Digital audio processor

Abstract

The utility model discloses a digital audio processor which comprises an installation cover, a placement cavity is reserved in the installation cover, an audio processor body is arranged in the placement cavity, a water-cooling cooling mechanism is installed on one side of the installation cover, and an air-cooling cooling mechanism is installed at the top end of the installation cover. The cooling device has the beneficial effects that a water-cooling cooling mechanism consisting of a water return pump, a cooling water tank, a circulating water pipe and a water suction pump is mounted on one side of the mounting cover, and an air-cooling cooling mechanism consisting of an air blower, a semiconductor chilling plate, a cooling pipe, a concentric-square-shaped spraying cavity and an air spraying hole is mounted at the top end of the mounting cover; according to the audio processor provided by the invention, the air cooling and the water cooling are combined to efficiently dissipate heat of the audio processor body when the audio processor body is used, so that the problem that the cooling speed is slowed down due to heat absorption and temperature rise of water in the cooling process during water cooling is avoided, and the heat dissipation efficiency of the audio processor is higher when the audio processor is used.

Description

TECHNICAL FIELD

[0001] The utility model relates to digital audio processor field, concretely relates to a digital audio processor. BACKGROUND

[0002] Digital audio processor is a kind of digital audio signal processing equipment, it first converts the analog signal of multichannel input into digital signal, then carries out a series of tunable algorithm processing to digital signal, satisfies the application demand such as improving tone quality, matrix mix, noise elimination, echo elimination, feedback elimination.

[0003] The Chinese patent with patent No.

[0004] Although the digital audio processor described in the above patent can realize the rapid dissipation of heat of the audio processor body during use in the form of water cooling, with the continuous cooling process, the water in the cooling mechanism will continuously absorb the heat emitted by the audio processor body and be heated, thereby causing the poor cooling effect of the audio processor body during long-time use and the low heat dissipation efficiency. UTILITY MODEL CONTENTS

[0005] The utility model solves the technical problem in the prior art, and provides a digital audio processor capable of realizing efficient heat dissipation of an audio processor body in the form of combination of air cooling and water cooling.

[0006] The utility model discloses a digital audio processor, including installation cover, the installation cover is reserved with the placement cavity, the placement cavity is provided with audio processor body, the installation cover one side is installed water cooling mechanism, the installation cover top is installed air cooling mechanism, the water cooling mechanism includes backwater pump, cooling water tank, circulating water pipe and water pump, wherein the cooling water tank is installed on the one side wall of cooling water tank, the water pump is located at the water outlet of cooling water tank, the backwater pump is installed at the backwater opening of cooling water tank, the circulating water pipe is connected between the water pump and the backwater pump, the air cooling mechanism includes air blower, semiconductor refrigeration piece, cooling pipe, back-shaped spray cavity and air jet hole, wherein the air blower is located at the top one side of installation cover, the cooling pipe is connected at the air outlet of air blower, the semiconductor refrigeration piece is installed on the side wall of cooling pipe, the back-shaped spray cavity is reserved in the middle part of installation cover interlayer, the air jet hole is opened on the inner wall of installation cover and is opposite the back-shaped spray cavity, the placement cavity is also installed with rubber support pad on the upper side and the lower side.

[0007] Furthermore, an operation panel is also installed on the outer wall of the mounting cover on one side of the cooling water tank. The operation panel is electrically connected to the water pump, the return water pump, and the blower.

[0008] Furthermore, a cylindrical support leg is installed at each of the four corners of the bottom of the mounting cover.

[0009] Furthermore, the cooling water tank is bolted to the mounting cover, and both the water pump and the return water pump are connected to the interior of the cooling water tank via pipes.

[0010] Furthermore, the circulating water pipe is composed of two connected sections of spirally wound heat dissipation pipes in a U-shape, and the connection between the two connected sections of spirally wound heat dissipation pipes is located outside the mounting cover. The inlet of the circulating water pipe is connected to the flange of the pump, and the outlet of the circulating water pipe is connected to the flange of the return pump.

[0011] Furthermore, the blower is bolted to the mounting cover, and the blower is connected to the air inlet of the cooling pipe via a pipe.

[0012] Furthermore, the thermoelectric cooler penetrates the sidewall of the cooling tube, with the cooling surface of the thermoelectric cooler facing the inside of the cooling tube and the heating surface of the thermoelectric cooler facing the outside of the cooling tube.

[0013] Furthermore, the air outlet of the cooling pipe is connected to the U-shaped spray cavity, and the air jet hole is connected to the interior of the U-shaped spray cavity.

