Semiconductor wafer probe test equipment

Abstract

The utility model provides semiconductor wafer probe test equipment, which comprises a workbench and a base, side mounting seats are arranged on two sides of the workbench, lifting adjusting assemblies are arranged on the side mounting seats, and the workbench is connected with the base through the lifting adjusting assemblies. A first moving track is arranged in the middle of the workbench, a bearing table is connected to the first moving track in a sliding mode, and a second moving track is arranged on the bearing table and is perpendicular to the first moving track. According to the semiconductor wafer probe test equipment provided by the utility model, the detection table can flexibly move in a two-dimensional plane through the first moving track and the second moving track, so that the operation and the test of workers are facilitated; comprising a polishing assembly and a cleaning assembly can clean and maintain the detection probe after continuous work, the detection precision is prevented from being affected, the position of the probe cleaning device is controlled through a third moving track, and mistaken touch in the testing process is avoided.

Description

TECHNICAL FIELD

[0001] The utility model relates to semiconductor detection equipment technical field especially relates to a kind of semiconductor wafer probe test equipment. BACKGROUND

[0002] Probe tester is the equipment for testing semiconductor wafer in electronic processing factory, and the resistivity of semiconductor wafer can be detected, so that whether the product produced is qualified can be detected, and it is an important test equipment in electronic processing factory.

[0003] The existing equipment has the following problems in operation flexibility and probe maintenance: the contact resistance increases due to oxidation, pollution or wear after long-term use of probe, frequent shutdown cleaning or replacement is required, manual cleaning is required during maintenance process, and shutdown time is increased and secondary pollution may be introduced.

[0004] Therefore, it is necessary to provide a kind of semiconductor wafer probe test equipment to solve the above technical problems. UTILITY MODEL CONTENT

[0005] The utility model provides a kind of semiconductor wafer probe test equipment, solve the problem that probe needs frequent maintenance after long-term use, and manual cleaning is time-consuming and laborious and possibly introduces secondary pollution.

[0006] To solve the above technical problems, the utility model provides a kind of semiconductor wafer probe test equipment, including: a kind of semiconductor wafer probe test equipment includes: workbench and base, the both sides of the workbench are provided with side mounting seat, the side mounting seat is provided with lifting adjustment assembly, and workbench and base are connected, the middle of the workbench is provided with first moving track, the first moving track is slidably connected with bearing table, the bearing table is provided with second moving track and is perpendicular to first moving track, the second moving track is slidably connected with detection table, the detection table is fixedly connected with support rod and clamping part, the support rod is provided with detection probe, the side of the bearing table is provided with first extension plate, the first extension plate is provided with third moving track, the third moving track is slidably connected with probe cleaning device, for maintaining and maintaining probe.

[0007] Preferably, the lifting adjustment assembly includes a docking rod, a first telescopic push rod and a second telescopic push rod, the docking rod is fixedly connected with the base, a through limiting hole is formed in the docking rod, the output ends of the first telescopic push rod and the second telescopic push rod correspond to the limiting hole, and the limiting positioning with the docking rod is realized.

[0008] Preferably, the probe cleaning device comprises a lifting rail, a lifting seat is slidably connected to the lifting rail, a second extension plate is fixedly connected to the side of the lifting seat facing the detection table, a first driving motor is fixedly connected to the second extension plate, a conversion seat is arranged at the output end of the first driving motor, and a polishing assembly and a cleaning assembly are fixedly connected to the conversion seat.

[0009] Preferably, the polishing assembly comprises a first fixed seat, a second driving motor is arranged on the first fixed seat, a polishing wheel is connected to the output end of the second driving motor, the polishing wheel is rotatably connected to the first fixed seat, and a first collecting box is slidably connected below the first fixed seat for collecting the polishing debris.

[0010] Preferably, the cleaning assembly comprises a second fixed seat, a third driving motor is arranged on the second fixed seat, a cleaning brush is rotatably connected to the second fixed seat, a synchronous wheel is rotatably connected to the side of the second fixed seat away from the third driving motor, the synchronous wheel is fixedly connected to the cleaning brush, a synchronous belt is arranged on the outer side of the synchronous wheel, the two groups of cleaning brushes are driven to synchronously rotate under the action of the third driving motor, and a second collecting box is slidably connected below the second fixed seat.

[0011] Preferably, a first locking piece is arranged below the first fixed seat and corresponds to the first collecting box, and a second locking piece is arranged below the second fixed seat and corresponds to the second collecting box.

[0012] Compared with the related art, the semiconductor wafer probe testing equipment has the following beneficial effects:

[0013] The semiconductor wafer probe testing equipment comprises a polishing assembly and a cleaning assembly, and the probe cleaning device can clean and maintain the detection probe after continuous work, so that the detection precision is not affected, and the position of the probe cleaning device is controlled by the third moving track, so that the test process is not affected. BRIEF DESCRIPTION OF DRAWINGS

[0014] Figure 1 A preferred embodiment structure diagram of the semiconductor wafer probe testing equipment is provided.

