Liquid silica gel mold of semi-coated conductive integrated circuit

Abstract

The utility model relates to the technical field of molds, and particularly discloses a liquid silicone mold of a semi-coated conductive integrated circuit. Wherein the front mold assembly comprises a front mold core; the rear mold assembly comprises a rear mold core, a mold core insert arranged on the rear mold core and an ejection assembly connected with the mold core insert; the first forming structure is used for forming the silica gel tooth socket part; and the second forming structure is used for wrapping a control circuit board, the second forming structure comprises a first fixing part arranged on the rear mold core and a second fixing part arranged on the front mold core, and the first fixing part and the second fixing part can be matched to fix the control circuit board. The control circuit board is good in fixing effect and good in forming effect.

Description

TECHNICAL FIELD

[0001] The utility model relates to mould technical field especially a kind of liquid silicone mould of half-coated conductive integrated circuit. BACKGROUND

[0002] Liquid silicone is a kind of high molecular material with good fluidity and flexibility, which is widely used in the molding manufacturing of various products. Liquid silicone mould is used to manufacture various shaped products by molding. There is a medical mouthpiece, which is embedded with conductive integrated circuit structure, including functional components, control circuit board 501 and the circuit connected to both, as shown in Figure 1 The control circuit board 501 has a connection port 503 connected to the circuit and a connection port 502 connected to the external structure, realizing more functions of the medical mouthpiece. During production, the control circuit board 501 is relatively light, and it is easy to float and move during the liquid silicone molding process, which may cause the connection port 502 to be blocked during silicone coating, and the connection port 502 may also be displaced during molding, which may cause the waterproof performance to be reduced and the connection effect to be poor. SUMMARY

[0003] The utility model aims at at least one of the technical problems existing in the prior art. To this end, the utility model provides a kind of liquid silicone mould of half-coated conductive integrated circuit, which has good control circuit board fixing effect and good molding effect.

[0004] To achieve the above purpose, the utility model provides the following technical scheme:

[0005] A kind of liquid silicone mould of half-coated conductive integrated circuit, comprising:

[0006] Front mould component, including front mould kernel;

[0007] Rear mould component, including rear mould kernel, mould kernel insert arranged on the rear mould kernel and ejection assembly connected with the mould kernel insert;

[0008] First molding structure for molding silicone mouthpiece part;

[0009] Second molding structure for coating control circuit board, the second molding structure includes first fixed part arranged on the rear mould kernel and second fixed part arranged on the front mould kernel, and the first fixed part and the second fixed part can cooperate to fix the control circuit board.

[0010] According to some embodiments of the utility model, the first fixed part has a fixed groove matched with the connection port of the control circuit board, and the connection port is fixed in the fixed groove.

[0011] According to some embodiments of the present application, the second fixing part comprises a first platform abutting against the upper surface of the control circuit board.

[0012] According to some embodiments of the present application, the control circuit board side has a protruding part, and the second fixing part further comprises a second platform abutting against the upper surface of the protruding part.

[0013] According to some embodiments of the present application, the second fixing part comprises a fixing protrusion, and the fixing protrusion is located at one side of the first fixing part when the mold is closed.

[0014] According to some embodiments of the present application, the rear mold core is provided with a glue overflow groove.

[0015] According to some embodiments of the present application, the second fixing part comprises a containing groove for containing the wiring port of the control circuit board.

[0016] According to some embodiments of the present application, the first forming structure comprises a component insert provided on the front mold core.

[0017] According to some embodiments of the present application, the rear mold core is provided with a third forming structure for forming a silica gel accessory.

