Electronic device

Abstract

The utility model provides electronic equipment. The electronic equipment comprises a protective film, a shell and a circuit board assembly. A containing space is defined by the shell. The circuit board assembly comprises a circuit board, a circuit board support and an electronic element, the circuit board is located in the containing space and fixedly connected with the shell, the circuit board support is fixedly connected with the circuit board, an installation space is defined by the circuit board support and the circuit board, and the electronic element is located in the installation space and fixedly connected with the circuit board; the protective film is located in the containing space and fixedly connected with the shell, and at least part of the protective film and at least part of the circuit board support are oppositely arranged; the protective film comprises a first heat dissipation layer and a first film layer, the first film layer is made of a flexible material, the first film layer comprises a first adhesive surface and a second adhesive surface which are arranged back to back, the first adhesive surface of the first film layer is directly bonded with the first heat dissipation layer, and the second adhesive surface of the first film layer is bonded with the shell. The protective film has the functions of preventing film printing and dissipating heat, and is thin in thickness.

Description

TECHNICAL FIELD

[0001] The present application relates to the technical field of electronic equipment, in particular to an electronic equipment. BACKGROUND

[0002] With the development of mobile internet and intelligence, mobile phones are becoming more and more indispensable terminal equipment for users. The traditional mobile phone includes a back cover and a circuit board support and electronic components arranged in the mobile phone. However, on the one hand, when the user presses the back cover, the circuit board support is easy to press the back cover, so that the back cover leaves a mark, on the other hand, the electronic components arranged in the mobile phone are easy to generate heat, thereby causing the temperature in the mobile phone to increase to a large extent. At this time, how to solve the problems of film printing and heat dissipation is attracting more and more attention of various research institutes. In addition, the mobile phone with thin and light setting is also favored by users, which means the reduction of the internal space of the mobile phone. Therefore, it is urgent to provide an electronic equipment with heat dissipation and film printing prevention functions and thin setting. CONTENT OF THE INVENTION

[0003] The purpose of the embodiment of the present application is to provide an electronic equipment with heat dissipation and film printing prevention functions and thin setting.

[0004] The present application provides an electronic equipment. The electronic equipment comprises a protective film, a shell and a circuit board assembly, the shell encloses a containing space;

[0005] The circuit board assembly comprises a circuit board, a circuit board support and an electronic component, the circuit board is located in the containing space and is fixedly connected with the shell, the circuit board support is fixedly connected with the circuit board and encloses a mounting space, the electronic component is located in the mounting space and is fixedly connected with the circuit board;

[0006] The protective film is located in the containing space and is fixedly connected with the shell, at least part of the protective film is arranged opposite to at least part of the circuit board support;

[0007] The protective film comprises a first heat dissipation layer and a first film layer, the first film layer is made of a flexible material, the first film layer comprises a first adhesive surface and a second adhesive surface arranged oppositely, the first adhesive surface of the first film layer is directly bonded with the first heat dissipation layer, and the second adhesive surface of the first film layer is bonded with the shell.

[0008] It can be understood that, in an embodiment, the protective film comprises a heat dissipation film and a first film layer. The heat dissipation film comprises a first PET layer, a graphite layer and a second PET layer which are sequentially stacked. The first film layer comprises an anti-stamping adhesive and a third PET layer which are sequentially stacked. The third PET layer is fixedly connected with the second PET layer. In the embodiment, the first adhesive surface of the first film layer is directly bonded with the first heat dissipation layer, so that the second PET layer and the third PET layer in the above embodiment are removed. At this time, in terms of mass, the protective film can at least save the mass of the second PET layer and the third PET layer in the above embodiment, thereby facilitating the lightweight setting of the protective film. In the thickness direction of the protective film, the protective film can at least save the thickness of the second PET layer and the third PET layer in the above embodiment, thereby facilitating the thinness setting of the protective film. When the protective film is applied to the electronic device, it is also beneficial to the lightweight and thinness setting of the electronic device. In addition, for electronic devices with limited internal space (for example, for smart phones that strive to be extremely thin), the protective film of the embodiment can still be easily assembled inside the electronic device.

[0009] It can be understood that, in the embodiment, the first adhesive surface of the first film layer is directly bonded with the first heat dissipation layer, so that the first heat dissipation layer is directly supported by the first film layer to avoid damage to the first heat dissipation layer.

[0010] In addition, the protective film can be directly composed of the first heat dissipation layer and the first film layer. The structure of the protective film is simple, thereby greatly reducing the cost investment of the protective film. On the other hand, compared with the structure of the protective film in the above embodiment, the protective film in the embodiment can also save the first PET layer in the above embodiment. In this way, the thickness of the protective film in the Z-axis direction in the embodiment is thinner, thereby being more beneficial to the thinness and lightweight setting of the electronic device.

[0011] It can be understood that, by arranging at least part of the protective film opposite at least part of the circuit board support, on the one hand, when the user presses the shell and at least part of the circuit board support is extruded towards the shell, the first film layer can buffer the extrusion force of at least part of the circuit board support, thereby avoiding that at least part of the circuit board support directly extrudes the shell and leaves marks on the shell; on the other hand, the heat generated by the first electronic element can also be transmitted to the first heat dissipation layer through the circuit board support and dissipated through the first heat dissipation layer. In other words, the first film layer of the protective film can play a role in preventing stamping. The first heat dissipation layer of the protective film can play a role in heat dissipation. Therefore, the protective film in the embodiment is a "two-in-one" film layer structure.

[0012] It can be understood that the protective film of the embodiment can achieve heat dissipation and prevent film printing in a very thin thickness. In other words, the protective film of the embodiment has the functions of preventing film printing and heat dissipation, and has a thin thickness.

[0013] In a possible implementation, the shell includes a back cover and a middle frame, the back cover is fixedly connected with the middle frame and encloses the accommodation space; the circuit board is fixedly connected with the middle frame, and the second adhesive surface of the first film layer is bonded with the back cover.

[0014] It can be understood that by arranging at least part of the protective film opposite at least part of the circuit board support, on the one hand, when the user presses the back cover and at least part of the circuit board support is extruded towards the back cover, the first film layer can buffer the extrusion force of at least part of the circuit board support, thereby avoiding that at least part of the circuit board support directly extrudes the back cover and leaves marks on the back cover; on the other hand, the heat generated by the first electronic element can be transmitted to the first heat dissipation layer through the circuit board support and dissipated through the first heat dissipation layer. In other words, the first film layer of the protective film can prevent film printing. The first heat dissipation layer of the protective film can dissipate heat. Therefore, the protective film of the embodiment is a "two-in-one" film layer structure.

[0015] In a possible implementation, the circuit board support includes a convex portion and a flat portion, the convex portion protrudes relative to the flat portion and protrudes towards the back cover; the electronic element includes a first electronic element, the first electronic element is arranged opposite the convex portion, and at least part of the first film layer is arranged opposite the convex portion.

[0016] It can be understood that, on the one hand, when the user presses the back cover and the convex portion of the circuit board support is extruded towards the back cover, the first film layer can buffer the extrusion force of the convex portion of the circuit board support, thereby avoiding that the convex portion of the circuit board support directly extrudes the back cover and leaves marks on the back cover; on the other hand, the heat generated by the first electronic element can be transmitted to the first heat dissipation layer through the circuit board support and dissipated through the first heat dissipation layer. In other words, the first film layer of the protective film can prevent film printing. The first heat dissipation layer of the protective film can dissipate heat. Therefore, the protective film of the embodiment is a "two-in-one" film layer structure.

