Heat dissipation structure of stove

Abstract

The utility model discloses a stove heat dissipation structure, which belongs to the technical field of cooking stoves and comprises a bottom shell, a bottom shell air inlet and a circuit board are arranged on the bottom shell, a fan is arranged on the bottom shell air inlet, an air port coaming is arranged on the periphery of the bottom shell air inlet, a coaming opening is arranged on the air port coaming towards the direction of the circuit board, and heat dissipation fins and heating elements are arranged on the circuit board. And the radiating fins and the heating elements are arranged close to the opening of the coaming. The radiating fins and the heating elements of the structure can be infinitely close to the fan and the opening of the coaming, so that radiating air blown and guided by the fan can be directly and quickly blown to the radiating fins and the heating elements through the opening of the coaming, the air volume and air speed loss of the radiating air in the blowing and guiding process is reduced, and the radiating efficiency is improved. And meanwhile, simultaneous heat dissipation of the heat dissipation fins and the heating element can be realized, so that the heat dissipation speed of the heat dissipation fins and the heating element is accelerated, the stable use of the stove is ensured, and the service life is prolonged.

Description

TECHNICAL FIELD

[0001] The utility model relates to cooking stove technical field, concretely is a kind of stove heat dissipation structure. BACKGROUND

[0002] Chinese patent number CN201820951685.1 utility model patent discloses a kind of heat dissipation fin structure, circuit board heat dissipation device and household appliance, the heat dissipation fin includes substrate and fin group, the fin group is fixed on the end face of substrate, the heat dissipation fin structure further include airflow passage, the airflow passage penetrates the substrate, the circuit board heat dissipation device includes circuit board, fan assembly, several components and the heat dissipation fin structure described above.The above structure can be installed simultaneously on the electronic components of heat dissipation fin structure and the electronic components of heat dissipation fin structure rear side are effectively heat-dissipated, improve the service life of electronic components on circuit board.But since electronic components are located in the rear side of heat dissipation fin, so the heat dissipation wind guided by fan assembly can be shielded by heat dissipation fin, heat dissipation wind cannot directly and quickly heat-dissipate electronic components, while the distance of electronic components and fan assembly is far, heat dissipation wind also cannot well realize heat dissipation to electronic components, to affect the overall heat dissipation effect of household appliance.

[0003] Therefore, it is necessary to further improve. UTILITY MODEL CONTENT

[0004] The utility model aims at providing a kind of stove heat dissipation structure to overcome the deficiencies in prior art.

[0005] A kind of stove heat dissipation structure designed according to this purpose, including bottom shell, the bottom shell is provided with bottom shell air inlet and circuit board, the bottom shell air inlet is provided with fan, is provided with air port coaming peripherally, the air port coaming is provided with coaming opening towards the direction of the circuit board, the circuit board is provided with heat dissipation fin and heating element, the heat dissipation fin and the heating element are set in the position close to the coaming opening.

[0006] The heating element is at least difference film inductor, or common film inductor, or I-shaped inductor, and is provided with at least one.

[0007] The axis of the difference film inductor, or common film inductor, or I-shaped inductor is perpendicular to the surface of the circuit board, or parallel, or inclined.

[0008] The difference film inductor, or common film inductor, or I-shaped inductor is provided with two, two difference film inductors, or common film inductors, or I-shaped inductors are located on the both sides of the heat dissipation fin, or, two difference film inductors, or common film inductors, or I-shaped inductors are located on the same side of the heat dissipation fin.

[0009] The first air deflector and the second air deflector are linearly or arcuately extended towards the direction of the differential film inductor, the common film inductor or the I-shaped inductor and / or the heat dissipation fin.

[0010] The two differential film inductors, the common film inductors or the I-shaped inductors are respectively located on the two sides of the heat dissipation fin, the first air deflector is linearly extended towards one of the differential film inductors, the common film inductors or the I-shaped inductors and is connected with one side of the opening of the surrounding plate, and the second air deflector is arcuately extended towards the direction between the other differential film inductor, the common film inductor or the I-shaped inductor and the heat dissipation fin and is located in the other side of the opening of the surrounding plate, so that the second air deflector and the air outlet surrounding plate form an air deflection channel.

[0011] The air inlet of the bottom shell is circular, oval, polygonal or any combination of the above, and the fan is fixedly arranged on the air inlet of the bottom shell and is coaxially arranged with the air inlet of the bottom shell.