[0014] Compared with the prior art, this utility model has the following advantages:

[0015] This invention utilizes a water-cooling mechanism consisting of a return water pump, a cooling water tank, a circulating water pipe, and a water pump, installed on one side of the mounting cover. Simultaneously, an air-cooling mechanism consisting of a blower, a semiconductor cooling chip, a cooling pipe, a U-shaped spray cavity, and air jets is installed on the top of the mounting cover. This allows the audio processor to efficiently dissipate heat through a combination of air and water cooling during use. This avoids the problem of slower cooling speeds caused by water absorbing heat and rising in temperature during water cooling, resulting in higher heat dissipation efficiency for the audio processor during operation. Attached Figure Description

[0016] Figure 1 This is a schematic diagram of the structure of a digital audio processor according to the present invention;

[0017] Figure 2 This is a schematic diagram of the mounting cover in a digital audio processor according to the present invention;

[0018] Figure 3 This is a top sectional view of the cooling tube in a digital audio processor according to the present invention;

[0019] Figure 4 This is a front sectional view of the mounting cover in the digital audio processor described in this utility model;

[0020] Figure 5 This is a top view of the water-cooling mechanism in a digital audio processor according to the present invention;

[0021] Figure 6 This is a top sectional view of the mounting cover in a digital audio processor according to the present invention.

[0022] The annotations in the attached figures are explained as follows:

[0023] 1. Air-cooled cooling mechanism; 101. Blower; 102. Semiconductor cooling chip; 103. Cooling pipe; 104. Air jet; 105. U-shaped spray cavity; 2. Mounting cover; 3. Audio processor body; 4. Support feet; 5. Control panel; 6. Water-cooled cooling mechanism; 601. Return water pump; 602. Cooling water tank; 603. Circulating water pipe; 604. Water pump; 7. Placement cavity; 8. Rubber support. Detailed Implementation

[0024] To enable those skilled in the art to better understand the present invention, the technical solutions of the present invention will be clearly and completely described below with reference to the accompanying drawings of the embodiments. Obviously, the described embodiments are only some embodiments of the present invention, and not all embodiments. Based on the embodiments of the present invention, all other embodiments obtained by those skilled in the art without creative effort should fall within the protection scope of the present invention.

[0025] like Figure 1 , Figure 2 and Figure 5As shown, a digital audio processor in this embodiment includes a mounting cover 2, with a reserved placement cavity 7 inside the mounting cover 2. The placement cavity 7 houses the audio processor body 3. A water-cooling mechanism 6 is installed on one side of the mounting cover 2, and an air-cooling mechanism 1 is installed on the top of the mounting cover 2. The water-cooling mechanism 6 includes a return water pump 601, a cooling water tank 602, a circulating water pipe 603, and a pump 604. The cooling water tank 602 is installed on one side wall of the cooling water tank 602, the pump 604 is located at the outlet of the cooling water tank 602, the return water pump 601 is installed at the return water outlet of the cooling water tank 602, and the circulating water pipe... 603 is connected between the water pump 604 and the return water pump 601; the air-cooled cooling mechanism 1 includes a blower 101, a semiconductor cooling chip 102, a cooling pipe 103, a U-shaped spray cavity 105, and a jet nozzle 104. The blower 101 is located on one side of the top of the mounting cover 2. The cooling pipe 103 is connected to the air outlet of the blower 101. The semiconductor cooling chip 102 is installed on the side wall of the cooling pipe 103. The U-shaped spray cavity 105 is reserved in the middle of the interlayer of the mounting cover 2. The jet nozzle 104 is opened on the inner wall of the mounting cover 2, directly opposite the U-shaped spray cavity 105. Rubber pads 8 are also installed on the upper and lower sides of the placement cavity 7.

[0026] This invention provides a digital audio processor that achieves efficient heat dissipation of the audio processor body 3 through a combination of air cooling and water cooling. This solves the problem that while existing digital audio processors can achieve rapid heat dissipation through water cooling, the water in the cooling mechanism continuously absorbs the heat emitted by the audio processor body and heats up as the cooling process continues, resulting in poor cooling performance and low heat dissipation efficiency over long-term use. The overall approach of this invention to solve the above problems is as follows: when the audio processor body 3 is working, the water pump 604 can dissipate the water in the cooling water tank 602. The water is drawn into the circulating water pipe 603. As the water flows in the circulating water pipe 603, it absorbs the heat generated by the audio processor body 3 during operation through heat transfer, thereby achieving water cooling of the audio processor body 3. The cooled water will eventually flow back to the cooling water tank 602 via the return water pump 601. When the air cooling mechanism 1 is started, the blower 101 and the semiconductor cooling chip 102 will also start. After the blower 101 starts, it will blow the outside air into the cooling pipe 103. When the air flows through the cooling pipe 103, it will be cooled by the semiconductor cooling chip 102. The cooled air will eventually be sprayed onto the surface of the audio processor body 3 through the U-shaped spray cavity 105 and the air jet hole 104, thereby achieving air cooling of the audio processor body 3.

