High-power semiconductor device press-fitting device

Abstract

The utility model discloses a high-power semiconductor device press-fitting device which comprises a press-fitting base, a supporting seat is arranged on the upper surface of the press-fitting base and provided with a linear sliding groove, the linear sliding groove is in sliding fit with a press-fitting mechanism, a motor is installed on the back vertical face of the supporting seat, the press-fitting mechanism comprises a sliding block, and the sliding block is in sliding fit with the linear sliding groove. A rack is arranged on the back vertical face of the sliding block, a driving shaft of the motor is connected with a gear, the gear is meshed with the rack, the upper end and the lower end of the rack are elastically connected with single-tooth pieces correspondingly, a connecting piece is arranged at the top of the sliding block and connected with a press-fitting plate, and a fixing groove is formed in the position, located at the projection of the press-fitting plate, of the upper surface of the press-fitting base. Through the elastic connection between the rack and the single-tooth piece, when the gear rotates to the single-tooth piece from the rack, the gear is separated from the rack, and therefore the purpose of stopping the downward pressing action of the press-fitting plate is achieved.

Description

Technical Field

[0001] This utility model belongs to the field of semiconductor manufacturing equipment technology, and in particular relates to a pressing device for high-power semiconductor devices. Background Technology

[0002] In the manufacturing process of high-power semiconductor devices, it is usually necessary to connect the semiconductor device to the substrate through welding or sintering processes. In order to ensure the connection quality, a certain pressure needs to be applied to the semiconductor device and the substrate through a pressing device during the welding or sintering process to fix them in place.

[0003] Currently, motor-controlled pressing plates are mostly used to press semiconductor devices and substrates. In order to prevent damage to the semiconductor devices and substrates, the number of rotations of the motor drive shaft needs to be preset to control the stroke of the pressing plate. This not only increases the equipment cost, but also increases the machine debugging time and reduces the pressing efficiency. Utility Model Content

[0004] The purpose of this invention is to solve the problem in the prior art that, in order to control the stroke of the pressing plate, the number of rotations of the motor drive shaft needs to be predetermined, which increases equipment cost and debugging time and reduces pressing efficiency. This is achieved by using the elastic connection between the rack and the single tooth. When the gear rotates from the rack to the single tooth, the gear disengages from the rack, and the pressing plate stops pressing.

[0005] The specific technical solution of this utility model is as follows:

[0006] A high-power semiconductor device press-fitting device includes a press-fitting base, a support seat on the upper surface of the press-fitting base, a linear slide groove on the support seat, a press-fitting mechanism slidably engaged with the linear slide groove, a motor mounted on the back surface of the support seat, a slider, a rack on the back surface of the slider, a gear connected to the drive shaft of the motor, the gear meshing with the rack, a single tooth elastically connected to the upper and lower ends of the rack, a connector on the top of the slider, a press-fitting plate connected to the connector, and a fixing groove on the upper surface of the press-fitting base at the projection of the press-fitting plate.

[0007] Furthermore, fixing members are respectively provided on the upper and lower sides of the rack, and springs are fixedly connected between the fixing members and the single tooth.

[0008] Furthermore, the fixing component and the single tooth component are each provided with a through hole, the through hole is equipped with a fastening bolt, and the fastening bolt is equipped with a fastening nut.

[0009] Furthermore, the slider has a first limiting member on each side of its vertical surface, and the linear slide has a first limiting groove that matches the first limiting member.

[0010] Furthermore, the connector is provided with a threaded hole, and the upper surface of the press plate is provided with a threaded rod that matches the threaded hole.

[0011] Furthermore, a limiting rod is provided on one side of the slider, and an installation groove is provided on the support base. The installation groove is equipped with a limiting bolt, and the limiting bolt is equipped with a limiting nut.

[0012] Furthermore, a mounting platform is provided on the back of the support base, and the motor is mounted on the mounting platform.

[0013] Furthermore, the upper surface of the press base is provided with a groove, and one side of the press base is provided with an opening communicating with the groove. A fixing plate is provided in the groove, and the upper surface of the fixing plate is provided with a fixing groove at the projection of the press plate. The fixing groove is a through groove.

