Electric driver for unmanned aerial vehicle

By integrating a temperature sensor and a heat-conducting plate with a heat sink into the drone's electric drive, and using a fan to drive airflow for heat dissipation, the heat dissipation problem of the electric drive is solved, ensuring the efficient operation of the drive chip and preventing high-temperature damage.

CN224061194UActive Publication Date: 2026-03-31JINZHOU HANNA AVIATION TECH CO LTD
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Patent Information

Authority / Receiving Office
CN · China
Patent Type
Utility models(China)
Current Assignee / Owner
Filing Date
2025-05-12
Publication Date
2026-03-31

AI Technical Summary

Technical Problem

The electric drive of the drone has poor heat dissipation and is prone to damage due to high temperature after prolonged use.

Method used

The integrated temperature sensor is located in the driver chip. The heat-conducting plate and heat sink work together to transfer heat to the ventilation holes. The fan drives the airflow to dissipate heat, increasing the heat dissipation area and efficiency.

Benefits of technology

It effectively reduces the temperature of the driver chip, prevents high-temperature damage, and ensures the efficiency and lifespan of the driver chip.

✦ Generated by Eureka AI based on patent content.

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Abstract

The utility model relates to the field of unmanned aerial vehicles, in particular to an electric driver for an unmanned aerial vehicle, which comprises a shell, a packaging groove is arranged at the top of the shell, a circuit board is arranged on the inner wall of the bottom of the packaging groove of the shell, and connecting grooves distributed at equal intervals are arranged at the tops of the outer walls of the two ends of the shell. The circuit board is provided with a connecting pin at the center of the connecting groove, and heat dissipation assemblies are installed on the outer walls of the tops of the two sides of the shell. The mounting plates are slidably connected to the outer walls of the two sides of the shell, the air inlet holes are formed in the mounting plates at equal intervals and located at the top of the shell, and the supports are mounted on the outer walls of the inner sides of the mounting plates at equal intervals. According to the utility model, the integrated temperature sensor is located in the driving chip, and the heat conduction plate and the cooling fins cooperate to transmit heat to the ventilation holes, thereby facilitating heat dissipation, ensuring the efficiency of the driving chip, and preventing the driving chip from being affected by high temperature; air flow enters from the inlet holes and then is exhausted from the ventilation holes, heat on the cooling fins is taken away, heat dissipation is facilitated, and use is facilitated.
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Description

Technical Field

[0001] This utility model relates to the field of unmanned aerial vehicle (UAV) technology, and in particular to an electric drive for UAVs. Background Technology

[0002] Unmanned aerial vehicles (UAVs), also known as drones, are unmanned aircraft controlled by radio remote control equipment and their own programmed control devices. They have no cockpit but are equipped with autopilots, programmed control devices, and other equipment. Ground-based, shipboard, or mother-aircraft remote control stations track, locate, remotely control, telemetry, and transmit digital data to them using radar and other equipment.

[0003] The electric actuator body has poor heat dissipation, and after prolonged use, the temperature of the electric actuator body will rise and it will be easily damaged. Utility Model Content

[0004] The purpose of this invention is to address the aforementioned problems and shortcomings by proposing an electric drive for unmanned aerial vehicles (UAVs): an integrated temperature sensor is located within the drive chip, and a heat-conducting plate and a heat sink work together to transfer heat to the ventilation holes, facilitating heat dissipation, ensuring the efficiency of the drive chip, and preventing high temperatures from affecting the drive chip.

[0005] To achieve the above objectives, the present invention adopts the following technical solution:

[0006] An electric actuator for a drone includes a housing. The top of the housing has an encapsulation groove, and a circuit board is mounted on the inner wall of the bottom of the encapsulation groove. The top of the outer walls at both ends of the housing has equally spaced connecting grooves, and the circuit board has connecting pins at the center of the connecting grooves. Heat dissipation components are mounted on the top outer walls of both sides of the housing. The heat dissipation components include mounting plates slidably connected to the outer walls of both sides of the housing, air inlets equally spaced on the mounting plates at the top of the housing, and brackets equally spaced on the inner outer walls of the mounting plates.

[0007] Preferably, two mounting holes are provided at both ends of the outer shell, and an encapsulation layer is cast on the outer shell at the encapsulation groove.

[0008] Preferably, a driver chip is soldered to the top outer wall of the circuit board, and an integrated temperature sensor is attached to the top outer wall of the driver chip.

[0009] Preferably, a heat-conducting plate is installed on the inner wall of the bottom of the encapsulation groove of the outer shell, and the outer wall of the bottom of the heat-conducting plate is coated with thermal grease. A semiconductor cooling chip is provided on the outer wall of the bottom of the heat-conducting plate and the thermal grease.

[0010] The integrated temperature sensor is located in the driver chip. The heat-conducting plate and heat sink work together to transfer heat to the ventilation holes, which facilitates heat dissipation, ensures the efficiency of the driver chip, and prevents high temperature from affecting the driver chip.

