Large-current small-size overhead inductor structure

Abstract

The utility model relates to a large-current small-size overhead inductor structure which comprises a magnetic core, a coil and a supporting artificial foot. The magnetic core is made of an EE type or ER type distributed air gap alloy material and has excellent anti-saturation performance; the coil is of a spiral structure formed by winding a flat wire and is embedded in a center groove of the magnetic core. The supporting artificial feet are located below the magnetic core, the magnetic core and the coil are lifted to be overhead, the overhead height is larger than 1.5 mm, a cavity is formed between the magnetic core and the PCB substrate, and components such as resistors and capacitors can be arranged at the bottom conveniently. According to the utility model, through the overhead design, the space utilization rate of the PCB is obviously improved, the board distribution area is reduced, the large-current flow capacity and the high saturation resistance are realized, the overall height is less than 10mm, and the antenna is suitable for a power supply module, a high-frequency filter and a DC-DC converter in a high-density circuit design. According to the utility model, an automatic chip mounting technology is supported, a heat radiation pad can be installed on the top to optimize heat management performance, and the LED chip is suitable for small-size and high-power-density electronic products.

Description

TECHNICAL FIELD

[0001] The utility model relates to electronic components technical field especially relates to a large current small size overhead inductance structure. BACKGROUND

[0002] In the prior art, the traditional filter inductance is usually directly installed on the PCB board, occupying a large board area. Such design is often difficult to meet the requirement of space optimization in the pursuit of limit size and high density application scene, resulting in large overall module size, affecting the power density and performance of the product.

[0003] In addition, the anti-saturation capacity of the traditional ferrite core inductance is limited, and the core saturation problem is prone to occur under large current scene, which seriously affects the reliability and performance of the inductance. At the same time, the inductance of traditional winding process has the problem of large winding direct current resistance, resulting in increased energy consumption and excessive heating.

[0004] In view of the above-mentioned defects, the utility model provides a large current small size overhead inductance structure, which adopts distributed air gap alloy core, flat wire winding and overhead design of supporting false foot, not only solves the problem of low space utilization and performance limitation in traditional design, but also has higher reliability and efficiency under large current condition, providing an optimization scheme for high density circuit design.

[0005] The utility model can be widely applied to DC-DC converter, power module, high frequency filter and other scenes with high demand for high power density and high performance inductance device. UTILITY MODEL CONTENTS

[0006] The utility model relates to a large current small size overhead inductance structure, and aims to solve the problem of volume limitation and low space utilization of existing inductors in high density circuit design. The utility model optimizes the structure design of the core, coil and supporting false foot, so that the inductance has smaller size, larger current capacity and higher space utilization.

[0007] The utility model provides a large current small size overhead inductance structure, which comprises a core, a coil and a supporting false foot.

[0008] The core is any one of EE type or ER type structure and is made of alloy material and has distributed air gap.

[0009] The coil is spirally wound by flat wire and embedded in the center groove of the core.

[0010] The supporting false foot is located below the core, and the core and the coil are overhead, so that a gap greater than 1.5mm is formed between the core and the mounting substrate.

[0011] Further, the top of the magnetic core is designed as a plane.

[0012] Further, the coil adopts a multi-layer flat wire structure and is closely matched with the magnetic core.

[0013] Further, the support prosthetic foot is fixedly connected with the magnetic core and is used for supporting the whole inductance structure in suspension.

[0014] Further, the bottom space of the support prosthetic foot in suspension is used for mounting electronic components.

[0015] Further, the height of the magnetic core is less than 10 mm, and the overall thickness of the coil winding is matched with the magnetic core.

[0016] Further, the bottom of the support prosthetic foot is in contact with the substrate and is fixed by welding.

[0017] Specifically, the utility model discloses a PCB inductance module.

[0018] Magnetic core: EE type or ER type distributed air gap alloy material magnetic core is adopted, and excellent anti-saturation performance is possessed, and stable magnetic performance can be kept under high current working state.