[0014] Furthermore, the two sides of the fixed plate are respectively provided with second limiting members, and the two sides of the sink are provided with second limiting grooves that are used in conjunction with the second limiting members.

[0015] Furthermore, a pushing component is provided on the upper surface of the fixed plate.

[0016] Compared with the prior art, the present invention has the following beneficial effects:

[0017] During the pressing operation, the substrate and semiconductor device are placed into the fixed slot in sequence. The motor is started, and the pressing plate moves downward through the meshing of the gear and rack. When the pressing plate presses down on the semiconductor device, the gear rotates onto the single tooth. Since the single tooth is elastically connected to the rack, although the gear is still rotating, the rack has stopped moving downward. Therefore, the pressing plate will not continue to press down on the semiconductor device, avoiding damage to the semiconductor device. This eliminates the need to adjust and control the number of rotations of the motor drive shaft, reduces equipment costs, saves equipment debugging time, and improves pressing efficiency. Attached Figure Description

[0018] Figure 1 This is a three-dimensional structural diagram of an embodiment of the present utility model;

[0019] Figure 2 This is a schematic diagram of the back structure of this utility model embodiment in the state of the pressure plate being lifted;

[0020] Figure 3 for Figure 2 A magnified view of a portion of point A in the middle;

[0021] Figure 4 This is a schematic diagram of the back structure of this utility model under the pressure of the pressing plate;

[0022] Figure 5 This is a three-dimensional structural diagram of the semiconductor device being pushed out by the fixing plate in an embodiment of this utility model;

[0023] Figure 6 This is an assembly diagram of the pressing mechanism and the single toothed component in an embodiment of this utility model;

[0024] Figure 7 This is a three-dimensional structural diagram of the pressing mechanism in an embodiment of this utility model;

[0025] Figure 8 This is a three-dimensional structural diagram of a single toothed component in an embodiment of this utility model;

[0026] Figure label:

[0027] 1. Press-fit base; 11. Fixing groove; 12. Settling groove; 121. Second limiting groove;

[0028] 2. Support base; 21. Linear slide; 211. First limiting groove; 22. Mounting slide; 221. Limiting bolt; 222. Limiting nut; 23. Mounting platform;

[0029] 3. Pressing mechanism; 31. Slider; 311. Rack; 312. Fixing component; 313. First limiting component; 314. Limiting rod; 32. Connecting component; 321. Threaded hole; 33. Pressing plate; 331. Threaded rod;

[0030] 4. Electric motor; 41. Gear;

[0031] 5. Single toothed component; 51. Spring;

[0032] 6. Fixing plate; 61. Second limiting component; 62. Pushing component. Detailed implementation method:

[0033] To better understand the purpose, structure, and function of this utility model, the technical solutions in the embodiments of this utility model will be clearly and completely described below with reference to the accompanying drawings.

[0034] See Figures 1 to 8This embodiment discloses a high-power semiconductor device press-fitting device, including a press-fitting base 1, a support seat 2 on the upper surface of the press-fitting base 1, a linear slide groove 21 on the support seat 2, a press-fitting mechanism 3 slidably fitted onto the linear slide groove 21, a motor 4 mounted on the back surface of the support seat 2, and a slider 31 on the back surface of the slider 31. The slider 31 slidably fits onto the linear slide groove 21, and a rack 311 is provided on the back surface of the slider 31. A gear 41 is connected to the drive shaft of the motor 4, and the gear 41 meshes with the rack 311. Single toothed parts 5 are elastically connected to the upper and lower ends of the rack 311, respectively. The teeth on the single toothed parts 5 have the same size as the teeth on the rack 311. A connecting part 32 is provided on the top of the slider 31, and a press-fitting plate 33 is connected to the connecting part 32. A fixing groove 11 is provided on the upper surface of the press-fitting base 1 at the projection of the press-fitting plate 33. During the press-fitting operation, the substrate and the semiconductor device are sequentially placed into the fixing groove. In step 11, the motor 4 is started, and the pressing plate 33 moves downward through the meshing of the gear 41 and the rack 311. When the pressing plate 33 presses down on the semiconductor device, the gear 41 rotates onto the single tooth 5 on the upper part of the rack 311. Since the single tooth 5 is elastically connected to the rack 311, although the gear 41 is still rotating, the single tooth 5 continues to reciprocate. The gear 41 will no longer drive the rack 311 to move downward. Therefore, the pressing plate 33 will not continue to press down on the semiconductor device, thus avoiding damage to the semiconductor device. After the pressing is completed, the motor 4 is started in reverse to lift the pressing plate 33. The gear 41 rotates onto the single tooth 5 on the lower part of the rack 311. Since the single tooth 5 is elastically connected to the rack 311, although the gear 41 is still rotating, the rack 311 has stopped moving upward, preventing the slider 31 from slipping off the linear groove 21.