[0018] The present application has at least the following advantages:

[0019] The first fixing part on the rear mold core and the second fixing part on the front mold core cooperate to provide stable support and firm fixation for the control circuit board when the mold is closed, so that the control circuit board will not be displaced or loosened during the forming process, and the forming quality is improved. BRIEF DESCRIPTION OF DRAWINGS

[0020] Figure 1 FIG. 1 is a structural schematic view of a control circuit board of the present application;

[0021] Figure 2 FIG. 2 is a structural schematic view of a front mold assembly of an embodiment of the present application;

[0022] Figure 3 FIG. 3 is a structural schematic view of a rear mold assembly of an embodiment of the present application. DETAILED DESCRIPTION

[0023] The present utility model provides the following description of reference drawings to help understand various embodiments of the present utility model as defined by the claims and their equivalents comprehensively. The description includes various specific details to help understanding, but these details should be regarded as just exemplary. Therefore, those skilled in the art will realize that various changes and modifications can be made to various embodiments described herein without departing from the scope and spirit of the present utility model.

[0024] In the description of the present utility model, the orientation description such as the orientation or position relationship indicated by up, down, front, back, left, right and the like is based on the orientation or position relationship shown in the drawings, and is only for the convenience of describing the present utility model and simplifying the description, and does not indicate or imply that the device or element referred to must have a particular orientation, be constructed and operated in a particular orientation, and therefore cannot be understood as a limitation on the present utility model.

[0025] It should be understood that when one element (for example, a first element) is "connected" to another element (for example, a second element), the element can be directly connected to the other element, or there can be an intervening element (for example, a third element) between the element and the other element.

[0026] The embodiment of the present utility model provides a kind of liquid silicone mould of half-coated conductive integrated circuit, as shown in Figures 1-3 It includes:

[0027] Front mould component, including front mould kernel 102;

[0028] Rear mould component, including rear mould kernel 202, mould kernel insert 203 being arranged on rear mould kernel 202 and ejection assembly being connected with mould kernel insert 203;

[0029] First forming structure 301 is used to form silicone gum mouthguard part;

[0030] Second forming structure 401 is used to coat control circuit board 501, and second forming structure 401 includes first fixed part 402 being arranged on rear mould kernel 202 and second fixed part 403 being arranged on front mould kernel 102, and first fixed part 402 and second fixed part 403 can cooperate and fix control circuit board 501.

[0031] The control circuit board 501 is covered in the second forming structure 401, and the structure of the second forming structure 401 after forming is an inner buckle shape, so that this part is difficult to be directly demolded. The mold insert 203 is matched with the rear mold insert 202 to form, and the mold insert 203 is lifted by the ejection assembly, so that the lower part of the second forming structure 401 is demolded. The first fixing part 402 on the rear mold insert 202 and the second fixing part 403 on the front mold insert 102 are matched to provide stable support and firm fixation for the control circuit board 501 when the mold is closed, so as to ensure that the control circuit board 501 does not shift or loosen during the forming process, improve the forming quality, and ensure the reliability and consistency of the product.

[0032] In some embodiments, as shown in Figure 1 , 3 The first fixing part 402 has a fixing groove 404 matched with the connecting port 502 of the control circuit board 501, and the connecting port 502 is fixed in the fixing groove 404.

[0033] The connecting port 502 of the control circuit board 501 is fixed in the fixing groove 404, which plays a role in positioning and fixing the bottom of the control circuit board 501; further, the space left after the first fixing part 402 is formed also provides a space for the connecting port 502 to connect with the external structure.

[0034] Further, as shown in Figures 1-2 The second fixing part 403 includes a first platform 302 abutting against the upper surface of the control circuit board 501.

[0035] The first platform 302 abuts against the upper surface of the control circuit board 501, cooperates with the fixing groove 404 inserted into the connecting port 502, and realizes the limiting of the control circuit board 501 in up, down, left and right directions, thereby improving the forming stability.

[0036] Further, as shown in Figures 1-2 The control circuit board 501 has a protruding part 504 on the side surface, and the second fixing part 403 further includes a second platform 303 abutting against the upper surface of the protruding part 504.

[0037] The protruding part 504 can improve the connection firmness with the formed silica gel, and the second platform 303 abuts against the protruding part 504, further limiting and fixing the control circuit board 501.

[0038] In some embodiments, as shown in Figure 2 The second fixing part 403 includes a fixing protrusion 304, and the fixing protrusion 304 is located on one side of the first fixing part 402 when the mold is closed.

