Heat dissipation device and notebook computer support

Abstract

The utility model relates to a heat dissipation device and a notebook computer support, and belongs to the technical field of heat dissipation, the heat dissipation device comprises a fitting refrigeration device, an upper cover piece and a springback connecting device, the fitting refrigeration device comprises a refrigeration piece and a heat dissipation module, the refrigeration piece is arranged on the heat dissipation module, and the heat dissipation module can dissipate heat for the refrigeration piece; the upper cover piece is provided with a through hole penetrating through the top face and the bottom face of the upper cover piece, and the refrigerating piece is connected with the upper cover piece. The springback connecting device comprises a first springback connecting piece arranged on the upper cover piece and a second springback connecting piece matched with the first springback connecting piece to enable the first springback connecting piece to springback and jack the upper cover piece, and during use, the first springback connecting piece and the second springback connecting piece are matched with each other to jack the upper cover piece. Due to the fact that the through hole is formed in the upper cover piece, the refrigerating piece is arranged in the through hole in a penetrating mode and connected with the upper cover piece, the refrigerating piece and the upper cover can be synchronously jacked so that the refrigerating piece can act on the bottom of the notebook computer, and therefore the notebook computer can be cooled.

Description

Technical Field

[0001] This utility model relates to the field of heat dissipation technology, and more specifically, to a heat dissipation device and a laptop stand. Background Technology

[0002] A notebook computer, also known as a laptop computer or handheld computer, is a small, portable personal computer. It integrates key components such as a display, keyboard, touchpad (or pointing stick), and battery, all mounted on the same motherboard, forming a unified design.

[0003] The main features of laptops are portability and flexibility, making them ideal for mobile work and entertainment. Their size and weight are much smaller than desktop computers, so they can be easily packed into a backpack or handbag, facilitating movement between different locations.

[0004] Traditional laptop cooling devices mostly rely solely on fans to blow air from the bottom of the laptop for heat dissipation. For example, there is a Chinese utility model patent document with authorization announcement number "CN219392618U" entitled "A Laptop Heatsink". However, with the advancement of technology, the performance of core components such as laptop processors (CPU) and graphics cards (GPUs) has become increasingly powerful, but this has also led to higher power consumption. Increased power consumption means that these components will generate more heat during operation, causing traditional laptop cooling devices that rely solely on fans to dissipate heat to still experience overheating, which greatly affects the user experience. Summary of the Invention

[0005] The technical problem this utility model aims to solve is that, with the advancement of technology, the performance of core components such as processors (CPUs) and graphics cards (GPUs) in laptops is becoming more and more powerful, but at the same time, it also brings higher power consumption. The increase in power consumption means that these components will generate more heat during operation, which makes it difficult for traditional laptop cooling devices to cool the laptop by relying solely on fans, even if they overheat. This greatly affects the user experience. In view of the above-mentioned defects of the prior art, this utility model provides a cooling device.

[0006] The technical solution adopted by this utility model to solve its technical problem is:

[0007] A heat dissipation device is constructed and a refrigeration device is attached to it. The attached refrigeration device includes a refrigeration component and a heat dissipation module. The refrigeration component is disposed on the heat dissipation module, and the heat dissipation module can dissipate heat from the refrigeration component.

[0008] The upper cover has a through hole that connects its top and bottom surfaces, through which the cooling component can pass, and the cooling component is connected to the upper cover.

[0009] A spring-loaded connecting device, comprising a first spring-loaded connecting member disposed on the upper cover and a second spring-loaded connecting member cooperating with the first spring-loaded connecting member to cause the first spring-loaded connecting member to spring back and lift the upper cover.

[0010] Optionally, the upper cover includes a heat-conducting sheet disposed on its top that can conduct the low temperature generated by the cooling component, the heat-conducting sheet being in contact with the cooling surface of the cooling component.

[0011] Optionally, the first spring-loaded connector includes one or more first mounting posts disposed at the bottom of the upper cover, the first mounting posts having a first mounting hole communicating with one end thereof.

[0012] Optionally, the second spring-loaded connector includes a second assembly connecting post that mates with the first spring-loaded connector. The second assembly connecting post is provided with a second mounting hole corresponding to the first mounting hole. When the first assembly connecting post and the second assembly connecting post are inserted, the first mounting hole and the second mounting hole combine to form a receiving chamber. A spring-loaded component is provided in the receiving chamber, and the spring-loaded component acts on the two opposite ends of the first mounting hole and the second mounting hole.