[0035] Fixing members 312 are respectively provided on the upper and lower sides of the rack 311. A spring 51 is fixedly connected between the fixing member 312 and the single tooth 5. The fixing member 312 and the single tooth 5 are elastically connected by the spring 51.

[0036] The fixing member 312 and the single tooth member 5 are respectively provided with through holes. The through holes are equipped with fastening bolts, and the fastening bolts are equipped with fastening nuts. By adjusting the position of the fastening nuts on the fastening bolts, the distance between the fixing member 312 and the single tooth member 5 can be adjusted to adapt to the tooth pitch of the gear 41.

[0037] The slider 31 has a first limiting member 313 on each of its two sides facing each other. The linear slide 21 has a first limiting groove 211 that matches the first limiting member 313. The cooperation between the first limiting member 313 and the first limiting groove 211 makes the slider 31 slide more smoothly and its position more stable in the linear slide 21.

[0038] The connector 32 is provided with a threaded hole 321, and the upper surface of the pressure plate 33 is provided with a threaded rod 331 that matches the threaded hole 321. By cooperating with the threaded hole 321 and the threaded rod 331, the height of the pressure plate 33 can be adjusted to accommodate semiconductor devices of different heights.

[0039] A limiting rod 314 is provided on one side of the slider 31, and the support base 2 is provided with a mounting groove 22. The mounting groove 22 is equipped with a limiting bolt 221, and the limiting bolt 221 is equipped with a limiting nut 222. By limiting the position of the limiting rod 314 through the limiting bolt 221, the rising height of the slider 31 can be limited, preventing the slider 31 from falling out of the linear groove 21. Through the sliding cooperation between the mounting groove 22 and the limiting bolt 221, and the cooperation between the limiting bolt 221 and the limiting nut 222, the position of the limiting bolt 221 on the mounting groove 22 can be adjusted and fixed.

[0040] The support base 2 has a mounting platform 23 on its back side. The motor 4 is mounted on the mounting platform 23, making the motor 4 more stable when running.

[0041] The upper surface of the pressing base 1 is provided with a groove 12, and one side of the pressing base 1 is provided with an opening communicating with the groove 12. A fixing plate 6 is provided in the groove 12. The upper surface of the fixing plate 6 is provided with a fixing groove 11 at the projection of the pressing plate 33. The fixing groove 11 is a through groove. After the pressing is completed, the control motor 4 reverses to lift the pressing plate 33 and push the fixing plate 6 so that the fixing groove 11 leaves the pressing base 1. At this time, the semiconductor device will automatically fall out of the fixing groove 11.

[0042] The fixed plate 6 is provided with second limiting members 61 on both sides of the vertical surface, and the sink 12 is provided with second limiting grooves 121 on both sides of the vertical surface, which are used in conjunction with the second limiting members 61, so that the fixed plate 6 can move more smoothly and its position is more stable in the sink 12.

[0043] The upper surface of the fixed plate 6 is provided with a pusher 62. In this embodiment, the pusher 62 is cubic in shape and is located close to one side of the fixed plate 6, so that the operator can push and pull the fixed plate 6 by pushing the pusher 62.

