Package structure
By electrically connecting the arrayed biochips to the substrate, combined with encapsulation and adhesive layer protection, the problems of low sequencing throughput and corrosion in gene sequencing chips are solved, achieving efficient electrical connection and chip protection.
Patent Information
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- Filing Date
- 2024-12-27
- Publication Date
- 2026-04-03
AI Technical Summary
Existing gene sequencing chips have low sequencing throughput, and the bonding wires and circuit boards are easily corroded by reagents, leading to chip failure.
The biochips are electrically connected to the substrate using an array, and the biochips and substrate are protected by an encapsulation. An adhesive layer and metal bumps are used for connection, and through-silicon via (TSV) technology is combined to achieve electrical connection and reduce the risk of corrosion.
It increases sequencing throughput, reduces the risk of chip failure, and protects the circuitry of the biochip and substrate.
Smart Images
Figure CN224077391U_ABST
Abstract
Description
Technical Field
[0001] This application relates to the field of biochemical reaction technology, and in particular to an encapsulation structure. Background Technology
[0002] Gene sequencing chips are typically fabricated by wire bonding, where individual chips are fixed to a circuit board. The wires are then protected with adhesive, and a cover plate is attached to the chip. This method results in low throughput, limiting sequencing accuracy and application scenarios. During chip fabrication, adhesive may overflow onto the chip surface, affecting its biochemical properties. During testing, the wires and circuit board are susceptible to corrosion by reagents, causing short circuits and chip failure. Utility Model Content
[0003] One objective of this application is to provide a packaging structure that can improve sequencing throughput and reduce the risk of chip failure.
[0004] One embodiment of this application provides a packaging structure including a substrate, multiple biochips and a package body. The multiple biochips are arranged in an array on the substrate and electrically connected to the substrate. The package body covers the multiple biochips and covers the surface of the substrate exposed outside the biochips.
[0005] According to some embodiments of this application, a functional area is provided on the front side of the biochip, and the functional area is exposed outside the package body.
[0006] According to some embodiments of this application, an electrode is provided on the front side of the biochip, a first contact pad is provided on the surface of the substrate, and the electrode is connected to the first contact pad through bonding leads.
[0007] According to some embodiments of this application, an electrode is provided on the front side of the biochip, a second contact pad is provided on the back side of the biochip, a through-silicon via is provided on the biochip to electrically connect the electrode and the second contact pad, a first contact pad is provided on the surface of the substrate, and the second contact pad is electrically connected to the first contact pad.
[0008] According to some embodiments of this application, the second contact pad is welded to the first contact pad.
[0009] According to some embodiments of this application, the surface of the second contact pad is provided with metal bumps, and the first contact pad is connected to the metal bumps on the second contact pad by cold pressing bonding.
[0010] According to some embodiments of this application, the height of the metal bump is greater than the hardness of the first contact pad.
[0011] According to some embodiments of this application, the packaging structure includes at least one electronic component, which is embedded in the package and electrically connected to the substrate. The at least one electronic component includes at least one of a serializer / deserializer, a central processing unit, and a memory.
[0012] According to some embodiments of this application, the encapsulation structure includes an adhesive layer, through which each biochip is bonded to a substrate.
[0013] According to some embodiments of this application, the adhesive layer is silver paste.
[0014] The encapsulation structure provided in this application integrates multiple biochips in an array distribution into one encapsulation structure, which can improve sequencing throughput, and the encapsulation can protect the biochips and substrate, reducing the risk of biochip failure caused by substrate corrosion by reagents. Attached Figure Description
[0015] The above and / or additional aspects and advantages of this application will become apparent and readily understood from the description of the embodiments taken in conjunction with the following drawings, in which:
[0016] Figure 1 This is a cross-sectional schematic diagram of the packaging structure provided in one embodiment of this application.
[0017] Figure 2 This is a top view of the packaging structure provided in an embodiment of this application.
[0018] Figure 3 This is a cross-sectional schematic diagram of the packaging structure provided in another embodiment of this application.
