circumferential" is based on the orientation or positional relationship shown in the drawings, or is the orientation or positional relationship commonly used when the utility model product is used, or is the orientation or positional relationship commonly understood by those skilled in the art, and is only for the convenience of describing the utility model and simplifying the description, and therefore cannot be understood as indicating or implying that the indicated device or element must have a particular orientation, be constructed and operated in a particular orientation, and therefore cannot be understood as limiting the utility model.
[0045] In addition, the terms "first" and "second" are only for descriptive purposes and cannot be understood as indicating or implying relative importance or implicitly indicating the number of indicated technical features. Therefore, the features defined as "first" and "second" can explicitly or implicitly include one or more of the features. In the description of the utility model, the meaning of "multiple" is two or more, unless otherwise explicitly specified.
[0046] In view of the related art, by setting a movable limiting ring and a spring structure, when the polishing head is adjusted downward, the polishing head contacts the top of the limiting ring, the spring at the bottom end of the limiting ring is compressed, until the top of the limiting ring is at the same height as the top of the silicon wafer, and the extrusion force on the surface of the silicon wafer is reduced, but during operation, since the limiting ring can move freely up and down inside the base, when the top of the limiting ring is at the same height as the silicon wafer, the polishing head is continuously adjusted downward, the spring at the bottom of the limiting ring cannot support, and the downward pressure of the polishing head will still be concentrated on the top of the silicon wafer, thereby causing damage to the silicon wafer, reducing the yield of the silicon wafer, and increasing the production cost.
[0047] As shown in Figs. 1-6 The utility model discloses a polishing device for silicon wafer production, which comprises a frame body 1, an air cylinder 2 and a polishing mechanism 3 and the like.
[0048] The frame body 1 is fixedly welded on the base, and the top of the frame body 1 is fixedly connected with the bottom of the air cylinder 2. The output shaft at the bottom of the air cylinder 2 penetrates through the top of the frame body 1 and is tightly connected with the top of the polishing mechanism 3. The top of the polishing mechanism 3 is a motor, which is electrically connected with an external power supply. The output end of the motor is fixedly connected with a grinding disc at the bottom of the polishing mechanism, which is used for polishing the surface of the silicon wafer.
[0049] In use, the silicon wafer is fixed on the base, the cylinder 2 is started to push down the polishing mechanism 3 until the polishing mechanism bottom's grinding disc is attached to the top of the silicon wafer, then the motor is started to drive the polishing mechanism bottom's grinding disc to rotate, the polishing liquid is scattered through the polishing mechanism bottom's grinding disc, the sodium hydroxide in the polishing liquid plays a role of chemical corrosion to make the silicon wafer surface generate silicate steel salt, the silicon wafer is mechanically rubbed by the silica colloid, and then is taken away by the polishing liquid, so that the surface of the silicon wafer is polished.
[0050] Further, in order to reduce the damage to the silicon wafer caused by excessive adjustment when the polishing mechanism 3 is adjusted downward, the polishing device is further provided with a protection assembly 4.
[0051] Specifically, as shown in Figs. 1-3 the protection assembly 4 includes a seat body 41, a ring body 42 and a first guide rod 43.
