Heat dissipation assembly, domain controller and movable platform
By setting a turbulence section on the bottom wall of the heat dissipation cavity, the coolant is changed from laminar flow to turbulent flow, which solves the problem of insufficient heat exchange capacity between the lower and upper layers of coolant, improves the heat dissipation effect and reduces the temperature of electronic equipment.
Patent Information
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- Filing Date
- 2025-03-13
- Publication Date
- 2026-03-31
AI Technical Summary
In the prior art, the heat exchange capacity between the lower and upper layers of coolant in the heat dissipation components of domain controllers is poor, resulting in poor heat dissipation performance.
A turbulence section is installed on the bottom wall of the heat dissipation cavity. The design of the turbulence section changes the coolant from a laminar flow state to a turbulent flow state, thereby accelerating the heat exchange capacity between the lower and upper layers of coolant.
The heat dissipation effect of the heat dissipation components has been improved, and the temperature of the heat-generating components of electronic devices has been reduced by about 4-5℃, maintaining the domain controller in good working condition.
Smart Images
Figure CN224068991U_ABST
Abstract
Description
TECHNICAL FIELD
[0001] The present application relates to the technical field of domain controller heat dissipation, in particular to a heat dissipation assembly, a domain controller and a movable platform. BACKGROUND
[0002] The domain controller is a key network server for managing and controlling computers, users and resources within a domain. For example, in the field of vehicles, the domain controller is responsible for managing and controlling various functions of the vehicle, including but not limited to the powertrain, chassis control and information processing of the intelligent cockpit. The domain controller integrates multiple heat generating devices such as chips, and therefore has a corresponding heat dissipation assembly inside the domain controller. The heat dissipation assembly is in abutment with the heat generating devices to quickly dissipate the heat generated by the heat generating devices, so that the domain controller maintains a good working state.
[0003] In the related art, the heat dissipation assembly arranged in the domain controller includes a shell, a heat dissipation cavity is formed in the shell, a first pipe and a second pipe are arranged on the surface of the shell and are in communication with the heat dissipation cavity, the cooling liquid enters the heat dissipation cavity from the first pipe and flows out of the heat dissipation cavity from the second pipe after heat exchange. In order to improve the heat dissipation performance of the heat dissipation assembly, a plurality of heat dissipation fins can be arranged in the heat dissipation cavity, and the plurality of heat dissipation fins divide a plurality of flow channels in the heat dissipation cavity, thereby improving the heat dissipation performance of the heat dissipation assembly.
[0004] However, in the related art, the heat exchange capacity between the lower layer cooling liquid and the upper layer cooling liquid in the heat dissipation assembly is poor, thereby reducing the heat dissipation effect of the heat dissipation assembly. Invention content
[0005] In order to overcome the above-mentioned defects in the related art, the purpose of the present application is to provide a heat dissipation assembly, a domain controller and a movable platform, which can improve the heat exchange capacity between the lower layer cooling liquid and the upper layer cooling liquid in the heat dissipation assembly, thereby improving the heat dissipation effect of the heat dissipation assembly.
[0006] In one aspect, the present application provides a heat dissipation assembly for dissipating heat of a heat generating device of an electronic device, comprising:
[0007] a shell, a heat dissipation cavity is formed in the shell, the heat dissipation cavity includes a bottom wall, and the heat generating device is arranged to abut against the bottom wall;
[0008] a turbulence portion formed on one side of the bottom wall facing into the heat dissipation cavity; in a direction perpendicular to the bottom wall, the turbulence portion protrudes into the heat dissipation cavity, or the turbulence portion is recessed away from the heat dissipation cavity, or part of the turbulence portion protrudes into the heat dissipation cavity and another part of the turbulence portion is recessed away from the heat dissipation cavity.
[0009] In a possible implementation, the spoiler includes a plurality of protrusions and / or a plurality of grooves.
[0010] In a possible implementation, the spoiler includes a plurality of grooves arranged at intervals, the plurality of grooves are arranged in a plurality of rows along a first direction and arranged in a plurality of columns along a second direction.
[0011] Along the first direction, a first heat dissipation ridge is formed between two adjacent grooves; along the second direction, a second heat dissipation ridge is formed between two adjacent grooves; an intersection of the first heat dissipation ridge and the second heat dissipation ridge forms a heat dissipation island, in a direction perpendicular to the bottom wall, the height of the heat dissipation island is greater than the height of the first heat dissipation ridge and the height of the second heat dissipation ridge.
