Overflow method substrate glass forming thickness fine adjusting device

By setting up a rotary cooling mechanism in the overflow method of substrate glass production, and using universal joints and flow regulating valves to achieve flexible adjustment of cooling air, the problem of difficult thickness adjustment caused by the fixed position of traditional air ducts is solved, and fine control of glass sheet thickness is achieved.

CN224062663UActive Publication Date: 2026-03-31IRICO DISPLAY DEVICES CO LTD
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Patent Information

Authority / Receiving Office
CN · China
Patent Type
Utility models(China)
Current Assignee / Owner
Filing Date
2025-04-01
Publication Date
2026-03-31

AI Technical Summary

Technical Problem

In traditional overflow glass production, the fixed position of the air ducts limits the range of glass sheet thickness adjustment, making it difficult to achieve high-precision thickness uniformity control. In particular, the thickness adjustment effect between the two air ducts is poor when the air duct spacing is large.

Method used

A cooling mechanism consisting of multiple thick ducts and rotating parts is installed below the overflow brick. The rotating parts use universal joints, allowing the thick ducts to rotate within a range of 0-360°. Combined with a flow regulating valve, the cooling air can be flexibly adjusted.

Benefits of technology

It enables precise cooling adjustment at different locations on the glass sheet, improves the flexibility and fine control of thickness adjustment, avoids difficulties in local adjustment, and ensures the uniformity of glass sheet thickness and production stability.

✦ Generated by Eureka AI based on patent content.

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Abstract

The utility model discloses an overflow method substrate glass forming thickness fine adjusting device. The overflow method substrate glass forming thickness fine adjusting device comprises two heat conduction box bodies arranged below an overflow brick and a cooling mechanism. The heat conduction box bodies are located on the two sides of a glass sheet respectively, and the cooling mechanisms are arranged on the heat conduction box bodies respectively. The cooling mechanism comprises a plurality of thickness air pipes and a rotating piece; the thickness air pipe is arranged on the rotating piece, an air inlet of the thickness air pipe is communicated with cooling air, and the other end of the thickness air pipe is arranged in the heat conduction box body; the rotating piece is arranged on the heat conduction box body and used for achieving rotation of the thickness air pipe. According to the application, the thickness air pipe can be adjusted, so that the thickness range and the cooling area of the glass sheet can be finely adjusted by the thickness air pipe, and the processing quality of the glass sheet can be improved.
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Description

Technical Field

[0001] This application belongs to the field of glass manufacturing technology, and specifically relates to a device for finely adjusting the thickness of overflow-process substrate glass forming. Background Technology

[0002] In the overflow-pull-down process for manufacturing substrate glass, controlling the glass thickness is a crucial step in producing high-quality glass substrates. Traditional thickness control methods rely on horizontally arranged cooling ducts in regions with lower viscosity above the glass's softening point. These ducts blow cool air towards the glass through a high-thermal-conductivity enclosure or baffles, creating a transverse temperature gradient perpendicular to the flow direction on the glass strip. These temperature gradients affect the local viscosity of the glass and, in turn, alter the glass thickness through the pull-down force.

[0003] However, as display technology continues to evolve towards higher resolution, thinner profiles, and larger sizes, the requirements for the uniformity of glass substrate thickness are becoming increasingly stringent, typically requiring thickness variations to be controlled within 10μm. Traditional fixed-position air ducts, due to their limited adjustment range and restricted cooling area, struggle to meet this high-precision requirement. Especially when the air duct spacing is large, the thickness adjustment effect of the glass sheet between two air ducts is poor, leading to overall panel thickness deviations. Utility Model Content

[0004] The purpose of this application is to provide a device for finely adjusting the thickness of substrate glass formed by overflow method. This addresses the problems mentioned in the background art, such as the limited range of glass sheet thickness adjustment due to the fixed position of the duct and the restricted cooling area, making it difficult to achieve fine adjustment of the glass sheet.

