Wafer cutting and cleaning integrated equipment
By integrating wafer dicing, cleaning, and unloading processes, the problem of requiring different equipment for wafer dicing and cleaning has been solved. It enables automated transfer and all-round cleaning, improves production efficiency and automation, and ensures the uniformity of cleaning and the continuity of the production line.
Patent Information
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- Filing Date
- 2025-04-03
- Publication Date
- 2026-03-27
AI Technical Summary
In existing technologies, wafer dicing and cleaning require different equipment, which leads to wasted time in transferring wafers between different devices and reduces processing efficiency.
Design an integrated wafer dicing and cleaning equipment that integrates dicing, cleaning and unloading processes. The equipment uses a gripping mechanism to achieve automated transfer and cleaning of wafers, a hydraulic rod and an electric turntable for uniform cleaning, a water spray pipe and an air spray pipe for all-round cleaning, and an electric slide rail and lifting plate for automatic unloading and placement.
It achieves seamless integration of wafer dicing, cleaning, and unloading processes, improving production efficiency, reducing manual operations, ensuring the uniformity and automation of cleaning, and enhancing the continuity and efficiency of the production line.
Smart Images
Figure CN224044213U_ABST
Abstract
Description
TECHNICAL FIELD
[0001] The application relates to the technical field of semiconductor production, in particular to a wafer cutting and cleaning integrated equipment. BACKGROUND
[0002] In the current semiconductor production, cylindrical monocrystalline silicon is cut into multiple wafers from a circular section, and then the edges of the wafers are cut and polished to remove the burrs of the wafers, so that the wafers can be separated into multiple wafer particles, and then the wafer particles are processed into semiconductor chips through electroplating.
[0003] However, in the current wafer production, cutting and cleaning need to be completed by different devices, and the wafers need to be packaged and transported between different devices, and each packaging and disassembly will waste a lot of time, which is not conducive to improving the processing efficiency. CONTENT OF THE UTILITY MODEL
[0004] In view of the defects of the prior art, the application provides a wafer cutting and cleaning integrated equipment, which has the advantages of improving the processing efficiency, and solves the problems that, in the current wafer production, cutting and cleaning need to be completed by different devices, the wafers need to be packaged and transported between different devices, and each packaging and disassembly will waste a lot of time, which is not conducive to improving the processing efficiency.
[0005] To achieve the above purpose, the application provides the following technical scheme: a wafer cutting and cleaning integrated equipment, comprising a cutting mechanism, one side of the cutting mechanism is fixedly connected with a cleaning box, one side of the cleaning box is fixedly connected with a discharging table, the upper ends of the cutting mechanism and the cleaning box are fixedly connected with a grabbing mechanism, the bottom end of the cleaning box is fixedly connected with a third hydraulic rod, the telescopic end of the third hydraulic rod is fixedly connected with a second electric turntable, a receiving groove is formed in one side of the inside of the cleaning box, one side of the upper end of the cleaning box is fixedly connected with a second motor, the output end of the second motor is fixedly connected with a cleaning mechanism, the upper end of the discharging table is fixedly connected with a third electric turntable, the upper end of the third electric turntable is rotatably provided with a rotating plate, the upper end of the rotating plate is fixedly connected with two third linear modules which are arranged in a mirror image, the moving ends of the two third linear modules are fixedly connected with a moving frame, one side of the moving frame is fixedly connected with two connecting plates which are arranged in a mirror image, one end of the two connecting plates away from the moving frame is fixedly connected with a discharging gripper, one side of the discharging table is fixedly provided with two electric sliding rails which are arranged in a mirror image, the inside of the two electric sliding rails is fixedly connected with a moving rod, the upper end of the moving rod is fixedly connected with a lifting plate, and the upper end of the lifting plate is fixedly connected with a placing table.