[0012] The first direction and the second direction are perpendicular to each other.
[0013] In a possible implementation, in the direction perpendicular to the bottom wall, the heat dissipation island is flush with the bottom wall.
[0014] Alternatively, the spoiler further includes a plurality of protrusions arranged at intervals, the protrusions include at least one of the first heat dissipation ridge, the second heat dissipation ridge, or the heat dissipation island, in the direction perpendicular to the bottom wall, the heat dissipation island protrudes into the heat dissipation cavity.
[0015] In a possible implementation, along the first direction, two columns of grooves correspond one by one, or two columns of grooves are arranged alternately.
[0016] And / or, along the second direction, two rows of grooves correspond one by one, or two rows of grooves are arranged alternately.
[0017] In a possible implementation, in a plane parallel to the bottom wall, a projection of the groove is circular, elliptical, or polygonal, where the number of sides of the polygon is greater than or equal to 4.
[0018] In a possible implementation, in the direction perpendicular to the bottom wall, the distance between the bottom end of the groove and the top end of the heat dissipation island is 0.5-1 mm.
[0019] In a possible implementation, the diameter of the groove is 2-5 mm.
[0020] In a possible implementation, the distance between the centers of two adjacent grooves is 2-5 mm.
[0021] In a possible implementation, the heat dissipation cavity comprises a first heat dissipation region, a second heat dissipation region and a third heat dissipation region in communication, and the second heat dissipation region is located between the first heat dissipation region and the third heat dissipation region.
[0022] The heat dissipation assembly further comprises a first pipe and a second pipe, the first pipe is in communication with the first heat dissipation region, and the second pipe is in communication with the third heat dissipation region.
[0023] The heat dissipation assembly further comprises a plurality of heat dissipation fins and / or a plurality of heat dissipation columns, the heat dissipation fins are arranged in at least one of the first heat dissipation region, the third heat dissipation region and the second heat dissipation region, and the plurality of heat dissipation columns are arranged in the second heat dissipation region.
[0024] In a possible implementation, the heat dissipation assembly further comprises a plurality of wall convexes, and the plurality of wall convexes are arranged on the side wall of at least one of the first heat dissipation region, the second heat dissipation region and the third heat dissipation region.
[0025] In a possible implementation, a projection of the spoiler in a plane parallel to the bottom wall coincides with a projection of the second heat dissipation region.
[0026] Alternatively, the projection of the spoiler is smaller than the projection of the second heat dissipation region, and a projection of the heat generating device is located in the projection range of the spoiler.
[0027] In a possible implementation, the shell comprises a base and an end cover, the heat dissipation cavity is formed in the base, and the end cover is arranged on the base to seal the heat dissipation cavity.
[0028] The spoiler, the heat dissipation fin, the heat dissipation column and the wall convex are integrated with the base.
[0029] In another aspect, the present application provides a domain controller comprising the heat dissipation assembly as described above.
[0030] In still another aspect, the present application provides a movable platform comprising the domain controller as described above.
[0031] The application provides a heat dissipation assembly, a domain controller and a movable platform, and the heat dissipation assembly is used for dissipating heat of a heating device of an electronic device and comprises a shell and a spoiler part. The shell is internally formed with a heat dissipation cavity, the heat dissipation cavity comprises a bottom wall, and the heating device is used for abutting against the bottom wall. The spoiler part is formed on a side of the bottom wall facing into the heat dissipation cavity. In a direction perpendicular to the bottom wall, the spoiler part protrudes towards the heat dissipation cavity, or the spoiler part is recessed away from the heat dissipation cavity, or part of the spoiler part protrudes towards the heat dissipation cavity and another part of the spoiler part is recessed away from the heat dissipation cavity. The application sets the spoiler part on the bottom wall of the heat dissipation cavity. When the cooling liquid at the bottom of the heat dissipation cavity passes through the spoiler part, the cooling liquid is affected by the spoiler part and flows upwards or downwards, so that the cooling liquid changes from a laminar flow state to a turbulent flow state, thereby accelerating the heat exchange capacity between the lower cooling liquid and the upper cooling liquid, and the heat dissipation effect of the heat dissipation assembly is improved. BRIEF DESCRIPTION OF DRAWINGS
[0032] In order to more clearly illustrate the technical solutions in the embodiments of the application or the related art, the following will briefly introduce the drawings needed to be used in the embodiments or the related art description. Obviously, the drawings in the following description are some embodiments of the application, and other drawings can also be obtained by those skilled in the art without any creative effort on the basis of these drawings.