[0044] Working principle: During the press-fitting operation, the substrate and semiconductor device are placed into the fixing groove 11 in sequence. The motor 4 is started, and the pressing plate 33 moves downward through the meshing of the gear 41 and the rack 311. When the pressing plate 33 presses down on the semiconductor device, the gear 41 rotates onto the single tooth 5. Since the single tooth 5 is elastically connected to the rack 311, although the gear 41 is still rotating, the rack 311 has stopped moving downward. Therefore, the pressing plate 33 will not continue to press down on the semiconductor device, avoiding damage to the semiconductor device. After the press-fitting is completed, the motor 4 is started in reverse to lift the pressing plate 33 and push the fixing plate 6, so that the fixing groove 11 leaves the pressing base 1. At this time, the semiconductor device will automatically fall out of the fixing groove 11.

[0045] The above description is only a preferred embodiment of the present utility model, but the protection scope of the present utility model is not limited thereto. Any equivalent substitutions or changes made by those skilled in the art within the technical scope disclosed in the present utility model, based on the technical solution and concept of the present utility model, should be included within the protection scope of the present utility model.

Claims

1. A high power semiconductor device press mounting apparatus, characterized by: The utility model provides a press -fitting base (1), the upper surface of press -fiting base (1) is equipped with support seat (2), support seat (2) is equipped with linear slide groove (21), linear slide groove (21) is slidably fitted with press -fitting mechanism (3), support seat (2) back vertical surface is installed motor (4), press -fitting mechanism (3) includes sliding block (31), sliding block (31) with linear slide groove (21) slidingly fits, sliding block (31) back vertical surface is equipped with rack (311), the drive shaft of motor (4) is connected with gear (41), gear (41) is engaged with rack (311), and the upper end and lower end of rack (311) are elastically connected with single tooth piece (5) respectively, and the top of sliding block (31) is equipped with connecting piece (32), and connecting piece (32) is connected with press -fitting plate (33), and the upper surface of press -fitting base (1) is located the projection of press -fitting plate (33) and is equipped with fixed groove (11).

2. The high power semiconductor device press mounting apparatus according to claim 1, wherein The upper portion and the lower portion of the rack (311) are respectively provided with a fixed part (312) opposite to each other, and a spring (51) is fixedly connected between the fixed part (312) and the single tooth piece (5).

3. The high power semiconductor device press mounting apparatus according to claim 2, wherein The fixed part (312) and the single tooth piece (5) are respectively provided with a round through hole, and a fastening bolt is matched with the round through hole.

4. The high power semiconductor device press mounting apparatus according to claim 1, wherein The two side vertical surfaces of the sliding block (31) are oppositely provided with a first limiting part (313), and the linear slide groove (21) is provided with a first limiting groove (211) matched with the first limiting part (313).

5. The high power semiconductor device press mounting apparatus according to claim 1, wherein The connecting piece (32) is provided with a threaded hole (321), and the upper surface of the press -fitting plate (33) is provided with a threaded rod (331) matched with the threaded hole (321).

6. The high power semiconductor device press mounting apparatus according to claim 1, wherein The side vertical surface of the sliding block (31) is provided with a limiting rod (314), and the support seat (2) is provided with a mounting slide groove (22) matched with the limiting rod (314).

7. The high power semiconductor device press mounting apparatus according to claim 1, wherein The back vertical surface of the support seat (2) is provided with a mounting table (23), and the motor (4) is mounted on the mounting table (23).

8. The high power semiconductor device press mounting apparatus according to claim 1, wherein The upper surface of the press -fitting base (1) is provided with a sink (12), and one side of the press -fitting base (1) is provided with an opening communicated with the sink (12).

9. The high power semiconductor device press mounting apparatus according to claim 8, wherein The two side vertical surfaces of the fixed plate (6) are respectively provided with a second limiting part (61), and the two side vertical surfaces of the sink (12) are provided with a second limiting groove (121) matched with the second limiting part (61).

10. The high power semiconductor device press mounting apparatus according to claim 9, wherein The upper surface of the fixed plate (6) is provided with a pushing piece (62).

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