[0006] The above solution integrates the three processes of wafer dicing, cleaning, and unloading, achieving seamless integration between processes and improving production efficiency. The gripping mechanism automatically grabs the wafers after dicing and accurately transfers them to the cleaning tank, reducing manual operation and labor intensity while improving production accuracy and efficiency. The third hydraulic rod and the second electric turntable inside the cleaning tank work together to rotate during the cleaning process, ensuring that the cleaning mechanism can clean the wafers evenly. The third electric turntable, rotating plate, third linear module, and unloading gripper on the unloading platform work together to achieve automatic wafer unloading and placement. The cleaning mechanism, driven by the second motor, can rotate freely in the receiving tank to adapt to different cleaning angles, enabling all-round, no-dead-angle cleaning of the wafers. The cleaning arm sprays water for cleaning and air for drying. The electric slide rail, moving rod, lifting plate, and placement platform on the unloading platform work together to achieve automatic wafer lifting and placement, facilitating subsequent processes and improving the continuity and efficiency of the production line.
[0007] Furthermore, the cutting mechanism includes a base, a groove is provided at the upper end of the base, a threaded rod is rotatably connected inside the groove, a positioning rod is fixedly connected inside the groove, a movable stage is slidably connected inside the groove, a first electric turntable is fixedly connected at the upper end of the movable stage, and a wafer tray is slidably connected at the upper end of the first electric turntable.
[0008] Through the above scheme, the rotation of the threaded rod can drive the precise linear movement of the moving table through the engagement of the threads. The design of the first electric turntable allows the wafer tray to rotate around its axis, which increases the flexibility of the cutting mechanism. The angle of the wafer can be adjusted according to the cutting requirements to achieve cutting operations in different directions. The wafer tray is slidably connected to the upper end of the first electric turntable. The tray is used to support the wafer body and is installed on the upper end of the first electric turntable.
[0009] Furthermore, two first hydraulic rods arranged in a mirror image are fixedly connected to the upper end of the base. The telescopic ends of the two first hydraulic rods are fixedly connected to a first movable plate. The bottom end of the first movable plate is fixedly connected to a first linear module. The movable end of the first linear module is fixedly connected to a cutting device. A first motor is fixedly connected to one side of the base.
[0010] With the above scheme, the height of the first moving plate and the cutting device it carries can be flexibly adjusted by using two mirror-distributed first hydraulic rods to adapt to different cutting depths.
[0011] Furthermore, the output end of the first motor is fixedly connected to the threaded rod via a coupling.
[0012] Through the above scheme, the rotation of the threaded rod driven by the motor can realize the accurate control of the position of the mobile platform and the wafer thereon, which helps to realize high-precision wafer cutting and ensures the accuracy and consistency of cutting.
[0013] Further, the grabbing mechanism comprises two vertical columns, the upper ends of the two vertical columns are fixedly connected with a second linear module, a movable arm is movably arranged in the second linear module, a second hydraulic rod is fixedly connected to one side of the bottom end of the movable arm, a protective cover is fixedly connected to the extension end of the second hydraulic rod, and a movable grabber is fixedly connected to the inside of the protective cover.
[0014] Through the above scheme, the grabbing mechanism is supported by the two vertical columns, and the movable arm inside the second linear module can move horizontally, allowing the grabbing mechanism to adapt to the wafer grabbing requirements. The second hydraulic rod at the bottom end of the movable arm provides vertical movement, allowing the protective cover and the movable grabber inside it to fine-tune the position in the vertical direction. The design of the protective cover not only provides support for the movable grabber, but also plays a protective role for the wafer. During the process of grabbing and moving the wafer, the protective cover can reduce the direct contact between the wafer and the external environment, reducing the risk of damage to the wafer due to collision or friction.
[0015] Further, the cleaning mechanism comprises a cleaning arm, and a fixed frame is fixedly connected to the bottom end of the cleaning arm, and a water spraying pipe and an air spraying pipe are fixedly connected inside the fixed frame.
[0016] Through the above scheme, the cleaning mechanism integrates the water spraying pipe and the air spraying pipe through the fixed frame at the bottom end of the cleaning arm. The water spraying pipe can spray high-pressure water flow to effectively flush away dirt and cutting residues on the wafer surface; and the air spraying pipe can spray high-pressure gas to dry the residual water on the wafer surface, achieving rapid drying.