[0033] Figure 1 The flow performance simulation diagram of the heat dissipation assembly in the related art;
[0034] Figure 2 The structural diagram of the heat dissipation assembly provided by an embodiment of the application;
[0035] Figure 3 The structural diagram of the heat dissipation assembly provided by an embodiment of the application; Figure 2 The structural diagram of the heat dissipation assembly provided by an embodiment of the application;
[0036] Figure 4 The top view of the heat dissipation cavity provided by an embodiment of the application;
[0037] Figure 5 The partial sectional view of the heat dissipation assembly provided by an embodiment of the application;
[0038] Figure 6 The top view of the spoiler part provided by an embodiment of the application;
[0039] Figure 7 The partial side view of the spoiler part provided by an embodiment of the application.
[0040] Reference signs:
[0041] 100 - shell; 101 - base; 102 - end cover; 110 - first heat dissipation area; 120 - second heat dissipation area; 130 - third heat dissipation area; 1100 - bottom wall;
[0042] 200 - Fluid flow deflector; 210 - Groove; 220 - First heat dissipation ridge; 230 - Second heat dissipation ridge; 240 - Heat dissipation island;
[0043] 300 - First Pipeline;
[0044] 400 - Second pipe;
[0045] 500-heat sink fins;
[0046] 600-heat sink;
[0047] 700-wall convex hull;
[0048] X - First direction; Y - Second direction; Z - Third direction. Detailed Implementation
[0049] To make the objectives, technical solutions, and advantages of the embodiments of this application clearer, the technical solutions of the embodiments of this application will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are some embodiments of this application, but not all embodiments.
[0050] Based on the embodiments in this application, all other embodiments obtained by those skilled in the art without inventive effort are within the scope of protection of this application. Unless otherwise specified, the following embodiments and features can be combined with each other.
[0051] As described in the background section, in the heat dissipation components installed in the domain controller, the heat exchange capacity between the lower and upper layers of coolant is poor, resulting in poor heat dissipation performance of the heat dissipation components.
[0052] Specifically, such as Figure 1 As shown, in the related heat dissipation assembly, the heat dissipation cavity inside the housing 100 is provided with multiple heat dissipation fins 500. The heat dissipation fins 500 are curved and adapted to the contour of the side wall of the heat dissipation cavity. The heat dissipation fins 500 can transfer heat from the domain controller to the heat dissipation cavity and guide the coolant flow within the heat dissipation cavity. The multiple heat dissipation fins 500 divide the interior of the heat dissipation cavity into multiple heat dissipation channels, allowing the coolant to be evenly distributed into each heat dissipation channel, thereby dissipating heat from the heat-generating components of the domain controller. In areas where the domain controller generates a high amount of heat, the density of the heat dissipation fins 500 can be increased to improve heat dissipation performance. Because the coolant flows in a basically laminar state within the heat dissipation channels, the heat exchange capacity between the lower and upper layers of coolant in the heat dissipation assembly is relatively poor.
[0053] exist Figure 1The lighter the color in the flow performance simulation diagram of the heat dissipation assembly shown, the higher the cooling liquid flow rate. For example Figure 1 As shown in the heat dissipation assembly, the flow rate of the cooling liquid near the liquid inlet and the liquid outlet is the highest, and in the middle of the heat dissipation assembly, the flow rate of the cooling liquid at the edge position is higher than that at the middle position. Since the main heat generating device of the domain controller corresponds to the middle region of the heat dissipation assembly, the heat dissipation effect of the region corresponding to the main heat generating device in the domain controller is poor. Figure 1 As shown in the heat dissipation assembly, the flow rate of the cooling liquid near the liquid inlet and the liquid outlet is the highest, and in the middle of the heat dissipation assembly, the flow rate of the cooling liquid at the edge position is higher than that at the middle position. Since the main heat generating device of the domain controller corresponds to the middle region of the heat dissipation assembly, the heat dissipation effect of the region corresponding to the main heat generating device in the domain controller is poor.
[0054] Therefore, the embodiments of the present application aim to provide a heat dissipation assembly, a domain controller and a movable platform. By arranging a turbulence portion on the bottom wall of the heat dissipation cavity, when the cooling liquid at the bottom of the heat dissipation cavity passes through the turbulence portion, it is affected by the turbulence portion and flows upward or downward, so that the cooling liquid changes from laminar flow to turbulent flow, thereby accelerating the heat exchange capacity between the lower cooling liquid and the upper cooling liquid, and facilitating the improvement of the heat dissipation effect of the heat dissipation assembly.