[0005] To achieve the above objectives, this application adopts the following technical solution:

[0006] This application provides a device for finely adjusting the thickness of substrate glass formed by overflow method. The device includes two heat-conducting boxes and a cooling mechanism disposed below the overflow brick.

[0007] The heat-conducting boxes are located on both sides of the glass sheet, and the cooling mechanisms are respectively installed on the heat-conducting boxes;

[0008] The cooling mechanism includes multiple thick air ducts and rotating components;

[0009] The thick air duct is mounted on the rotating part, and the air inlet of the thick air duct is connected to the cooling air, while the other end is located inside the heat conduction box.

[0010] The rotating component is mounted on the heat-conducting box and is used to rotate the thick air duct.

[0011] In one possible implementation, the rotating element is configured as a universal joint.

[0012] In one possible implementation, the universal joint is detachably connected to the heat-conducting housing.

[0013] In one possible implementation, the universal joint is made of a high-temperature resistant material.

[0014] In one possible implementation, the universal joint has a rotation angle of 0-360°.

[0015] In one possible implementation, the heat-conducting box is provided with at least 90 universal joints, and each of the universal joints is provided with a thick air duct.

[0016] In one possible implementation, a sealing structure is provided between the universal joint and the heat-conducting box.

[0017] In one possible implementation, the heat-conducting box is provided with an inclined surface, which is parallel to the inclined surface of the overflow brick.

[0018] In one possible implementation, the cooling mechanism further includes multiple flow regulating valves.

[0019] In one possible implementation, the thick duct is made of a metallic material.

[0020] Compared with the prior art, this application has the following beneficial effects:

[0021] This application provides a device for finely adjusting the thickness of substrate glass formed by overflow method. By arranging a cooling mechanism below the overflow brick, including multiple thickness ducts and a rotating component, with the thickness ducts mounted on the rotating component, the device enables flexible adjustment of the cooling air direction. Traditional thickness ducts are often fixed and can only cool specific areas. However, the rotating component in this device allows the thickness ducts to rotate, enabling the cooling air to change direction as needed, allowing for more precise cooling adjustment of different positions on the glass sheet. This greatly improves the flexibility of glass sheet thickness adjustment, avoiding the difficulties in localized adjustments caused by fixed cooling air positions. Therefore, it can precisely guide the cooling air to the areas on the glass sheet where thickness adjustment is required, achieving more refined thickness control.

[0022] In one possible implementation, a universal joint is used as a rotating component, which greatly improves the rotational flexibility of the thick duct. Compared with a simple rotating component, the universal joint can achieve multi-dimensional rotation, allowing for more free angle adjustment of the thick duct in three-dimensional space. This enables more precise guidance of cooling air to the glass sheet area that needs adjustment, enhancing the controllability of glass sheet thickness adjustment and providing a better mechanical structure basis for achieving fine adjustment.

[0023] In one possible implementation, the 360° rotation angle range allows the thickness duct to be adjusted across the entire circumference, enabling comprehensive cooling air adjustment at different positions on the glass sheet. This greatly expands the effective range of the cooling air. Regardless of where the thickness deviation occurs on the glass sheet, the thickness duct can be aligned with that area by adjusting the universal joint angle, improving the flexibility and comprehensiveness of glass sheet thickness adjustment and facilitating more precise thickness control.

[0024] In one possible implementation, a high-temperature resistant rubber gasket is placed between the universal joint and the heat-conducting housing as a sealing structure to prevent cooling air leakage. Cooling air leakage leads to a decrease in cooling efficiency and affects the accuracy of glass plate thickness adjustment. The sealing structure ensures the effective utilization of cooling air, guarantees the stability of the cooling effect, and also helps improve energy efficiency.