[0017] Further, the cleaning mechanism is rotatably arranged inside the storage groove.
[0018] Through the above scheme, the rotation of the cleaning mechanism allows it to extend from the storage groove for cleaning operation when needed, and to be retracted into the storage groove when not in use, which can adapt to different working environments and operation requirements.
[0019] Further, the threaded rod is threadedly arranged inside the mobile platform, and the two positioning rods are slidingly arranged inside the mobile platform.
[0020] Through the above scheme, the threaded rod is threadedly arranged inside the mobile platform, and the two positioning rods are slidingly arranged inside the mobile platform. When the threaded rod rotates, the mobile platform will accurately displace along the axial direction of the threaded rod. This displacement mode has high accuracy and controllability. The positioning rods play a role in guiding and supporting the mobile platform, ensuring the stability of the mobile platform during movement and preventing displacement deviation caused by vibration or external interference.
[0021] Compared with the prior art, the technical scheme of the application has the following beneficial effects:
[0022] The wafer cutting, cleaning and discharging three processes are integrated together to realize seamless connection between processes, improve production efficiency, and the setting of the grabbing mechanism enables the wafer to be automatically grabbed after cutting and accurately transferred to the cleaning box, reduces manual operation, reduces labor intensity, and improves production accuracy and efficiency. The third hydraulic rod and the second electric turntable in the cleaning box cooperate to rotate during cleaning, ensuring that the cleaning mechanism can uniformly clean the wafer. The third electric turntable, rotating plate, third linear module and discharging gripper on the discharging table work together to realize automatic discharging and placement of the wafer. The cleaning mechanism is driven by the second motor and can rotate freely in the storage groove to meet the needs of different cleaning angles and can clean the wafer in all directions without dead angles. The wafer is cleaned by the water spray pipe and air jet pipe on the cleaning arm. The electric sliding rail, moving rod, lifting plate and placement table on the discharging table work together to realize automatic lifting and placement of the wafer, facilitating subsequent processes and improving the continuity and efficiency of the production line. BRIEF DESCRIPTION OF DRAWINGS
[0023] Figure 1 The figure is a schematic diagram of the overall structure of the structure of the application;
[0024] Figure 2 The figure is a schematic diagram of the internal structure of the cleaning box of the structure of the application;
[0025] Figure 3 The figure is a schematic diagram of the discharging device structure of the structure of the application;
[0026] Figure 4 The figure is a schematic diagram of the grabbing mechanism structure of the structure of the application;
[0027] Figure 5 The figure is a schematic diagram of the cleaning mechanism structure of the structure of the application;
[0028] Figure 6 The figure is a schematic diagram of the cutting mechanism structure of the structure of the application.
[0029] In the figure:
[0030] 1, cutting mechanism; 101, base; 102, sliding groove; 103, threaded rod; 104, positioning rod; 105, moving table; 106, first electric turntable; 107, wafer tray; 108, first hydraulic rod; 109, first moving plate; 1010, first linear module; 1011, cutting device; 1012, first motor; 2, cleaning box; 3, discharge table; 4, grabbing mechanism; 401, stand; 402, second linear module; 403, moving arm; 404, second hydraulic rod; 405, protective cover; 406, moving gripper; 5, third hydraulic rod; 6, second electric turntable; 7, storage groove; 8, second motor; 9, cleaning mechanism; 901, cleaning arm; 902, fixed frame; 903, water spray pipe; 904, air jet pipe; 10, third electric turntable; 11, rotating plate; 12, third linear module; 13, moving frame; 14, connecting plate; 15, discharge gripper; 16, electric sliding rail; 17, moving rod; 18, lifting plate; 19, placing table. DETAILED DESCRIPTION
[0031] The technical solutions in the embodiments of the present application will be described clearly and completely below with reference to the drawings in the embodiments of the present application. Obviously, the described embodiments are only part of the embodiments of the present application, rather than all the embodiments of the present application. Based on the embodiments in the present application, all other embodiments obtained by those of ordinary skill in the art without creative work fall within the scope of protection of the present application.
