Crystal oscillator structure with heat insulation function

By introducing a vacuum cavity and sealing ring design into the crystal oscillator structure, combined with a heat sink and fins, the problem of heat insulation and heat dissipation of crystal oscillators in aerospace environments is solved, improving their performance stability and lifespan under extreme conditions.

CN224068625UActive Publication Date: 2026-03-31SHENZHEN T & W ELECTRONICS CO LTD
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Patent Information

Authority / Receiving Office
CN · China
Patent Type
Utility models(China)
Current Assignee / Owner
Filing Date
2025-04-15
Publication Date
2026-03-31

AI Technical Summary

Technical Problem

Existing crystal oscillators lack effective vacuum insulation structures in aerospace environments, resulting in unstable performance and ineffective heat dissipation under extreme temperature changes and mechanical shocks.

Method used

The design employs a vacuum cavity and fitting groove on the substrate, combined with a heat sink, heat sink fins, and sealing ring structure to create a vacuum environment, preventing the crystal oscillator body from directly contacting the substrate. The seal is achieved by utilizing the internal and external pressure difference, thereby increasing the heat dissipation area.

Benefits of technology

This achieves effective heat insulation and heat dissipation in the crystal oscillator structure, extending its service life and improving its reliability in extreme environments.

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Abstract

The utility model discloses a crystal oscillator structure with a heat insulation function, which relates to the technical field of aerospace low-power-consumption circuits, and comprises a substrate, the substrate is provided with a group of vacuum cavities and a group of wedging grooves, and the substrate is respectively provided with symmetrical through holes corresponding to each vacuum cavity; the crystal oscillator body is matched with the vacuum cavity, the crystal oscillator body is fixedly connected with symmetrical pins, and the symmetrical pins are matched with the symmetrical through holes; the heat dissipation cover shell is matched with the crystal oscillator body, the two sides of the heat dissipation cover shell are each fixedly connected with a set of heat dissipation fins, the heat dissipation cover shell is fixedly connected with a square shell, and the square shell is matched with the wedging groove; the symmetrical mounting columns are fixedly connected with the crystal oscillator body respectively; and the symmetrical mounting hole columns are fixedly connected with the base plate respectively, and the symmetrical mounting hole columns are matched with the symmetrical mounting hole columns. The technical problem to be solved by the utility model is to provide a crystal oscillator structure with a heat insulation function, which is favorable for realizing heat dissipation of the crystal oscillator structure.
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Description

Technical Field

[0001] This utility model relates to the field of low-power circuit technology in aerospace, specifically to a crystal oscillator structure with heat insulation function. Background Technology

[0002] A crystal oscillator is a key component in electronic circuits used to generate stable frequency signals. Its core principle is frequency control achieved by utilizing the piezoelectric effect of quartz crystals (or other piezoelectric materials). A crystal oscillator typically consists of two parts: a resonator (crystal unit) and peripheral circuitry. In the aerospace field, the performance and reliability of crystal oscillators are crucial for navigation, communication, and control systems.

[0003] Most existing crystal oscillators do not have a vacuum insulation structure, which makes them inadequately protected in aerospace environments with extreme temperature changes and mechanical shocks. For example, ordinary crystal oscillators (PXOs) are greatly affected by external environmental factors such as temperature and humidity, while the aerospace field has extremely high requirements for the stability and vibration resistance of crystal oscillators.

[0004] Existing technology, such as the utility model of a crystal oscillator with a vacuum insulation structure, authorized publication number CN216390943U, involves bonding the crystal oscillator body inside a vacuum chamber, with the leads and through holes fixedly connected by sealant. A mating block is bonded inside a mating groove, allowing a cover to enclose the crystal oscillator body, providing excellent protection. Simultaneously, the cooperation between the cover and the vacuum chamber creates a vacuum environment, giving the crystal oscillator body excellent thermal insulation.

[0005] Currently, there is a lack of crystal oscillator structures that facilitate sealing in a vacuum environment and facilitate heat dissipation. Utility Model Content

[0006] The technical problem to be solved by this utility model is to provide a crystal oscillator structure with heat insulation function, which is beneficial to heat dissipation of the crystal oscillator structure.