[0012] The air outlet surrounding plate is composed of an arc segment, and the center of the arc segment is the same as or different from the center of the air inlet of the bottom shell, or the air outlet surrounding plate is composed of multiple arc segments, and the centers of the multiple arc segments are the same or different.

[0013] The circuit board is provided with a capacitor, and the capacitor is located at the back side of the differential film inductor, the common film inductor or the I-shaped inductor or the back side of the heat dissipation fin.

[0014] The bottom shell is provided with an air outlet, the opening of the surrounding plate is arranged opposite to the air outlet of the bottom shell, and the circuit board is located between the opening of the surrounding plate and the air outlet of the bottom shell.

[0015] The heat dissipation fin and the heating element are arranged close to the opening of the surrounding plate, so that the heat dissipation fin and the heating element can be infinitely close to the fan and the opening of the surrounding plate, so that the heat dissipation wind blown by the fan can be directly and quickly blown to the heat dissipation fin and the heating element through the opening of the surrounding plate, not only reducing the loss of air volume and air speed of the heat dissipation wind in the blowing process, but also realizing the simultaneous heat dissipation of the heat dissipation fin and the heating element, thereby accelerating the heat dissipation speed of the heat dissipation fin and the heating element, so as to ensure the stable use of the stove and prolong the service life. BRIEF DESCRIPTION OF DRAWINGS

[0016] Fig. 1 It is an exploded structural schematic view of an embodiment of the utility model.

[0017] Fig. 2 It is another perspective exploded structural schematic view of an embodiment of the utility model.

[0018] Fig. 3This is a schematic diagram of the assembly structure of an embodiment of the present utility model.

[0019] Fig. 4 This is a schematic diagram of the assembly structure from another perspective of an embodiment of the present invention.

[0020] Fig. 5 This is a schematic diagram of another application example of a circuit board.

[0021] Fig. 6 This is a schematic diagram of another application example of a circuit board. Detailed Implementation

[0022] To make the above-mentioned objects, features, and advantages of this utility model more apparent and understandable, the specific embodiments of this utility model will be described in detail below with reference to the accompanying drawings. Many specific details are set forth in the following description to provide a full understanding of this utility model. However, this utility model can be implemented in many other ways different from those described herein, and those skilled in the art can make similar modifications without departing from the spirit of this utility model. Therefore, this utility model is not limited to the specific embodiments disclosed below.

[0023] The present invention will be further described below with reference to the accompanying drawings and embodiments.

[0024] See Figs. 1-6 The heat dissipation structure of this stove includes a bottom shell 1, on which a bottom shell air inlet 2 and a circuit board 3 are provided. A fan 4 is provided on the bottom shell air inlet 2, and an air vent enclosure 5 is provided around it. The air vent enclosure 5 has an opening 6 facing the circuit board 3. The circuit board 3 is provided with heat dissipation fins 7 and heating elements, which are located near the opening 6 of the enclosure.

[0025] In this embodiment, since the heat dissipation fins 7 and the heating element are positioned near the opening 6 of the enclosure, the heat dissipation fins 7 and the heating element can be infinitely close to the fan 4 and the opening 6 of the enclosure. This allows the cooling air blown by the fan 4 to be directly and quickly blown onto the heat dissipation fins 7 and the heating element through the opening 6 of the enclosure. This not only reduces the loss of air volume and air velocity during the blowing process, but also enables the heat dissipation fins 7 and the heating element to dissipate heat simultaneously, thereby accelerating the heat dissipation speed of the heat dissipation fins 7 and the heating element, ensuring stable use of the stove and extending its service life.

[0026] The heat-generating element is at least a differential film inductor 8, or a common film inductor, or an I-beam inductor, and at least one of them is provided. Since the differential film inductor 8, or the common film inductor, or the I-beam inductor is close to the fan 4 and the enclosure opening 6, heat dissipation of the differential film inductor 8, or the common film inductor, or the I-beam inductor can be effectively achieved.

[0027] The axis of the differential film inductor 8, or the common film inductor, or the I-type inductor is perpendicular to, parallel to, or inclined to the surface of the circuit board 3.