[0055] The content of the embodiments of the present application will be described in detail below with reference to the drawings, so that those skilled in the art can understand the content of the present application in more detail. It should be noted that in the description of the embodiments of the present application, the first direction X, the second direction Y and the third direction Z are three different directions in a three-dimensional space, and the first direction X, the second direction Y and the third direction Z can be perpendicular to each other, and the third direction Z may, for example, be a vertical direction.
[0056] Please refer to Figures 2-7 The embodiments provide a heat dissipation assembly for dissipating heat of a heat generating device of an electronic device, which may, for example, be a domain controller, and the heat generating device may, for example, be a chip.
[0057] The heat dissipation assembly comprises a shell 100, and a heat dissipation cavity is formed in the shell 100. The shape of the heat dissipation cavity is adapted to the distribution shape of the heat generating device in the electronic device, so as to cover most or even all of the heat generating device. The heat dissipation cavity comprises a bottom wall 1100, and the heat generating device is arranged to abut against the bottom wall 1100, so as to transfer the heat of the heat generating device to the heat dissipation assembly by heat conduction, thereby dissipating heat of the heat generating device.
[0058] The turbulence portion 200 is formed on the side of the bottom wall 1100 facing the heat dissipation cavity. In the direction perpendicular to the bottom wall 1100 (i.e., the third direction Z), the turbulence portion 200 can protrude towards the heat dissipation cavity. Alternatively, the turbulence portion 200 can be recessed away from the heat dissipation cavity. Alternatively, part of the turbulence portion 200 can protrude towards the heat dissipation cavity, and another part of the turbulence portion 200 can be recessed away from the heat dissipation cavity. In the present embodiment, the specific structure of the turbulence portion 200 when protruding or recessing can be set as needed, for example, it can be columnar, sawtooth-shaped, wavy, etc. When the turbulence portion 200 simultaneously includes protruding and recessed structures, the protruding structure and the recessed structure can be arranged adjacent to each other, or can be staggered and spaced apart.
[0059] It can be understood that the height of the turbulence portion 200 is different from the height of the bottom wall 1100. By setting the turbulence portion 200, the originally flat bottom wall 1100 can at least partially present a concave-convex structure. When the cooling liquid at the bottom of the heat dissipation cavity flows to the turbulence portion 200, it is affected by the turbulence portion 200 and flows in the third direction Z (upward or downward), so that the cooling liquid changes from a laminar state to a turbulent state, thereby accelerating the heat exchange capacity between the lower cooling liquid and the upper cooling liquid, and facilitating to improve the heat dissipation effect of the heat dissipation assembly.
[0060] In the present embodiment, the turbulence portion 200 can include a plurality of protrusions and / or a plurality of grooves 210. Specifically, when the turbulence portion 200 protrudes towards the heat dissipation cavity, the turbulence portion 200 can be composed of a plurality of protrusions. When the turbulence portion 200 is recessed away from the heat dissipation cavity, the turbulence portion 200 can be composed of a plurality of grooves 210. When part of the turbulence portion 200 protrudes towards the heat dissipation cavity, and another part of the turbulence portion 200 is recessed away from the heat dissipation cavity, the turbulence portion can simultaneously include a plurality of protrusions and a plurality of grooves 210.
[0061] Please continue to refer to Figure 5 and Figure 6 In one possible implementation, the turbulence portion 200 of the present embodiment includes a plurality of grooves 210 arranged at intervals, and the plurality of grooves 210 are arranged in a plurality of rows along the first direction X and a plurality of columns along the second direction Y.
[0062] Along the first direction X, a first heat dissipation rib 220 is formed between two adjacent grooves 210. Along the second direction Y, a second heat dissipation rib 230 is formed between two adjacent grooves 210. The intersection of the first heat dissipation rib 220 and the second heat dissipation rib 230 forms a heat dissipation island 240. In the direction perpendicular to the bottom wall 1100, the height of the heat dissipation island 240 is greater than the height of the first heat dissipation rib 220 and the height of the second heat dissipation rib 230.
[0063] It can be understood that the heat dissipation island 240 is the highest part in the turbulence portion 200, and the groove 210 is the lowest part in the turbulence portion 200, so that a sharp heat dissipation effect can be formed at the heat dissipation island 240, thereby improving the heat dissipation speed. The heat dissipation island 240 can also destroy the boundary layer effect of the cooling liquid at the bottom of the heat dissipation cavity, guide the cooling liquid at the bottom of the heat dissipation cavity to generate turbulence, and enhance the convective heat transfer capacity.