[0017] In a possible implementation, the first electronic element is a board-to-board electrical connector or a combiner.

[0018] In a possible implementation, at least part of the first heat dissipation layer is arranged opposite the convex portion. In this way, the distance between the first heat dissipation layer and the first electronic element is short. The heat generated by the first electronic element can be quickly transmitted to the first heat dissipation layer and dissipated through the first heat dissipation layer.

[0019] In a possible implementation, the electronic component includes a second electronic component, the second electronic component is arranged opposite to the flat part, and a part of the first heat dissipation layer is arranged opposite to the flat part. It can be understood that the heat generated by the second electronic component can also be transmitted to the first heat dissipation layer through the circuit board support, and dissipated through the first heat dissipation layer.

[0020] In a possible implementation, the protective film further includes a substrate, the substrate is fixedly connected to a side of the first heat dissipation layer away from the first film layer. In this way, the first heat dissipation layer is supported from different sides by the first film layer and the substrate, thereby avoiding damage to the first heat dissipation layer. In this way, the reliability of the protective film is better.

[0021] In a possible implementation, the substrate is in contact with the circuit board support. At this time, the protective film is better at preventing film printing and dissipating heat for the first electronic component.

[0022] In a possible implementation, the substrate includes a first middle part and an edge part, the edge part of the substrate is connected to the first middle part of the substrate and is arranged around the first middle part of the substrate; the edge part of the substrate is bent relative to the first middle part of the substrate and is connected to the first adhesive surface of the first film layer, the substrate and the first film layer enclose a containing space, and the first heat dissipation layer is located in the containing space and is fixedly connected to the first middle part of the substrate. In this way, the first film layer and the substrate can protect the first heat dissipation layer to avoid damage to the first heat dissipation layer. The reliability of the protective film is better.

[0023] In a possible implementation, the substrate includes a first surface, the first surface of the substrate is an adhesive surface, and the first surface of the substrate is directly bonded to the first heat dissipation layer.

[0024] It can be understood that by directly bonding the first surface of the substrate to the first heat dissipation layer, the first surface of the substrate and the first heat dissipation layer are no longer connected through an additional structural member, thereby making the thickness of the protective film thin enough, that is, facilitating the thin-type setting of the protective film. In this way, when the protective film is applied to an electronic device, it is also beneficial to the light-type and thin-type setting of the electronic device.

[0025] In a possible implementation, the substrate includes a second surface, the second surface of the substrate is arranged away from the first surface of the substrate, and the maximum vertical distance D2 between the second surface of the substrate and the second adhesive surface of the first film layer is less than or equal to 0.1 millimeter. In this way, the thickness of the protective film in the Z-axis direction is greatly reduced, thereby facilitating the thin-type setting of the electronic device when the protective film is applied to the electronic device.

[0026] In a possible implementation, the protective film comprises a second heat dissipation layer, and the second heat dissipation layer is fixedly connected between the first heat dissipation layer and the substrate. It can be understood that, by fixedly connecting the second heat dissipation layer between the first heat dissipation layer and the substrate, the heat dissipation capacity of the protective film is better by using the cooperation of the second heat dissipation layer and the first heat dissipation layer. In this way, when the heat generated by the first electronic component is transmitted to the first heat dissipation layer and the second heat dissipation layer, the first heat dissipation layer and the second heat dissipation layer can dissipate heat more quickly.

[0027] In a possible implementation, the protective film comprises a connecting adhesive, the connecting adhesive comprises a third adhesive surface and a fourth adhesive surface arranged oppositely, the third adhesive surface of the connecting adhesive is directly bonded to the first heat dissipation layer, and the fourth adhesive surface of the connecting adhesive is directly bonded to the second heat dissipation layer. It can be understood that, by fixedly connecting the second heat dissipation layer to the first heat dissipation layer through the connecting adhesive, the connection between the second heat dissipation layer and the first heat dissipation layer is more stable and reliable. In addition, the connection between the second heat dissipation layer and the first heat dissipation layer is relatively simple, which is conducive to reducing the input cost of the protective film.

[0028] In a possible implementation, the elastic modulus of the first film layer is in a range of 0.001 Gpa to 1 Gpa. In this way, the material of the first film layer is relatively soft, and the effect of preventing film printing is better.

[0029] In a possible implementation, the first film layer is a double-sided adhesive tape without a base material or a PET grid double-sided adhesive tape.

[0030] In a possible implementation, the first heat dissipation layer is a graphite sheet, a graphene, carbon black or a two-dimensional transition metal carbon-nitrogen-oxygen oxide.

[0031] In a possible implementation, the electronic device comprises a battery, the battery is located in the accommodation space and is fixedly connected to the shell, the battery is located on one side of the circuit board, and a part of the protective film is arranged opposite to the battery.

[0032] It can be understood that, if the surface of the battery is uneven, that is, the surface of the battery has protrusions or recesses, the protective film can also prevent the battery from being printed. For example, a part of the protective film can be arranged opposite to the protrusions or recesses of the battery. In this way, when the user presses the shell and the edges of the protrusions or recesses of the battery are extruded in the direction close to the shell, the protective film can buffer the extrusion force of the protrusions of the battery or the extrusion force of the edges of the recesses, so as to avoid that the edges of the protrusions or recesses of the battery directly extrude the shell and cause the shell to leave marks. In this way, the protective film can prevent the battery from being printed and also can dissipate heat for the battery. The protective film has the effect of “one thing with multiple uses”.

[0033] In a possible implementation, the protective film comprises a first end portion, a second middle portion and a second end portion connected in sequence, and the first end portion and the second end portion of the protective film are both bent relative to one side of the second middle portion of the protective film; the second middle portion of the protective film is arranged opposite the circuit board support, and the first end portion and the second end portion of the protective film are both arranged opposite the battery.

[0034] It can be understood that the protective film can not only prevent the first electronic element and the battery from being marked, but also can dissipate heat for the first electronic element and the battery. The protective film has the effect of "one thing with multiple uses". BRIEF DESCRIPTION OF DRAWINGS

[0035] In order to more clearly illustrate the technical solutions in the embodiments of the present application or the background art, the drawings needed to be used in the embodiments of the present application or the background art will be described below.

[0036] Figure 1 is a structural schematic diagram of an electronic device provided by an embodiment of the present application;

[0037] Figure 2 is Figure 1 a partial exploded schematic diagram of the electronic device shown in some embodiments;

[0038] Figure 3 is Figure 1 a partial cross-sectional schematic diagram of the electronic device shown in some embodiments along A-A;

[0039] Figure 4 is Figure 1 a partial structural schematic diagram of an embodiment of the electronic device shown in some embodiments; Figure 1 ;

[0040] Figure 5 is Figure 2 a structural schematic diagram of an embodiment of the circuit board support;

[0041] Figure 6 is Figure 1 a partial structural schematic diagram of an embodiment of the electronic device shown in some embodiments; Figure 2 ;

[0042] Figure 7 is Figure 6 a partial cross-sectional schematic diagram of the electronic device shown in some embodiments along B-B;

[0043] Figure 8 is Figure 2 a structural schematic diagram of an embodiment of the protective film and the rear cover;

[0044] Figure 9 is Figure 8An assembly view of one embodiment of the protective film and the back cover is shown.