[0019] Coil: the coil adopts a spiral structure of flat wire winding, is nested in the center groove of the magnetic core, and through optimization design, direct current resistance (DCR) is reduced, inductance efficiency is improved and heat generation is reduced.

[0020] Support prosthetic foot: the support prosthetic foot is arranged below the magnetic core, plays the role of supporting and suspending the inductance, the suspension height is greater than 1.5 mm, provides additional space for the bottom of the PCB substrate and is used for arranging resistors, capacitors, chips and other components, thereby improving the use efficiency of the PCB.

[0021] The utility model has the advantages of:

[0022] Small size and large current compatibility: high through-flow capacity and excellent anti-saturation performance are realized in compact design.

[0023] Suspension design: the inductance structure is lifted through the support prosthetic foot, the bottom space is released, the power density of the module is improved, and the overall circuit layout is optimized.

[0024] Supporting automatic patching and heat dissipation optimization: the top plane structure facilitates automatic production process, and supports installation of heat dissipation pads to further improve heat dissipation performance.

[0025] The above description is only a summary of the technical scheme of the utility model, in order to more clearly understand the technical means of the utility model, which can be implemented according to the content of the specification, and in order to let the above and other purposes, characteristics and advantages of the utility model can be more obvious and easy to understand, the following preferred embodiments are taken, and the detailed description is as follows. BRIEF DESCRIPTION OF DRAWINGS

[0026] Figure 1 A finished product appearance structure schematic view of the large-current small-size overhead inductance structure is provided in the utility model;

[0027] Figure 2 A finished product appearance structure schematic view of the large-current small-size overhead inductance structure is provided in the utility model;

[0028] Figure 3 A finished product appearance structure schematic view of the large-current small-size overhead inductance structure is provided in the utility model;

[0029] Figure 4 A magnetic core structure schematic view of the large-current small-size overhead inductance structure is provided in the utility model;

[0030] Figure 5 A magnetic core structure schematic view of the large-current small-size overhead inductance structure is provided in the utility model;

[0031] Figure 6 A magnetic core structure schematic view of the large-current small-size overhead inductance structure is provided in the utility model;

[0032] Figure 7 A magnetic core structure schematic view of the large-current small-size overhead inductance structure is provided in the utility model;

[0033] Figure 8 A coil structure schematic view of the large-current small-size overhead inductance structure is provided in the utility model;

[0034] Figure 9 A support prosthetic foot structure schematic view of the large-current small-size overhead inductance structure is provided in the utility model;

[0035] Figure 10 A support prosthetic foot structure schematic view of the large-current small-size overhead inductance structure is provided in the utility model.

[0036] In the drawing: 1, magnetic core; 2, coil; 3, support prosthetic foot. DETAILED DESCRIPTION

[0037] The technical solutions in the embodiments of the utility model will be clearly and completely described below with reference to the drawings in the embodiments of the utility model. Obviously, the described embodiments are only part of the embodiments of the utility model, rather than all the embodiments.

[0038] Referring to Figures 1 to 10

[0039] Magnetic core 1:

[0040] The magnetic core adopts EE or ER type structure and is made of alloy material with distributed air gap. The magnetic core material has excellent anti-saturation capability and can provide stable magnetic performance under high current conditions.

[0041] The overall height of the magnetic core is less than 10 mm, and the top is a flat structure to support the surface mount technology (SMD) process or add a heat dissipation pad.

[0042] Coil 2:

[0043] The coil is wound by multiple layers of flat wires, and the winding adopts a spiral design that closely matches the center slot of the magnetic core, ensuring efficient magnetic coupling.

[0044] The two ends of the coil are fixedly connected with the support prosthetic foot to form a complete electrical circuit. The use of flat wires further reduces the DC resistance of the winding, improves the electrical efficiency and reduces the heat generation.

