Heat exchanger, temperature adjusting system and vehicle

Abstract

The utility model provides a heat exchanger, a temperature adjusting system and a vehicle. The heat exchanger is provided with a first inlet, a second inlet, a first outlet and a second outlet. The heat exchanger comprises a first heat exchange pipe and a second heat exchange pipe, wherein the first heat exchange pipe communicates with the first inlet and the first outlet; the second heat exchange tube and the first heat exchange tube are mutually independent and are not communicated, and the second heat exchange tube is communicated with the second inlet and the second outlet; the semiconductor refrigeration part is provided with a hot end and a cold end, the hot end conducts heat with the first heat exchange pipe, and the cold end conducts heat with the second heat exchange pipe. According to the arrangement of the heat exchanger and the semiconductor refrigeration part, the heat exchange effect of the first heat exchange pipe and the second heat exchange pipe in the heat exchanger can be improved, the energy efficiency ratio of the vehicle is increased, the electric power consumption is reduced, the electric quantity of a power battery is saved, and the cruising ability of the vehicle battery is improved.

Description

Technical Field

[0001] This application relates to the field of temperature control technology, and in particular to a heat exchanger, a temperature control system, and a vehicle. Background Technology

[0002] With the development of new energy technologies, new energy vehicles are becoming increasingly popular among users. New energy vehicles are typically equipped with PTC heaters.

[0003] For non-heat pump new energy vehicles, in winter they often rely entirely on the power battery to power the PTC heater to provide heat to the vehicle's cabin. This results in a relatively low energy efficiency for new energy vehicles, for example, 0.95, and also affects the driving range of the power battery.

[0004] For heat pump new energy vehicles, the heat pump system can provide heat to the cabin in winter. The heat pump system operates at approximately 3kW, and the energy efficiency ratio of new energy vehicles is relatively high, around 1.5, meaning the heating power is approximately 4.5kW. However, when the temperature drops below -15℃, the heat pump system cannot operate normally. In this case, the vehicle still needs to rely on the power battery to power the PTC heater to provide heat to the vehicle's cabin. At this time, the energy efficiency ratio of the new energy vehicle decreases, for example, to 0.95, which also affects the driving range of the power battery. Utility Model Content

[0005] In view of this, this application provides a heat exchanger, a temperature regulation system, and a vehicle, which are beneficial to improving the energy efficiency ratio of the vehicle to at least a certain extent and extending the driving range of the vehicle's power battery.

[0006] In a first aspect, this application provides a heat exchanger having a first inlet, a second inlet, a first outlet, and a second outlet; the heat exchanger includes: a first heat exchange tube connected to the first inlet and the first outlet; a second heat exchange tube independent of and not connected to the first heat exchange tube, the second heat exchange tube being connected to the second inlet and the second outlet; and a semiconductor cooling element having a hot end and a cold end, the hot end being thermally conductive to the first heat exchange tube, and the cold end being thermally conductive to the second heat exchange tube.

[0007] According to the heat exchanger of this application embodiment, a semiconductor cooling element is provided, and the hot end of the semiconductor cooling element conducts heat with the first heat exchange tube, while the cold end conducts heat with the second heat exchange tube. Furthermore, the first and second heat exchange tubes are independent and non-conductive. When the heat exchanger is used in a vehicle's temperature control system, in cold winter environments, during vehicle operation, the heat generated by the electronic heating device can be absorbed by the heat exchange medium in the cooling pipes. The heat exchange medium in the cooling pipes flows to the second heat exchange tube of the heat exchanger and exchanges heat with the heat exchange medium in the first heat exchange tube, thus heating the heat exchange medium in the first heat exchange tube. The heated heat exchange medium in the first heat exchange tube can then flow to the heater core, facilitating the transfer of heat from the heater core to the vehicle cabin for heating. This eliminates the need for a separate PTC heater for cabin heating. Furthermore, the inclusion of semiconductor cooling components can improve the heat exchange efficiency of the first and second heat exchange tubes within the heat exchanger, thereby increasing the vehicle's energy efficiency ratio, reducing power consumption and saving battery power, and enhancing the vehicle's battery range.

[0008] In one embodiment of the first aspect of this application, the first heat exchange tube and the semiconductor cooling element are both located inside the second heat exchange tube, and the semiconductor cooling element is fixedly connected to the first heat exchange tube via the hot end. The second inlet and the second outlet are both located in the second heat exchange tube.