[0027] like Figures 1-2As shown, an operation panel 5 is also installed on the outer wall of the mounting cover 2 on one side of the cooling water tank 602. The operation panel 5 is electrically connected to the water pump 604, the return water pump 601 and the blower 101.

[0028] As one implementation method, the operation panel 5 mainly functions as a master switch, and mainly controls the on / off state of the control circuit to achieve the coordinated operation of the water pump 604, the return water pump 601 and the blower 101.

[0029] like Figures 1-2 As shown, a cylindrical support leg 4 is also installed at each of the four corners of the bottom of the mounting cover 2;

[0030] As one implementation method, the support foot 4 can ensure the stable placement of the mounting cover 2 during use. The rubber pad 8 reserved inside the mounting cover 2 can leave a gap between the audio processor body 3 and the upper and lower side walls of the placement cavity 7 after installation, so as to ensure that the air can be easily blown to the surface of the audio processor body 3 after cooling, thereby achieving air cooling of the audio processor body 3.

[0031] like Figure 1 , Figure 2 and Figure 5 As shown, the cooling water tank 602 is bolted to the mounting cover 2, and the water pump 604 and the return water pump 601 are both connected to the inside of the cooling water tank 602 through pipes.

[0032] As one implementation method, the bolted connection makes the installation of the cooling water tank 602 more stable. The water pump 604 is mainly used to pump water from the cooling water tank 602 to the circulating water pipe 603, while the return water pump 601 is mainly used to pump the cooled water from the circulating water pipe 603 back to the cooling water tank 602.

[0033] like Figure 1 , Figure 2 and Figure 5 As shown, the circulating water pipe 603 is composed of two connected sections of spirally wound heat dissipation pipes in a U-shape, and the connection between the two connected sections of spirally wound heat dissipation pipes is located outside the mounting cover 2. The inlet of the circulating water pipe 603 is connected to the flange of the pump 604, and the outlet of the circulating water pipe 603 is connected to the flange of the return water pump 601.

[0034] In one implementation, the circulating water pipes 603 are distributed in two reserved cavities inside the mounting cover 2 in a spiral winding manner, while the connecting pipe between the two spirally wound heat dissipation pipes in the circulating water pipes 603 is placed outside the mounting cover 2, which can ensure the normal circulation of water.

[0035] like Figures 1-2 As shown, the blower 101 is bolted to the mounting cover 2, and the blower 101 is connected to the air inlet of the cooling pipe 103 through a pipe.

[0036] As one implementation method, the bolted installation method makes the blower 101 more securely fixed on the mounting cover 2, and connects the air inlet of the cooling pipe 103 through the pipe, which can ensure that the air blown out by the blower 101 can smoothly enter the cooling pipe 103.

[0037] like Figures 1-3 As shown, the thermoelectric cooler 102 penetrates the side wall of the cooling tube 103, with the cooling surface of the thermoelectric cooler 102 facing the inside of the cooling tube 103 and the heating surface of the thermoelectric cooler 102 facing the outside of the cooling tube 103.

[0038] In one implementation, the cooling surface of the thermoelectric cooler 102 faces the inside of the cooling tube 103, and the heating surface of the thermoelectric cooler 102 faces the outside of the cooling tube 103. This not only allows for convenient cooling of the air flowing through the cooling tube 103, but also ensures convenient heat dissipation of the thermoelectric cooler 102 during operation.

[0039] like Figure 1 , Figure 4 and Figure 6 As shown, the air outlet of the cooling pipe 103 is connected to the U-shaped spray cavity 105, and the air jet hole 104 is connected to the inside of the U-shaped spray cavity 105.

[0040] In one implementation, the air outlet of the cooling pipe 103 is connected to the U-shaped spray cavity 105, and the air jet hole 104 is connected to the inside of the U-shaped spray cavity 105. This ensures that the air in the U-shaped spray gun can be conveniently sprayed onto the surface of the audio processor through the air jet hole 104, thereby achieving efficient heat dissipation of the audio processor body 3.

