Substrate and rotary table shape follow-up cooling device

Abstract

The utility model discloses a shape follow-up cooling device for a substrate and a rotary table, and relates to the field of 3D printing. Comprising a heating part and a cooling part, the cooling part is arranged below the heating part, and the cooling part and the heating part are attached to each other; the cooling part comprises a rotary table and a cooling piece, the heating part is arranged on the rotary table, and the cooling piece is arranged in the rotary table and attached to the rotary table; the heating part comprises a heating table and a heating piece, the heating table is used for placing a substrate, the heating piece is arranged in the heating table, and the heating table is arranged on the rotary table and attached to the rotary table. The substrate heating device has the advantages that the requirement for substrate heating can be met, meanwhile, heat generated in the substrate heating process is cooled by the cooling piece, and then other devices can be prevented from being affected by high temperature when the substrate is heated, so that the other devices can work at normal working temperature.

Description

Technical Field

[0001] This utility model relates to the field of 3D printing, and in particular to a substrate and turntable conformal cooling device. Background Technology

[0002] In 3D printing, a substrate is generally used as the carrier for printing parts. Before printing begins, the substrate typically needs to be preheated to a certain temperature to reduce temperature differences, thereby minimizing material delamination and reducing residual stress within the material during printing. However, the substrate is usually placed on a turntable throughout the printing process. Precision sensors and control devices are usually located beneath the turntable. These devices are highly sensitive to temperature changes and have strict requirements for the operating environment. Therefore, maintaining the normal operation of these devices beneath the turntable while heating the substrate during printing is a crucial technical challenge that needs to be addressed. Utility Model Content

[0003] In order to overcome the shortcomings of the prior art, this utility model provides a substrate and a turntable conformal cooling device.

[0004] This utility model is achieved by the following technical solution: a substrate and turntable conformal cooling device, including a heating part and a cooling part, wherein the cooling part is disposed below the heating part and the cooling part is in close contact with the heating part;

[0005] The cooling section includes a turntable and a cooling component. The heating section is disposed on the turntable, and the cooling component is disposed inside the turntable and fits against the turntable.

[0006] The heating section includes a heating platform and a heating element. The heating platform is used to place a substrate, and the heating element is disposed inside the heating platform. The heating platform is placed on the turntable and is in contact with the turntable.

[0007] The turntable and the heating platform are fixed together by a snap-fit ​​connector. The snap-fit ​​connector is located on the turntable and when the heating platform is placed on the turntable, the snap-fit ​​connector abuts against the heating platform.

[0008] The latching component includes a latching base, one end of which is fixed to the turntable and perpendicular to the turntable, and the other end of which extends in a circular direction to form a blocking post. The blocking post and the turntable form an area for inserting a heating platform.

[0009] A positioning hole is provided on the blocking post, and a positioning bolt passes through the positioning hole. When the heating platform is inserted below the blocking post, the positioning bolt abuts against the end of the heating platform.

[0010] The heating platform has a hollow interior forming a heating cavity. The heating element includes a heating tube, which is S-shaped and wound around the heating cavity. The heating tube is filled with a heating medium, which flows within the heating tube.

[0011] A first through hole is made on the side wall of the heating platform, and the end of the heating tube protrudes through the first through hole.

[0012] The turntable has a hollow interior forming a receiving cavity. The cooling component includes a water-cooled pipe, which is located inside the receiving cavity. A clearance hole is formed on the side wall of the receiving cavity, and the end of the water-cooled pipe protrudes through the clearance hole.

[0013] The turntable has several slots, which are radially distributed around the center of the turntable, dividing the turntable into several independent areas.

[0014] The cavity contains several partition blocks centered on the turntable. These partition blocks are arranged in a circular pattern within the cavity, with the turntable as the center. The water-cooling pipes are arranged in an S-shape around the partition blocks.

[0015] Compared to existing technologies, the heat at the bottom of the heating stage in this invention is dissipated by the cooling components within the turntable through heat exchange with it. This protects various devices mounted below the turntable from the high temperatures of the heating stage, maintaining their optimal operating temperatures. In practical use, this design satisfies the need for substrate heating while simultaneously cooling the heat generated during substrate heating, thus protecting other devices from the high temperatures of substrate heating and allowing them to operate at their normal operating temperatures. Attached Figure Description

[0016] Figure 1 This is a schematic diagram of the conformal cooling device in this utility model;

[0017] Figure 2 This is a schematic diagram of the cooling section structure of the conformal cooling device in this utility model;

[0018] Figure 3 This is a schematic diagram of the internal structure of the cooling section of the conformal cooling device in this utility model;

[0019] Figure 4 This is a schematic diagram of the heating section of the conformal cooling device in this utility model;

[0020] In the diagram: 1. Heating section; 11. Heating platform; 111. Heating chamber; 12. Heating element; 121. Heating tube; 13. First perforation; 2. Cooling section; 21. Turntable; 211. Receiving cavity; 22. Cooling element; 221. Water cooling tube; 222. Clearance hole; 223. Divider block; 3. Snap-fit ​​element; 31. Snap-fit ​​seat; 32. Positioning hole. Detailed Implementation

[0021] The present invention will be further described below with reference to the accompanying drawings and specific embodiments. It should be noted that, without conflict, the various embodiments or technical features described below can be arbitrarily combined to form new embodiments.