[0019] Figure 4 This is a cross-sectional schematic diagram of the packaging structure provided in another embodiment of this application. Detailed Implementation
[0020] The technical solutions in the embodiments of this application are described clearly and in detail below. Obviously, the described embodiments are only some, not all, of the embodiments of this application. Unless otherwise defined, all technical and scientific terms used herein have the same meaning as commonly understood by one of ordinary skill in the art to which this application belongs. The terminology used in the specification of this application is for the purpose of describing particular embodiments only and is not intended to limit this application.
[0021] Additionally, for brevity and clarity, the dimensions or thicknesses of various components and layers may be enlarged in the accompanying drawings. Throughout the text, the same numerical values refer to the same elements. As used herein, the terms "and / or" and "and / or" include any and all combinations of one or more of the associated enumerated items. Furthermore, it should be understood that when element A is referred to as "connecting" element B, element A may be directly connected to element B, or there may be an intermediate element C and element A and element B may be indirectly connected to each other.
[0022] Furthermore, when describing the implementation of this application, the word "may" refers to "one or more implementations of this application".
[0023] The technical terms used herein are for the purpose of describing particular embodiments and are not intended to limit this application. As used herein, the singular form is intended to include the plural form as well, unless the context clearly indicates otherwise. It should be further understood that the term "comprising," as used in this specification, means the presence of the described features, values, steps, operations, elements, and / or components, but does not exclude the presence or addition of one or more other features, values, steps, operations, elements, components, and / or combinations thereof.
[0024] It should be understood that although the terms first, second, third, etc., may be used herein to describe various elements, components, regions, layers, and / or portions, these elements, components, regions, layers, and / or portions should not be limited by these terms. These terms are used to distinguish one element, component, region, layer, or portion from another element, component, region, layer, or portion. Therefore, the first element, component, region, layer, or portion discussed below may be referred to as the second element, component, region, layer, or portion without departing from the teachings of the exemplary embodiments.
[0025] Please see Figure 1 and Figure 2 This application provides an embodiment of an encapsulation structure 100. The encapsulation structure 100 can be used for gene sequencing and can be coupled with a microfluidic housing to form a microfluidic device. The encapsulation structure 100 includes a substrate 10, multiple biochips 20, and an encapsulation body 30. Multiple biochips 20 are arranged in an array on the substrate 10 and electrically connected to the substrate 10. Integrating multiple arrayed biochips 20 into one encapsulation structure 100 can improve sequencing throughput. Each biochip 20 includes a front side 20a facing away from the substrate 10 and a back side 20b facing the substrate 10. The front side 20a has a functional area 23. The encapsulation body 30 covers the biochips 20 and the surface of the substrate 10 exposed outside the biochips 20, with the functional area 23 exposed outside the encapsulation body 30. The encapsulation body 30 can protect the biochips 20, the substrate 10, and the circuitry, reducing the risk of the biochips 20 failing due to reagent corrosion of the substrate 10.
[0026] The biochip 20 can be used for nucleic acid sequencing. In some embodiments, the functional region 23 is one or more of the following: a sample adsorption region, a photosensitive region, a bioreaction region, a pressure sensing region, and a capacitive-inductive coupling region. In some embodiments, the functional region 23 includes a series of binding sites, each of which can be independently occupied by biomolecules such as proteins, nucleic acids, antibodies, and polysaccharides. One or more binding sites can generate a detectable signal, for example, an enzymatic, binding, or chemical reaction at a binding site can generate a detectable signal, such as fluorescence or chemiluminescence emission, which is detected and identifies the characteristics or properties of the biomolecule at that site.
[0027] In some embodiments, the biochip 20 can be a silicon wafer of a wafer or other shape, which can be formed by dicing.
[0028] In some embodiments, each biochip 20 can operate independently, so that the failure of a single biochip 20 will not cause the entire array of biochips 20 to fail.
[0029] In some embodiments, substrate 10 is a printed circuit board. In other embodiments, substrate 10 is a semiconductor (e.g., silicon) substrate, glass substrate, ceramic substrate, etc.