[0007] This utility model achieves its purpose through the following technical solution:

[0008] A crystal oscillator structure with heat insulation function is characterized by comprising: a substrate, wherein the substrate is provided with a set of vacuum chambers and a set of mating grooves, and the substrate is provided with symmetrical through holes corresponding to each of the vacuum chambers; a crystal oscillator body, matching the vacuum chambers, the crystal oscillator body being fixedly connected to symmetrical pins, the symmetrical pins matching the symmetrical through holes; a heat sink cover, matching the crystal oscillator body, a set of heat sink fins being fixedly connected to both sides of the heat sink cover, the heat sink cover being fixedly connected to a square shell, the square shell matching the mating grooves; symmetrical mounting posts, each fixedly connected to the crystal oscillator body; and symmetrical mounting hole posts, each fixedly connected to the substrate, the symmetrical mounting posts matching the symmetrical mounting hole posts. The pins are inserted into the interior of the through holes, and the pins and through holes are fixedly connected by sealant. Sealant is applied to the surface of the mounting posts, and the mounting posts are installed in the mounting hole posts to achieve a stable connection between the two, preventing the crystal oscillator body from directly contacting the substrate. The combination of the heat sink and the vacuum chamber creates a vacuum environment, providing the crystal oscillator with excellent thermal insulation. The close fit between the heat sink and the crystal oscillator allows the heat dissipation fins to effectively dissipate heat generated by the crystal oscillator, thus extending its lifespan. The square shell is bonded to the mating groove.

[0009] As a further limitation of this technical solution, the substrate is fixedly connected to a sealing groove for each of the vacuum chambers, and the square shell is fixedly connected to a sealing ring, which matches the sealing groove.

[0010] As a further limitation of this technical solution, the sealing groove is made of rubber material, the sealing ring is wider at the top and narrower at the bottom, and the upper dimension of the sealing ring is larger than the dimension of the sealing groove. By using the sealing ring and the sealing groove, and utilizing the internal and external pressure difference, the sealing ring is tightly packed inside the sealing groove, thus achieving a seal.

[0011] As a further limitation of this technical solution, the mounting post is thicker in the middle and thinner at both ends, so as to achieve a stable connection between the mounting post and the mounting hole post.

[0012] As a further limitation of this technical solution, rubber pads are fixedly connected to the four corners of the substrate. The rubber pads significantly improve the compactness and stability of the fit with the mounting surface.

[0013] Compared with related technologies, the crystal oscillator structure with heat insulation function provided by this utility model has the following beneficial effects:

[0014] (1) This device avoids the crystal oscillator body from sticking to the substrate by using mounting posts and mounting hole posts for fixed connection, which facilitates heat dissipation;

[0015] (2) This device increases the contact area by having the two sides of the heat sink directly contact the crystal oscillator body, which facilitates direct heat dissipation by the heat sink fins;

[0016] (3) This device uses a sealing ring and a sealing groove, and utilizes the internal and external pressure difference to make the sealing ring tightly plugged into the sealing groove to achieve sealing. Attached Figure Description

[0017] Figure 1 This is a three-dimensional structural diagram of the present invention;

[0018] Figure 2 This is an exploded view of the present invention;

[0019] Figure 3 This is a partial three-dimensional structural schematic diagram of the present invention;

[0020] Figure 4 This is a partially cut-away three-dimensional structural diagram of the present invention.

[0021] In the diagram: 1. Substrate, 2. Heat sink cover, 3. Heat sink fins, 4. Fitting groove, 5. Vacuum chamber, 6. Through hole, 7. Rubber pad, 8. Square shell, 9. Crystal oscillator body, 10. Pin, 11. Mounting post, 12. Mounting hole post, 13. Sealing groove, 14. Sealing ring. Detailed Implementation

[0022] The technical solutions of the present utility model will be clearly and completely described below with reference to the accompanying drawings of the embodiments. Obviously, the described embodiments are only some embodiments of the present utility model, and not all embodiments. Based on the embodiments of the present utility model, all other embodiments obtained by those of ordinary skill in the art without creative effort are within the protection scope of the present utility model.