[0045] Support prosthetic foot 3:

[0046] The support prosthetic foot is arranged below the magnetic core and is fixed to the PCB substrate by welding, while the entire inductor is elevated and the elevation height is greater than 1.5 mm.

[0047] The support prosthetic foot is made of high-temperature resistant material, which not only provides stable mechanical support but also can withstand the high-temperature environment during welding.

[0048] The design of the support prosthetic foot forms a cavity space between the magnetic core and the substrate, which is used to arrange resistors, capacitors or chips and other components, thereby greatly improving the space utilization of the PCB board.

[0049] Assembly process

[0050] Assembly of the magnetic core and the coil:

[0051] The center slot of the magnetic core is used to install the coil, and the coil is tightly fitted with the magnetic core after being wound by multiple layers of flat wires to form an efficient magnetic circuit.

[0052] The flat design of the top of the magnetic core facilitates the mounting of the entire structure and subsequent heat dissipation management.

[0053] Installation of the support prosthetic foot:

[0054] The support prosthetic foot is fixed to the bottom of the magnetic core by mechanical connection and connected to the PCB substrate by welding. The height design of the prosthetic foot ensures that the elevated space is above 1.5 mm, providing enough space for the layout of the components at the bottom.

[0055] Advantages of use

[0056] By adopting the distributed air gap alloy magnetic core, the anti-saturation capability of the inductor is improved by 2-3 times compared with the traditional ferrite material, and is suitable for large current application scenarios.

[0057] The flat design of the coil significantly reduces the volume of the inductor winding, while reducing power consumption.

[0058] The overhead design of the support prosthetic foot provides additional component layout space for the bottom of the PCB board, reduces the board area, and improves the power density of the module.

[0059] The planar design of the top of the magnetic core supports the automatic patch process, and the heat dissipation pad can be installed to further optimize the heat dissipation performance.

[0060] The utility model is suitable for high density circuit design, and has strict requirements for small size, large current inductor device in scene, such as power module, high frequency filter circuit, DC-DC converter and high efficiency power electronic system. Through the optimization design of the structure, the board area of the overall circuit can be greatly reduced, and the requirement of high current carrying capacity is met.

[0061] The above is only the preferred specific embodiment of the utility model, but the protection scope of the utility model is not limited to this, any skilled person in the art in the technical range disclosed by the utility model, according to the technical scheme and the utility model concept of the utility model, equivalent replacement or change, should be covered in the protection scope of the utility model.

Claims

1. A high current small size overhead inductor structure, characterized by, The magnetic core (1), the coil (2) and the supporting prosthetic foot (3) are included. The magnetic core (1) is made of alloy material and has distributed air gap in EE or ER structure. The coil (2) is wound by flat wire into spiral shape and embedded in the center slot of the magnetic core (1). The supporting prosthetic foot (3) is located below the magnetic core (1) and makes the magnetic core (1) and the coil (2) suspended, so that a gap greater than 1.5mm is formed between the magnetic core (1) and the mounting substrate.

2. The small size high current overhead inductor structure of claim 1, wherein: The top of the magnetic core (1) is designed as a plane.

3. The small size high current overhead inductor structure of claim 1, wherein: The coil (2) adopts a multi-layer flat wire structure and closely matches the magnetic core (1).

4. The small size high current overhead inductor structure of claim 1, wherein: The supporting prosthetic foot (3) is fixedly connected with the magnetic core (1) and is used for supporting the whole inductance structure to be suspended.

5. The small size high current overhead inductor structure of claim 1, wherein: The bottom space of the supporting prosthetic foot (3) is used for mounting electronic components.

6. The small size high current overhead inductor structure of claim 1, wherein: The height of the magnetic core (1) is less than 10mm, and the overall thickness of the coil (2) is matched with the magnetic core (1).

7. The small size high current overhead inductor structure of claim 1, wherein: The bottom of the supporting prosthetic foot (3) is in contact with the substrate and is fixed by welding.

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