Circuit cover plate and data processing device for solder paste detection

Abstract

The utility model belongs to the technical field of solder paste detection, and particularly relates to a circuit cover plate and a data processing device for solder paste detection. The circuit cover plate comprises a supporting layer, a protection inner layer, a heat conductor and at least one heat dissipation hole. The protective inner layer is connected to the surface of one side of the supporting layer; a mounting groove is formed in the surface of one side, far away from the supporting layer, of the protective inner layer; the heat dissipation holes sequentially penetrate through the protective inner layer and the supporting layer in the thickness direction; the heat conductor is arranged in the mounting groove; and one side end of the heat conductor is connected and communicated with the drift diameter direction of the heat dissipation holes. The heat conduction and heat dissipation performance of the circuit cover plate can be improved; and the movement stability and safety of heat production components such as the circuit board are ensured.

Description

Technical Field

[0001] This utility model belongs to the field of solder paste testing technology, and in particular relates to a circuit masking plate and a data processing device for solder paste testing. Background Technology

[0002] Solder paste is an essential soldering material in the electronics manufacturing industry, used to fix electronic components onto circuit boards. Since soldering quality significantly impacts the performance and reliability of electronic products, solder paste quality is paramount. Therefore, solder paste inspection equipment is needed to inspect the solder paste printing accuracy and quality during the PCBA (Printed Circuit Board Assembly) production process. The solder paste inspection equipment (SPI) includes sensors, an image processing system, a motion control system, a data storage and analysis system, auxiliary systems, and a motion module. The image processing system, motion control system, and data storage and analysis system are all housed on a control circuit board, which is located within a control box. The control box includes a main housing and a circuit cover plate; the control circuit board is positioned inside the circuit cover plate.

[0003] However, most existing circuit cover plates provide poor heat dissipation protection for the inner circuit board, affecting its normal use and shortening its service life to some extent. Utility Model Content

[0004] The purpose of this utility model is to provide a circuit cover plate that addresses the shortcomings of existing technologies and solves the technical problem of poor heat dissipation and protection performance in existing technologies.

[0005] To achieve the above objectives, the present invention adopts the following technical solution:

[0006] A circuit cover plate includes a support layer, a protective inner layer, a heat conductor, and at least one heat dissipation hole; the protective inner layer is connected to one side surface of the support layer; the protective inner layer has a mounting groove on its side surface away from the support layer; the heat dissipation hole is arranged sequentially through the thickness direction of the protective inner layer and the support layer; the heat conductor is disposed inside the mounting groove; and one end of the heat conductor is connected and communicates with the through-hole in the direction of the heat dissipation hole.

[0007] Preferably, the heat conductor includes a heat-conducting groove and a heat-conducting bump; the heat-conducting bump is connected to the interior of the mounting groove; the heat-conducting groove is disposed on the side surface of the protective inner layer away from the support layer; and one end of the heat-conducting groove communicates with the heat dissipation hole; the other end of the heat-conducting groove is connected to one end of the heat-conducting bump.

[0008] Preferably, the thickness of the heat-conducting bump is less than or equal to the depth of the mounting groove.

[0009] Preferably, the inner bottom of the heat-conducting groove is provided with a heat-conducting slope; the thickness of the heat-conducting slope near the heat-conducting protrusion is greater than the thickness of the heat-conducting slope near the heat dissipation hole.

[0010] Preferably, the surface of the heat-conducting protrusion away from the mounting groove is provided with a heat-conducting arc surface; the thickness of the heat-conducting arc surface at the position away from the heat-conducting groove is greater than the thickness of the heat-conducting arc surface at the position close to the heat-conducting groove.

[0011] Preferably, the number of heat dissipation holes is at least two; and at least one connecting groove is provided between two adjacent heat dissipation holes.

[0012] Preferably, the protective inner layer includes a shock-absorbing layer, a heat-insulating layer, and a heat-conducting layer that are stacked sequentially; the shock-absorbing layer is connected to the support layer; and the mounting groove is disposed on the surface of the heat-conducting layer away from the heat-insulating layer.

[0013] Preferably, the damping layer is a sponge, latex, or polyurethane elastomer;

[0014] And / or, the insulation layer is polystyrene board or rock wool;

[0015] And / or, the thermally conductive layer is a thermally conductive adhesive or a thermally conductive pad.

[0016] Preferably, the support layer is a metal support material.

[0017] This utility model also discloses a data processing device for solder paste detection, including the circuit cover plate mentioned above.