[0025] In one possible implementation, a flow regulating valve is installed at the air inlet of the thick duct to facilitate adjustment of the cooling air flow rate of the cooling duct as needed, thereby precisely controlling the cooling effect of the cooling air on the glass plate. Attached Figure Description

[0026] Figure 1 A front view of an overflow method substrate glass forming thickness fine adjustment device provided in this application;

[0027] Figure 2 for Figure 1 Enlarged image.

[0028] The attached diagram is labeled as follows: 1. Overflow brick; 2. Heat-conducting box; 3. Cooling mechanism; 4. Thick air duct; 5. Rotating component; 6. Glass plate. Detailed Implementation

[0029] The specific embodiments of this application will be described in further detail below with reference to the accompanying drawings.

[0030] like Figure 1 and Figure 2 As shown, this application discloses an overflow method substrate glass forming thickness fine adjustment device, which may include two heat-conducting boxes 2 and a cooling mechanism 3 disposed below the overflow brick 1.

[0031] The heat-conducting box 2 is located on both sides of the glass plate 6, and the cooling mechanism 3 is respectively installed on the heat-conducting box 2.

[0032] The heat-conducting box 2 can be made of high-temperature resistant and high-thermal-conductivity ceramic materials, such as silicon carbide. Based on the dimensions and installation positions of the overflow brick 1 and the glass plate 6, the two heat-conducting boxes 2 are respectively installed on both sides of the glass plate 6 below the overflow brick 1.

[0033] The cooling mechanism 3 may include multiple thick air ducts 4 and rotating parts 5.

[0034] The thick air duct 4 is mounted on the rotating part 5. The air inlet of the thick air duct 4 is connected to the cooling air, and the other end is located inside the heat conduction box 2.

[0035] The thick duct 4 can be made of high-temperature resistant material and manufactured with a suitable diameter and length. Its air inlet is connected to the external cooling air supply system through the pipe to ensure a continuous and stable supply of cooling air.

[0036] The rotating component 5 can be a simple bushing structure, installed on the heat conduction box 2, with the thick air duct 4 installed on the rotating component 5, so that one end can rotate freely inside the heat conduction box 2, and the other end receives the cooling air.

[0037] In this embodiment, a cooling mechanism 3 comprising multiple thick air ducts 4 and a rotating component 5 is provided below the overflow brick 1, with the thick air ducts 4 mounted on the rotating component 5, enabling flexible adjustment of the cooling air direction. Traditional thick air ducts 4 are often fixed and can only cool specific areas. However, the rotating component 5 in this device allows the thick air ducts 4 to rotate, enabling the cooling air to change direction as needed, allowing for more precise cooling adjustment of different positions on the glass sheet 6. This greatly improves the flexibility of adjusting the thickness of the glass sheet 6, avoiding the difficulty of localized adjustment caused by fixed cooling air positions. Therefore, the cooling air can be precisely guided to the areas on the glass sheet 6 where thickness adjustment is required, achieving more refined thickness control.

[0038] In one possible embodiment, the rotating element 5 can be configured as a universal joint.

[0039] The universal joint can be a commercially available industrial universal joint, whose dimensions match the thickness of the duct 4 and the heat-conducting housing 2. The universal joint is installed on the heat-conducting housing 2, ensuring that the thickness of the duct 4 is securely mounted on it and can rotate freely via the universal joint. For example, one end of the universal joint can be bolted to the mounting hole in the heat-conducting housing 2, and the thickness of the duct 4 can be connected to the other end of the universal joint via a flange or clamp, allowing the thickness of the duct 4 to rotate in different directions.

[0040] In this embodiment, a universal joint is used as the rotating component 5, which greatly improves the rotational flexibility of the thick duct 4. Compared with a simple rotating component 5, the universal joint can achieve multi-dimensional rotation, making the angle adjustment of the thick duct 4 in three-dimensional space more free. This allows for more precise guidance of cooling air to the glass sheet 6 area that needs adjustment, enhancing the controllability of the thickness adjustment of the glass sheet 6 and providing a better mechanical structure basis for achieving fine adjustment.