[0013] Optionally, a lower cover is included, the second assembly connecting post is disposed on the top of the lower cover, the top of the lower cover is provided with a first airflow acceleration member to increase the heat dissipation efficiency of the heat dissipation module, and the upper cover is provided with a plurality of heat dissipation through holes penetrating its top and bottom.

[0014] A laptop stand is constructed, including a heat dissipation device and a detachably connected upper and lower housing. The lower cover is installed on the side of the lower housing near the upper housing. The upper housing is provided with a through groove extending through its top and bottom. The heat dissipation device can pass through the upper housing through the through groove. A limiting protrusion is provided on the outer peripheral side of the upper cover. The limiting protrusion can act at the opening of the through groove to restrict the travel of the heat dissipation device through the through groove.

[0015] Optionally, an accommodating space is provided between the upper housing and the lower housing, and a plurality of second airflow acceleration elements are provided in the accommodating space. The air outlets of the second airflow acceleration elements are directly facing the upper housing, and a plurality of ventilation grilles are provided on the upper housing and the lower housing.

[0016] Optionally, the bottom of the lower housing is provided with a foldable bracket.

[0017] Optionally, the upper housing, the lower housing, the first airflow speed-up component, the second airflow speed-up component, and the folding bracket are all made of transparent material.

[0018] Optionally, a light-emitting device is provided between the plurality of second airflow speed-increasing components, and the light-emitting device can be controlled by a microcomputer.

[0019] The beneficial effects of this utility model are as follows:

[0020] 1. When using this utility model, a laptop can be placed on top of the top cover. At this time, the laptop will press down on the top cover, causing the top cover to retract downwards. At the same time, the first and second spring-loaded connectors can play a certain role in shock absorption, thus extending the service life of this utility model.

[0021] 2. When in use, the upper cover can be lifted by the cooperation of the first and second spring-loaded connectors. The cooling component is installed in the through hole and connected to the upper cover. The cooling component will be lifted synchronously with the upper cover so that the cooling component can act on the bottom of the laptop, thereby enhancing the heat dissipation effect and cooling the laptop to prevent it from overheating. Attached Figure Description

[0022] To more clearly illustrate the technical solutions in the embodiments of this utility model or the prior art, the utility model will be further described below in conjunction with the accompanying drawings and embodiments. The drawings described below are only some embodiments of this utility model. For those skilled in the art, other drawings can be obtained based on these drawings without creative effort.

[0023] Figure 1 This is an exploded view of the heat dissipation device in this utility model;

[0024] Figure 2 This is an exploded view of the heat dissipation device in this utility model from another angle;

[0025] Figure 3 This is a bottom schematic diagram of the heat dissipation device in this utility model;

[0026] Figure 4 This is an overall exploded view of the present invention;

[0027] Figure 5 This is an exploded view of the entire utility model from another angle;

[0028] Figure 6 This is a schematic diagram of the overall bottom of this utility model;

[0029] Figure 7This is an isometric schematic diagram of the entire utility model;

[0030] Figure 8 This is a schematic diagram of the structure of the light strip and the micro control device of this utility model.

[0031] The attached figures are labeled as follows:

[0032] 1. Adhesive cooling device; 101. Cooling component; 102. Heat dissipation module;

[0033] 2. Top cover; 201. Through hole; 202. Heat-conducting plate; 203. Limiting protrusion;

[0034] 301. First spring-loaded connector; 301.1. First assembly connecting post; 301.2. First mounting hole; 302. Second spring-loaded connector; 302.1. Second assembly connecting post; 302.2. Second mounting hole;

[0035] 4. Lower cover; 401. First airflow acceleration component; 402. Heat dissipation through hole;

[0036] 5. Upper housing; 501. Through groove;

[0037] 6. Lower housing; 7. Second airflow speed-increasing component; 8. Ventilation grille; 9. Foldable bracket;

[0038] 10.1 LED strip; 10.2 LED beads;

[0039] 11. Microcontroller; 11.1 PCB board; 11.2 Microcontroller. Detailed Implementation

[0040] To make the objectives, technical solutions, and advantages of this utility model clearer, the technical solutions of this utility model will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only some embodiments of this utility model, not all embodiments. Based on the embodiments of this utility model, all other embodiments obtained by those skilled in the art without creative effort are within the scope of protection of this utility model.