[0032] Please refer to Figure 1 , Figure 2 and Figure 3The wafer cutting and cleaning integrated equipment in the embodiment comprises a cutting mechanism 1, one side of the cutting mechanism 1 is fixedly connected with a cleaning box 2, one side of the cleaning box 2 is fixedly connected with a discharging table 3, the upper ends of the cutting mechanism 1 and the cleaning box 2 are fixedly connected with a grabbing mechanism 4, the setting of the grabbing mechanism 4 enables the wafer to be automatically grabbed after cutting and accurately transferred into the cleaning box 2, thereby reducing manual operation, lowering labor intensity, and improving production accuracy and efficiency, the inner bottom end of the cleaning box 2 is fixedly connected with a third hydraulic rod 5, the telescopic end of the third hydraulic rod 5 is fixedly connected with a second electric turntable 6, one side of the inside of the cleaning box 2 is provided with a storage groove 7, one side of the upper end of the cleaning box 2 is fixedly connected with a second motor 8, the output end of the second motor 8 is fixedly connected with a cleaning mechanism 9, the third hydraulic rod 5 and the second electric turntable 6 in the cleaning box 2 can rotate in the process of cleaning, thereby ensuring that the cleaning mechanism 9 can uniformly clean the wafer, the cleaning mechanism 9 can be freely rotated in the storage groove 7 by the driving of the second motor 8, and the requirements of different cleaning angles can be met, the wafer can be cleaned in all directions and without dead angle, the upper end of the discharging table 3 is fixedly connected with a third electric turntable 10, the upper end of the third electric turntable 10 is rotatably provided with a rotating plate 11, the upper end of the rotating plate 11 is fixedly connected with two third linear modules 12 which are mirror image distributed, the moving ends of the two third linear modules 12 are fixedly connected with a moving frame 13, one side of the moving frame 13 is fixedly connected with two connecting plates 14 which are mirror image distributed, one end of the two connecting plates 14 away from the moving frame 13 is fixedly connected with a discharging gripper 15, the third electric turntable 10, the rotating plate 11, the third linear modules 12 and the discharging gripper 15 and other components on the discharging table 3 work cooperatively to realize automatic discharging and placing of the wafer, one side of the discharging table 3 is fixedly provided with two electric sliding rails 16 which are mirror image distributed, the inner sides of the two electric sliding rails 16 are both fixedly connected with a moving rod 17, the upper end of the moving rod 17 is fixedly connected with a lifting plate 18, the upper end of the lifting plate 18 is fixedly connected with a placing table 19, the electric sliding rails 16, the moving rod 17, the lifting plate 18 and the placing table 19 and other components on the discharging table 3 work cooperatively to realize automatic lifting and placing of the wafer, thereby facilitating subsequent processes and improving the continuity and efficiency of the production line.
[0033] Please refer to Figure 6The cutting mechanism 1 comprises a base 101, a sliding groove 102 is formed in the upper end of the base 101, a threaded rod 103 is rotatably connected in the sliding groove 102, a positioning rod 104 is fixedly connected in the sliding groove 102, a moving table 105 is slidably connected in the sliding groove 102, a first electric turntable 106 is fixedly connected to the upper end of the moving table 105, a wafer tray 107 is slidably connected to the upper end of the first electric turntable 106, the rotation of the threaded rod 103 can drive the precise linear movement of the moving table 105 through the cooperation between the threads, and the design of the first electric turntable 106 enables the wafer tray 107 to rotate around its axis, which increases the flexibility of the cutting mechanism 1 and allows the angle of the wafer to be adjusted according to the cutting requirements, enabling cutting operations in different directions. The wafer tray 107 is slidably connected to the upper end of the first electric turntable 106, and is used to support the wafer body and is installed on the upper end of the first electric turntable 106. The upper end of the base 101 is fixedly connected with two first hydraulic rods 108 which are mirror image distributed. The extension end of the two first hydraulic rods 108 is fixedly connected with a first moving plate 109. The bottom end of the first moving plate 109 is fixedly connected with a first linear module 1010. The moving end of the first linear module 1010 is fixedly connected with a cutting device 1011. The first motor 1012 is fixedly connected to one side of the base 101. Through the two mirror image distributed first hydraulic rods 108, the height of the first moving plate 109 and the cutting device 1011 carried thereby can be flexibly adjusted to adapt to different cutting depths. The output end of the first motor 1012 is fixedly connected with the threaded rod 103 through a shaft coupling. The rotation of the threaded rod 103 driven by the motor can realize the precise control of the position of the moving table 105 and the wafer thereon, which is helpful to realize high-precision wafer cutting and ensure the accuracy and consistency of the cutting.