[0045] Figure 10 is Figure 1 A partial structure view of one embodiment of the electronic device is shown. Figure 3 ;

[0046] Figure 11 is Figure 1 A partial cross-sectional view of the electronic device along the line C-C is shown in some embodiments.

[0047] Figure 12 is Figure 2 A partial exploded view of one embodiment of the protective film is shown.

[0048] Figure 13 is Figure 1 A partial cross-sectional view of one embodiment of the electronic device along the line D-D is shown.

[0049] Figure 14 is Figure 1 A partial cross-sectional view of another embodiment of the electronic device along the line D-D is shown.

[0050] Figure 15 is Figure 2 A partial exploded view of another embodiment of the protective film is shown.

[0051] Figure 16 is Figure 1 A partial cross-sectional view of yet another embodiment of the electronic device along the line D-D is shown.

[0052] Figure 17 is Figure 2 A partial cross-sectional view of one embodiment of the protective film is shown.

[0053] Figure 18 is Figure 2 A partial exploded view of yet another embodiment of the protective film is shown.

[0054] Figure 19 is Figure 1 A partial cross-sectional view of yet another embodiment of the electronic device along the line D-D is shown. DETAILED DESCRIPTION

[0055] The embodiments of the present application will be described below in conjunction with the accompanying drawings.

[0056] In the description of the embodiments of the present application, it should be noted that unless specifically defined and limited, the terms "mounting", "connecting" should be understood in a broad sense, for example, "connecting" can be detachable connection, or can be non-detachable connection; can be direct connection, or can be indirect connection through intermediate medium. Among them, "fixed connection" refers to the relative position relationship after being connected with each other does not change. The orientation language mentioned in the embodiments of the present application, such as "upper", "lower", "inner", "outer" and the like, is only the direction of the drawing, therefore, the orientation language used is for better and clearer illustration and understanding of the embodiments of the present application, and is not intended to indicate or imply that the device or element referred to must have a particular orientation, be constructed and operated in a particular orientation, therefore, it cannot be understood as a limitation on the embodiments of the present application. "Multiple" means at least two. A and / or B includes three schemes, specifically scheme A, scheme B and scheme AB. Among them, the two components are integrated by the one-piece forming process to obtain an integrated structure, which means that during the process of forming one of the two components, the component is connected with the other component together, and the two components do not need to be connected together by reprocessing (such as bonding, welding, buckle connection, screw connection) mode.

[0057] In the embodiments of the present application, the terms "first", "second", "third", "fourth" are only for descriptive purposes, and cannot be understood as indicating or implying relative importance or implicitly indicating the number of the indicated technical features. Therefore, the features limited by "first", "second", "third", "fourth" can explicitly or implicitly include one or more of the features.

[0058] It can be understood that the specific embodiments described herein are only used to explain the related application, and not to limit the application. In addition, it should be noted that for the convenience of description, only the parts related to the application are shown in the drawings.

[0059] Figure 1 is a structural schematic diagram of an electronic device 100 provided by the embodiments of the present application.

[0060] As Figure 1 shown, in some embodiments, the electronic device 100 can be a device with a shell 1, such as a mobile phone, a tablet personal computer, a laptop computer, a personal digital assistant (PDA), a personal computer, a notebook computer, a vehicle-mounted device, a wearable device, augmented reality (AR) glasses, an AR helmet, virtual reality (VR) glasses or a VR helmet, etc. Figure 1The electronic device 100 of the illustrated embodiment is described by way of example as a mobile phone.

[0061] It can be understood that, for the convenience of description hereinafter, the electronic device 100 is defined to have a first direction Z, a second direction Y and a third direction X. The first direction Z can be a thickness direction of the electronic device 100. The second direction Y can be a length direction of the electronic device 100. The third direction X can be a width direction of the electronic device 100. In some embodiments, the coordinate system of the electronic device 100 can be flexibly set according to specific actual needs.

[0062] Figure 2 is Figure 1 A partially exploded schematic view of the electronic device 100 in some embodiments is shown.

[0063] As shown in Figure 1 and Figure 2 , the electronic device 100 includes a protective film 10, a back cover 20, a middle frame 30, a circuit board assembly 40, a battery 50 and a display module 60. It can be understood that, Figure 1 , Figure 2 and the relevant drawings hereinafter only schematically show some components included in the electronic device 100, and the actual shape, actual size, actual position and actual structure of these components are not limited by Figure 1 , Figure 2 and the drawings hereinafter.

[0064] In other embodiments, the electronic device 100 can also include more or fewer structures. For example, when the electronic device 100 includes more structures, the electronic device 100 can include a camera module, a loudspeaker, etc. When the electronic device 100 includes fewer structures, the electronic device 100 can also not include the battery 50 and / or the display module 60, etc.

[0065] Figure 3 is Figure 1 A partially cross-sectional schematic view of the electronic device 100 along A-A in some embodiments is shown.

[0066] Referring to Figure 3 , and in combination with Figure 1 and Figure 2 , the back cover 20 is fixedly connected with the middle frame 30 and encloses a receiving space 31, for example. The back cover 20 can be fixedly connected with the middle frame 30 by a dispensing process, for example. It can be understood that the middle frame 30 and the back cover 20 can constitute a housing 1 of the electronic device 100. At this time, the housing 1 encloses the receiving space 31. The structure of the housing 1 is not specifically limited in the present application. In other embodiments, the middle frame 30 and the back cover 20 can be an integrally formed structure.

[0067] Exemplarily, the back cover 20 comprises an inner surface 21 and an outer surface 22 arranged oppositely. The inner surface 21 of the back cover 20 faces the accommodating space 31. The outer surface 22 of the back cover 20 faces away from the accommodating space 31.

[0068] Referring to Figure 3 , and in combination with Figure 1 and Figure 2 , it is shown that, exemplarily, when the electronic device 100 comprises the display module 60, the display module 60 is fixedly connected with the middle frame 30 and is located at a side of the middle frame 30 away from the back cover 20. At this time, the display module 60 and the back cover 20 are respectively installed at two sides of the middle frame 30. Exemplarily, the display module 60 can also be fixedly connected with the middle frame 30 through a dispensing process.

[0069] It can be understood that the display module 60 can be an organic light-emitting diode (OLED) display module, an active-matrix organic light-emitting diode (AMOLED) display module, a liquid crystal display (LCD), etc. The specific structure of the display module 60 is not specifically limited in the present embodiment.

[0070] Referring again to Figure 2 , it is shown that, exemplarily, the circuit board assembly 40 comprises a circuit board 41, a circuit board support 42 and an electronic component 43. It can be understood that, Figure 2 and the relevant drawings below only schematically show some components included in the circuit board assembly 40, and the actual shape, actual size, actual position and actual structure of these components are not limited by Figure 2 and the drawings below.

[0071] Exemplarily, the electronic component 43 can comprise a board to board (BTB) electrical connector, a combiner, a capacitor or an inductor, etc.

[0072] Figure 4 is Figure 1 a partial structure schematic diagram of an embodiment of the electronic device 100 shown in Figure 1 .

[0073] Referring to Figure 4 , and in combination with Figure 2 and Figure 3As shown in FIG. 1, the circuit board 41 is located in the accommodating space 31 and is fixedly connected with the middle frame 30. Exemplarily, the circuit board 41 can be fixedly connected with the middle frame 30 by means of adhesion, welding or buckling, etc. The connection manner of the circuit board 41 with the middle frame 30 is not specifically limited.