[0041] In the description of the embodiments of this application, it should be noted that, unless otherwise explicitly specified and limited, the terms "connected" and "linked" should be interpreted broadly. For example, they can refer to a fixed connection, a detachable connection, or an integral connection; they can refer to a mechanical connection or an electrical connection; they can refer to a direct connection or an indirect connection through an intermediate medium. Those skilled in the art can understand the specific meaning of the above terms in the embodiments of this application based on the specific circumstances.

[0042] In the embodiments of this application, unless otherwise expressly specified and limited, "above" or "below" the second feature can mean that the first feature is in direct contact with the second feature, or that the first feature is in indirect contact with the second feature through an intermediate medium. Furthermore, "above," "on top of," and "over" the second feature can mean that the first feature is directly above or diagonally above the second feature, or simply that the first feature is at a higher horizontal level than the second feature. "Below," "below," and "under" the second feature can mean that the first feature is directly below or diagonally below the second feature, or simply that the first feature is at a lower horizontal level than the second feature.

[0043] In the description of this specification, the references to terms such as "one embodiment," "some embodiments," "example," "specific example," or "some examples," etc., refer to specific features, structures, materials, or characteristics described in connection with that embodiment or example, which are included in at least one embodiment or example of the embodiments of this application. In this specification, the illustrative expressions of the above terms do not necessarily refer to the same embodiment or example. Furthermore, the specific features, structures, materials, or characteristics described may be combined in any suitable manner in one or more embodiments or examples. Moreover, without contradiction, those skilled in the art can combine and integrate the different embodiments or examples described in this specification, as well as the features of different embodiments or examples.

[0044] Examples of embodiments of this utility model Figures 1-8The diagram illustrates a heat dissipation device, comprising a bonding cooling device 1, an upper cover 2, and a spring-loaded connecting device. The bonding cooling device 1 includes a cooling component 101 and a heat dissipation module 102. The cooling component 101 is disposed on the heat dissipation module 102, which dissipates heat from the cooling component 101. The upper cover 2 has a through hole 201 connecting its top and bottom surfaces, through which the cooling component 101 passes. The cooling component 101 is connected to the upper cover 2. The spring-loaded connecting device includes a first spring-loaded connector 301 disposed on the upper cover 2 and a second spring-loaded connector 302 that cooperates with the first spring-loaded connector 301 to spring back and lift the upper cover 2. Furthermore, when using this invention, the heat dissipation device is mounted on a laptop stand. In this case, the upper cover 2 can be lifted by the cooperation of the first spring-loaded connector 301 and the second spring-loaded connector 302. Since the upper cover 2 is provided with the through hole 201, the cooling component 101 passes through the through hole. Within the through hole 201 and connected to the top cover 2, the cooling component 101 rises synchronously with the top cover, allowing it to act on the bottom of the laptop for cooling. Furthermore, the top cover 2 includes a heat-conducting plate 202 on its top for conducting the low temperature generated by the cooling component. The heat-conducting plate 202 is in contact with and connected to the cooling surface of the cooling component 101. Optionally, when the cooling component 101 passes through the through hole 201, its top can be slightly higher than the top of the top cover, parallel to the top of the top cover, or slightly lower than the top of the top cover. When the cooling component 101 is slightly higher than the top of the cover, an installation groove can be opened at the bottom of the heat-conducting plate 202 to accommodate the top of the cooling component 101. When the cooling component 101 is slightly lower than the top of the cover, a low-temperature guide can be provided at the bottom of the heat-conducting plate 202 to guide the low-temperature guide generated by the cooling component 101. Both the low-temperature guide and the heat-conducting plate 202 can be aluminum sheets. Optionally, the cooling component 101 is a semiconductor cooling chip, which includes a heating surface and a cooling surface. The heat dissipation module 102 includes a heat dissipation fin group that can dissipate heat from the heating surface.