[0052] The seat body 41 is fixed on the top of the base, the seat body 41 supports the silicon wafer, and the top of the seat body 41 is provided with a vacuum adsorption structure, an adsorption force is generated by a vacuum pump to make the silicon wafer directly attached to the disc surface, so as to fix the silicon wafer (not shown in the figure), the ring body 42 is located outside the seat body 41 and is in sliding connection with the base, the ring body 42, the first guide rod 43 and the spring 44 cooperate with each other to realize the sliding of the ring body 42 in the vertical direction along the first guide rod 43, and after the ring body 42 is loosened, the ring body 42 will slide upward under the action of the spring 44, at the same time, the top of the first guide rod 43 is provided with a limiting head, the diameter of the limiting head is larger than that of the first guide rod 43 and is in sliding connection with the inside of the ring body 42, which is used to prevent the first guide rod 43 from sliding out of the inside of the ring body 42, the threaded rod 45 is in threaded connection with one side of the ring body 42, after the silicon wafer is fixed, the ring body 42 is pushed downward, so that the threaded rod 45 slides downward together with the ring body 42, the periphery of the ring body 42 is provided with a collecting box 46 which is fixedly connected with the base, after the top of the ring body 42 is at the same height as the silicon wafer, the threaded rod 45 is tightened, so that the adjusting head at one end of the threaded rod 45 tightly abuts against the edge of the collecting box 46, thereby limiting the movement of the threaded rod 45 and the ring body 42 through the friction force, and further making the top of the ring body 42 and the silicon wafer at the same height, the top of the ring body 42 is fixedly connected with a fixing block (symmetrically arranged with the pressure sensor 6 on the figure), when the polishing mechanism 3 is adjusted by the cylinder 2, the fixing block at the top of the ring body 42 abuts against the edge of the bottom surface of the polishing mechanism bottom's grinding disc to prevent the polishing mechanism bottom's grinding disc from being excessively adjusted and causing the surface of the silicon wafer to be damaged, the center of the grinding disc is provided with a cylindrical protrusion, the diameter of the protrusion is smaller than the inner diameter of the ring body 42, the surface of the protrusion is covered with a flexible porous polishing cloth made of polyester or polyurethane, and is attached to the surface of the fixed silicon wafer to cooperate with the silica colloid and sodium hydroxide in the polishing liquid to polish the surface of the silicon wafer.
[0053] Furthermore, in order to facilitate the adjustment of the ring 42 and the top of the silicon wafer to the same height, the polishing device is also equipped with an auxiliary component 5.
[0054] Specifically, such as Figs. 4-5 As shown, the auxiliary component 5 includes structures such as a slider 51, a second guide rod 52, and a plate 53.
[0055] The rod 54 is engaged with one side of the collection box 46 by a slider 51, and has a recessed hole for easy removal of the rod 54. The slider 51 is slidably connected inside the collection box 46 and slidably connected to the second guide rod 52. The plate 53 is fixedly connected to one side of the slider 51, extends to the outside of the collection box 46 and is slidably connected to the collection box 46. By pushing the plate 53 upward, the second guide rod 52 can be slid out of the groove at the top of the rod 54, and then the rod 54 can be pried out from the recessed hole. 4. It is relatively convenient. After fixing the silicon wafer to the top of the base 41, with the rubber pad on one side of the rod 54 facing down, align the rod 54 with the groove on the top of the collection box 46 and insert it downwards. Slowly push the rod 54 downwards until the top of the ring 42 is at the same height as the top of the silicon wafer. Stop moving downwards after the rubber pad at the bottom of the rod 54 contacts the surface of the silicon wafer, ensuring that the ring 42 is aligned with the height of the silicon wafer. The rubber pad is used to buffer the pressure of the rod 54 on the silicon wafer, thereby reducing damage to the silicon wafer. Then tighten the threaded rod 45 to limit the ring 42. The operation is relatively simple. After use, face the rubber pad of the rod 54 towards the collection box 46 and make the groove on the rod 54 at the top. Insert the rod 54 into the groove on one side of the collection box 46. During the insertion process, the edge of the rod 54 will press the inclined surface at the bottom of the slider 51, thereby pushing the slider 51 upward and causing the slider 51 to be retracted into the collection box 46. It also compresses the spring outside the second guide rod 52 to prevent the slider 51 from affecting the continued pushing of the rod 54. When the groove at the top of the rod 54 moves to below the slider 51, the slider 51 is pushed into the inside of the rod 54 by the spring, thereby fixing the rod 54 and facilitating the storage of the rod 54.
[0056] Furthermore, to prevent the cylinder 2 from being over-adjusted, causing the pressure of the polishing mechanism 3 on the ring 42 to be greater than the friction between the threaded rod 45 and the collection box 46, which would cause the ring 42 to slide and the bottom of the polishing mechanism 3 to press against the silicon wafer surface, resulting in damage to the silicon wafer, the polishing device is also equipped with a pressure sensor 6.