[0074] As shown in FIG. 1, Figure 4 and as shown in FIG. 2, Figure 2 and Figure 3 As shown in FIG. 1, the electronic component 43 is located in the accommodating space 31 and is fixedly connected with the circuit board 41.

[0075] Exemplarily, the electronic component 43 comprises a first electronic component 431 and a second electronic component 432. The first electronic component 431 can be a BTB electrical connector or a combiner, etc. The second electronic component 432 can be a capacitor or an inductor.

[0076] Figure 5 As shown in FIG. 1, Figure 2 is a structural schematic diagram of an embodiment of the circuit board support 42.

[0077] As shown in FIG. 1, Figure 5 exemplarily, the circuit board support 42 comprises a protruding portion 421 and a flat portion 422, and the flat portion 422 is connected with the protruding portion 421. The protruding portion 421 protrudes relative to the flat portion 422. It can be understood that the circuit board support 42 can be an integrally formed structure. In addition, the number of the protruding portions 421 of the circuit board support 42 is not limited to Figure 5 three as shown in the figure. Figure 5 The same reference numerals are used for illustration. For example, the number of the protruding portions 421 of the circuit board support 42 can also be one, two or more than three. In addition, the shape of the protruding portions 421 of the circuit board support 42 is not limited to Figure 5 the shape as shown in the figure. Specifically, the present application is not limited.

[0078] Figure 6 As shown in FIG. 1, Figure 1 is a partial structural schematic diagram of an embodiment of the electronic device 100. Figure 2 .As shown in FIG. 1, Figure 7 is a partial sectional schematic diagram of the electronic device 100 along B-B in some embodiments. Figure 6 As shown in FIG. 1,

[0079] and as shown in FIG. 2, Figure 6 and as shown in FIG. 3, Figure 7 exemplarily, the circuit board support 42 is located in the accommodating space 31. The circuit board support 42 is fixedly connected with the circuit board 41 and encloses the mounting space 45. Figure 4 Figure 5 As shown in FIG. 1,

[0080] It is understood that the circuit board bracket 42 can be fixedly connected to the circuit board 41 by means of bonding, welding, or fastening. No specific limitations are made regarding the connection method between the circuit board bracket 42 and the circuit board 41.

[0081] Please see Figure 6 and Figure 7 and combined Figure 4 and Figure 5 As shown, electronic component 43 is located within mounting space 45. Circuit board bracket 42 can be used to protect electronic component 43.

[0082] For example, the first electronic component 431 is disposed opposite to the protrusion 421. The second electronic component 432 is disposed opposite to the flat portion 422. In other embodiments, the flat portion 422 may also be disposed opposite to some small structural components of the electronic device 100, such as a spring.

[0083] Please see Figure 6 and Figure 7 and combined Figure 2 and Figure 4 As shown, exemplarily, the battery 50 is located within the receiving space 31 and is fixedly connected to the middle frame 30. Exemplarily, the battery 50 can be fixedly connected to the middle frame 30 by means of bonding, welding, or fastening. No specific limitations are made regarding the connection method between the circuit board 41 and the middle frame 30.

[0084] For example, the battery 50 may be located on one side of the circuit board 41. The battery 50 may be electrically connected to the circuit board 41. The battery 50 may be used to transfer electrical energy to the electronic components 43 on the circuit board 41.

[0085] Figure 8 yes Figure 2 The diagram shows a structural schematic of one embodiment of the protective film 10 and the back cover 20. Figure 9 yes Figure 8 The diagram shows an assembly schematic of one embodiment of the protective film 10 and the back cover 20.

[0086] like Figure 8 and Figure 9 As shown, the protective film 10 includes a first end 10a, a second middle portion 10b, and a second end 10c connected in sequence. Both the first end 10a and the second end 10c of the protective film 10 are bent relative to one side of the second middle portion 10b of the protective film 10.

[0087] like Figure 8 and Figure 9 As shown, the protective film 10 is fixedly connected to the back cover 20. Exemplarily, the protective film 10 is fixedly connected to the inner surface 21 of the back cover 20. Exemplarily, the protective film 10 can be fixedly connected to the inner surface 21 of the back cover 20 by adhesive bonding.

[0088] Figure 10 is Figure 1 part structure schematic diagram of one embodiment of the electronic device 100 shown in Figure 3 . Figure 11 is Figure 1 part cross-sectional schematic diagram of the electronic device 100 shown in along C-C in some embodiments.

[0089] Please refer to Figure 10 and Figure 11 , and in combination with Figure 8 and Figure 9 , the protective film 10 is located in the accommodation space 31. At least part of the protective film 10 is arranged opposite at least part of the circuit board support 42.

[0090] Exemplarily, the second middle part 10b of the protective film 10 is arranged opposite the protruding part 421 of the circuit board support 42. Wherein, the protruding part 421 of the circuit board support 42 protrudes towards the direction of the back cover 20.

[0091] It can be understood that, on the one hand, when the user presses the back cover 20, and the protruding part 421 of the circuit board support 42 is extruded towards the direction close to the back cover 20, the protective film 10 can buffer the extrusion force of the protruding part 421 of the circuit board support 42, so as to avoid the protruding part 421 of the circuit board support 42 leaving marks on the back cover 20 due to direct extrusion; on the other hand, the heat generated by the first electronic element 431 can also be transmitted to the protective film 10 through the circuit board support 42, and heat dissipation is carried out through the protective film 10. In other words, the protective film 10 of the present application can not only prevent film printing, but also play a role in heat dissipation. The protective film 10 has the effect of "one thing with multiple uses".

[0092] In one embodiment, at least part of the protective film 10 is in contact with the protruding part 421 of the circuit board support 42. At this time, the protective film 10 plays a better role in preventing film printing and heat dissipation for the first electronic element 431.

[0093] Please refer to Figure 10 and Figure 11 , and in combination with Figure 8 and Figure 9 , the second middle part 10b of the protective film 10 is arranged opposite the flat part 422 of the circuit board support 42. It can be understood that, the heat generated by the second electronic element 432 can also be transmitted to the protective film 10 through the circuit board support 42, and heat dissipation is carried out through the protective film 10.

[0094] It can be understood that the present embodiment in combination with the relevant drawings specifically introduces a structure of the circuit board support 42. In other embodiments, when the circuit board support 42 adopts other structures, the protective film 10 can also play the effect of preventing the film mark on the circuit board support 42. For example, the protective film 10 does not include the protruding part 421. At this time, when the user presses the back cover 20 and a part of the circuit board support 42 extrudes the protective film 10 in the direction close to the back cover 20, the protective film 10 can buffer the extrusion force of the circuit board support 42, thereby avoiding that a part of the circuit board support 42 directly extrudes the back cover 20 to cause the back cover 20 to leave a mark.

[0095] Please refer to Figure 10 , in combination with Figure 8 and Figure 9 , it is shown that the first end part 10a and the second end part 10c of the protective film 10 are arranged opposite to the battery 50. In this way, the heat generated by the battery 50 can also be transmitted to the protective film 10 and dissipated through the protective film 10.