[0028] like Figs. 1-4 As shown, the axis of the differential film inductor 8, or the common film inductor, or the I-type inductor is perpendicular to the surface of the circuit board 3, that is, the differential film inductor 8, or the common film inductor, or the I-type inductor is horizontally fixed, as shown. Fig. 5 , Fig. 6 As shown, the axis of the differential film inductor 8, or the common film inductor, or the I-shaped inductor is parallel to the surface of the circuit board 3, that is, the differential film inductor 8, or the common film inductor, or the I-shaped inductor is fixed vertically. In addition, the axis of the differential film inductor 8, or the common film inductor, or the I-shaped inductor can also be tilted relative to the surface of the circuit board 3, that is, the differential film inductor 8, or the common film inductor, or the I-shaped inductor is fixed in a semi-horizontal and semi-vertical manner.

[0029] There are two differential film inductors 8, or common film inductors, or I-shaped inductors. The two differential film inductors 8, or common film inductors, or I-shaped inductors are located on both sides of the heat sink fin 7, or the two differential film inductors 8, or common film inductors, or I-shaped inductors are located on the same side of the heat sink fin 7.

[0030] In this embodiment, the two differential film inductors 8, or common film inductors, or I-shaped inductors can be fixed on both sides of the heat sink fins 7, or they can be fixed together on the same side of the heat sink fins 7.

[0031] The bottom shell 1 is also provided with a first air guide plate 9 and a second air guide plate 10. The first air guide plate 9 and the second air guide plate 10 extend linearly or arc-shapedly toward the differential film inductor 8, or common film inductor, or I-shaped inductor and / or heat dissipation fins 7, respectively.

[0032] In this embodiment, the first air guide plate 9 guides air in the direction of the differential film inductor 8, or the common film inductor, or the I-shaped inductor, and the second air guide plate 10 guides air in the direction of the heat dissipation fins 7, so that the cooling air blown by the fan 4 can effectively act on the differential film inductor 8, or the common film inductor, or the I-shaped inductor and the heat dissipation fins 7, thereby effectively dissipating heat from the differential film inductor 8, or the common film inductor, or the I-shaped inductor and the heat dissipation fins 7.

[0033] Specifically, two differential film inductors 8, or common film inductors, or I-shaped inductors are located on both sides of the heat sink fins 7. The first air guide plate 9 extends linearly toward one of the differential film inductors 8, or common film inductors, or I-shaped inductors and is connected to one side of the enclosure opening 6. The second air guide plate 10 extends arc-shaped toward the other differential film inductor 8, or common film inductor, or I-shaped inductor and the heat sink fins 7 and is located inside the other side of the enclosure opening 6. An air guide channel 11 is formed between the second air guide plate 10 and the air outlet enclosure 5.

[0034] When the fan 4 is working, part of the heat dissipation air it generates is blown out through the opening 6 of the enclosure plate and acts on the heat dissipation fins 7, and acts on one of the differential film inductors 8, or common film inductors, or I-shaped inductors through the first air guide plate 9. The other part of the heat dissipation air is blown out through the air guide channel 11 and acts on another differential film inductor 8, or common film inductor, or I-shaped inductor.

[0035] The bottom shell air inlet 2 is circular, elliptical, polygonal, or any combination of the above shapes. The fan 4 is fixedly installed on the bottom shell air inlet 2 and is coaxial with the bottom shell air inlet 2.

[0036] The air vent enclosure 5 is composed of an arc-shaped segment, and its arc center may be the same as or different from the center of the bottom shell air inlet 2. Alternatively, the air vent enclosure 5 is composed of multiple arc-shaped segments, which are connected end to end or spaced apart, and the centers of the multiple arc-shaped segments may be the same or different.

[0037] In this embodiment, the bottom shell air inlet 2 is circular, and the air vent enclosure 5 is composed of multiple arc-shaped segments. These multiple arc-shaped segments are connected end to end or spaced apart. The centers of the multiple arc-shaped segments are different, and the center of one of the arc-shaped segments is the same as the center of the air vent enclosure 5, so that the fan 4, the shell air inlet 2, and the air vent enclosure 5 form an eccentric volute-like fit, which is conducive to the blowing of heat dissipation air.

[0038] A capacitor 12 is provided on the circuit board 3. The capacitor 12 is located behind the differential film inductor 8, or the common film inductor, or the I-type inductor, or the heat sink fin 7.

[0039] In this embodiment, capacitor 12 is located behind differential film inductor 8, or common film inductor, or I-shaped inductor. After heat dissipation through differential film inductor 8, or common film inductor, or I-shaped inductor, the heat dissipation air can be blown to capacitor 12.

[0040] The bottom shell 1 is provided with a bottom shell air outlet 13, the enclosure opening 6 is arranged opposite to the bottom shell air outlet 13, and the circuit board 3 is located between the enclosure opening 6 and the bottom shell air outlet 13.

