Temperature control reaction kettle device for laser velocity field instrument

Abstract

The utility model discloses a temperature control reaction kettle device for a laser velocity field instrument in the technical field of temperature control of reaction kettles. The annular heating rod is arranged in the reaction kettle and is used for heating fluid in the reaction kettle; the semiconductor chilling plate is used for dissipating heat of the reaction kettle and comprises a refrigeration surface and a heat dissipation surface; the water-cooling heat dissipation system comprises a water-cooling plate attached to the heat dissipation face and a cooling liquid circulating pipeline for refrigerating the water-cooling plate. Through cooperation of the annular heating rod, the semiconductor chilling plate and the cooling liquid circulating pipeline, accurate temperature control of fluid in the reaction kettle is achieved, and the reaction kettle is suitable for a laser velocity field instrument.

Description

Technical Field

[0001] This utility model relates to the field of temperature control technology for reaction vessels, specifically to a temperature-controlled reaction vessel device for laser velocity field instruments. Background Technology

[0002] Laser velocity field instruments are used to study the effect of fluid temperature on velocity distribution in a reactor. These instruments utilize laser technology to measure the velocity field of a fluid or solid, and a high-speed camera captures images of the fluid. The reactor is heated using a water bath method. Traditional water bath temperature control has significant drawbacks. It involves placing the reactor in a large container filled with water and relying on heat transfer from the water for temperature control. However, in a large water bath, the temperature distribution is not uniform, and the water bath method is sensitive to changes in ambient temperature. If the laboratory temperature is low, the water loses heat quickly, making it difficult to maintain the set temperature; conversely, if the ambient temperature is high, the temperature may become excessively high.

[0003] During this process, a flowing water layer forms between the reactor and the high-speed camera. The presence of this water layer alters the propagation path of light, preventing the camera from capturing the marked particles and thus affecting the measurement of the flow field velocity distribution. For example, light refraction and scattering cause distortion in the captured flow field image. Furthermore, the unstable flow of the water layer generates water waves and vortices, which not only affect the camera's ability to capture the flow trajectory within the reactor but also interfere with laser tracing.

[0004] Therefore, it is necessary to develop a new temperature-controlled reactor device that can control the temperature of the reaction process while ensuring the high transparency and optical stability of the reactor wall. Utility Model Content

[0005] The present invention aims to provide a temperature-controlled reaction vessel device for laser velocity field instruments, so as to provide a reaction vessel device that ensures high transparency and optical stability of the reaction vessel wall while achieving temperature control.

[0006] To achieve the above objectives, this utility model provides the following technical solution:

[0007] A temperature-controlled reaction vessel device for a laser velocity field instrument includes: a reaction vessel; an annular heating rod disposed inside the reaction vessel for heating the fluid inside the reaction vessel; a semiconductor cooling chip for dissipating heat from the reaction vessel, including a cooling surface and a heat dissipation surface; and a water-cooled heat dissipation system including a water-cooled plate attached to the heat dissipation surface and a coolant circulation pipe for cooling the water-cooled plate.

[0008] Furthermore, the reaction vessel is made of a highly transparent material. In experimental scenarios using laser velocity field instruments, the laser and high-speed camera require extremely high transparency from the reaction vessel. The reaction vessel is made of highly transparent materials, including but not limited to glass and organic transparent materials, to ensure that the laser can penetrate the reaction vessel without obstruction, enabling accurate measurement of the fluid velocity field inside the reaction vessel.

[0009] Furthermore, the annular heating rod is positioned at the bottom of the inner side of the reactor. This close fit ensures more uniform heating, allowing heat to be transferred quickly and effectively to the fluid within the reactor. The annular heating rod is connected to an external adjustable-power heating controller via its heating contact end, enabling the reactor to meet the diverse needs of fluid velocity field experiments at different temperatures. In experiments requiring the simulation of high-temperature chemical reactions, the heating power can be increased to rapidly raise the fluid temperature to the required level; conversely, in experiments requiring a more gradual temperature rise, the heating power can be reduced to achieve precise temperature control.

[0010] Furthermore, the connection between the water-cooled plate and the heat dissipation surface is filled with thermally conductive silicone grease. The function of the thermally conductive silicone grease is to enhance the heat conduction efficiency between the two, so that the heat from the heat dissipation surface of the semiconductor refrigeration chip can be quickly transferred to the water-cooled plate of the water-cooling system.

[0011] Furthermore, the water-cooled heat dissipation system includes a circulation pump and a coolant storage tank. The circulation pump is used to deliver coolant to circulate within the coolant storage tank and the coolant circulation pipes.