[0009] In one embodiment of the first aspect of this application, a plurality of semiconductor cooling elements are fixed on the first heat exchange tube, and the plurality of semiconductor cooling elements are distributed in the circumferential direction of the first heat exchange tube.

[0010] In one embodiment of the first aspect of this application, the first heat exchange tube is a flat tube, and the semiconductor cooling element is respectively provided on both sides in the thickness direction of each first heat exchange tube.

[0011] In one embodiment of the first aspect of this application, there are multiple first heat exchange tubes. The multiple first heat exchange tubes are arranged in parallel and spaced apart; and / or, the heat exchanger further includes a first manifold and a second manifold, the first manifold and the second manifold being located outside the second heat exchange tube, the multiple first heat exchange tubes communicating between the first manifold and the second manifold, the first manifold having a first inlet, and the second manifold having a first outlet.

[0012] In one embodiment of the first aspect of this application, the first heat exchange tube and the second heat exchange tube are arranged in parallel, and the semiconductor cooling element is disposed between the first heat exchange tube and the second heat exchange tube.

[0013] In one embodiment of the first aspect of this application, there are multiple first heat exchange tubes, multiple second heat exchange tubes and multiple semiconductor cooling elements, with multiple first heat exchange tubes and multiple second heat exchange tubes arranged alternately, and one semiconductor cooling element arranged between each adjacent first heat exchange tube and second heat exchange tube.

[0014] Secondly, this application provides a vehicle temperature regulation system, including: a heat exchanger, a heater core, and a heat dissipation pipe. The heater core is used to provide heat to the vehicle's cabin, and the heater core is connected to a first inlet via a first pipe and to a first outlet via a second pipe; the heat dissipation pipe is used to dissipate heat from the vehicle's electronic heating devices, and a first end of the heat dissipation pipe is connected to a second inlet, and a second end of the heat dissipation pipe is connected to a second outlet.

[0015] In one embodiment of the second aspect of this application, the temperature regulation system includes a radiator, a first end of which is connected to a first end of the heat dissipation pipe, and a second end of which is connected to a second end of the heat dissipation pipe.

[0016] In one embodiment of the second aspect of this application, the temperature regulation system includes a reversing component that selectively connects the heat dissipation pipe and the second heat exchange pipe, or connects the heat dissipation pipe and the radiator.

[0017] In one embodiment of the second aspect of this application, the reversing component is a three-way solenoid valve, which is connected to the second end of the heat dissipation pipe, the second outlet, and the second end of the radiator.

[0018] In one embodiment of the second aspect of this application, the temperature regulation system includes a first drive pump disposed on the first pipeline and / or the second pipeline; and / or, the temperature regulation system includes a second drive pump disposed on the heat dissipation pipeline.

[0019] Thirdly, this application provides a vehicle, including: a cabin, an electronic heating device, and a temperature regulation system as described in any of the above.

[0020] In one embodiment of the third aspect of this application, the electronic heating device is at least one of a charging and distribution assembly, an electric drive system, a driving information and entertainment host, and an autonomous driving domain controller.

[0021] In one embodiment of the third aspect of this application, there are multiple heat dissipation pipes and multiple electronic heating devices, and the multiple heat dissipation pipes are arranged in parallel, with one heat dissipation pipe corresponding to one electronic heating device. Attached Figure Description

[0022] Figure 1 A schematic diagram of a vehicle provided for an embodiment of this application;

[0023] Figure 2 According to Figure 1 The diagram shown is a schematic of the vehicle's temperature control system.

[0024] Figure 3 According to Figure 1 The diagram shown is of a heat exchanger.

[0025] Figure 4 A schematic diagram of another heat exchanger provided in this application;

[0026] Figure 5 A schematic diagram of yet another heat exchanger provided in this application;

[0027] Figure 6 A schematic diagram of another temperature control system provided in this application.