[0034] Please refer to Figure 4 The grabbing mechanism 4 comprises two upright columns 401, the upper end of the two upright columns 401 is fixedly connected with a second linear module 402, a movable arm 403 is movably arranged in the second linear module 402, a second hydraulic rod 404 is fixedly connected to the bottom end of the movable arm 403, the extension end of the second hydraulic rod 404 is fixedly connected with a protective cover 405, the protective cover 405 is fixedly connected with a movable gripper 406 inside, the grabbing mechanism 4 is supported by the two upright columns 401, the movable arm 403 inside the second linear module 402 can move in the horizontal direction, allowing the grabbing mechanism 4 to adapt to the wafer grabbing requirements, the second hydraulic rod 404 at the bottom end of the movable arm 403 provides vertical movement, allowing the protective cover 405 and the movable gripper 406 inside to fine-tune the position in the vertical direction. The design of the protective cover 405 not only provides support for the movable gripper 406, but also plays a protective role for the wafer. During the process of grabbing and moving the wafer, the protective cover 405 can reduce the direct contact between the wafer and the external environment, reducing the risk of damage to the wafer due to collision or friction.
[0035] Please refer to Figure 1 , Figure 5 and Figure 6 , the cleaning mechanism 9 includes a cleaning arm 901, the bottom end of the cleaning arm 901 is fixedly connected with a fixed frame 902, the inside of the fixed frame 902 is fixedly connected with a water spraying pipe 903 and an air spraying pipe 904, the cleaning mechanism 9 integrates the water spraying pipe 903 and the air spraying pipe 904 through the fixed frame 902 at the bottom end of the cleaning arm 901, the water spraying pipe 903 can spray high-pressure water flow to effectively flush away dirt and cutting residues on the surface of the wafer; while the air spraying pipe 904 can spray high-pressure gas to blow dry the water residues on the surface of the wafer, realizing rapid drying, the cleaning mechanism 9 is rotationally arranged inside the storage groove 7, the rotational arrangement of the cleaning mechanism 9 allows it to stretch out from the storage groove 7 for cleaning operation when needed, and to be retracted into the storage groove 7 when not in use, so as to adapt to different working environments and operation requirements, the threaded rod 103 is threadedly arranged inside the moving table 105, the two positioning rods 104 are slidingly arranged inside the moving table 105, the threaded rod 103 is matched with the inside of the moving table 105 through threads, when the threaded rod 103 rotates, the moving table 105 will accurately displace along the axial direction of the threaded rod 103, this displacement mode has high accuracy and controllability, the positioning rods 104 are slidingly arranged inside the moving table 105, which play a role in guiding and supporting the moving table 105, the positioning rods 104 ensure the stability of the moving table 105 during movement, preventing displacement deviation caused by vibration or external interference.