[0018] The beneficial effects of this utility model are that, by using a heat conductor on one side, the heat generated by the heat-generating components such as the circuit board installed on the inner side can be diverted to the heat dissipation holes, and then discharged to the outside through the heat dissipation holes from the thickness direction of the protective inner layer and the support layer, thereby improving the heat conduction and heat dissipation performance of the circuit cover plate; ensuring the stability and safety of the movement of heat-generating components such as the circuit board; and through the protective performance of the inner layer, ensuring the stability and safety of the overall structure, thereby ensuring the orderly conduction and heat dissipation, and further improving the heat conduction and heat dissipation performance of the circuit cover plate. Attached Figure Description

[0019] The following will refer to the appendix. Figures 1-3 This section describes the features, advantages, and technical effects of exemplary embodiments of the present invention.

[0020] Figure 1 This is a schematic diagram of the structure of a circuit cover plate according to an embodiment of the present invention;

[0021] Figure 2This is a cross-sectional view of section AA of a circuit cover plate according to an embodiment of the present invention;

[0022] Figure 3 This is a cross-sectional view of the BB section of a circuit cover plate according to an embodiment of the present invention.

[0023] In the diagram: 1-Support layer; 11-Mounting hole; 2-Protective inner layer; 201-Mounting groove; 21-Shock-damping layer; 22-Insulation layer; 23-Heat-conducting layer; 3-Heat dissipation hole; 301-Connecting groove; 4-Heat conductor; 41-Heat-conducting groove; 411-Heat-conducting inclined surface; 42-Heat-conducting protrusion; 421-Heat-conducting arc surface. Detailed Implementation

[0024] Unless otherwise defined, all technical and scientific terms used herein have the same meaning as commonly understood by one of ordinary skill in the art to which this application pertains; the terminology used herein is for the purpose of describing particular embodiments only and is not intended to limit the application; the terms “comprising” and “having”, and any variations thereof, in the specification, claims, and foregoing description of the drawings are intended to cover non-exclusive inclusion.

[0025] In the description of the embodiments of this application, technical terms such as "first" and "second" are used only to distinguish different objects and should not be construed as indicating or implying relative importance or implicitly specifying the number, specific order, or primary and secondary relationship of the indicated technical features. In the description of the embodiments of this application, "multiple" means two or more, unless otherwise explicitly defined.

[0026] In this document, the term "embodiment" means that a particular feature, structure, or characteristic described in connection with an embodiment may be included in at least one embodiment of this application. The appearance of this phrase in various places throughout the specification does not necessarily refer to the same embodiment, nor is it a separate or alternative embodiment mutually exclusive with other embodiments. It will be explicitly and implicitly understood by those skilled in the art that the embodiments described herein can be combined with other embodiments.

[0027] In the description of the embodiments in this application, the term "and / or" is merely a description of the relationship between related objects, indicating that three relationships can exist. For example, A and / or B can represent: A existing alone, A and B existing simultaneously, or multiple situations existing alone. In addition, the character " / " in this document generally indicates that the related objects before and after are in an "or" relationship.

[0028] In the description of the embodiments of this application, unless otherwise expressly specified and limited, technical terms such as "installation," "connection," "joining," and "fixing" should be interpreted broadly. For example, they can refer to a fixed connection, a detachable connection, or an integral part; they can refer to a mechanical connection or an electrical connection; they can refer to a direct connection or an indirect connection through an intermediate medium; they can refer to the internal communication of two components or the interaction between two components. For those skilled in the art, the specific meaning of the above terms in the embodiments of this application can be understood according to the specific circumstances.

[0029] The following is in conjunction with the appendix Figures 1-3 The present invention will be described in further detail, but this is not intended to limit the scope of the present invention.

[0030] like Figure 1 As shown, in one embodiment of this utility model, the circuit cover plate includes a support layer 1, a protective inner layer 2, a heat conductor 4, and at least one heat dissipation hole 3; the protective inner layer 2 is connected to one side surface of the support layer 1; a mounting groove 201 is provided on the side surface of the protective inner layer 2 away from the support layer 1; the heat dissipation hole 3 is arranged sequentially through the thickness direction of the protective inner layer 2 and the thickness direction of the support layer 1; the heat conductor 4 is disposed inside the mounting groove 201; and one end of the heat conductor 4 is connected and communicated with the through-hole 3 in the through-hole direction.

[0031] The technical solution of this utility model uses a heat conductor arranged on the inner side to conduct heat from heat-generating components such as circuit boards installed on the inner side, so that the heat is transported to the heat dissipation holes; then, through the heat dissipation holes, it is discharged to the outside from the thickness direction of the protective inner layer and the support layer, thereby improving the heat conduction and heat dissipation performance of the circuit cover plate; ensuring the stability and safety of the movement of heat-generating components such as circuit boards; and through the protective performance of the inner layer, ensuring the stability and safety of the overall structure, thereby ensuring the orderly conduction and heat dissipation, and further improving the heat conduction and heat dissipation performance of the circuit cover plate.