[0015] Figure 2 A structure diagram of the detection table in the utility model is provided.

[0016] Figure 3 A structure diagram of the polishing assembly and the cleaning assembly in the utility model is provided.

[0017] The figure label: 1, workbench, 2, base, 3, side mounting seat, 4, lifting adjusting assembly, 41, butt joint rod, 42, limit hole, 43, first telescopic push rod, 44, second telescopic push rod, 5, first moving track, 6, bearing table, 7, second moving track, 8, detection table, 9, support rod, 10, detection probe, 11, clamping part, 12, first extension plate, 13, third moving track, 14, lifting guide rail, 15, lifting seat, 16, second extension plate, 17, first drive motor, 18, conversion seat, 19, polishing assembly, 191, first fixed seat, 192, second drive motor, 193, polishing wheel, 194, first collection box, 195, first locking piece, 20, cleaning assembly, 201, second fixed seat, 202, third drive motor, 203, cleaning brush, 204, synchronous wheel, 205, synchronous belt, 206, second collection box, 207, second locking piece. DETAILED DESCRIPTION

[0018] The utility model makes further explanation below combining with the drawing and embodiment.

[0019] Please combine with Figure 1 , Figure 2 And Figure 3 Among them, Figure 1 It is a preferred embodiment structure schematic drawing of semiconductor wafer probe test equipment provided by the utility model;

[0020] Figure 2 It is the structure schematic drawing of detection table in the utility model;

[0021] Figure 3 It is the structure schematic drawing of polishing assembly and cleaning assembly in the utility model.

[0022] A semiconductor wafer probe test equipment includes: workbench 1 and base 2, the both sides of workbench 1 are provided with side mounting seat 3, lifting adjusting assembly 4 is provided on side mounting seat 3, and workbench 1 and base 2 are connected, the middle of workbench 1 is provided with first moving track 5, bearing table 6 is slidably connected on first moving track 5, second moving track 7 is provided on bearing table 6 and is perpendicular to first moving track 5, detection table 8 is slidably connected on second moving track 7, support rod 9 and clamping part 11 are fixedly connected on detection table 8, detection probe 10 is provided on support rod 9, first extension plate 12 is provided on the side of bearing table 6, third moving track 13 is provided on first extension plate 12, probe cleaning device is slidably connected on third moving track 13, and the probe is maintained and maintained.

[0023] First, the workbench 1 is adjusted to the height of the operator by the lifting adjusting assembly 4, then the semiconductor wafer is placed on the detection table 8 and fixed by the clamping part 11, and the detection probe 10 is used for detection, and after continuous work, the detection probe 10 is cleaned and maintained by the probe cleaning device.

[0024] The lifting adjusting assembly 4 comprises a docking rod 41, a first telescopic push rod 43 and a second telescopic push rod 44, the docking rod 41 is fixedly connected with the base 2, the docking rod 41 is provided with a through limiting hole 42, and the output ends of the first telescopic push rod 43 and the second telescopic push rod 44 correspond to the limiting hole 42, so as to realize the limiting positioning with the docking rod 41.

[0025] The workbench 1 is provided below with a lifting power assembly (not shown in the figure), which cooperates with the lifting adjusting assembly 4 to accurately control the lifting height of the workbench 1, and the positioning is stable and reliable, so that the height of the workbench 1 is adjusted to adapt to different test requirements and operation scenes.

[0026] The probe cleaning device comprises a lifting guide rail 14, a lifting seat 15 is slidably connected on the lifting guide rail 14, a second extension plate 16 is fixedly connected on one side of the lifting seat 15 facing the detection table 8, a first driving motor 17 is fixedly connected on the second extension plate 16, a conversion seat 18 is arranged on the output end of the first driving motor 17, and a polishing assembly 19 and a cleaning assembly 20 are fixedly connected on the conversion seat 18.

[0027] The polishing and cleaning functions are switched by the first driving motor 17, and the detection probe 10 is comprehensively cleaned and maintained.

[0028] The polishing assembly 19 comprises a first fixed seat 191, a second driving motor 192 is arranged on the first fixed seat 191, a polishing wheel 193 is connected with the output end of the second driving motor 192, the polishing wheel 193 is rotatably connected with the first fixed seat 191, and a first collecting box 194 is slidably connected below the first fixed seat 191, for collecting the debris after polishing.

[0029] The polishing assembly 19 can polish and repair the detection probe 10, and the first collecting box 194 can collect debris to keep the equipment clean.

[0030] The cleaning assembly 20 comprises a second fixing base 201, a third driving motor 202 is arranged on the second fixing base 201, a cleaning brush 203 is rotationally connected to the second fixing base 201, a synchronous wheel 204 is rotationally connected to the side, away from the third driving motor 202, of the second fixing base 201, the synchronous wheel 204 is fixedly connected with the cleaning brush 203, a synchronous belt 205 is arranged on the outer side of the synchronous wheel 204, and the two groups of cleaning brushes 203 are driven to synchronously rotate under the action of the third driving motor 202, and a second collecting box 206 is slidably connected below the second fixing base 201.