[0030] In some embodiments, the biochip 20 can be connected to the substrate 10 using a wire bonding method. The front side 20a of the biochip 20 is provided with a plurality of electrodes 21, 22, which are located around the functional area 23. Figure 1 Only two electrodes 21 and 22 are shown, but the number is not limited to two. The surface of the substrate 10 is provided with multiple first contact pads 11 and 12. Figure 1 Only two first contact pads 11, 12 are shown, but not limited to two. Each electrode 21, 22 can be electrically connected to the biochip 20 by connecting the bonding lead 40 to the corresponding first contact pad 11, 12 via a wire bonding process. In some embodiments, the bonding lead 40 is soldered to the electrodes 21, 22 and the first contact pads 11, 12.
[0031] In some embodiments, electrodes 21, 22, bonding leads 40, and first contact pads 11, 12 are embedded in the package 30. The package 30 protects electrodes 21, 22, bonding leads 40, and first contact pads 11, 12 from short circuits caused by reagent corrosion, further reducing the risk of biochip 20 failure.
[0032] The package 30 is made of an insulating material. In some embodiments, the package 30 is formed using a molding compound through a molding process. The material of the package 30 can be epoxy resin. When forming the package 30 through the molding process, a mold or other shielding element can be used to shield the functional area 23 of the biochip 20 to prevent the molding compound from contaminating the functional area 23 and affecting its biochemical performance.
[0033] In some embodiments, the encapsulation structure 100 includes an adhesive layer 50 through which the biochip 20 is bonded to the substrate 10. The adhesive layer 50 can be formed by curing an adhesive material. In some embodiments, the adhesive material is in a solid form before curing and substantially retains its thickness after curing. In some embodiments, the adhesive material is in a liquid form before curing. In some embodiments, the adhesive material includes a pressure-sensitive adhesive, a polyurethane adhesive material, or a liquid epoxy resin.
[0034] In some embodiments, the adhesive layer 50 has good thermal conductivity to facilitate heat dissipation of the biochip 20. In some embodiments, the adhesive layer 50 includes conductive particles, which may be powders of gold, silver, copper, aluminum, zinc, iron, nickel, or graphite. The conductive particles can increase the thermal conductivity of the adhesive layer 50. In some embodiments, the adhesive layer 50 is silver paste.
[0035] In some embodiments, the adhesive layer 50 is sandwiched between the biochip 20 and the substrate 10. The adhesive layer 50 may cover a portion of the back surface 20b of the biochip 20, or it may cover the entire back surface 20b. The size of the adhesive layer 50 is preferably no larger than the size of the biochip 20.
[0036] In some embodiments, the package structure 100 includes at least one electronic component 60 electrically connected to the substrate 10. The at least one electronic component 60 includes at least one of a serializer / deserializer (SerDes), a central processing unit (CPU), and a memory. The CPU can be used to process test data from the biochip 20. The memory can be used to store the data processed by the CPU. The serializer / deserializer (SerDes) can be used to receive data processed by the CPU, convert a serial data stream into a parallel data stream or vice versa, and transmit the data.
[0037] In some embodiments, the multiple biochips 20 are divided into multiple groups, and each group of biochips 20 is connected to a serializer / deserializer. See also Figure 2 Multiple biochips 20 are arranged in two rows, and multiple serializers / deserializers are arranged in one row and located between the two rows of biochips 20.
[0038] In some embodiments, the electronic component 60 is embedded in the package 30. The package 30 can protect the electronic component 60.
[0039] In some embodiments, please refer to Figure 3 Each electrode 21, 22 is led to the back surface 20b of the biochip 20 through a through-silicon via (TSV) 25. The TSV 25 can be fabricated using silicon through-hole technology and deep-hole electroplating filling. The aspect ratio of the TSV 25 is preferably less than or equal to 20:1. The back surface 20b of the biochip 20 is provided with a plurality of second contact pads 23, 24. Each second contact pad 23, 24 is electrically connected to each electrode 21, 22 through the TSV 25, thereby transferring the electrodes 21, 22 on the front surface 20a to the back surface 20b. The plurality of second contact pads 23, 24 are electrically connected to a plurality of first contact pads 11, 12, respectively, so that the biochip 20 is electrically connected to the substrate 10. In some embodiments, each first contact pad 11, 12 is soldered to a corresponding second contact pad 23, 24. In some embodiments, solder paste is provided between each first contact pad 11, 12 and the corresponding second contact pad 23, 24, and the first contact pad 11, 12 is soldered to the second contact pad 23, 24 by solder paste.