[0036] In the embodiment, the wafer cutting and cleaning integrated equipment integrates wafer cutting, cleaning and discharging three processes together, realizes seamless connection between processes, improves production efficiency, the arrangement of the grabbing mechanism 4 enables the wafer to be automatically grabbed after cutting and accurately transferred to the cleaning box 2, reduces manual operation, reduces labor intensity, and improves production accuracy and efficiency, the third hydraulic rod 5 and the second electric turntable 6 in the cleaning box 2 are matched and can rotate during cleaning, ensuring that the cleaning mechanism 9 can uniformly clean the wafer, the third electric turntable 10, the rotating plate 11, the third linear module 12 and the discharging gripper 15 and other components on the discharging table 3 work cooperatively to realize automatic discharging and placing of the wafer, the cleaning mechanism 9 is driven by the second motor 8 and can freely rotate in the storage groove 7, adapting to the needs of different cleaning angles and being capable of cleaning the wafer in all directions without dead angles, the water spraying pipe 903 and the air spraying pipe 904 on the cleaning arm 901 are arranged to spray water and dry the wafer, the electric sliding rail 16, the moving rod 17, the lifting plate 18 and the placing table 19 and other components on the discharging table 3 work cooperatively to realize automatic lifting and placing of the wafer, facilitating subsequent processes and improving the continuity and efficiency of the production line.
[0037] The working principle of the above embodiment is as follows:
[0038] First, the wafer is placed on the wafer tray 107 of the cutting mechanism 1, the threaded rod 103 is driven to rotate by the first motor 1012, the threaded rod 103 is matched with the thread inside the moving table 105, and the moving table 105 and the wafer tray 107 thereon are driven to move linearly, at the same time, the first motorized turntable 106 can rotate the wafer tray 107, adjust the angle of the wafer according to the cutting demand, the cutting device 1011 moves to the appropriate position on the first moving plate 109 by the first linear module 1010, starts to cut the wafer, the two first hydraulic rods 108 can adjust the height of the first moving plate 109 and the cutting device 1011 thereon to adapt to different cutting depths, after cutting is completed, the grabbing mechanism 4 starts to work, the moving arm 403 inside the second linear module 402 moves to above the wafer in the horizontal direction, the second hydraulic rod 404 at the bottom end of the moving arm 403 extends and retracts, drives the protective cover 405 and the moving gripper 406 inside it to descend and grab the wafer and the wafer tray 107, after grabbing, the second hydraulic rod 404 extends and retracts again, lifts the wafer to the appropriate height, then the second linear module 402 transfers the wafer to the cleaning box 2, in the cleaning box 2, the third hydraulic rod 5 extends and retracts, drives the second motorized turntable 6 and the wafer thereon to move up and down, the second motorized turntable 6 can rotate the wafer, ensures that the cleaning mechanism 9 can uniformly clean the wafer, the cleaning mechanism 9 is driven by the second motor 8, freely rotates in the storage groove 7 to adapt to the demand of different cleaning angles, the water jet pipe 903 at the bottom end of the cleaning arm 901 sprays high-pressure water flow to flush the dirt and cutting residues on the surface of the wafer; the air jet pipe 904 sprays high-pressure gas to blow dry the water remaining on the surface of the wafer, after cleaning is completed, the wafer is transferred to the discharge table 3, the third linear module 12 moves on the rotating plate 11, after the discharge gripper 15 grabs the wafer, the moving rod 17 inside the motorized sliding rail 16 drives the lifting plate 18 and the placement table 19 thereon to lift to the appropriate height, the discharge gripper 15 places the wafer on the placement table 19, after the wafer is placed on the placement table 19, subsequent processes such as detection, packaging, etc. can be conveniently carried out.
[0039] It is to be understood that the terminology used herein is for the purpose of describing particular embodiments only and is not intended to be limiting; it is not intended to exclude myriad other embodiments of the present application that other inventors can develop based on the same general inventive concepts embodied by the enclosed claims. That is, although the present application is described in terms of particular embodiments and illustrative figures, it should be apparent that the application can be varied in a multitude of ways. Such alterations, many of which will be apparent to those skilled in the art, can be based on current technology, and as such, this application should not be limited to the particular embodiments described herein, but should be understood to include all embodiments that are within the scope of the appended claims and their equivalents.
[0040] While the embodiments of the application have been shown and described herein, it will be understood by those skilled in the art that many changes, modifications, substitutions and alterations to these embodiments can be made without departing from the principles and spirits of the application, which can be limited only by the scope of the appended claims and their equivalents.