[0022] Reference Figure 1-4 A substrate and turntable conformal cooling device includes a heating section 1 and a cooling section 2, with the cooling section 2 located below the heating section 1 and in close contact with it. The substrate is placed on the heating section 1. The heating section 1 heats the substrate to a suitable temperature. Because the cooling section 2 is in close contact with the heating section 1, the heat generated by the heating section 1 cannot be transferred to the cooling section 2, thus allowing various precision components mounted below the cooling section 2 to operate at a suitable temperature.

[0023] In this embodiment, the cooling unit 2 includes a turntable 21 and a cooling element 22. The heating unit 1 is disposed on the turntable 21, and the cooling element 22 is disposed inside the turntable 21 and in contact with it. The heating unit 1 includes a heating table 11 and a heating element 12. The heating table 11 is used to place the substrate, and the heating element 12 is disposed inside the heating table 11. The heating table 11 is placed on the turntable 21 and in contact with it. When printing is required, the heating table 11 is used to heat the substrate to a suitable temperature, thereby reducing delamination between the substrate and the printing material during the 3D printing process and reducing stress concentration in the printing material. Other parts are installed below the turntable 21. The turntable 21 is cooled by the cooling element 22, creating a temperature difference with the heating stage 11. Since the heating stage 11 is actually in close contact with the turntable 21 and positioned above the cooling stage, the heat from the bottom of the heating stage 11 is carried away by the cooling element 22 within the turntable 21 through heat exchange. This protects various devices mounted below the turntable 21 from the high temperature of the heating stage 11, maintaining a suitable operating temperature for the devices. In practical use, this system satisfies the need for substrate heating while simultaneously cooling the heat generated during substrate heating by the cooling element 22, thus protecting other devices from the high temperatures of substrate heating and allowing them to operate at normal operating temperatures.

[0024] In this utility model, the turntable 21 and heating platform 11 are designed to be detachable for easy replacement. Specifically, the turntable 21 and heating platform 11 are fixed together by a snap-fit ​​member 3. The snap-fit ​​member 3 is located on the turntable 21, and when the heating platform 11 is placed on the turntable 21, the snap-fit ​​member 3 abuts against the heating platform 11. In this embodiment, one implementation of the snap-fit ​​member 3 includes a snap-fit ​​seat 31, which is L-shaped. One end of the snap-fit ​​seat 31 is fixed to the turntable 21 and perpendicular to the turntable 21, such that a portion of the snap-fit ​​seat 31 is perpendicular to the turntable 21, while the other portion is parallel to the end face of the turntable 21. The other end of the snap-fit ​​seat 31 extends towards the center of the seat to form a blocking post. The blocking post and the turntable 21 form an area for inserting the heating platform 11. When the heating platform 11 needs to be inserted into this area, the blocking post can limit its position, allowing the heating platform 11 to be positioned on the turntable 21. This also ensures a tight fit between the heating stage 11 and the turntable 21, facilitating better heat conduction. Heat from the bottom of the heating stage 11 is dissipated by the cooling element 22 within the turntable 21 through heat exchange, thus protecting various devices mounted below the turntable 21 from the high temperatures of the heating stage 11 and maintaining their optimal operating temperatures. In practical use, this system satisfies the need for substrate heating while simultaneously cooling the heat generated during substrate heating by the cooling element 22, protecting other devices from the high temperatures of substrate heating and allowing them to operate at normal temperatures.

[0025] Furthermore, based on the above embodiment, a positioning hole 32 is provided on the blocking post, and a positioning bolt passes through the positioning hole 32. When the heating platform 11 is inserted below the blocking post, the positioning bolt abuts against the end of the heating platform 11. Even if the height is too large and the heating platform 11 can move on the turntable 21, the end of the positioning bolt can be pressed against the heating platform 11 by rotating the positioning bolt to push the heating platform 11 and the turntable 21 to be pressed together, thereby achieving better heat conduction.

[0026] The heating element 12 can be installed within the heating stage 11 in the following manner: Specifically, the heating stage 11 has a hollow interior forming a heating cavity 111. The heating element 12 includes a heating tube 121, which is S-shaped and wound around the heating cavity 111. A heating medium is filled within the heating tube 121 and flows within it. The heating tube 121 can be tightly attached to the top of the heating cavity 111, with a gap between it and the bottom of the cavity. This allows for better heating of the top surface of the heating stage 11, and consequently, better heating of the substrate placed on the end face of the heating stage 11. Simultaneously, it avoids direct heating of the bottom of the heating stage 11, thus reducing the cooling burden on the cooling element 22 and improving cooling efficiency. This protects other components from the high temperatures during substrate heating, allowing them to operate at normal operating temperatures.