[0039] The fixed protrusion 304 reduces the amount of glue on the side of the first fixing part 402, reduces the impact on the control circuit board 501 during molding, and improves the molding stability.

[0040] Further, as shown in Figure 3 The rear mold core 202 is provided with a glue overflow groove 405.

[0041] The glue overflow groove 405 ensures that the silicone solution can fill the molding cavity, improving the molding quality.

[0042] In some embodiments, as shown in Figures 1-2 The second fixing part 403 includes a receiving groove 305 for accommodating the wiring port 503 of the control circuit board 501.

[0043] The receiving groove 305 allows the wire of the wiring port 503 to be not covered, facilitating connection with the wire after molding.

[0044] In some embodiments, as shown in Figure 3 The first molding structure 301 includes a component insert 406 arranged on the front mold core 102.

[0045] The component insert 406 allows the molded silicone to have space for placing functional components, facilitating connection with the wire placed on the first molding structure 301.

[0046] In some embodiments, as shown in Figure 3 The rear mold core 202 is provided with a third molding structure 103 for molding silicone accessories.

[0047] The additional silicone accessories are molded at one time, facilitating subsequent assembly and improving production efficiency.

[0048] The terms and words used in the above description and claims are not limited to the literal meaning, but are merely used by the applicant to enable a clear and consistent understanding of the present application. Therefore, it should be clear to those skilled in the art that the above description of various embodiments of the present application is provided only for illustration, not for limitation, as defined by the appended claims and their equivalents.

Claims

1. A liquid silicone mold for a semi-encased conductive integrated circuit, characterized by, The application relates to a front mold assembly, a rear mold assembly, a first forming structure and a second forming structure. The front mold assembly comprises a front mold core (102). The rear mold assembly comprises a rear mold core (202), a mold core insert (203) arranged on the rear mold core (202) and an ejection assembly connected with the mold core insert (203). The first forming structure (301) is used for forming a silica gel mouthpiece part. The second forming structure (401) is used for covering a control circuit board (501), and the second forming structure (401) comprises a first fixing part (402) arranged on the rear mold core (202) and a second fixing part (403) arranged on the front mold core (102), and the first fixing part (402) and the second fixing part (403) can cooperatively fix the control circuit board (501).

2. The liquid silicone rubber mold for a semi-encapsulated conductive integrated circuit according to claim 1, characterized by: The first fixing part (402) is provided with a fixing groove (404) matched with a connecting port (502) of the control circuit board (501), and the connecting port (502) is fixed into the fixing groove (404).

3. The liquid silicone rubber mold for a semi-encapsulated conductive integrated circuit according to claim 2, wherein: The second fixing part (403) comprises a first platform (302) abutting against an upper surface of the control circuit board (501).

4. The liquid silicone mold for a semi-encased conductive integrated circuit line according to claim 3, characterized by: The control circuit board (501) is provided with a convex part (504) on a side surface, and the second fixing part (403) further comprises a second platform (303) abutting against an upper surface of the convex part (504).

5. A liquid silicone mold for a semi-encased conductive integrated circuit according to any one of claims 1 to 4, characterized in that: The second fixing part (403) comprises a fixing protrusion (304), and the fixing protrusion (304) is located on one side of the first fixing part (402) when the mold is closed.

6. A liquid silicone mold for a semi-encased conductive integrated circuit line according to claim 5, characterized in that: The rear mold core (202) is provided with a glue overflow groove (405).

7. A liquid silicone mold for a semi-encased conductive integrated circuit line according to any one of claims 1 to 4, characterized in that: The second fixing part (403) comprises a containing groove (305) used for containing a wiring port (503) of the control circuit board (501).

8. The liquid silicone mold for a semi-encased conductive integrated circuit line according to claim 1, wherein: The first forming structure (301) comprises a component insert (406) arranged on the front mold core (102).

9. The liquid silicone mold for a semi-encased conductive integrated circuit line according to claim 1, wherein: The rear mold core (202) is provided with a third forming structure (103) used for forming a silica gel accessory.

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