[0041] In one possible embodiment, the universal joint is detachably connected to the heat-conducting housing 2.

[0042] When installing the universal joint into the heat-conducting housing 2, a detachable connection method, such as bolt connection, is used. The heat-conducting housing 2 has pre-drilled mounting holes with internal threads, and the connection part of the universal joint is designed with corresponding external threads. The universal joint is fixed to the heat-conducting housing 2 by tightening the bolts. When maintenance or replacement of the universal joint is required, simply loosen the bolts to remove the universal joint from the heat-conducting housing 2.

[0043] In this embodiment, the detachable connection facilitates maintenance and component replacement. During long-term use, if the universal joint wears or is damaged, it can be quickly disassembled for repair or replacement without requiring extensive disassembly of the entire device. This reduces overall maintenance costs and time, improves maintainability and service life, and ensures the continuity and stability of production.

[0044] In one possible embodiment, the universal joint is made of a high-temperature resistant material.

[0045] Considering the high-temperature environment during the overflow method substrate glass forming process, ceramic materials can be used for the universal joints to ensure their structural and performance stability at high temperatures. For example, alumina ceramic materials can be used to form universal joints of the required shape and size through processes such as molding and sintering, and then installed on the heat-conducting housing 2.

[0046] In this embodiment, the use of high-temperature resistant materials ensures the stability and reliability of the universal joint in high-temperature environments, preventing deformation or damage to the universal joint due to high temperatures. This ensures that the thickness duct 4 can rotate stably for a long time, guarantees the long-term effective operation of the thickness adjustment device in high-temperature production environments, extends the service life of the universal joint, and ensures the reliability of glass sheet 6 production and the stability of product quality.

[0047] In one possible embodiment, the universal joint has a rotation angle of 0-360°.

[0048] After installing the universal joint and the thick duct 4, the universal joint can be rotated within the range of 0° to 360° by means of electric push rod or manual adjustment.

[0049] Therefore, when it is necessary to adjust the thickness of the glass sheet 6 in a certain area, the universal joint is rotated to the required precise angle according to the control signal or manual operation.

[0050] In this embodiment, the 360° rotation angle range allows the adjustment range of the thickness duct 4 to cover the entire circumference. The arrayed duct adjustment areas are seamlessly connected, enabling all-round adjustment of the cooling air at different positions of the glass sheet 6. This greatly expands the effective range of the cooling air. No matter where the thickness deviation occurs in the glass sheet 6, the thickness duct 4 can be aligned with that area by adjusting the universal joint angle. This improves the flexibility and comprehensiveness of the thickness adjustment of the glass sheet 6 and helps to achieve more precise thickness control.

[0051] In one possible embodiment, the heat-conducting box 2 is provided with at least 90 universal joints, and each universal joint is provided with a thick air duct 4. The number of universal joints is determined according to the width of the glass sheet 6. In this embodiment, 100 universal joints can be provided, so there are 100 thick air ducts provided on the heat-conducting box 2.

[0052] In one possible embodiment, a sealing structure is provided between the universal joint and the heat-conducting box 2.

[0053] In this embodiment, a high-temperature resistant rubber gasket is provided between the universal joint and the heat-conducting housing 2 as a sealing structure to prevent cooling air leakage. Cooling air leakage leads to a decrease in cooling effect and affects the accuracy of adjusting the thickness of the glass sheet 6. The sealing structure ensures the effective utilization of cooling air, guarantees the stability of the cooling effect, and also helps improve energy efficiency.

[0054] In one possible embodiment, the heat-conducting box 2 is provided with an inclined surface, which is parallel to the inclined surface of the overflow brick 1.

[0055] When manufacturing the heat-conducting box 2, one side of it is machined into a slope. By measuring the slope angle of the overflow brick 1, the slope angle of the heat-conducting box 2 is machined to be parallel to it.