[0011] Preferably, the bottom outer wall of the semiconductor cooling chip is attached to the top outer wall of the driving chip, and the top outer wall of the heat-conducting plate is welded with heat sinks that are evenly distributed, and the top outer wall of each heat sink is provided with vent holes that are evenly distributed.

[0012] Preferably, each of the brackets is equipped with a fan, and the mounting plate has fixing holes at both ends of its outer wall, and the mounting plate is installed on the outer wall of the outer shell;

[0013] After the fan starts, it drives the airflow to move in one direction. The airflow enters through the inlet and exits through the vent, carrying away the heat from the heat sink, which facilitates heat dissipation and ease of use.

[0014] Preferably, the air inlet and the ventilation hole overlap each other, and the airflow direction of the fans at both ends of the mounting plate is the same.

[0015] The beneficial effects of this utility model are as follows:

[0016] After the fan starts, it drives the airflow to move in one direction. The airflow enters through the inlet and exits through the vent, carrying away the heat from the heat sink, which facilitates heat dissipation and ease of use.

[0017] The integrated temperature sensor is located in the driver chip. The heat-conducting plate and heat sink work together to transfer heat to the ventilation holes, which facilitates heat dissipation, ensures the efficiency of the driver chip, and prevents high temperature from affecting the driver chip. Attached Figure Description

[0018] Figure 1 This is a schematic diagram of the overall structure of an electric drive for a drone proposed in this utility model;

[0019] Figure 2 This is a schematic diagram of the housing structure of an electric drive for a drone proposed in this utility model;

[0020] Figure 3 This is a schematic diagram of the unfolded structure of an electric drive for a drone proposed in this utility model;

[0021] Figure 4 This is a schematic diagram of the mounting plate structure for an electric drive for a drone proposed in this utility model.

[0022] In the diagram: 1. Housing, 2. Encapsulation slot, 3. Connection slot, 4. Mounting hole, 5. Heat dissipation component, 6. Circuit board, 7. Connection pin, 8. Driver chip, 9. Integrated temperature sensor, 10. Semiconductor cooling chip, 11. Thermal grease, 12. Heat conduction plate, 13. Heat sink, 14. Vent hole, 15. Encapsulation layer, 16. Mounting plate, 17. Air inlet, 18. Bracket, 19. Fan. Detailed Implementation

[0023] The technical solutions of the present utility model will be clearly and completely described below with reference to the accompanying drawings of the embodiments of the present utility model. Obviously, the described embodiments are only some embodiments of the present utility model, and not all embodiments. Example

[0024] Reference Figure 1-4 An electric driver for a drone includes a housing 1. The top of the housing 1 is provided with an encapsulation groove 2, and a circuit board 6 is installed on the inner wall of the bottom of the encapsulation groove 2. The top of the outer walls at both ends of the housing 1 are provided with equally spaced connection grooves 3, and the circuit board 6 is provided with connection pins 7 at the center of the connection grooves 3. Heat dissipation components 5 are installed on the top outer walls on both sides of the housing 1. When a semiconductor cooling chip 10 is activated, the semiconductor cooling chip 10 absorbs and releases heat on one side to reduce the temperature of the driver chip 8. The heat conduction plate 13 and the heat sink 13 cooperate to transfer heat to the ventilation hole 14 to facilitate heat dissipation, ensure the efficiency of the driver chip 8, and prevent high temperature from affecting the driver chip 8.

[0025] Two mounting holes 4 are provided at both ends of the outer casing 1, and an encapsulation layer 15 is cast on the outer casing 1 at the encapsulation groove 2. Example

[0026] Reference Figure 2-4 The heat dissipation assembly 5 includes a mounting plate 16 slidably connected to the outer walls of both sides of the housing 1, an air inlet 17 equidistantly opened on the mounting plate 16 at the top of the housing 1, and a bracket 18 equidistantly installed on the inner outer wall of the mounting plate 16.

[0027] A driver chip 8 is soldered to the top outer wall of the circuit board 6, and an integrated temperature sensor 9 is attached to the top outer wall of the driver chip 8. The encapsulation layer 15 in the housing 1 fixes the driver chip 8 in the housing 1. The heat of the driver chip 8 is transferred through the semiconductor cooling chip 10, the heat conduction plate 12 and the heat sink 13 to increase the heat dissipation area.

[0028] A heat-conducting plate 12 is installed on the inner wall of the bottom of the outer casing 1 in the encapsulation groove 2, and thermal grease 11 is applied to the outer wall of the bottom of the heat-conducting plate 12. A semiconductor cooling chip 10 is provided on the outer wall of the bottom of the heat-conducting plate 12 and the thermal grease 11. When the semiconductor cooling chip 10 is activated, it works with the heat-conducting plate 12, the heat sink 13 and the thermal grease 11 to improve the heat dissipation efficiency of the driver chip 8, actively cool down and improve efficiency.

[0029] The bottom outer wall of the semiconductor cooling chip 10 is attached to the top outer wall of the driver chip 8, and the top outer wall of the heat-conducting plate 12 is welded with heat sinks 13 distributed at equal intervals. The top outer wall of the heat sinks 13 is provided with ventilation holes 14 distributed at equal intervals.