[0032] Specifically, in some implementations, such as Figure 1 and 2 As shown, the heat conductor 4 includes a heat-conducting groove 41 and a heat-conducting bump 42; the heat-conducting bump 42 is connected to the interior of the mounting groove 201; the heat-conducting groove 41 is disposed on the surface of the protective inner layer 2 away from the support layer 1; and one end of the heat-conducting groove 41 communicates with the heat dissipation hole 3; the other end of the heat-conducting groove 41 is connected to one end of the heat-conducting bump 42. Wherein, as... Figure 2As shown, the thermally conductive bump 42 protrudes from the inner bottom of the mounting groove 201 toward the opening of the mounting groove 201. That is, the generated heat is guided to the thermally conductive groove 41 by the thermally conductive bump 42; then, it flows out through the internal flow of the thermally conductive groove 41 and the heat dissipation hole 3, achieving directional and orderly heat dissipation and avoiding excessive heat backflow, thereby improving heat dissipation efficiency. Furthermore, the thickness of the thermally conductive bump 42 is less than or equal to the depth of the mounting groove 201 to avoid excessive protrusion that could cause damage to the circuit board or other structures, and to ensure heat dissipation efficiency.

[0033] Specifically, in some implementations, such as Figure 2 As shown, the inner bottom of the heat-conducting groove 41 is provided with a heat-conducting slope 411; the thickness of the heat-conducting slope 411 near the heat-conducting protrusion 42 is greater than the thickness of the heat-conducting slope 411 near the heat dissipation hole. That is, the heat-conducting slope 411 in the heat-conducting groove 41 has a structure that slopes downward from the heat-conducting protrusion 42 toward the heat dissipation hole 3, which helps to improve the speed of heat conduction and heat dissipation and ensure heat dissipation efficiency.

[0034] Specifically, in some implementations, such as Figure 2 As shown, the surface of the heat-conducting protrusion 42 away from the mounting groove 201 is provided with a heat-conducting arc surface 421; the thickness of the heat-conducting arc surface 421 at the position away from the heat-conducting groove 41 is greater than the thickness of the heat-conducting arc surface 421 at the position close to the heat-conducting groove 41. In other words, this structure, through the guiding method of the central protrusion and the relatively concave sides, can ensure the orderly conduction and dissipation of heat, thereby improving the heat conduction and dissipation performance of the circuit cover plate.

[0035] Specifically, in some implementations, such as Figure 1 and 3 As shown, there are at least two heat dissipation holes 3; and at least one connecting groove 301 is provided between two adjacent heat dissipation holes 3. This structure connects all the heat dissipation holes 3 to each other through the connecting groove 301 to form a heat dissipation grid structure, thereby improving the heat flow and dissipation speed and avoiding excessive heat accumulation in some heat dissipation holes 3; thus ensuring the orderly conduction and dissipation of heat.

[0036] Specifically, in some implementations, such as Figure 1 and 3As shown, the inner protective layer 2 includes a shock-absorbing layer 21, a heat insulation layer 22, and a heat-conducting layer 23 that are stacked in sequence; the shock-absorbing layer 21 is connected to the support layer 1; and the heat dissipation holes 3 are disposed through the support layer 1, the shock-absorbing layer 21, the heat insulation layer 22, and the heat-conducting layer 23 in sequence; the mounting groove 201 is disposed on the side surface of the heat-conducting layer 23 away from the heat insulation layer 22 (that is, the heat-conducting groove 41 and the heat-conducting protrusion 42 in the heat conductor 4 are disposed on the side surface of the heat-conducting layer 23 away from the heat insulation layer 22). This structure reduces stress caused by external impacts on the cover plate through the outermost shock-absorbing layer 21, thereby improving the protection of the inner circuit board. The middle heat insulation layer 22 blocks external heat, preventing heat conduction into the interior and further enhancing protection of the inner circuit board (even if heat flows in through the heat dissipation holes, it is only localized and partial, not rapidly or extensively affecting the circuit board; and the heat-conducting bumps 42 push the heat entering from the outside back outwards). The innermost heat-conducting layer 23 absorbs and guides the heat generated by the circuit board, and the gap between the heat-conducting bumps 42 and the inner wall of the mounting groove 201 allows the heat to flow rapidly, thus improving heat dissipation speed. In some embodiments, the shock-absorbing layer 21 is made of sponge, latex, or polyurethane elastomer; the heat insulation layer 22 is made of polystyrene board or rock wool; and the heat-conducting layer 23 is made of thermally conductive adhesive or a thermally conductive pad. The support layer 1 is a metal support material, specifically aluminum sheet or stainless steel.