[0096] It can be understood that if the surface of the battery 50 is uneven, that is, the surface of the battery 50 has protrusions or pits, the protective film 10 can also play the effect of preventing the film mark on the battery 50. For example, a part of the protective film 10 can be arranged opposite to the protrusions or pits of the battery 50. In this way, when the user presses the back cover 20 and the edge of the protrusion of the battery 50 or the edge of the pit extrudes in the direction close to the back cover 20, the protective film 10 can buffer the extrusion force of the protrusion of the battery 50 or the edge of the pit, thereby avoiding that the edge of the protrusion or the pit of the battery 50 directly extrudes the back cover 20 to cause the back cover 20 to leave a mark. In this way, the protective film 10 of the present application can not only play the effect of preventing the film mark on the battery 50, but also play the effect of dissipating the heat of the battery 50. The protective film 10 has the effect of "one thing with multiple uses".

[0097] For example, the first end part 10a and the second end part 10c of the protective film 10 are in contact with the battery 50. At this time, the protective film 10 plays a better effect of preventing the film mark and dissipating the heat of the battery 50.

[0098] It can be understood that the present embodiment in combination with Figures 8 to 11 illustrates a shape of the protective film 10, but the shape of the protective film 10 of the present embodiment is not limited to Figures 8 to 11 the shape illustrated. Among them, the shape of the protective film 10 can be determined according to the position of the heat generating device inside the electronic device 100 and the position of the related structural part which is easy to extrude the back cover 20. Specifically, the present application is not limited. In addition, the present embodiment in combination with Figures 8 to 11The positional relationship between the parts of the protective film 10 and the relevant structural members (e.g. the circuit board support 42 and the battery 50) is shown. In other embodiments, the positional relationship between the parts of the protective film 10 and the relevant structural members (e.g. the circuit board support 42 and the battery 50) is not specifically limited, as long as at least part of the protective film 10 is arranged opposite to part of the circuit board support 42. When the electronic device 100 includes the battery 50, part of the protective film 10 can be arranged opposite to the battery 50.

[0099] It can be understood that the above specifically describes that the protective film 10 is fixed on the inner surface 21 of the back cover 20, and the protective film 10 is used to solve the problem that part of the circuit board support 42 leaves an imprint on the back cover 20 due to pressing the back cover 20. In other embodiments, the protective film 10 can also be fixed on other positions (e.g. the middle frame 30) of the housing 1, and the protective film 10 is used to solve the problem that part of the circuit board support 42 leaves an imprint on other positions of the housing 1 due to pressing the other positions of the housing 1. The specific embodiments are not limited.

[0100] The above specifically describes the position, function and connection relationship with other structural members of the protective film 10 in combination with the relevant drawings. The structure of the protective film 10 will be specifically described in combination with the relevant drawings below. The shape of the protective film 10 described below is taken as a square as an example.

[0101] Figure 12 is a partial exploded view of an embodiment of the protective film 10 shown in Figure 2 Figure 13 is a partial cross-sectional view of an embodiment of the electronic device 100 shown in Figure 1 As shown in

[0102] and Figure 12 and Figure 13 The protective film 10 includes a heat dissipation film 10A and a film layer 10B. The film layer 10B is fixedly connected to the inner surface 21 of the back cover 20. The heat dissipation film 10A is fixedly connected to the surface of the film layer 10B away from the back cover 20. In other words, the film layer 10B is fixedly connected between the heat dissipation film 10A and the back cover 20.

[0103] As shown in Figure 12 and Figure 13 ​As shown in FIG. 1, the heat dissipation film 10A includes a first PET (polyethylene terephthalate) layer 101, a graphite layer 102 and a second PET layer 103 which are sequentially stacked. The first PET layer 101 includes a main body 1011 and a colloid 1012 which are sequentially stacked. The colloid 1012 of the first PET layer 101 is connected between the graphite layer 102 and the main body 1011 of the first PET layer 101. In addition, the second PET layer 103 includes a first colloid 1031, a main body 1032 and a second colloid 1033 which are sequentially stacked. The first colloid 1031 of the second PET layer 103 is connected between the graphite layer 102 and the main body 1032 of the second PET layer 103.

[0104] As shown in FIG. 1, the heat dissipation film 10A includes a first PET (polyethylene terephthalate) layer 101, a graphite layer 102 and a second PET layer 103 which are sequentially stacked. The first PET layer 101 includes a main body 1011 and a colloid 1012 which are sequentially stacked. The colloid 1012 of the first PET layer 101 is connected between the graphite layer 102 and the main body 1011 of the first PET layer 101. In addition, the second PET layer 103 includes a first colloid 1031, a main body 1032 and a second colloid 1033 which are sequentially stacked. The first colloid 1031 of the second PET layer 103 is connected between the graphite layer 102 and the main body 1032 of the second PET layer 103. Figure 12 Figure 13 As shown in FIG. 1, the heat dissipation film 10A includes a first PET (polyethylene terephthalate) layer 101, a graphite layer 102 and a second PET layer 103 which are sequentially stacked. The first PET layer 101 includes a main body 1011 and a colloid 1012 which are sequentially stacked. The colloid 1012 of the first PET layer 101 is connected between the graphite layer 102 and the main body 1011 of the first PET layer 101. In addition, the second PET layer 103 includes a first colloid 1031, a main body 1032 and a second colloid 1033 which are sequentially stacked. The first colloid 1031 of the second PET layer 103 is connected between the graphite layer 102 and the main body 1032 of the second PET layer 103.

[0105] As shown in FIG. 1, the heat dissipation film 10A includes a first PET (polyethylene terephthalate) layer 101, a graphite layer 102 and a second PET layer 103 which are sequentially stacked. The first PET layer 101 includes a main body 1011 and a colloid 1012 which are sequentially stacked. The colloid 1012 of the first PET layer 101 is connected between the graphite layer 102 and the main body 1011 of the first PET layer 101. In addition, the second PET layer 103 includes a first colloid 1031, a main body 1032 and a second colloid 1033 which are sequentially stacked. The first colloid 1031 of the second PET layer 103 is connected between the graphite layer 102 and the main body 1032 of the second PET layer 103. Figure 12 Figure 13 As shown in FIG. 1, the heat dissipation film 10A includes a first PET (polyethylene terephthalate) layer 101, a graphite layer 102 and a second PET layer 103 which are sequentially stacked. The first PET layer 101 includes a main body 1011 and a colloid 1012 which are sequentially stacked. The colloid 1012 of the first PET layer 101 is connected between the graphite layer 102 and the main body 1011 of the first PET layer 101. In addition, the second PET layer 103 includes a first colloid 1031, a main body 1032 and a second colloid 1033 which are sequentially stacked. The first colloid 1031 of the second PET layer 103 is connected between the graphite layer 102 and the main body 1032 of the second PET layer 103.

[0106] (1) In the Z-axis direction, the thickness of the protective film 10 includes the thickness of the first PET layer 101, the graphite layer 102 and the second PET layer 103 of the heat dissipation film 10A, and the thickness of the anti-film printing colloid 104 and the third PET layer 105 of the film layer 10B. In other words, in the Z-axis direction, the thickness of the protective film 10 includes the thickness of at least five film layers. For example, in the Z-axis direction, the thickness of the protective film 10 reaches 0.12 millimeters or even more. Thus, in the Z-axis direction, the thickness of the protective film 10 is relatively thick, which is not conducive to the thinness of the electronic device 100. Moreover, when the internal space of the electronic device 100 is limited, the protective film 10 is also not easy to assemble in the internal space of the electronic device 100.​​

[0107] (2) The electronic device 100 needs to purchase the heat dissipation film 10A and the film layer 10B from different material companies. The number of the material supply companies is large, and the input cost is high.