[0031] The cleaning brush 203 that synchronously rotates can efficiently clean the side surface of the detection probe 10, and the second collecting box 206 can collect the impurities swept during the cleaning process.

[0032] The first fixing base 191 is provided with a first locking piece 195 corresponding to the first collecting box 194, and the second fixing base 201 is provided with a second locking piece 207 corresponding to the second collecting box 206.

[0033] The first locking piece 195 and the second locking piece 207 can firmly lock the first collecting box 194 and the second collecting box 206, so that the collecting boxes are prevented from shaking or falling off during use.

[0034] The working principle of the semiconductor wafer probe testing equipment provided by the utility model is as follows:

[0035] First, the workbench 1 is adjusted to a height suitable for the worker by using the lifting adjusting assembly 4, then the semiconductor wafer is placed on the detection table 8 and fixed by using the clamping part 11, the detection probe 10 is used to detect the semiconductor wafer, and the detection probe 10 is cleaned and maintained by using the probe cleaning device after continuous work.

[0036] Compared with the related art, the semiconductor wafer probe testing equipment provided by the utility model has the following beneficial effects:

[0037] The detection table 8 can be flexibly moved in a two-dimensional plane by the first moving track 5 and the second moving track 7, so that the operation and testing of the worker are facilitated, the probe cleaning device including the polishing assembly 19 and the cleaning assembly 20 can clean and maintain the detection probe 10 after continuous work, so that the detection precision is avoided from being affected, and the position of the probe cleaning device is controlled by the third moving track 13, so that the detection probe 10 is avoided from being touched by mistake during the testing process.

[0038] The above merely illustrates the embodiments of the present application, and does not limit the patent scope of the present application, and any equivalent structure or equivalent process transformation, or direct or indirect application in other related technical fields, which are made by using the content of the present application specification and drawings, are also included in the patent protection scope of the present application.

Claims

1. A semiconductor wafer probe test apparatus, comprising: Include: A semiconductor wafer probe test equipment includes: a workbench and a base, both sides of the workbench are provided with side mounting seats, the side mounting seats are provided with lifting adjusting assemblies, and the workbench and the base are connected, the middle of the workbench is provided with a first moving rail, the first moving rail is slidably connected with a bearing table, the bearing table is provided with a second moving rail perpendicular to the first moving rail, the second moving rail is slidably connected with a detection table, the detection table is fixedly connected with a support rod and a clamping part, the support rod is provided with a detection probe, the side of the bearing table is provided with a first extension plate, the first extension plate is provided with a third moving rail, and the third moving rail is slidably connected with a probe cleaning device for maintaining and maintaining the probe.

2. The semiconductor wafer probe testing apparatus of claim 1, wherein The lifting adjusting assembly includes a butt joint rod, a first telescopic push rod and a second telescopic push rod, the butt joint rod is fixedly connected with the base, a limiting hole penetrating through the butt joint rod is formed, and the output ends of the first telescopic push rod and the second telescopic push rod correspond to the limiting hole, so that the limiting positioning with the butt joint rod is realized.

3. The semiconductor wafer probe testing apparatus of claim 1, wherein The probe cleaning device comprises a lifting guide rail, a lifting seat is slidably connected to the lifting guide rail, a second extension plate is fixedly connected to one side of the lifting seat facing the detection table, a first driving motor is fixedly connected to the second extension plate, a conversion seat is arranged at the output end of the first driving motor, and a polishing assembly and a cleaning assembly are fixedly connected to the conversion seat.

4. The semiconductor wafer probe testing apparatus of claim 3, wherein The polishing assembly comprises a first fixed seat, a second driving motor is arranged on the first fixed seat, a polishing wheel is connected to the output end of the second driving motor, the polishing wheel is rotatably connected to the first fixed seat, and a first collecting box is slidably connected below the first fixed seat for collecting debris after polishing.

5. The semiconductor wafer probe testing apparatus of claim 4, wherein, The cleaning assembly comprises a second fixed seat, a third driving motor is arranged on the second fixed seat, a cleaning brush is rotatably connected to the second fixed seat, a synchronous wheel is rotatably connected to one side of the second fixed seat away from the third driving motor, the synchronous wheel is fixedly connected to the cleaning brush, a synchronous belt is arranged on the outer side of the synchronous wheel, and the two groups of cleaning brushes are driven to rotate synchronously under the action of the third driving motor, and a second collecting box is slidably connected below the second fixed seat.

6. A semiconductor wafer probe testing apparatus according to claim 5, wherein, The first fixed seat is provided with a first locking piece corresponding to the first collecting box, and the second fixed seat is provided with a second locking piece corresponding to the second collecting box.

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