[0064] Optionally, please continue to refer to Figure 5 In the direction perpendicular to the bottom wall 1100, the heat dissipation island 240 of the embodiment is flush with the bottom wall 1100.
[0065] With the above scheme, only the grooves 210 arranged at intervals need to be machined on the bottom wall 1100, and the first heat dissipation ribs 220, the second heat dissipation ribs 230 and the heat dissipation islands 240 are naturally formed when the grooves 210 are machined. The above scheme only needs to change the structure of the bottom wall 1100, without introducing new materials, so it is convenient to manufacture and has low cost.
[0066] In another possible implementation, the turbulence portion 200 of the embodiment can include a plurality of protrusions arranged at intervals, and the protrusions include at least one of the first heat dissipation ribs 220, the second heat dissipation ribs 230 or the heat dissipation islands 240. In the direction perpendicular to the bottom wall 1100, the heat dissipation islands 240 protrude into the heat dissipation cavity.
[0067] The above scheme can form the heat dissipation islands 240 by introducing new materials on the bottom wall 1100, or by other processing schemes without introducing new materials, so as to achieve the effects of forming a sharp heat dissipation effect, enhancing the convective heat transfer capacity and the like.
[0068] Optionally, please continue to refer to Figure 6 In the embodiment, along the first direction X, the two adjacent rows of grooves 210 correspond one by one. In other possible implementations, along the first direction X, the two adjacent rows of grooves 210 can also be staggered.
[0069] In the embodiment, along the second direction Y, the two adjacent rows of grooves 210 correspond one by one. In other possible implementations, along the second direction Y, the two adjacent rows of grooves 210 can also be staggered.
[0070] It can be understood that the specific arrangement form of the grooves 210 can be selected based on the process manufacturing requirements and manufacturing costs, and no matter what the arrangement form is, the effects of accelerating the heat exchange capacity between the lower cooling liquid and the upper cooling liquid, enhancing the convective heat transfer capacity and the like can be achieved.
[0071] In a plane parallel to the bottom wall 1100, the projection of the groove 210 of the embodiment is circular, elliptical or polygonal, wherein the number of sides of the polygon is greater than or equal to 4, so as to form a heat dissipation island between adjacent grooves 210. Preferably, as shown in Figure 6 the projection of the groove 210 of the embodiment is circular, and the circular groove 210 is convenient for processing and manufacturing.
[0072] Please continue to refer to Figure 7 In a direction perpendicular to the bottom wall 1100, the distance D1 between the bottom end of the groove 210 and the top end of the heat dissipation island 240 of the embodiment is 0.5-1mm.
[0073] The distance D1 between the groove 210 and the heat dissipation island 240 of the embodiment is set in the above range in combination with the existing manufacturing process and cost, which can increase the convective heat transfer area between the lower cooling liquid and the upper cooling liquid, make the lower cooling liquid become a turbulent state, and improve the heat dissipation capacity.
[0074] Please continue to refer to Figure 6 In the embodiment, the diameter φ of the groove 210 is 2-5mm, for example, the diameter φ of the groove 210 is 3mm.
[0075] The diameter φ of the groove 210 of the embodiment is set in the above range in combination with the existing manufacturing process and cost, which can make the heat dissipation assembly have better heat dissipation effect.
[0076] Further, in the embodiment, the distance D2 between the centers of two adjacent grooves 210 is 2-5mm, for example, the distance D2 between the centers of two adjacent grooves 210 is 3mm.
[0077] The distance D2 between the two adjacent grooves 210 of the embodiment is set in the above range (such as the same range as the diameter of the groove 210) in combination with the existing manufacturing process and cost, which can ensure the formation of the heat dissipation island 240 between the four adjacent grooves 210, thereby forming a sharp heat dissipation effect and improving the heat dissipation speed.
[0078] Please continue to refer to Figure 4 The heat dissipation cavity of the embodiment includes the first heat dissipation area 110, the second heat dissipation area 120 and the third heat dissipation area 130 which are connected in communication, and the second heat dissipation area 120 is located between the first heat dissipation area 110 and the third heat dissipation area 130. Among them, the first heat dissipation area 110 and the third heat dissipation area 130 can correspond to the heat generating devices with small heat generation in the electronic equipment, and the second heat dissipation area 120 can correspond to the heat generating devices with large heat generation in the electronic equipment, and the second heat dissipation area 120 is the main heat dissipation area of the heat dissipation assembly.