[0108] In order to solve the technical problems proposed in the foregoing, a structure of the protective film 10 will be introduced in detail below in combination with the related drawings. Specifically as follows.

[0109] Figure 14 is Figure 1 Another embodiment of the electronic device 100 is shown in the partial cross-sectional view at the D-D line.

[0110] As shown in Figure 14 The protective film 10 includes the first heat dissipation layer 11 and the first film layer 12.

[0111] Exemplarily, the first heat dissipation layer 11 can be one or more of a graphite sheet, graphene, carbon black, or two-dimensional transition metal carbon nitride oxide (mxene).

[0112] Exemplarily, the first film layer 12 adopts a flexible material. For example, the first film layer 12 can adopt an acrylic adhesive.

[0113] Exemplarily, the first film layer 12 can be a double-sided adhesive tape without a substrate or a PET grid double-sided adhesive tape. In this way, the first film layer 12 has strong adhesion and holding adhesion. In addition, the first film layer 12 has good temperature resistance and is easy to die-cut.

[0114] Exemplarily, the elastic modulus of the first film layer 12 is in the range of 0.001 Gpa (Giga Pascals) to 1 Gpa. In this way, the material of the first film layer 12 is relatively soft, and the film printing prevention effect is better.

[0115] Exemplarily, the adhesion of the first film layer 12 is in the range of 64 to 88 N / 25CM. N / 25CM is the unit of adhesion, which means Newton per 25 centimeters.

[0116] Exemplarily, in the Z-axis direction, the thickness of the first film layer 12 is less than or equal to 0.5 millimeters.

[0117] As shown in Figure 14As shown, the first film layer 12 can be a double-sided adhesive structure. The first film layer 12 includes a first adhesive surface 121 and a second adhesive surface 122 arranged oppositely. The first adhesive surface 121 of the first film layer 12 is directly bonded to the first heat dissipation layer 11. It can be understood that the direct bonding between A and B can be that A and B are bonded and no longer connected through other structural members. For example, the direct bonding between the first adhesive surface 121 of the first film layer 12 and the first heat dissipation layer 11 can be that the first adhesive surface 121 of the first film layer 12 and the first heat dissipation layer 11 are fixedly connected through bonding. In addition, the first adhesive surface 121 of the first film layer 12 and the first heat dissipation layer 11 are no longer connected through other structural members. Hereinafter, if A and B are directly bonded, the explanation here can be referred to. Details will not be described below.

[0118] It can be understood that, in the structure of the protective film 10 introduced in Figure 12 and Figure 13 , the thickness of the protective film 10 in the Z-axis direction includes the thickness of the first PET layer 101, the graphite layer 102 and the second PET layer 103 of the heat dissipation film 10A, and the thickness of the anti-stamping adhesive 104 and the third PET layer 105 of the first film layer 10B. For example, in the Z-axis direction, the thickness of the protective film 10 reaches 0.12 millimeters, or even thicker. In the present embodiment, the second PET layer 103 and the third PET layer 105 introduced in Figure 14 are removed by directly bonding the first adhesive surface 121 of the first film layer 12 to the first heat dissipation layer 11. Figure 12 and Figure 13 . At this time, in terms of mass, the protective film 10 can at least save the mass of the second PET layer 103 and the third PET layer 105 introduced in Figure 12 and Figure 13 , thereby facilitating the lightweight setting of the protective film 10. In the Z-axis direction, the protective film 10 can at least save the thickness of the second PET layer 103 and the third PET layer 105 introduced in Figure 12 and Figure 13 , thereby facilitating the thin-type setting of the protective film 10. When the protective film 10 is applied to the electronic device 100, it is also beneficial to the lightweight and thin-type setting of the electronic device 100. In addition, for the electronic device 100 with limited internal space (for example, for a smart phone that strives to be extremely thin), the protective film 10 of the present embodiment can still be easily assembled inside the electronic device 100.

[0119] In an embodiment, the maximum vertical distance D1 between the second adhesive surface 122 of the first film layer 12 and the surface of the first heat dissipation layer 11 away from the first film layer 12 is less than or equal to 0.8 millimeters. Compared with Figure 12 and Figure 13The thickness of the protective film 10 in the Z-axis direction is greatly reduced, which is very beneficial to the thinness of the electronic device 100.

[0120] It can be understood that in the present embodiment, the first adhesive surface 121 of the first film layer 12 is directly bonded with the first heat dissipation layer 11, so that the first film layer 12 is directly used to support the first heat dissipation layer 11, so as to avoid damage to the first heat dissipation layer 11.

[0121] In addition, the protective film 10 can be directly composed of the first heat dissipation layer 11 and the first film layer 12. The structure of the protective film 10 is simple, so that the cost of the protective film 10 is greatly reduced. On the other hand, compared with Figure 12 and Figure 13 The structure of the protective film 10 introduced above, the protective film 10 of the present embodiment can also save Figure 14 and Figure 14 The first PET layer 101 introduced above. In this way, the thickness of the protective film 10 of the present embodiment in the Z-axis direction is thinner, which is more beneficial to the thinness and lightness of the electronic device 100.

[0122] As shown in Figure 10 , the second adhesive surface 122 of the first film layer 12 is bonded with the back cover 20. For example, the second adhesive surface 122 of the first film layer 12 is directly bonded with the inner surface 21 of the back cover 20. In this way, the second adhesive surface 122 of the first film layer 12 and the inner surface 21 of the back cover 20 are no longer connected through additional structural parts, so that the thickness of the electronic device 100 in the Z-axis direction is thin enough, that is, beneficial to the thinness of the electronic device 100. In other embodiments, the second adhesive surface 122 of the first film layer 12 and the back cover 20 can also be indirectly bonded through other adhesive layers.

[0123] Please refer to Figure 11 , and in combination with Figure 14 and Figure 10 , at least part of the first film layer 12 is arranged opposite to the protruding part 421 of the circuit board support 42.

[0124] It can be understood that, on the one hand, when the user presses the back cover 20, and the protruding portion 421 of the circuit board support 42 is extruded towards the direction close to the back cover 20, the first film layer 12 can buffer the extrusion force of the protruding portion 421 of the circuit board support 42, so as to avoid the protruding portion 421 of the circuit board support 42 leaving marks on the back cover 20 due to direct extrusion of the back cover 20; on the other hand, the heat generated by the first electronic element 431 can also be transmitted to the first heat dissipation layer 11 through the circuit board support 42, and dissipated through the first heat dissipation layer 11. In other words, the first film layer 12 of the protective film 10 can play a role of preventing film marks. The first heat dissipation layer 11 of the protective film 10 can play a role of heat dissipation. Therefore, the protective film 10 of the present embodiment is a "two-in-one" film layer structure.

[0125] It can be understood that the protective film 10 of the present embodiment can achieve heat dissipation and effectively prevent film marks in a very thin thickness. In other words, the protective film 10 of the present embodiment has the functions of preventing film marks and heat dissipation, and has a thin thickness at the same time.

[0126] Referring to Figure 11 , and combining Figure 14 and Figure 10 , in an embodiment, the first heat dissipation layer 11 is arranged opposite to the protruding portion 421 of the circuit board support 42. In this way, the distance between the first heat dissipation layer 11 and the first electronic element 431 is short. The heat generated by the first electronic element 431 can be quickly transmitted to the first heat dissipation layer 11 and dissipated through the first heat dissipation layer 11.