[0040] In some embodiments, the package 30 fills the gap between the biochip 20 and the substrate 10.
[0041] In some embodiments, please refer to Figure 4 Each second contact pad 23, 24 has at least one metal bump 26. The size of the metal bump 26 is preferably smaller than the size of each second contact pad 23, 24. The metal bump 26 can be deposited on each second contact pad 23, 24 by electroplating or physical vapor deposition. For example, a second contact pad 23, 24 may have eight metal bumps 26, preferably with the same height. The second contact pads 23, 24 and the metal bumps 26 are preferably cylindrical, and the diameter of the metal bumps 26 is preferably smaller than the diameter of the second contact pads 23, 24, so that the eight metal bumps 26 can be distributed on the surface of the second contact pads 23, 24. The second contact pads 23, 24 and the metal bumps 26 can also have other geometric structures, such as cubes. Each first contact pad 11, 12 is connected to the metal bump 26 on each second contact pad 23, 24 by cold pressing.
[0042] In some embodiments, the height of the metal bump 26 is less than the height of the first contact pads 11 and 12, such that the entire metal bump 26 can be pressed into the first contact pads 11 and 12. In some embodiments, the second contact pads 23 and 24 are not limited to those formed of copper, tin, etc., the metal bump 26 is not limited to those formed of elemental or composite metals such as copper, tin, indium, bismuth, cesium, gold, silver, nickel, palladium, etc., and the first contact pads 11 and 12 are not limited to those formed of elemental or composite metals such as copper, tin, indium, bismuth, cesium, gold, silver, nickel, palladium, etc.
[0043] In some embodiments, to facilitate cold bonding between the metal bump 26 and the first contact pads 11 and 12, the hardness of the metal bump 26 is preferably greater than the hardness of the first contact pad 11, or the hardness of the metal bump 26 is preferably greater than the hardness of the metal in the top region of the first contact pad 11. For example, the top region of the first contact pad 11 is formed of a metal with lower hardness, including but not limited to metals such as tin, indium, bismuth, gold, and cesium.
[0044] The above-disclosed embodiments are merely preferred embodiments of this application and should not be construed as limiting the scope of this application. Therefore, any equivalent variations made in accordance with this application are still within the scope of this application.
Claims
1. A package structure comprising a substrate, characterized by, The packaging structure further comprises a plurality of biochips and a packaging body, the plurality of biochips are arranged in an array on the substrate and are electrically connected to the substrate, and the packaging body covers the plurality of biochips and covers the surface of the substrate exposed outside the biochips.
2. The package structure of claim 1, wherein, The front surface of the biochip is provided with a functional area exposed outside the packaging body.
3. The package structure of claim 1, wherein, The front surface of the biochip is provided with an electrode, the surface of the substrate is provided with a first contact pad, and the electrode is connected to the first contact pad through a bonding wire.
4. The package structure of claim 1, wherein, The front surface of the biochip is provided with an electrode, the back surface of the biochip is provided with a second contact pad, the biochip is provided with a through-silicon via electrically connecting the electrode and the second contact pad, the surface of the substrate is provided with a first contact pad, and the second contact pad is electrically connected to the first contact pad.
5. The package structure of claim 4, wherein, The second contact pad is welded to the first contact pad.
6. The package structure of claim 4, wherein, The surface of the second contact pad is provided with a metal bump, and the first contact pad is connected to the metal bump on the second contact pad through cold press bonding.
7. The package structure of claim 6, wherein, The height of the metal bump is less than the height of the first contact pad.
8. The package structure of claim 1, wherein, The packaging structure comprises at least one electronic element, the at least one electronic element is embedded in the packaging body and is electrically connected to the substrate, and the at least one electronic element comprises at least one of a serializer / deserializer, a central processing unit, and a memory.
9. The package structure of claim 1, wherein, The packaging structure comprises an adhesive layer, and each biochip is bonded to the substrate through the adhesive layer.
10. The package structure of claim 9, wherein, The adhesive layer is silver glue.