[0079] The heat dissipation assembly further comprises a first pipe 300 and a second pipe 400, the first pipe 300 is communicated with the first heat dissipation area 110, and the second pipe 400 is communicated with the third heat dissipation area 130. In the case of the overall symmetry of the heat dissipation assembly, the functions of the first pipe 300 and the second pipe 400 can be interchanged, that is, the first pipe 300 can be the liquid inlet pipe of the cooling liquid, or can be the liquid outlet pipe of the cooling liquid; the second pipe 400 can be the liquid outlet pipe of the cooling liquid, or can be the liquid inlet pipe of the cooling liquid.
[0080] In other possible embodiments, the heat dissipation assembly can also be provided as an asymmetric structure, and the specific structure of the heat dissipation assembly can be set according to the arrangement structure of the heat generating devices in the electronic device. At this time, the first pipe 300 can be the liquid inlet pipe of the cooling liquid, and the second pipe 400 can be the liquid outlet pipe of the cooling liquid.
[0081] The heat dissipation assembly further comprises a plurality of heat dissipation fins 500, which are arranged in at least one of the first heat dissipation area 110, the second heat dissipation area 120 and the third heat dissipation area 130. Figure 4 As shown, when the heat dissipation fins 500 are arranged in the first heat dissipation area 110 and the third heat dissipation area 130, the heat dissipation fins 500 can guide the cooling liquid entering or flowing out of the heat dissipation cavity. When the heat dissipation fins 500 are arranged in the second heat dissipation area 120, the heat dissipation fins 500 can be arranged close to the side wall of the second heat dissipation area 120, and the shape of the heat dissipation fins 500 is matched with the shape of the side wall of the second heat dissipation area 120. The heat dissipation fins 500 can guide the cooling liquid in the second heat dissipation area 120, so as to avoid the formation of a backflow area in the second heat dissipation area 120, thereby improving the heat exchange capacity.
[0082] The heat dissipation assembly further comprises a plurality of heat dissipation columns 600, which are arranged in the second heat dissipation area 120 at intervals. By arranging the plurality of heat dissipation columns 600, the flow state of the cooling liquid in the second heat dissipation area 120 can be changed, so that the turbulent flow of the cooling liquid in the second heat dissipation area 120 is changed into turbulent flow, thereby improving the heat exchange capacity.
[0083] Further, the heat dissipation assembly of the embodiment further comprises a plurality of wall convexes 700, which are arranged on the side wall of at least one of the first heat dissipation area 110, the second heat dissipation area 120 and the third heat dissipation area 130 at intervals. Figure 4 As shown, when the wall convexes 700 are arranged on the side wall of the second heat dissipation area 120, the flow state of the cooling liquid close to the side wall of the second heat dissipation area 120 can be changed, the wall flow rate is reduced, the turbulent flow capacity is enhanced, and the heat dissipation performance is strengthened. When the wall convexes 700 are arranged on the side wall of the first heat dissipation area 110 or the third heat dissipation area 130, the wall convexes 700 can disperse the cooling liquid entering the second heat dissipation area 120 in advance, so as to reduce the potential energy.
[0084] In the embodiment, the projection of the spoiler 200 can coincide with the projection of the second heat dissipation area 120 in the plane parallel to the bottom wall 1100 (i.e. the plane composed of the first direction X and the second direction Y). It can be understood that coinciding the projection of the spoiler 200 with the projection of the second heat dissipation area 120 can improve the heat dissipation capacity of the main heat dissipation area in the heat dissipation assembly.
[0085] In other possible embodiments, the projection of the spoiler 200 can be smaller than the projection of the second heat dissipation area 120, and the projection of the heat-generating device with a large heat generation in the electronic device is located in the projection range of the spoiler 200. It can be understood that covering the heat-generating device with a large heat generation in the electronic device with the spoiler 200 can reduce part of the manufacturing cost, and can improve the heat dissipation capacity of the key area.
[0086] In one possible embodiment, the shell 100 includes a base 101 and an end cover 102, the heat dissipation cavity is formed in the base 101, and the end cover 102 is arranged on the base 101 to seal the heat dissipation cavity. For example, the end cover 102 can be connected to the base 101 in an integrated manner by welding, so as to ensure good sealing performance.