[0127] Referring to Figure 11 , and combining Figure 14 and Figure 10 , in an embodiment, the first heat dissipation layer 11 is arranged opposite to the flat portion 422 of the circuit board support 42. It can be understood that the heat generated by the second electronic element 432 can also be transmitted to the first heat dissipation layer 11 through the circuit board support 42 and dissipated through the first heat dissipation layer 11.

[0128] Referring to Figure 14 , and combining Figure 10 , it is exemplarily shown that a part of the first heat dissipation layer 11 is arranged opposite to the battery 50. In this way, the distance between the first heat dissipation layer 11 and the battery 50 is short. The heat generated by the battery 50 can be quickly transmitted to the first heat dissipation layer 11 and dissipated through the first heat dissipation layer 11.

[0129] Referring to Figure 15 , and combining Figure 2 , it is exemplarily shown that a part of the first film layer 12 is arranged opposite to the battery 50.

[0130] It can be understood that if the surface of the battery 50 is uneven, that is, the surface of the battery 50 has protrusions or pits, a part of the first film layer 12 can be arranged opposite to the protrusions or pits of the battery 50. In this way, when the user presses the back cover 20, and the edges of the protrusions or pits of the battery 50 are extruded in the direction close to the back cover 20, the first film layer 12 can buffer the extrusion force of the protrusions of the battery 50 or the extrusion force of the edges of the pits, thereby avoiding the edges of the protrusions or pits of the battery 50 from leaving marks on the back cover 20 due to direct extrusion of the back cover 20; on the other hand, the heat generated by the battery 50 can also be transmitted to the first heat dissipation layer 11 and dissipated through the first heat dissipation layer 11.

[0131] Figure 16 is Figure 1 a partial exploded schematic view of another embodiment of the protective film 10. Figure 15 is Figure 16 a partial cross-sectional view of still another embodiment of the electronic device 100 at the D-D line.

[0132] As Figure 12 and Figure 13 shown, the protective film 10 further includes a substrate 13. The substrate 13 is fixedly connected to the side of the first heat dissipation layer 11 away from the first film layer 12. In other words, the first heat dissipation layer 11 can be fixedly connected between the substrate 13 and the first film layer 12. In other embodiments, the protective film 10 can also not include the substrate 13.

[0133] Exemplarily, the substrate 13 can be a PET film.

[0134] It can be understood that by fixedly connecting the substrate 13 to the side of the first heat dissipation layer 11 away from the first film layer 12, the first heat dissipation layer 11 is supported from different sides by the first film layer 12 and the substrate 13, thereby avoiding damage to the first heat dissipation layer 11. In this way, the reliability of the protective film 10 is better.

[0135] In an embodiment, the substrate 13 includes a first surface 131 and a second surface 132 arranged away from each other. Among them, the first surface 131 of the substrate 13 is a glue surface, and the first surface 131 of the substrate 13 is directly bonded to the first heat dissipation layer 11.

[0136] It can be understood that by directly bonding the first surface 131 of the substrate 13 to the first heat dissipation layer 11, the first surface 131 of the substrate 13 and the first heat dissipation layer 11 are no longer connected by an additional structural member, thereby making the thickness of the protective film 10 in the Z-axis direction thin enough, that is, facilitating the thin type setting of the protective film 10. In this way, when the protective film 10 is applied to the electronic device 100, it is also beneficial to the light weight and thin type setting of the electronic device 100.

[0137] In one embodiment, the maximum vertical distance D2 between the second surface 132 of the substrate 13 and the second adhesive surface 122 of the first film layer 12 is less than or equal to 0.1 mm. Compared to Figure 15 and Figure 16 The protective film 10 described is 0.12 mm thick. The thickness of the protective film 10 in this embodiment is greatly reduced in the Z-axis direction, which is beneficial for the thinner design of the electronic device 100 when the protective film 10 is applied to the electronic device 100.

[0138] In other embodiments, the substrate 13 and the first heat dissipation layer 11 may also employ other connection methods. This embodiment is not specifically limited to these methods.

[0139] Please see Figure 10 and Figure 11 and combined Figure 17 and Figure 2 As shown, in one embodiment, at least a portion of the substrate 13 is in contact with the protrusion 421 of the circuit board support 42. In this case, the protective film 10 better serves to prevent film staining and dissipate heat for the first electronic component 431. In other embodiments, at least a portion of the substrate 13 may also contact other locations on the circuit board support 42. Specific details will not be elaborated here.

[0140] In one embodiment, a portion of the substrate 13 is in contact with the battery 50. In this case, the protective film 10 is more effective in preventing film residue and dissipating heat from the battery 50.

[0141] Figure 17 yes Figure 17 A partial cross-sectional schematic diagram of one embodiment of the protective film 10 shown.

[0142] like Figure 18 As shown, in one embodiment, the substrate 13 includes a first central portion 133 and an edge portion 134. The edge portion 134 of the substrate 13 is connected to the first central portion 133 of the substrate 13 and is disposed around the first central portion 133 of the substrate 13. The edge portion 134 of the substrate 13 is bent relative to the first central portion 133 of the substrate 13 and is connected to the first adhesive surface 121 of the first film layer 12, and the substrate 13 and the first film layer 12 enclose an accommodating space 135.

[0143] like Figure 2 As shown, the first heat dissipation layer 11 is located within the accommodating space 135 and is fixedly connected to the first central portion 133 of the substrate 13. In this way, the first film layer 12 and the substrate 13 can protect the first heat dissipation layer 11 to prevent damage to it. The protective film 10 also offers improved reliability.

[0144] Figure 19 yes Figure 1A partially exploded view of another embodiment of the protective film 10 shown. Figure 18 yes Figure 19 A partial cross-sectional view of another embodiment of the electronic device 100 at the DD line.

[0145] like Figure 11 and Figure 10 As shown, in one embodiment, the protective film 10 includes a second heat dissipation layer 14. The second heat dissipation layer 14 is fixedly connected between the first heat dissipation layer 11 and the substrate 13.

[0146] It is understood that by fixing the second heat dissipation layer 14 between the first heat dissipation layer 11 and the substrate 13, the cooperation between the second heat dissipation layer 14 and the first heat dissipation layer 11 improves the heat dissipation capacity of the protective film 10. Thus, when the first electronic component 431 (see...) Figure 18 ) and battery 50 (see Figure 19 When the heat generated is transferred to the first heat dissipation layer 11 and the second heat dissipation layer 14, the first heat dissipation layer 11 and the second heat dissipation layer 14 can dissipate heat more quickly.

[0147] For example, the second heat dissipation layer 14 may be one or more of graphite sheets, graphene, carbon black, or two-dimensional transition metal carbon nitride oxides (mxene).

[0148] In other embodiments, the protective film 10 may also include more heat dissipation layers, such as a third heat dissipation layer (not shown), a fourth heat dissipation layer (not shown), etc. Specific implementation is not limited in this application.

[0149] like ​ and ​ As shown, in one embodiment, the protective film 10 includes a bonding adhesive 15. The bonding adhesive 15 includes a third adhesive surface 151 and a fourth adhesive surface 152 disposed opposite to each other. The third adhesive surface 151 of the bonding adhesive 15 is directly bonded to the first heat dissipation layer 11. The fourth adhesive surface 152 of the bonding adhesive 15 is directly bonded to the second heat dissipation layer 14.