[0023] Example 1: A crystal oscillator structure with heat insulation function includes: a substrate 1, wherein the substrate 1 is provided with a set of vacuum chambers 5 and a set of mating grooves 4, and the substrate 1 is provided with symmetrical through holes 6 corresponding to each of the vacuum chambers 5; a crystal oscillator body 9, matching the vacuum chambers 5, and the crystal oscillator body 9 is fixedly connected to symmetrical pins 10, the symmetrical pins 10 matching the symmetrical through holes 6; a heat dissipation cover 2, matching the crystal oscillator body 9, and a set of heat dissipation fins 3 are fixedly connected to both sides of the heat dissipation cover 2, the heat dissipation cover 2 is fixedly connected to a square shell 8, the square shell 8 matching the mating grooves 4; symmetrical mounting posts 11, respectively fixedly connected to the crystal oscillator body 9; and symmetrical mounting hole posts 12, respectively fixedly connected to the substrate 1, the symmetrical mounting posts 11 matching the symmetrical mounting hole posts 12. The pins 10 are inserted into the interior of the through holes 6, and the pins 10 and the through holes 6 are fixedly connected by sealant. Sealant is applied to the surface of the mounting post 11, and the mounting post 11 is installed in the mounting hole post 12 to achieve a stable connection between the two, preventing the crystal oscillator body 9 from directly contacting the substrate 1. The cooperation between the heat sink shroud 2 and the vacuum chamber 5 forms a vacuum environment, giving the crystal oscillator body 9 a good heat insulation structure. The heat sink shroud 2 is in close contact with the crystal oscillator body 9, allowing the heat dissipation fins 3 to dissipate the heat generated by the crystal oscillator body 9 in a timely manner, thereby extending the service life of the crystal oscillator body 9. The square shell 8 is fixed in the fitting groove 4.

[0024] The mounting post 11 is thicker in the middle and thinner at both ends, so as to achieve a stable connection between the mounting post 11 and the mounting hole post 12.

[0025] Rubber pads 7 are fixedly connected to the four corners of the substrate 1. The rubber pads 7 greatly improve the compactness and stability of the fit with the mounting surface.

[0026] Example 2: This example is a further elaboration based on Example 1. The substrate 1 is fixedly connected to a sealing groove 13 for each of the vacuum chambers 5, and the square shell 8 is fixedly connected to a sealing ring 14, which matches the sealing groove 13.

[0027] The sealing groove 13 is made of rubber material, and the sealing ring 14 is wider at the top and narrower at the bottom, with the upper part of the sealing ring 14 being larger than the size of the sealing groove 13. By using the sealing ring 14 and the sealing groove 13, and utilizing the internal and external pressure difference, the sealing ring 14 is tightly packed inside the sealing groove 13, thus achieving a seal.

[0028] The above description is merely an embodiment of this utility model and does not limit the patent scope of this utility model. Any equivalent structural or procedural transformations made based on the content of this utility model specification and drawings, or direct or indirect applications in other related technical fields, are similarly included within the patent protection scope of this utility model.

Claims

1. A crystal oscillator structure with heat insulation function, characterized in that, Include: The substrate (1) is provided with a set of vacuum cavities (5) and a set of matching slots (4), the substrate (1) is provided with symmetric through holes (6) corresponding to each of the vacuum cavities (5) respectively; Crystal body (9), matching the vacuum cavity (5), the crystal body (9) is fixedly connected with symmetric pins (10), and the symmetric pins (10) are matched with the symmetric through holes (6); Heat dissipation shell (2), matching the crystal body (9), the two sides of the heat dissipation shell (2) are respectively fixedly connected with a set of heat dissipation fins (3), the heat dissipation shell (2) is fixedly connected with a square shell (8), and the square shell (8) is matched with the matching slot (4); Symmetric mounting column (11), respectively fixedly connected with the crystal body (9); Symmetric mounting hole column (12), respectively fixedly connected with the substrate (1), and the symmetric mounting column (11) is matched with the symmetric mounting hole column (12).

2. The crystal oscillator structure with thermal insulation function according to claim 1, characterized in that: The substrate (1) is respectively fixedly connected with a sealing groove (13) corresponding to each of the vacuum cavities (5), the square shell (8) is fixedly connected with a sealing ring (14), and the sealing ring (14) is matched with the sealing groove (13).

3. The crystal oscillator structure with thermal insulation function according to claim 2, characterized in that: The sealing groove (13) is made of rubber material, the sealing ring (14) is wide at the top and narrow at the bottom, and the size of the upper part of the sealing ring (14) is greater than the size of the sealing groove (13).

4. The crystal oscillator structure with thermal insulation function according to claim 1, characterized in that: The mounting column (11) is thick in the middle and thin at both ends.

5. The crystal oscillator structure with thermal insulation function according to claim 1, characterized in that: The four corners of the substrate (1) are respectively fixedly connected with rubber pads (7).

Citation Information

Patent Citations

  • Crystal oscillator with vacuum heat insulation structure

    CN216390943U