[0087] In the embodiment, the spoiler 200, the heat dissipation fins 500, the heat dissipation columns 600 and the wall convex 700 are formed in an integrated manner with the base 101. For example, the spoiler 200, the heat dissipation fins 500, the heat dissipation columns 600 and the wall convex 700 can be integrally formed with the base 101 by die casting, so as to facilitate improving the production efficiency.
[0088] The heat dissipation assembly of the embodiment can make the originally flat bottom wall 1100 at least partially present a concave-convex structure by arranging the spoiler 200. When the cooling liquid at the bottom of the heat dissipation cavity flows to the spoiler 200, the cooling liquid is affected by the spoiler 200 and flows upward or downward, so that the cooling liquid changes from a laminar flow state to a turbulent flow state, thereby accelerating the heat exchange capacity between the lower cooling liquid and the upper cooling liquid, and facilitating improving the heat dissipation effect of the heat dissipation assembly. According to Table 1 obtained by the inventors through simulation and actual measurement experiments, compared with the heat dissipation assembly without the spoiler 200, the temperature of the heat-generating device in the electronic device can be reduced by about 4-5℃ by the embodiment, thereby obviously improving the heat dissipation effect of the heat dissipation assembly.
[0089] Table 1 Comparison of heat dissipation effects of different heat dissipation assemblies
[0090] Heat sink assembly housing temperature (°C) Heat generating device temperature (°C) Heat sink assembly of the present embodiment 100.10 103.99 Heat sink assembly without turbulence portion 104.59 108.55
[0091] The embodiment also provides a domain controller including the heat dissipation assembly.
[0092] It can be understood that the domain controller of the embodiment can improve the heat dissipation capability of the domain controller, so that the domain controller can keep a good working state.
[0093] The embodiment also provides a movable platform comprising the domain controller.
[0094] Specifically, the movable platform of the embodiment can be a vehicle, a drone, a robot or the like. Since the domain controller is used, the heat dissipation capability of the movable platform can be improved, so that the movable platform can keep a good working state.
[0095] In the description of the present application, it should be understood that the orientation or positional relationship indicated by the terms "center", "longitudinal", "lateral", "length", "width", "thickness", "upper", "lower", "front", "back", "left", "right", "vertical", "horizontal", "top", "bottom", "inner", "outer", "clockwise", "counterclockwise", "axial", "radial", "circumferential" and the like is based on the orientation or positional relationship shown in the drawings, and is only for the convenience of describing the present application and simplifying the description, and does not indicate or imply that the device or element referred to must have a particular orientation, be constructed and operated in a particular orientation, and therefore cannot be understood as a limitation of the present application.
[0096] In the present application, unless otherwise explicitly specified and limited, the terms "mounting", "connection", "connection", "fixing" and the like should be understood in a broad sense, for example, can be fixed connection, can also be detachable connection, or integral; can be directly connected, or indirectly connected through an intermediate medium; can be the internal connection of two elements or the interaction relationship between two elements. For those skilled in the art, the specific meaning of the above terms in the present application can be understood according to the specific circumstances.
[0097] It should be noted that in the description of the present application, the terms "first", "second" are only used for the convenience of describing different parts, and cannot be understood as indicating or implying the sequence relationship, relative importance or implicitly indicating the number of the technical features indicated. Therefore, the features with "first", "second" can explicitly or implicitly include at least one of the features.
[0098] The embodiments or implementation manners in the present application are described in a progressive manner, and each embodiment focuses on the difference from other embodiments. The same or similar parts between the embodiments can be referred to each other.
[0099] In the description of the present application, the description of the terms "one embodiment", "some embodiments", "exemplary embodiment", "example", "specific example", or "some examples" etc. means that the specific features, structures, materials or characteristics described in connection with the embodiment or example are contained in at least one embodiment or example of the present application. In the present application, the exemplary description of the above terms does not necessarily refer to the same embodiment or example. Moreover, the specific features, structures, materials or characteristics described can be combined in any appropriate manner in one or more embodiments or examples.
[0100] Finally, it should be noted that: the above embodiments are only used to illustrate the technical solutions of the present application, and not to limit them; although the present application has been described in detail with reference to the foregoing embodiments, those skilled in the art should understand: it can still modify the technical solutions recorded in the foregoing embodiments, or make equivalent replacement for part or all of the technical features; and these modifications or replacements do not make the essence of the corresponding technical solutions deviate from the scope of the technical solutions of the embodiments of the present application.