[0057] The pressure sensor 6 is fixedly installed on the top of the ring body 42, and the surface of the pressure sensor 6 protrudes above the ring body 42, the width of the pressure sensor 6 is the same as the fixed block on the top of the ring body 42, so that when the polishing mechanism 3 is adjusted downward by the cylinder 2, the edge of the grinding disc at the bottom of the polishing mechanism 3 can preferentially contact the pressure sensor 6 and the fixed block on the top of the ring body 42, the pressure sensor 6 is an electromagnetic force type load cell, when the measured object is placed on the bearing table, one end of the lever inclines upward; the photoelectric element detects the inclination signal, which flows into the coil after amplification, generates electromagnetic force, and makes the lever return to the balanced state. The current generating the electromagnetic balance force is digitally converted, so that the mass of the measured object can be determined, the bottom of the pressure sensor 6 is electrically connected with a signal transmitter, when the pressure sensor 6 is pressed by the grinding disc at the bottom of the polishing mechanism 3, and the value measured by the pressure sensor 6 reaches 10N or more, the signal transmitter sends a stop signal to the control panel of the cylinder 2, so that the cylinder 2 stops working, the common screw friction limiting force is usually 100-300N, so as to avoid that the cylinder 2 continues to adjust the polishing mechanism 3 downward, causing the friction locking of the threaded rod 45 to the ring body 42 to fail, the thickness of the central protrusion at the bottom of the polishing mechanism 3 is equal to the thickness of the pressure sensor 6 and the fixed block on the top of the ring body 42, so as to ensure that the central protrusion can contact the surface of the silicon wafer when the polishing cloth is installed, so as to facilitate the dispersion of the polishing liquid, and realize the polishing of the silicon wafer.
[0058] Finally, it should be noted that: the above only for the preferred embodiments of the present application, and not for limiting the present application, although the present application has been described in detail with reference to the foregoing embodiments, for those skilled in the art, it still can modify the technical solutions recorded in the foregoing embodiments, or make equivalent replacement for part of the technical features. Any modification, equivalent replacement, improvement, etc. made within the spirit and principles of the present application shall be included in the protection scope of the present application.
Claims
1. A polishing apparatus for silicon wafer production, characterized in that, Include: Frame body, installed on the top of the base; Cylinder, fixedly installed on the top of the frame body; Polishing mechanism, provided on the bottom of the cylinder, for polishing silicon wafer; The lower part of the polishing mechanism is provided with a protection assembly; the protection assembly comprises: Seat body, fixedly connected to the top of the base, for supporting silicon wafer; Ring body, slidingly connected to the top of the base, and arranged around the seat body; No. 1 guide rod, fixedly connected to the inside of the base, and the No. 1 guide rod is slidingly connected with the ring body; Spring, sleeved on the outside of the No. 1 guide rod, providing elastic force for upward reset of the ring body; Threaded rod, threadedly connected to one side of the ring body; Collecting box, fixedly connected to the top of the base, the threaded rod penetrates through the collecting box and slidingly cooperates with it, for limiting the ring body.
2. The polishing apparatus for producing a silicon wafer according to claim 1, wherein It also includes an auxiliary assembly, which is arranged on one side of the collecting box, for assisting the height adjustment of the ring body.
3. The polishing apparatus for producing a silicon wafer according to claim 2, wherein The auxiliary assembly comprises: Sliding block, slidingly connected to the inside of the collecting box; No. 2 guide rod, fixedly connected to the inside of the collecting box, and the No. 2 guide rod is slidingly connected with the sliding block; Plate body, fixedly connected to one side of the sliding block, and one end of the plate body extends to the outside of the collecting box and slidingly cooperates with the collecting box; Rod body, slidingly connected to one side of the collecting box, and the rod body is clamped in the inside of the collecting box by the sliding block.
4. The polishing apparatus for producing a silicon wafer according to claim 3, wherein: The bottom of the sliding block is provided with an inclined surface, and the top of the rod body is provided with a groove with the same size and shape as the bottom of the sliding block.
5. The polishing apparatus for producing a silicon wafer according to claim 3, wherein: The top of the collecting box is provided with a sliding groove with the same width as the width of the rod body.
6. The polishing apparatus for producing a silicon wafer according to claim 3, wherein: One side of the rod body is fixedly connected with a rubber pad.
7. The polishing apparatus for producing a silicon wafer according to claim 1, wherein: The No. 1 guide rod and the spring are a group, and the bottom of the ring body is provided with multiple groups.
8. The polishing apparatus for producing a silicon wafer according to claim 1, wherein: One end of the threaded rod extends to the outside of the collecting box and is fixedly connected with an adjusting head, and the outside of the adjusting head is provided with a friction pad.
9. The polishing apparatus for producing a silicon wafer according to claim 1, wherein: The top of the ring body is fixedly provided with a pressure sensor.