[0030] Fans 19 are installed in each bracket 18, and fixing holes are opened at both ends of the outer wall of the mounting plate 16. The mounting plate 16 is installed on the outer wall of the outer shell 1. After the fan 19 on the mounting plate 16 is started, it accelerates the airflow speed in the mounting plate 16. After the airflow passes through the ventilation holes 14 on the heat sink 13, the heat dissipation efficiency is improved.

[0031] The air inlet 17 and the ventilation hole 14 overlap each other, and the airflow direction of the fans 19 at both ends of the mounting plate 16 is the same. After the fans 19 are started, they drive the airflow to move in one direction. The airflow enters from the air inlet 17 and is discharged from the ventilation hole 14, which removes the heat from the heat sink 13, making it easy to dissipate heat and easy to use.

[0032] Working principle: During use, the entire unit is installed in the circuit through the mounting holes 4 on the outer casing 1. The driver chip 8 and other components are connected to the circuit through the connecting pins 7 on the circuit board 6. The driver chip 8 provides computing power to the drone's motors. The integrated temperature sensor 9 is located in the driver chip 8. When the temperature of the driver chip 8 reaches a certain level, the semiconductor cooling chip 10 is activated. The semiconductor cooling chip 10 absorbs and releases heat on one side, reducing the temperature of the driver chip 8. The heat conduction plate 13 and the heat sink 13 work together to transfer heat to the ventilation holes 14 for easy heat dissipation, ensuring the efficiency of the driver chip 8 and preventing high temperature from affecting the driver chip 8. The fan 19 on the bracket on the mounting plate 16 is activated. After the fan 19 is activated, it drives the airflow to move in one direction. The airflow enters through the air inlet 17 and exits through the ventilation holes 14, carrying away the heat from the heat sink 13 for easy heat dissipation and convenient use.

[0033] The exemplary embodiments of the present invention have been described in detail herein with reference to examples. However, those skilled in the art will understand that various modifications and alterations can be made to the specific embodiments described above without departing from the spirit of the present invention, and various combinations can be made to the various technical features and structures proposed in the present invention without exceeding the protection scope of the present invention, which is determined by the appended claims. The foregoing description of specific exemplary embodiments of the present invention is not intended to limit the present invention to the precise forms disclosed, and it is obvious that many changes and variations can be made based on the above teachings. The exemplary embodiments were chosen and described in order to explain the specific principles of the present invention and its practical applications, thereby enabling those skilled in the art to implement and utilize various different exemplary embodiments of the present invention, as well as various different choices and variations. The scope of the present invention is intended to be defined by the claims and their equivalents.

Claims

1. An electric drive for a drone comprising a housing (1), characterized in that, The top of the shell (1) is provided with an encapsulation groove (2), and the shell (1) is mounted with a circuit board (6) at the bottom inner wall of the encapsulation groove (2), the top of the outer wall of both ends of the shell (1) is provided with equidistantly distributed connecting grooves (3), and the circuit board (6) is provided with connecting pins (7) at the center of the connecting grooves (3), and the top outer wall of both sides of the shell (1) is provided with heat dissipation assemblies (5). The heat dissipation assembly (5) comprises a mounting plate (16) slidably connected to the outer wall of both sides of the shell (1), air inlet holes (17) equidistantly provided at the top of the mounting plate (16) located in the shell (1), and supports (18) equidistantly mounted on the inner side wall of the mounting plate (16).

2. The electric drive for a UAV according to claim 1, characterized in that, Both ends of the shell (1) are provided with two mounting holes (4), and the shell (1) is cast with an encapsulation layer (15) at the encapsulation groove (2).

3. The electric drive for a UAV according to claim 1, characterized in that, The top outer wall of the circuit board (6) is welded with a driving chip (8), and the top outer wall of the driving chip (8) is attached with an integrated temperature sensor (9).

4. The electric drive for a UAV according to claim 1, wherein, The bottom outer wall of the heat conduction plate (12) is coated with heat-conducting silicone grease (11), and the heat conduction plate (12) and the bottom outer wall of the heat-conducting silicone grease (11) are provided with a semiconductor refrigeration sheet (10).

5. The electric drive for UAV according to claim 4, characterized in that, The bottom outer wall of the semiconductor refrigeration sheet (10) is attached to the top outer wall of the driving chip (8), and the top outer wall of the heat conduction plate (12) is welded with equidistantly distributed heat dissipation fins (13), and the top end outer wall of the heat dissipation fins (13) is provided with equidistantly distributed ventilation holes (14).

6. The electric drive for a UAV according to claim 1, wherein, The fan (19) is mounted in the support (18), and the mounting plate (16) is provided with fixing holes at both ends of the outer wall, and the mounting plate (16) is mounted on the outer wall of the shell (1).

7. The electric drive for UAV according to claim 1, characterized in that, The air inlet holes (17) and the ventilation holes (14) coincide with each other, and the airflow directions of the fans (19) at both ends of the mounting plate (16) are consistent.