[0045] See Figures 2-5In this embodiment, the first spring-loaded connector 301 includes one or more first mounting connecting posts 301.1 disposed at the bottom of the upper cover 2. Each first mounting connecting post 301.1 has a first mounting hole 301.2 communicating with one end thereof. Further, the second spring-loaded connector 302 includes a second mounting connecting post 302.1 that engages with the first spring-loaded connector 301. Each second mounting connecting post 302.1 has a second mounting hole 302.2 corresponding to the first mounting hole 301.2. When the first mounting connecting post 301.1 and the second mounting connecting post 302.1 are engaged, the first mounting hole 301.2 and the second mounting hole 302.2 combine to form a receiving chamber. A spring-loaded component (not shown in the figure) is disposed within the receiving chamber. The spring-loaded component (not shown in the figure) functions as… Used on the opposite ends of the first mounting hole 301.2 and the second mounting hole 302.2, further, the diameter of the second mounting hole 302.2 is larger than the diameter of the first mounting hole 301.2, so that the second assembly connecting post 302.1 can be sleeved on the outside of the first assembly connecting post 301.1 and the second assembly connecting post 302.1 can be displaced relative to the first assembly connecting post 301.1. Optionally, four first assembly connecting posts 302.1 are provided, and the four first assembly connecting posts 302.1 connected in sequence can form a square, so as to stably and evenly lift the upper cover 2. In one embodiment, the spring element (not shown in the figure) can be a first magnet and a second magnet, wherein the like repulsive surfaces of the first magnet and the second magnet are arranged opposite each other. In another embodiment, the spring element (not shown in the figure) can be a spring, a silicone spring block or a metal elastic sheet.

[0046] In this embodiment, a lower cover 4 is included, and the second assembly connecting post 302.1 is disposed on the top of the lower cover 4. The top of the lower cover 4 is provided with a first airflow acceleration member 401 to increase the heat dissipation efficiency of the heat dissipation module 102. The upper cover 2 is provided with a plurality of heat dissipation through holes 402 penetrating its top and bottom. Furthermore, the heat dissipation through holes 402 can facilitate the dissipation of internal heat and also facilitate the intake of air into the first airflow acceleration member 401. Optionally, the first airflow acceleration member 401 is an electric fan. The first airflow acceleration member 401 can improve the heat dissipation efficiency of the heat dissipation fin assembly.

[0047] See Figures 4-8This embodiment also relates to a laptop stand, including a heat dissipation device and a detachably connected upper shell 5 and lower shell 6. The lower cover 4 is mounted on the side of the lower shell 6 near the upper shell 5. The upper shell 5 is provided with a through groove 501 extending through its top and bottom. The heat dissipation device can pass through the through groove 501 and exit the upper shell 5. A limiting protrusion 203 is provided on the outer periphery of the upper cover 2. The limiting protrusion 203 can act at the opening of the through groove 501 to restrict the travel of the heat dissipation device through the through groove 501. Furthermore, in use, it can... The laptop is placed on top of the upper casing 5. The heat dissipation device can pass through the upper casing 5 through the through slot 501 and act on the bottom of the laptop, so that the heat dissipation device can be closely attached to the bottom of the laptop. The cooperation of the first spring-loaded connector 301 and the second spring-loaded connector 302 will not cause the heat dissipation device to lift the laptop, thus avoiding instability of the laptop. Furthermore, the limiting protrusion 203 acts on the opening of the through slot 501 to limit the travel of the heat dissipation device through the through slot 501 and prevent the top cover 2 from completely coming off the through slot 501.

[0048] In this embodiment, an accommodating space is provided between the upper housing 5 and the lower housing 6. A plurality of second airflow acceleration components 7 are provided in the accommodating space. The air outlets of the second airflow acceleration components 7 face the upper housing 5. A plurality of ventilation grilles 8 are provided on the upper housing 5 and the lower housing 6. Furthermore, the second airflow components can dissipate heat from the laptop through the ventilation grilles 8. Optionally, the second airflow components are electric fans, which can further dissipate heat from the bottom of the laptop.

[0049] In this embodiment, a foldable bracket 9 is provided at the bottom of the lower housing 6. Furthermore, the foldable bracket 9 is damped and hinged at the bottom of the lower housing 6, and the upper housing 5 can be supported to an inclined position by means of the foldable bracket 9.

[0050] See Figures 4-8In this embodiment, the upper housing 5, the lower housing 6, and the folding bracket are all made of transparent material. Furthermore, a light-emitting device is provided between the plurality of second airflow speed-increasing components 7. The light-emitting device can be controlled by a microcomputer. The light-emitting device, in conjunction with the transparent upper housing 5, the lower housing 6, the first airflow speed-increasing component 401, the second airflow speed-increasing component 7, and the folding bracket, can enhance the aesthetics and atmosphere during use. Optional light-emitting devices include a light strip 10.1 and LED beads 10.2 set on the light strip 10.1. The microcontroller 11 includes a PCB board 11.1 and a microcontroller 11.2 soldered on the PCB board 11.1. The first airflow speed-increasing component 401, the second airflow speed-increasing component 7, and the LED beads 10.2 are all controlled by the microcontroller 11.2 to realize the adjustment of wind speed and the adjustment of the animation effect, color change effect, and brightness effect of the LED beads 10.2.