[0150] Understandably, the second heat dissipation layer 14 is fixedly connected to the first heat dissipation layer 11 by the adhesive 15, thereby making the connection between the second heat dissipation layer 14 and the first heat dissipation layer 11 more stable and reliable. In addition, the connection method between the second heat dissipation layer 14 and the first heat dissipation layer 11 is relatively simple, which helps to reduce the investment cost of the protective film 10.

[0151] Exemplarily, in the Z-axis direction, the thickness of the connecting glue 15 in the Z-axis direction ranges from 0.01 mm to 0.2 mm. In this way, the connection between the second heat dissipation layer 14 and the first heat dissipation layer 11 can be ensured to be more firm and reliable, and the thickness of the protective film 10 will not be increased to a large extent, thereby being conducive to the thin-type arrangement of the protective film 10.

[0152] It can be understood that the embodiments in the present application and the features in the embodiments can be combined with each other without conflict, and any combination of the features in different embodiments is also within the protection scope of the present application, that is, the above-described multiple embodiments can also be combined as needed.

[0153] It can be understood that all the above-mentioned drawings are exemplary drawings of the present application, and do not represent the actual size of the product. The size ratio relationship between the components in the drawings is not a limitation on the actual product of the present application. The above are only some embodiments and implementation manners of the present application, and the protection scope of the present application is not limited thereto. Any person skilled in the art can easily think of changes or replacements within the technical scope disclosed in the present application, which should be covered within the protection scope of the present application. Therefore, the protection scope of the present application should be subject to the protection scope of the claims.

Claims

1. An electronic device (100), characterized by The application relates to a protective film (10), a shell (1) and a circuit board assembly (40), wherein the shell (1) encloses a containing space (31); the circuit board assembly (40) comprises a circuit board (41), a circuit board support (42) and electronic components (43), the circuit board (41) is located in the containing space (31) and is fixedly connected with the shell (1), the circuit board support (42) is fixedly connected with the circuit board (41) and encloses a mounting space (45), and the electronic components (43) are located in the mounting space (45) and are fixedly connected with the circuit board (41); the protective film (10) is located in the containing space (31) and is fixedly connected with the shell (1), and at least part of the protective film (10) is oppositely arranged with at least part of the circuit board support (42); the protective film (10) comprises a first heat dissipation layer (11) and a first film layer (12), the first film layer (12) is made of flexible material, the first film layer (12) comprises oppositely arranged first and second adhesive surfaces (121 and 122), the first adhesive surface (121) of the first film layer (12) is directly bonded with the first heat dissipation layer (11), and the second adhesive surface (122) of the first film layer (12) is bonded with the shell (1). The shell (1) comprises a back cover (20) and a middle frame (30), the back cover (20) is fixedly connected with the middle frame (30) and encloses the containing space (31); the circuit board (41) is fixedly connected with the middle frame (30), and the second adhesive surface (122) of the first film layer (12) is bonded with the back cover (20). The circuit board support (42) comprises a convex part (421) and a flat part (422), the convex part (421) is convex relative to the flat part (422), and the convex part (421) is convex towards the direction of the back cover (20); the electronic components (43) comprise a first electronic component (431), the first electronic component (431) is oppositely arranged with the convex part (421), and at least part of the first film layer (12) is oppositely arranged with the convex part (421). The first electronic component (431) is a board-to-board electrical connector or a combiner.

2. The electronic device (100) according to claim 1, characterized in that At least part of the first heat dissipation layer (11) is oppositely arranged with the convex part (421). The electronic components (43) comprise a second electronic component (432), the second electronic component (432) is oppositely arranged with the flat part (422), and part of the first heat dissipation layer (11) is oppositely arranged with the flat part (422).

3. The electronic device (100) according to claim 2, characterized in that The protective film (10) further comprises a substrate (13), the substrate (13) is fixedly connected to the side of the first heat dissipation layer (11) which is away from the first film layer (12). The substrate (13) is in contact with the circuit board support (42).

4. The electronic device (100) according to claim 3, characterized in that ​ 5. The electronic device (100) according to claim 3, characterized in that ​ 6. The electronic device (100) according to claim 3, characterized in that ​ 7. The electronic device (100) according to any one of claims 1 to 6, characterized in that ​ 8. The electronic device (100) according to claim 7, characterized by ​ 9. The electronic device (100) according to claim 7, characterized by The substrate (13) comprises a first middle portion (133) and an edge portion (134), the edge portion (134) of the substrate (13) is connected to the first middle portion (133) of the substrate (13) and is arranged around the first middle portion (133) of the substrate (13); The edge portion (134) of the substrate (13) is bent relative to the first middle portion (133) of the substrate (13) and is connected to the first adhesive surface (121) of the first film layer (12), the substrate (13) and the first film layer (12) enclose a containing space (135), and the first heat dissipation layer (11) is located in the containing space (135) and is fixedly connected to the first middle portion (133) of the substrate (13).

10. The electronic device (100) according to claim 7, characterized by The substrate (13) comprises a first surface (131), the first surface (131) of the substrate (13) is an adhesive surface, and the first surface (131) of the substrate (13) is directly bonded to the first heat dissipation layer (11).

11. The electronic device (100) according to claim 10, characterized by The substrate (13) comprises a second surface (132), the second surface (132) of the substrate (13) is arranged opposite to the first surface (131) of the substrate (13), and a maximum vertical distance D2 between the second surface (132) of the substrate (13) and a second adhesive surface (122) of the first film layer (12) is less than or equal to 0.1 mm.

12. The electronic device (100) according to claim 7, characterized by The protective film (10) comprises a second heat dissipation layer (14), which is fixedly connected between the first heat dissipation layer (11) and the substrate (13).

13. The electronic device (100) according to claim 12, characterized by The protective film (10) comprises a connecting adhesive (15), the connecting adhesive (15) comprises a third adhesive surface (151) and a fourth adhesive surface (152) arranged opposite to each other, the third adhesive surface (151) of the connecting adhesive (15) is directly bonded to the first heat dissipation layer (11), and the fourth adhesive surface (152) of the connecting adhesive (15) is directly bonded to the second heat dissipation layer (14).

14. The electronic device (100) according to any one of claims 1 to 6, characterized by The first film layer (12) has an elastic modulus in a range of 0.001 Gpa to 1 Gpa.

15. The electronic device (100) according to any one of claims 1 to 6, characterized by The first film layer (12) is a double-sided adhesive tape without a substrate or a PET grid double-sided adhesive tape.

16. The electronic device (100) according to any one of claims 1 to 6, characterized by The first heat dissipation layer (11) is a graphite sheet, a graphene, carbon black or a two-dimensional transition metal carbon-nitrogen-oxide.

17. The electronic device (100) according to any one of claims 1 to 6, characterized by The electronic device (100) comprises a battery (50), the battery (50) is located in the containing space (31) and is fixedly connected to the shell (1), and the battery (50) is located on one side of the circuit board (41); A part of the protective film (10) is arranged opposite to the battery (50).

18. The electronic device (100) according to claim 17, characterized by The protective film (10) comprises a first end portion (10a), a second middle portion (10b) and a second end portion (10c) connected in sequence, and the first end portion (10a) and the second end portion (10c) of the protective film (10) are both bent relative to one side of the second middle portion (10b) of the protective film (10). The second middle part (10b) of the protective film (10) is arranged opposite to the circuit board support (42), and the first end part (10a) and the second end part (10c) of the protective film (10) are both arranged opposite to the battery (50).

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