[0012] The circulating pump continuously drives the coolant to circulate in the coolant circulation pipe. When the coolant flows through the water-cooled plate connected to the heat dissipation surface of the semiconductor refrigeration chip, it absorbs heat and then carries the heat to the coolant storage tank.

[0013] Furthermore, it also includes a cooling fan. The cooling fan exchanges heat with the external environment, dissipating heat and continuously cooling the heat dissipation surface of the thermoelectric cooler. This ensures the thermoelectric cooler is always in good working condition, thereby ensuring the stable and reliable cooling effect of the entire temperature-controlled reactor.

[0014] Furthermore, the cooling surface is attached to the bottom of the reactor.

[0015] The working principle and beneficial effects of this utility model:

[0016] A ring-shaped heating rod is used to heat the fluid. This rod is positioned at the bottom inner side of the reactor vessel, tightly fitted to the vessel's interior. This design and fitting method ensures more uniform heating, allowing for rapid and efficient heat transfer to the fluid within the reactor. The ring-shaped heating rod is designed with adjustable power to meet the diverse temperature requirements of different experiments. In experiments simulating high-temperature chemical reactions, the heating power can be increased to rapidly raise the fluid temperature to the desired level; conversely, in experiments requiring a more gradual temperature rise, the heating power can be reduced for precise temperature control.

[0017] A thermoelectric cooler is used to cool the fluid. The thermoelectric cooler is located on the outer bottom of the reactor vessel and has a clearly distinguishable cooling surface and a heat dissipation surface from top to bottom. The cooling surface directly acts on the outer bottom of the reactor vessel. When the thermoelectric cooler is powered on, the cooling surface absorbs heat from the fluid inside the reactor vessel, thus achieving the cooling purpose. The heat dissipation surface, on the other hand, needs to dissipate the absorbed heat in a timely manner to ensure the continuous and efficient operation of the thermoelectric cooler.

[0018] The water-cooling system releases the heat absorbed by the heat dissipation surface: the water-cooling plate of the system is tightly connected to the heat dissipation surface of the thermoelectric cooler via thermal grease. The thermal grease enhances the heat transfer efficiency between the two, allowing heat from the thermoelectric cooler's heat dissipation surface to be quickly transferred to the water-cooling surface of the system. The water-cooling system includes a circulating pump, a coolant storage tank, a cooling fan, and coolant circulation pipes. The circulating pump continuously drives the coolant to circulate within the coolant circulation pipes. As the coolant flows past the water-cooling plate connected to the thermoelectric cooler's heat dissipation surface, it absorbs heat, which is then carried to the coolant storage tank. The heat is then dissipated through heat exchange with the external environment by the cooling fan, thus continuously cooling the thermoelectric cooler's heat dissipation surface and ensuring that the thermoelectric cooler remains in optimal working condition. This, in turn, ensures the stable and reliable cooling effect of the entire temperature-controlled reactor. Attached Figure Description

[0019] Figure 1 This is a schematic diagram of a temperature-controlled reaction vessel device used in laser velocity field instruments.

[0020] Figure 2 This is a schematic diagram of the reactor device structure;

[0021] Figure 3 This is a schematic diagram of a semiconductor cooling chip structure;

[0022] Figure 4 This is a schematic diagram of a water-cooled heat dissipation system.

[0023] Figure 5This is a right view of the water-cooled heat dissipation system. Detailed Implementation

[0024] The following detailed description illustrates the specific implementation method:

[0025] The reference numerals in the accompanying drawings include:

[0026] Reactor assembly 01, inner bottom of reactor 011, outer bottom of reactor 012, annular heating rod 02, power supply terminal 021, semiconductor cooling chip 03, cooling surface 031, positive electrode of semiconductor cooling chip 032, negative electrode of semiconductor cooling chip 033, heat dissipation surface 034, water cooling system 04, water cooling plate 05, circulating pump 06, air inlet 07, coolant circulation pipe 08, cooling fan 09, coolant storage tank 10.

[0027] In the following statements, directional terms such as "left," "right," "up," and "down" are based on the directions shown in the diagram. In practice, if the corresponding structures are changed in the same direction based on the direction while maintaining their relative positions, it will not affect the implementation of the plan.

[0028] Example: A temperature-controlled reaction vessel device for a laser velocity field instrument, referring to... Figure 1 The reaction vessel device 01 includes: a reaction vessel, which is made of high borosilicate glass material. Its advantages are good transparency and chemical stability, which can meet the requirements of laser velocity field instruments for light transmission, and maintain stability in a variety of chemical experimental environments.