[0028] Figure label:

[0029] 1000 vehicles;

[0030] Temperature control system 100; heat exchanger 1; first inlet 1A; first outlet 1B; second inlet 1C; second outlet 1D; first heat exchange tube 11; second heat exchange tube 12; semiconductor refrigeration element 13; warm air core 2; heat dissipation pipe 3; radiator 4; reversing assembly 5; first drive pump 6; second drive pump 7; condenser 8; evaporator 9; throttling element 10; compressor 20; cooler 30; throttling element 40; heat exchange pipe 50; PTC heater 60; third drive pump 70; first pipe 80; second pipe 90;

[0031] Cabin 200;

[0032] Electronic heating element 300;

[0033] Air duct 400. Detailed Implementation

[0034] In the embodiments of this application, the terms "exemplary" or "for example" are used to indicate examples, illustrations, or descriptions. Any embodiment or design described as "exemplary" or "for example" in the embodiments of this application should not be construed as being more preferred or advantageous than other embodiments or designs. Specifically, the use of terms such as "exemplary" or "for example" is intended to present the relevant concepts in a specific manner.

[0035] In the embodiments of this application, the terms "first" and "second" are used for descriptive purposes only and should not be construed as indicating or implying relative importance or implicitly specifying the number of technical features indicated. Thus, a feature defined with "first" and "second" may explicitly or implicitly include one or more of that feature.

[0036] In the description of the embodiments of this application, the term "at least one" means one or more, and "more than one" means two or more. "At least one of the following" or similar expressions refer to any combination of these items, including any combination of a single item or a plurality of items. For example, at least one of a, b, or c can represent: a, b, c, ab, ac, bc, or abc, where a, b, and c can be a single item or multiple items.

[0037] In the description of the embodiments of this application, the term "and / or" refers to and covers any and all possible combinations of one or more of the associated listed items. The term "and / or" describes an association relationship between related objects, indicating that three relationships can exist. For example, A and / or B can represent: A existing alone, A and B existing simultaneously, and B existing alone. Additionally, the character " / " in this application generally indicates that the preceding and following related objects have an "or" relationship.

[0038] In the description of the embodiments of this application, unless otherwise expressly specified and limited, the terms "installation", "connection" and "linking" should be interpreted broadly. For example, "linking" can be a detachable connection or a non-detachable connection; it can be a direct connection or an indirect connection through an intermediate medium.

[0039] As used herein, "parallel" and "equal" include the described situation and situations that are similar to the described situation, within an acceptable deviation range, which is determined by those skilled in the art taking into account the measurement under discussion and the error associated with the measurement of the particular quantity (i.e., the limitations of the measurement system). For example, "parallel" includes absolute parallelism and approximate parallelism, where the acceptable deviation range for approximate parallelism could be, for example, a deviation within 10°. "Equal" includes absolute equality and approximate equality, where the acceptable deviation range for approximate equality could be, for example, a difference between the two equal items less than or equal to 10% of either one.

[0040] The structure of this application will now be described in detail with reference to the accompanying drawings.

[0041] This application provides a vehicle. The vehicle includes, but is not limited to, new energy vehicles, gasoline vehicles, and hybrid vehicles. Furthermore, the vehicle includes, but is not limited to, passenger cars and public vehicles. In the following description, a new energy vehicle will be used as an example.

[0042] Please see Figure 1 The vehicle 1000 includes a cabin 200, an electronic heating device 300, and a temperature control system 100.

[0043] The cabin 200 can be either a cockpit or a passenger cabin.

[0044] The electronic heating element 300 integrates electronic components. The electronic heating element 300 is used to enable the normal operation of the vehicle 1000.

[0045] The electronic heating device 300 can be at least one of the following: a charging and distribution assembly, an electric drive system, a driver information and entertainment system, and an autonomous driving domain controller. That is, the electronic heating device 300 can refer to the charging and distribution assembly, the electric drive system, the driver information and entertainment system, or the autonomous driving domain controller; or, when there are two electronic heating devices 300, each of the following can be two of the following: a charging and distribution assembly, an electric drive system, a driver information and entertainment system, and an autonomous driving domain controller; when there are three electronic heating devices 300, each of the following can be three of the following: a charging and distribution assembly, an electric drive system, a driver information and entertainment system, and an autonomous driving domain controller; and when there are four electronic heating devices 300, each of the following can be the following: a charging and distribution assembly, an electric drive system, a driver information and entertainment system, and an autonomous driving domain controller.

[0046] The temperature control system 100 is used to recover the heat generated by the electronic heating device 300 and supply it to the compartment 200. For details, please refer to [link / reference needed]. Figure 2 The temperature control system 100 includes: heat dissipation pipes 3, warm air core 2 and heat exchanger 1.