[0037] This utility model also proposes a data processing device for solder paste detection. The data processing device for solder paste detection includes a circuit cover plate. The specific structure of the circuit cover plate is as described in the above embodiments. Since this data processing device for solder paste detection adopts all the technical solutions of all the above embodiments, it has at least all the beneficial effects brought about by the technical solutions of the above embodiments, which will not be described in detail here.

[0038] The solder paste inspection equipment (SPI) includes sensors, an image processing system, a motion control system, a data storage and analysis system, auxiliary systems, and a motion module. The image processing system, motion control system, and data storage and analysis system are all housed on a control circuit board, which is located within a control box. The control box includes a main housing and a circuit cover plate; the control circuit board is positioned inside the circuit cover plate. Further, the auxiliary systems include a lighting system and a cooling system. Sensors are used to acquire data such as the height, volume, and area of ​​the solder paste. Common sensor types include laser sensors and optical sensors. The motion control system and motion module are responsible for controlling the movement and positioning of the equipment, ensuring that the sensors can accurately scan each inspection point. This typically involves sophisticated mechanical structures and high-precision servo motors. The image processing system processes the data acquired by the sensors, analyzing and judging the solder paste printing quality through complex algorithms. The data storage and analysis system stores the inspection data and provides data analysis functions to help users understand the quality of the solder paste printing.

[0039] Furthermore, it should be understood that although this specification describes embodiments, not every embodiment contains only one independent technical solution. This narrative style of the specification is merely for clarity. Those skilled in the art should regard the specification as a whole, and the technical solutions in each embodiment can also be appropriately combined to form other embodiments that can be understood by those skilled in the art.

[0040] Based on the disclosure and teachings of the above specification, those skilled in the art can make changes and modifications to the above embodiments. Therefore, this utility model is not limited to the specific embodiments described above, and any obvious improvements, substitutions, or modifications made by those skilled in the art based on this utility model are within the protection scope of this utility model. Furthermore, although some specific terms are used in this specification, these terms are only for convenience of explanation and do not constitute any limitation on this utility model.

Claims

1. A circuit cover plate, characterized by: The application relates to a circuit covering plate, which comprises a supporting layer, a protective inner layer, a heat conductor and at least one heat dissipation hole; the protective inner layer is connected to one side surface of the supporting layer; an installation groove is arranged on the side surface of the protective inner layer away from the supporting layer; the heat dissipation hole is arranged in the thickness direction of the protective inner layer and the supporting layer in sequence; the heat conductor is arranged in the installation groove; and one side end of the heat conductor is connected to the through direction of the heat dissipation hole.

2. The circuit covering plate according to claim 1, characterized in that: The heat conductor comprises a heat conduction groove and a heat conduction block; the heat conduction block is connected to the inside of the installation groove; the heat conduction groove is arranged on the side surface of the protective inner layer away from the supporting layer; and one side end of the heat conduction groove is connected to the heat dissipation hole; the other side end of the heat conduction groove is connected to one side end of the heat conduction block. The thickness of the heat conduction block is less than or equal to the depth of the installation groove.

3. The circuit covering plate according to claim 2, characterized in that: The inner bottom of the heat conduction groove is provided with a heat conduction inclined surface; the thickness corresponding to the position of the heat conduction inclined surface close to the heat conduction block is greater than the thickness corresponding to the position of the heat conduction inclined surface close to the heat dissipation hole.

4. The circuit cover plate of claim 2, wherein: The side surface of the heat conduction block away from the installation groove is provided with a heat conduction arc surface; the thickness corresponding to the position of the heat conduction arc surface away from the heat conduction groove is greater than the thickness corresponding to the position of the heat conduction arc surface close to the heat conduction groove.

5. A circuit cover according to claim 2 or 3, characterised in that: The number of the heat dissipation holes is at least two; and at least one connecting groove is arranged between two adjacent heat dissipation holes.

6. The circuit cover plate of claim 1, wherein: The protective inner layer comprises a shock absorption layer, a heat insulation layer and a heat conduction layer which are connected in sequence; the shock absorption layer is connected to the supporting layer; and the installation groove is arranged on the side surface of the heat conduction layer away from the heat insulation layer.

7. The circuit cover plate of claim 1, wherein: The shock absorption layer is sponge, latex or polyurethane elastomer; 8. The circuit cover plate of claim 7, wherein: The heat insulation layer is polystyrene board or rock wool; The heat conduction layer is heat conduction glue or heat conduction pad. The supporting layer is metal supporting material.

9. The circuit covering plate according to claim 1 or 7 or 8, characterized in that: The application further relates to a circuit covering plate comprising the circuit covering plate according to any one of claims 1 to 9.

10. A data processing device for detecting a solder paste, characterized by comprising: ​

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