[0029] Reference Figure 2 A copper annular heating rod 02 is fixedly installed at the inner bottom 011 of the reactor to heat the fluid inside the reactor. The annular heating rod 02 has a heating wire wound inside and includes a power supply terminal 021, which is connected to an external 220V indoor power supply to power the heating wire. The outer diameter of the annular heating rod 02 matches the inner diameter of the reactor. During installation, the matching annular heating rod 02 is embedded into the inner bottom 011 of the reactor, and thermally conductive silicone grease is filled between the annular heating rod 02 and the inner bottom 011 of the reactor to ensure a tight fit and achieve efficient heat transfer.

[0030] Reference Figure 3The thermoelectric cooler 03 is installed on the outer bottom 012 of the reactor. It includes a positive electrode 032, a negative electrode 033, and a cooling surface 031 and a heat dissipation surface 034 arranged sequentially from top to bottom. The cooling surface 031 is in contact with the outer bottom 012 of the reactor, and the contact area is filled with thermally conductive silicone grease to ensure good heat conduction. The positive electrode 032 and the negative electrode 033 are connected to an external power source to provide power. Insulating silicone is used to seal the thermoelectric cooler 03 to prevent moisture or other impurities from entering and affecting its performance.

[0031] Heating wire and semiconductor cooling chip 03 are commonly used components in this field. Their working principle and specific structure will not be described in detail. Moreover, they have heating or cooling functions from the factory and do not require modification. This application only adjusts the installation position.

[0032] Specifically: the semiconductor refrigeration chip 03 is a DA-72-24 semiconductor refrigeration chip 03 produced by Henan Guanjing Technology Co., Ltd., and the heating wire is a HYZ high-temperature heating wire produced by Jiangsu Kangtai Company.

[0033] Reference Figure 4 and Figure 5 The water-cooled heat dissipation system 04 includes: a water-cooled plate 05, a circulating pump 06, an air inlet 07, a coolant circulation pipe 08, a cooling fan 09, and a coolant storage tank 10. The circulating pump 06 continuously draws coolant and circulates it within the coolant circulation pipe 08. As the coolant flows through the coolant circulation pipe 08, its low temperature allows it to absorb heat from the water-cooled plate 05 through heat transfer. The water-cooled plate 05, in contact with the heat dissipation surface 034, absorbs heat from the heat dissipation surface 034 through heat transfer, thus achieving cooling. The heat is then carried to the coolant storage tank 10 and dissipated through heat exchange with the external environment via the cooling fan 09. This continuous cooling of the heat dissipation surface 034 ensures that the semiconductor cooling chip 03 remains in good working condition, thereby ensuring a stable and reliable cooling effect for the entire reactor device 01.

[0034] All standard parts used in this utility model can be purchased from the market, and irregular parts can be customized according to the description and drawings. The specific connection methods of each part adopt conventional methods such as bolts, rivets, and welding that are mature in the prior art. The machinery, parts and equipment adopt conventional models in the prior art, and the circuit connection adopts conventional connection methods in the prior art, which will not be described in detail here.

Claims

1. A temperature-controlled reaction vessel apparatus for a laser velocimetry instrument, comprising: The utility model provides a reaction kettle, its characterized in be: annular heating rod, set up in the reaction kettle, for heating the fluid in the reaction kettle, semiconductor refrigeration sheet is used for the heat dissipation of reaction kettle, including refrigeration face and heat dissipation face, water cooling heat dissipation system includes the water cooling plate that is in contact with heat dissipation face and the cooling liquid circulation pipeline that refrigerates the water cooling plate.

2. The temperature-controlled reaction vessel apparatus for a laser velocity field instrument of claim 1, wherein: The reaction kettle is made of high transparent material.

3. The temperature-controlled reaction vessel apparatus for a laser velocity field instrument of claim 2, wherein: The annular heating rod is arranged at the bottom of the inside of the reaction kettle.

4. The temperature-controlled reaction vessel apparatus for a laser velocity field instrument of claim 3, wherein: The refrigeration face is in contact with the bottom of the reaction kettle.

5. The temperature-controlled reaction vessel apparatus for a laser velocity field instrument of claim 4, wherein: The connection between the water cooling plate and the heat dissipation face is filled with heat-conducting silicone grease.

6. The temperature-controlled reaction vessel apparatus for a laser velocity field instrument of claim 5, wherein: The water cooling heat dissipation system includes a circulating pump and a cooling liquid storage tank, and the circulating pump is used to transport the cooling liquid to circulate in the cooling liquid storage tank and the cooling liquid circulation pipeline.

7. The temperature-controlled reaction vessel apparatus for a laser velocity field instrument of claim 6, wherein: It also includes a heat dissipation fan.

Images