Claims
1. A wafer cutting and cleaning integrated device, comprising a cutting mechanism (1), characterized in that: The cutting mechanism (1) is fixedly connected with a cleaning box (2) on one side, the cleaning box (2) is fixedly connected with a discharging table (3) on one side, the cutting mechanism (1) and the cleaning box (2) are fixedly connected with a grabbing mechanism (4) on the upper end, the cleaning box (2) is fixedly connected with a third hydraulic rod (5) on the inside bottom, the telescopic end of the third hydraulic rod (5) is fixedly connected with a second electric turntable (6), a receiving groove (7) is formed in the inside of the cleaning box (2) on one side, a second motor (8) is fixedly connected with the cleaning box (2) on the upper end on one side, the output end of the second motor (8) is fixedly connected with a cleaning mechanism (9), a third electric turntable (10) is fixedly connected with the discharging table (3) on the upper end, a rotating plate (11) is rotatably arranged on the upper end of the third electric turntable (10), two third linear modules (12) which are mirror image distributed are fixedly connected with the rotating plate (11) on the upper end, a moving frame (13) is fixedly connected with the moving end of the two third linear modules (12), two connecting plates (14) which are mirror image distributed are fixedly connected with the moving frame (13) on one side, a discharging gripper (15) is fixedly connected with the ends of the two connecting plates (14) away from the moving frame (13), two electric sliding rails (16) which are mirror image distributed are fixedly arranged on one side of the discharging table (3), moving rods (17) are fixedly connected with the inside of the two electric sliding rails (16), a lifting plate (18) is fixedly connected with the upper ends of the two moving rods (17), and a placing table (19) is fixedly connected with the lifting plate (18) on the upper end.
2. The wafer cutting and cleaning integrated apparatus according to claim 1, wherein: The cutting mechanism (1) comprises a base table (101), a sliding groove (102) is formed in the upper end of the base table (101), a threaded rod (103) is rotatably connected in the sliding groove (102), a positioning rod (104) is fixedly connected in the sliding groove (102), a moving table (105) is slidably connected in the sliding groove (102), a first electric turntable (106) is fixedly connected with the moving table (105) on the upper end, and a wafer tray (107) is slidably connected with the first electric turntable (106) on the upper end.
3. The wafer cutting and cleaning integrated apparatus according to claim 2, wherein: Two first hydraulic rods (108) which are mirror image distributed are fixedly connected with the base table (101) on the upper end, first moving plates (109) are fixedly connected with the telescopic ends of the two first hydraulic rods (108), first linear modules (1010) are fixedly connected with the bottom ends of the first moving plates (109), a cutting device (1011) is fixedly connected with the moving end of the first linear module (1010), and a first motor (1012) is fixedly connected with the base table (101) on one side.
4. The wafer cutting and cleaning integrated apparatus according to claim 3, wherein: The output end of the first motor (1012) is fixedly connected with the threaded rod (103) through a shaft coupling.
5. The wafer cutting and cleaning integrated apparatus according to claim 1, wherein: Said grabbing mechanism (4) includes two columns (401), two said column (401) upper end fixedly connected with second linear module (402), second linear module (402) inside mobile setting has mobile arm (403), mobile arm (403) bottom end one side fixedly connected with second hydraulic rod (404), the telescopic end of second hydraulic rod (404) is fixedly connected with protective cover (405), protective cover (405) inside fixedly connected with mobile grab (406).
6. The wafer cutting and cleaning integrated apparatus according to claim 1, wherein: Said cleaning mechanism (9) includes cleaning arm (901), cleaning arm (901) bottom fixedly connected with fixed frame (902), fixed frame (902) inside fixedly connected with water spray pipe (903) and air injection pipe (904).
7. The wafer cutting and cleaning integrated apparatus according to claim 1, wherein: Said cleaning mechanism (9) rotationally arranged in the storage groove (7) inside.
8. The wafer cutting and cleaning integrated apparatus according to claim 2, wherein: Said threaded rod (103) is screw set in the moving platform (105) inside, two said positioning rod (104) are all slidingly arranged in the moving platform (105) inside.