Claims
1. A heat dissipation assembly for dissipating heat from heat-generating components of electronic devices, characterized in that, The heat dissipation assembly comprises: a housing, a heat dissipation cavity is formed in the housing, the heat dissipation cavity comprises a bottom wall, and the heat generating device is arranged to abut against the bottom wall; a spoiler is formed on the side of the bottom wall facing into the heat dissipation cavity; in the direction perpendicular to the bottom wall, the spoiler is convex towards the heat dissipation cavity, or the spoiler is concave away from the heat dissipation cavity, or part of the spoiler is convex towards the heat dissipation cavity and the other part of the spoiler is concave away from the heat dissipation cavity.
2. The heat dissipation assembly of claim 1, wherein, The spoiler comprises a plurality of protrusions and / or a plurality of grooves.
3. The heat dissipation assembly of claim 2, wherein, The spoiler comprises a plurality of grooves arranged at intervals, and the plurality of grooves are arranged in a plurality of rows in a first direction and a plurality of columns in a second direction. In the first direction, a first heat dissipation rib is formed between two adjacent grooves, and in the second direction, a second heat dissipation rib is formed between two adjacent grooves; the intersection of the first heat dissipation rib and the second heat dissipation rib forms a heat dissipation island, and the height of the heat dissipation island is greater than the height of the first heat dissipation rib and the height of the second heat dissipation rib in the direction perpendicular to the bottom wall. The first direction and the second direction are perpendicular to each other.
4. The heat dissipation assembly of claim 3, wherein, In the direction perpendicular to the bottom wall, the heat dissipation island is flush with the bottom wall. Alternatively, the spoiler further comprises a plurality of protrusions arranged at intervals, the protrusions comprise at least one of the first heat dissipation rib, the second heat dissipation rib or the heat dissipation island, and the heat dissipation island is convex towards the heat dissipation cavity in the direction perpendicular to the bottom wall.
5. The heat dissipation assembly of claim 3, wherein, In the first direction, each of the two columns of grooves corresponds to one of the two adjacent grooves, or the two columns of grooves are staggered. And / or, in the second direction, each of the two rows of grooves corresponds to one of the two adjacent grooves, or the two rows of grooves are staggered.
6. The heat dissipating assembly of claim 3, wherein, In the plane parallel to the bottom wall, the projection of the groove is circular, elliptical or polygonal, wherein the number of sides of the polygon is greater than or equal to 4.
7. The heat dissipating assembly of claim 3, wherein, In the direction perpendicular to the bottom wall, the distance between the bottom end of the groove and the top end of the heat dissipation island is 0.5-1mm.
8. The heat dissipating assembly of claim 3, wherein, The diameter of the groove is 2-5mm.
9. The heat dissipating assembly of claim 8, wherein, The distance between the centers of two adjacent grooves is 2-5mm.
10. The heat dissipating assembly of any one of claims 1-9, wherein, The heat dissipation cavity comprises a first heat dissipation area, a second heat dissipation area and a third heat dissipation area connected in series, and the second heat dissipation area is located between the first heat dissipation area and the third heat dissipation area. The heat dissipation assembly further comprises a first pipe and a second pipe, the first pipe communicates with the first heat dissipation area, and the second pipe communicates with the third heat dissipation area. The heat dissipation assembly further comprises a plurality of heat dissipation fins and / or a plurality of heat dissipation columns, the heat dissipation fins are arranged in at least one of the first heat dissipation area, the third heat dissipation area and the second heat dissipation area, and the plurality of heat dissipation columns are arranged at intervals in the second heat dissipation area.
11. The heat dissipating assembly of claim 10, wherein, The heat dissipation assembly further comprises a plurality of wall convexes, and the plurality of wall convexes are arranged at intervals on the side wall of at least one of the first heat dissipation area, the second heat dissipation area and the third heat dissipation area.
12. The heat dissipating assembly of claim 11, wherein, In the plane parallel to the bottom wall, the projection of the spoiler coincides with the projection of the second heat dissipation area. Alternatively, a projection of the spoiler is smaller than a projection of the second heat dissipation region, and a projection of the heat generating device is located within a projection range of the spoiler.
13. The heat dissipating assembly of claim 11, wherein, The housing comprises a base and an end cover, the heat dissipation cavity is formed in the base, and the end cover is arranged on the base to seal the heat dissipation cavity. The spoiler, the heat dissipation fins, the heat dissipation columns and the wall convex are integrated with the base.
14. A domain controller, comprising: A heat dissipation assembly comprising any one of claims 1-13.
15. A movable platform, characterized by A domain controller comprising claim 14.