[0056] In this embodiment, the inclined surface of the heat-conducting box 2 is set parallel to the inclined surface of the overflow brick 1, which helps to guide the flow direction of the cooling air and make it better match the flow direction of the glass plate 6. This allows the cooling air to act more effectively on the glass plate 6, improves the utilization efficiency of the cooling air, reduces the energy loss caused by the inconsistency between the air direction and the flow direction of the glass plate 6, further optimizes the adjustment effect of the thickness of the glass plate 6, and improves the accuracy and efficiency of the adjustment.

[0057] In one possible embodiment, the cooling mechanism 3 also includes a plurality of flow regulating valves disposed at the inlet of the thickness duct 4.

[0058] In this embodiment, a flow regulating valve is provided at the air inlet of the thick air duct 4 to facilitate adjustment of the flow rate of the cooling air in the cooling air duct 4 as needed, and to precisely control the cooling effect of the cooling air on the glass plate 6.

[0059] In one possible embodiment, the thick duct 4 is made of metal.

[0060] In this embodiment of the application, the thick duct 4 is made of metal material, which can improve the strength and high temperature resistance of the thick duct 4.

[0061] Finally, it should be noted that the above embodiments are only used to illustrate the technical solutions of this application, and are not intended to limit them; although this application has been described in detail with reference to the foregoing embodiments, those skilled in the art should understand that modifications to the technical solutions described in the foregoing embodiments, or equivalent substitutions for some or all of the technical features, do not cause the essence of the corresponding technical solutions to deviate from the scope of the technical solutions of the embodiments of this application.

Claims

1. A device for finely adjusting the thickness of substrate glass formed by overflow method, characterized in that, The application relates to a cooling device for overflow bricks (1), which comprises two heat-conducting boxes (2) arranged below the overflow bricks (1) and a cooling mechanism (3); The heat-conducting boxes (2) are arranged on the two sides of a glass sheet (6) respectively, and the cooling mechanism (3) is arranged on the heat-conducting boxes (2) respectively; The cooling mechanism (3) comprises a plurality of thickness air pipes (4) and rotating members (5); The thickness air pipes (4) are arranged on the rotating members (5), the air inlets of the thickness air pipes (4) are communicated with cooling air, and the other ends of the thickness air pipes (4) are arranged in the heat-conducting boxes (2); The rotating members (5) are arranged on the heat-conducting boxes (2) and used for rotating the thickness air pipes (4).

2. The overflow method substrate glass thickness fine adjustment device according to claim 1, characterized by, The rotating member (5) is arranged as a universal joint.

3. The overflow method substrate glass thickness fine adjustment device according to claim 2, characterized by, The universal joint is detachably connected with the heat-conducting box (2).

4. The overflow method substrate glass thickness fine adjustment device according to claim 2, characterized by The universal joint is made of high-temperature-resistant material.

5. The overflow method substrate glass thickness fine adjustment device according to claim 2, characterized by The rotating angle of the universal joint is 0-360 degrees.

6. The overflow method substrate glass thickness fine adjustment device according to claim 2, characterized by The heat-conducting box (2) is provided with at least 90 universal joints, and one thickness air pipe (4) is arranged on each universal joint.

7. The overflow method substrate glass thickness fine adjustment device according to claim 2, characterized by A sealing structure is arranged between the universal joint and the heat-conducting box (2).

8. The overflow method substrate glass thickness fine adjustment device according to claim 1, wherein An inclined surface is arranged on the heat-conducting box (2) and is arranged in parallel with the inclined surface of the overflow brick (1).

9. The overflow method substrate glass thickness fine adjustment device according to claim 1, wherein The cooling mechanism (3) further comprises a plurality of flow regulating valves arranged at the inlets of the thickness air pipes (4).

10. The overflow method substrate glass thickness fine adjustment device according to claim 1, wherein The thickness air pipe (4) is made of metal material.