[0051] It should be understood that those skilled in the art can make improvements or modifications based on the above description, and all such improvements and modifications should fall within the protection scope of the appended claims.

Claims

1. A heat dissipating device, characterized by, The application relates to a cooling device, which comprises: a cooling device (1) comprising a cooling element (101) and a heat dissipation module (102), wherein the cooling element (101) is arranged on the heat dissipation module (102), and the heat dissipation module (102) can dissipate heat for the cooling element (101); an upper cover element (2) provided with a through hole (201) penetrating through the top surface and the bottom surface of the upper cover element (2), wherein the through hole (201) can be used for arranging the cooling element (101), and the cooling element (101) is connected with the upper cover element (2); a rebound connecting device, which comprises a first rebound connecting element (301) arranged on the upper cover element (2) and a second rebound connecting element (302) matched with the first rebound connecting element (301) to make the first rebound connecting element (301) rebound and lift the upper cover element (2).

2. A heat dissipating device according to claim 1, wherein The upper cover element (2) comprises a heat conduction sheet (202) arranged on the top of the upper cover element (2) and capable of conducting low temperature generated by the cooling element (101), and the heat conduction sheet (202) is connected with the cooling surface of the cooling element (101).

3. The heat dissipating device of claim 1, wherein The first rebound connecting element (301) comprises one or more first assembly connecting columns (301.1) arranged on the bottom of the upper cover element (2), and the first assembly connecting column (301.1) is provided with a first mounting hole (301.2) communicating with one end of the first assembly connecting column (301.1).

4. A heat dissipating device according to claim 3, wherein The second rebound connecting element (302) comprises a second assembly connecting column (302.1) matched with the first rebound connecting element (301) and provided with a second mounting hole (302.2) corresponding to the first mounting hole (301.2), when the first assembly connecting column (301.1) is matched with the second assembly connecting column (302.1), the first mounting hole (301.2) and the second mounting hole (302.2) form a containing cavity, and a rebound element is arranged in the containing cavity and acts on the two ends of the first mounting hole (301.2) and the second mounting hole (302.2).

5. A heat dissipating device according to claim 4, wherein The application further relates to a lower cover element (4), wherein the second assembly connecting column (302.1) is arranged on the top of the lower cover element (4), the top of the lower cover element (4) is provided with a first air flow increasing element (401) for increasing the heat dissipation efficiency of the heat dissipation module (102), and the upper cover element (2) is provided with a plurality of heat dissipation through holes (402) penetrating through the top and the bottom of the upper cover element (2).

6. A notebook computer stand comprising the heat dissipation device of claim 5, wherein, The application further relates to an upper shell (5) and a lower shell (6) which are detachably connected, the lower cover element (4) is arranged on one side of the lower shell (6) close to the upper shell (5), the upper shell (5) is provided with a through slot (501) penetrating through the top and the bottom of the upper shell (5), the cooling device can pass through the upper shell (5) from the through slot (501), the outer circumferential side of the upper cover element (2) is provided with a limiting protrusion (203), and the limiting protrusion (203) can act on the opening of the through slot (501) to limit the stroke of the cooling device passing through the through slot (501).

7. The notebook computer stand of claim 6, wherein, The upper shell (5) and the lower shell (6) are provided with a containing space, a plurality of second air flow speed increasers (7) are arranged in the containing space, air outlets of the second air flow speed increasers (7) are opposite to the upper shell (5), and a plurality of ventilation grilles (8) are arranged on the upper shell (5) and the lower shell (6).

8. The notebook computer stand of claim 7, wherein, A foldable support (9) is arranged at the bottom of the lower shell (6).

9. The notebook computer stand of claim 8, wherein, The upper shell (5), the lower shell (6), the first air flow speed increaser (401), the second air flow speed increaser (7) and the foldable support are all made of transparent materials.

10. The notebook computer stand of claim 7, wherein, Light emitting devices are arranged between the plurality of second air flow speed increasers (7), and the light emitting devices can be controlled by a microcomputer.

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