[0041] The specific implementation process of this embodiment is as follows: In use, the audio processor body 3 is first placed in the placement cavity 7, and the audio processor is limited by the rubber supports 8 on the upper and lower sides. At this time, a gap is reserved between the surface of the audio processor body 3 and the placement cavity 7. Then, simply start the audio processor body 3 to put the entire audio processor into use. When the audio processor body 3 is working, the water pump 604 can pump water from the cooling water tank 602 into the circulating water pipe 603. As the water flows in the circulating water pipe 603, it will heat the audio processor body 3 through heat transfer. The heat generated during operation is absorbed, thereby achieving water cooling of the audio processor body 3. The cooled water will eventually flow back to the cooling water tank 602 via the return water pump 601. When the air cooling mechanism 1 is started, the blower 101 and the semiconductor cooling chip 102 will also start. After the blower 101 starts, it will blow the outside air into the cooling pipe 103. When the air flows through the cooling pipe 103, it will be cooled by the semiconductor cooling chip 102. The cooled air will eventually be sprayed onto the surface of the audio processor body 3 through the U-shaped spray cavity 105 and the air jet hole 104, thereby achieving air cooling of the audio processor body 3.

[0042] The above description of the disclosed embodiments enables those skilled in the art to make or use the present invention. Various modifications to these embodiments will be readily apparent to those skilled in the art, and the general principles defined herein may be implemented in other embodiments without departing from the spirit or scope of the present invention. Therefore, the present invention is not to be limited to the embodiments shown herein, but is to be accorded the widest scope consistent with the principles and novel features disclosed herein.

Claims

1. A digital audio processor, characterized by: The utility model provides an audio processor cooling device, including installation cover (2), reserve the placing cavity (7) in installation cover (2), be provided with audio processor body (3) in placing cavity (7), water cooling mechanism (6) is installed to one side of installation cover (2), air cooling mechanism (1) is installed to the top of installation cover (2), water cooling mechanism (6) includes backwater pump (601), cooling water tank (602), circulating water pipe (603) and water pump (604), wherein cooling water tank (602) is installed on one side wall of cooling water tank (602), water pump (604) is located at the water outlet of cooling water tank (602), backwater pump (601) is installed at the backwater of cooling water tank (602), circulating water pipe (603) is connected between water pump (604) and backwater pump (601), air cooling mechanism (1) includes air blower (101), semiconductor refrigeration fin (102), cooling pipe (103), back -shaped spray cavity (105) and air jet hole (104), wherein air blower (101) is located at one side of the top of installation cover (2), cooling pipe (103) is connected at the air outlet of air blower (101), semiconductor refrigeration fin (102) is installed on the side wall of cooling pipe (103), back -shaped spray cavity (105) is reserved in the interlayer of installation cover (2) middle part, air jet hole (104) is set up on the inner wall of installation cover (2) and is opposite back -shaped spray cavity (105), and rubber support pad (8) is also installed in the upper and lower sides of placing cavity (7).

2. A digital audio processor as claimed in claim 1, characterized in that: The operation panel (5) is electrically connected with the water pump (604), the backwater pump (601) and the air blower (101).

3. A digital audio processor as defined in claim 1, wherein: The installation cover (2) is further provided with a cylindrical supporting leg (4) at each of the four corners of the bottom end.

4. A digital audio processor as defined in claim 1, wherein: The cooling water tank (602) is bolted to the installation cover (2), and the water pump (604) and the backwater pump (601) are connected to the inside of the cooling water tank (602) through pipes.

5. A digital audio processor as defined in claim 1, wherein: The circulating water pipe (603) is composed of two sections of heat dissipation pipes that are connected in a back-shaped spiral and are wound, and the connecting part between the two sections of heat dissipation pipes that are connected in a back-shaped spiral is located outside the installation cover (2).

6. A digital audio processor as defined in claim 1, wherein: The air blower (101) is bolted to the installation cover (2), and the air blower (101) is connected to the air inlet of the cooling pipe (103) through a pipe.

7. A digital audio processor as claimed in claim 6, characterized in that: The semiconductor refrigeration fin (102) penetrates the side wall of the cooling pipe (103), and the refrigeration surface of the semiconductor refrigeration fin (102) faces the inside of the cooling pipe (103), and the heating surface of the semiconductor refrigeration fin (102) faces the outside of the cooling pipe (103).

8. A digital audio processor as defined in claim 7, characterized in that: The air outlet of the cooling pipe (103) is communicated with the back-shaped spray cavity (105), and the air jet hole (104) is communicated with the inside of the back-shaped spray cavity (105).

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