[0027] A first through hole 13 is formed on the side wall of the heating platform 11, and the end of the heating tube 121 protrudes through the first through hole 13. The heating medium in the heating tube 121 can be hot oil, or a heating resistor can be used directly as the heating tube 121. If the heating medium is hot oil, the end of the heating tube 121 is connected to a pump that pumps hot oil to achieve hot oil circulation. Of course, an oil storage tank must be provided during the hot oil circulation process. When pumping hot oil, the circulation of hot oil between the heating tube 121 and the oil storage tank is achieved through the heating tube 121.

[0028] The turntable 21 has a hollow interior forming a cavity 211. The cooling component 22 includes a water-cooling pipe 221 housed within the cavity 211. A clearance hole 222 is formed on the side wall of the cavity 211, through which the end of the water-cooling pipe 221 protrudes. Several grooves are formed on the turntable 21, radially distributed around its center, dividing the turntable 21 into several independent areas. Several partition blocks 223 are arranged within the cavity 211, centered on the center of the turntable 21. These partition blocks 223 are spaced circumferentially within the cavity 211, and the water-cooling pipe 221 is arranged in an S-shape around the partition blocks 223. To achieve uniform cooling of the turntable 21, the cooling also circulates in the water cooling pipe 221, carrying away the heat transferred from the heating stage 11, thereby protecting other devices from the high temperature of the substrate during heating, so that other devices can operate at normal operating temperatures.

[0029] Compared to existing technologies, the heat at the bottom of the heating stage 11 in this invention is carried away by the cooling element 22 in the turntable 21 through heat exchange with the turntable 21. This protects various devices installed below the turntable 21 from the high temperature of the heating stage 11, thus maintaining a suitable operating temperature for the devices. In practical use, this design satisfies the need for substrate heating while simultaneously cooling the heat generated during substrate heating by the cooling element 22, thereby protecting other devices from the high temperatures of substrate heating and allowing them to operate at normal operating temperatures.

[0030] The above embodiments are merely preferred embodiments of this utility model and should not be construed as limiting the scope of protection of this utility model. Any non-substantial changes and substitutions made by those skilled in the art based on this utility model shall fall within the scope of protection claimed by this utility model.

Claims

1. A substrate, turntable conformal cooling device, comprising a heating portion and a cooling portion, characterized in that: The cooling part is arranged below the heating part and is attached to the heating part; The cooling part comprises a rotating table and a cooling member, the heating part is arranged on the rotating table, and the cooling member is arranged in the rotating table and attached to the rotating table; The heating part comprises a heating table and a heating member, the heating table is used for placing a substrate, the heating member is arranged in the heating table, and the heating table is arranged on the rotating table and attached to the rotating table.

2. A conformal cooling device for a substrate or turntable according to claim 1, wherein: The rotating table and the heating table are fixed through a clamping member, the clamping member is arranged on the rotating table and abuts against the heating table when the heating table is arranged on the rotating table.

3. A conformal cooling device for a substrate or turntable according to claim 2, wherein: The clamping member comprises a clamping seat, one end of the clamping seat is fixed on the rotating table and is perpendicular to the rotating table, the other end of the clamping seat extends to the circular direction of the clamping seat to form a blocking column, and the blocking column and the rotating table form an area for inserting the heating table.

4. A conformal cooling device for a substrate or turntable according to claim 3, wherein: A positioning hole is arranged on the blocking column, a positioning bolt is arranged in the positioning hole, and the positioning bolt abuts against the end of the heating table when the heating table is inserted below the blocking column.

5. A conformal cooling device for a substrate or turntable according to claim 1, wherein: The heating table is hollow to form a heating cavity, the heating member comprises a heating pipe, the heating pipe is arranged in the heating cavity in an S shape, the heating pipe is filled with a heating medium, and the heating medium flows in the heating pipe.

6. A conformal cooling device for a substrate or turntable according to claim 5, wherein: A first through hole is arranged on the side wall of the heating table, and the end of the heating pipe is arranged outside the first through hole.

7. A conformal cooling device for a substrate or turntable according to claim 1, wherein: The rotating table is hollow to form a containing cavity, the cooling member comprises a water cooling pipe, the water cooling pipe is arranged in the containing cavity, a side wall of the containing cavity is provided with a gap hole, and the end of the water cooling pipe is arranged outside the gap hole.

8. A conformal cooling device for a substrate or turntable according to claim 7, wherein: A plurality of grooves are arranged on the rotating table, the grooves are distributed radially with the center of the rotating table as the center, and the grooves divide the rotating table into a plurality of independent areas.

9. A conformal cooling device for a substrate or turntable according to claim 7, wherein: A plurality of separation blocks are arranged in the containing cavity with the center of the rotating table as the center, the separation blocks are arranged in the containing cavity in a circumferential manner with the center of the rotating table as the center, and the water cooling pipe is arranged on the separation blocks in an S shape.

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