[0041] In this embodiment, since the opening 6 of the enclosure plate is opposite to the air outlet 13 of the bottom shell, the convection effect of the heat dissipation air can be improved and the flow speed of the heat dissipation air can be accelerated. Moreover, the circuit board 3 is located between the opening 6 of the enclosure plate and the air outlet 13 of the bottom shell. Therefore, the heat dissipation air is directly discharged after dissipating heat from the circuit board 3 without any obstruction problem, which further improves the heat dissipation effect of the stove.

[0042] The above describes the preferred embodiments of this utility model, illustrating and describing its basic principles, main features, and advantages. Those skilled in the art should understand that this utility model is not limited to the above embodiments. The embodiments and descriptions in the specification are merely illustrative of the principles of this utility model. Various changes and modifications can be made without departing from the spirit and scope of this utility model, and all such changes and modifications fall within the scope of protection of this utility model as defined by the appended claims and their equivalents.

Claims

1. A stove heat dissipation structure comprising a bottom shell (1), characterized in that: The bottom shell (1) is provided with a bottom shell air inlet (2) and a circuit board (3), the bottom shell air inlet (2) is provided with a fan (4), and a peripheral air inlet coaming (5) is provided, the air inlet coaming (5) is provided with a coaming opening (6) towards the circuit board (3), the circuit board (3) is provided with a heat dissipation fin (7) and a heating element, and the heat dissipation fin (7) and the heating element are arranged at a position close to the coaming opening (6).

2. The heat dissipating structure of a stove as claimed in claim 1, wherein: The heating element is at least a difference film inductor (8), or a common film inductor, or an I-shaped inductor, and is provided with at least one.

3. The heat sink structure of claim 2, wherein: The axis of the difference film inductor (8), or the common film inductor, or the I-shaped inductor is perpendicular, parallel or inclined to the surface of the circuit board (3).

4. The heat sink structure of claim 2, wherein: The difference film inductor (8), or the common film inductor, or the I-shaped inductor is provided with two, and the two difference film inductors (8), or the common film inductors, or the I-shaped inductors are respectively located on both sides of the heat dissipation fin (7), or the two difference film inductors (8), or the common film inductors, or the I-shaped inductors are located on the same side of the heat dissipation fin (7).

5. The heat sink structure of claim 4, wherein: The bottom shell (1) is further provided with a first air baffle (9) and a second air baffle (10), the first air baffle (9) and the second air baffle (10) respectively extend linearly or arcuately towards the direction of the difference film inductor (8), or the common film inductor, or the I-shaped inductor and / or the heat dissipation fin (7).

6. The heat sink structure of claim 5, wherein: The two difference film inductors (8), or the common film inductors, or the I-shaped inductors are respectively located on both sides of the heat dissipation fin (7), the first air baffle (9) linearly extends towards one of the difference film inductors (8), or the common film inductors, or the I-shaped inductors and is connected to one side of the coaming opening (6), and the second air baffle (10) arcuately extends between the other difference film inductor (8), or the common film inductor, or the I-shaped inductor and the heat dissipation fin (7) and is located in the other side of the coaming opening (6), and the second air baffle (10) and the air inlet coaming (5) form an air guide channel (11).

7. The heat sink structure of claim 6, wherein: The bottom shell air inlet (2) is circular, or oval, or polygonal, or any combination of the above shapes, the fan (4) is fixedly arranged on the bottom shell air inlet (2), and the fan (4) is coaxially arranged with the bottom shell air inlet (2).

8. The heat sink structure of claim 7, wherein: The air inlet coaming (5) is composed of an arc segment, and the arc center is the same as or different from the center of the bottom shell air inlet (2), or the air inlet coaming (5) is composed of multiple arc segments, and the multiple arc segments are connected or arranged at intervals, and the centers of the multiple arc segments are the same or different.

9. The heat sink structure of claim 2, wherein: The circuit board (3) is provided with a capacitor (12), and the capacitor (12) is located on the rear side of the difference film inductor (8), or the common film inductor, or the I-shaped inductor or the rear side of the heat dissipation fin (7).

10. The heat sink structure for a stove as defined in claim 1, wherein: The bottom shell (1) is provided with a bottom shell air outlet (13), the coaming opening (6) and the bottom shell air outlet (13) are oppositely arranged, and the circuit board (3) is located between the coaming opening (6) and the bottom shell air outlet (13).

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