[0047] During normal operation of the vehicle 1000, the electronic heating element 300 generates heat. To prevent excessive heat generation from burning out the electronic heating element 300, a heat dissipation pipe 3 is used to dissipate heat from it. For example, the wall of the heat dissipation pipe 3 can be attached to or bonded to the electronic heating element 300 with thermally conductive adhesive, so that the heat from the electronic heating element 300 can be transferred to the heat dissipation pipe 3. As another example, a heat spreader is provided on the surface of the electronic heating element 300, and the heat dissipation pipe 3 is attached to or bonded to the surface of the heat spreader with thermally conductive adhesive, so that the heat from the electronic heating element 300 can be transferred to the heat dissipation pipe 3.

[0048] The heater core 2 is used to provide heat to the compartment 200 of the vehicle 1000. Specifically, the vehicle 1000 has an air duct 400 that communicates with the compartment 200. The heater core 2 can be located within the air duct 400.

[0049] Please see Figure 2 and Figure 3 The heat exchanger 1 has a first inlet 1A, a second inlet 1C, a first outlet 1B, and a second outlet 1D.

[0050] The heat exchanger 1 includes a first heat exchange tube 11, a second heat exchange tube 12, and a semiconductor cooling element 13.

[0051] The first heat exchange tube 11 connects the first inlet 1A and the first outlet 1B. There can be multiple first heat exchange tubes 11; when there are multiple first heat exchange tubes 11, each first heat exchange tube 11 connects the first inlet 1A and the first outlet 1B. In other embodiments, there can also be only one first heat exchange tube 11.

[0052] The first heat exchange tube 11 is used to circulate the heat exchange medium. For example, the heat exchange medium in the first heat exchange tube 11 can be water.

[0053] The second heat exchange tube 12 is independent of and not connected to the first heat exchange tube 11. The second heat exchange tube 12 is used to circulate the heat exchange medium. For example, the heat exchange medium in the second heat exchange tube 12 can be water. The heat exchange medium in the second heat exchange tube 12 can be the same as or different from the heat exchange medium in the first heat exchange tube 11.

[0054] The heat exchange medium in the second heat exchange tube 12 can exchange heat with the heat exchange medium in the first heat exchange tube 11.

[0055] The second heat exchange tube 12 is connected to the second inlet 1C and the second outlet 1D. There can be multiple second heat exchange tubes 12. When there are multiple second heat exchange tubes 12, each second heat exchange tube 12 is connected to the second inlet 1C and the second outlet 1D.

[0056] The first end of the heat dissipation pipe 3 is connected to the second inlet 1C, and the second end of the heat dissipation pipe 3 is connected to the second outlet 1D. In this way, the heat dissipation pipe 3 and the second heat exchange pipe 12 of the heat exchanger 1 can form a waste heat recovery circulation path.

[0057] The first end of the heater core 2 is connected to the first inlet 1A via the first pipe 80. The second end of the heater core 2 is connected to the first outlet 1B via the second pipe 90. In this way, the heater core 2, the first pipe 80, the first heat exchange tube 11 of the heat exchanger 1, and the second pipe 90 can form a waste heat reuse circulation path.

[0058] In cold winter environments, during the operation of vehicle 1000, the heat generated by the electronic heating device 300 can be absorbed by the heat exchange medium within the heat dissipation pipe 3. In the waste heat recovery circulation path, the heat exchange medium in the heat dissipation pipe 3 flows to the second heat exchange tube 12 of the heat exchanger 1, where it exchanges heat with the heat exchange medium in the first heat exchange tube 11 to heat the heat exchange medium in the first heat exchange tube 11. The heated heat exchange medium in the first heat exchange tube 11 can then flow to the heater core 2, facilitating the transfer of heat from the heater core 2 to the vehicle 1000's cabin 200 for heating. This eliminates the need for a separate PTC heater for heating the cabin 200, reducing the cost of vehicle 1000 and improving its energy efficiency ratio, thereby increasing the driving range of the vehicle 1000's power battery.

[0059] To improve the heat exchange efficiency of the first heat exchange tube 11 and the second heat exchange tube 12 in the heat exchanger 1, the semiconductor cooling element 13 has a hot end 131 and a cold end 132. The hot end 131 conducts heat with the first heat exchange tube 11. The cold end 132 conducts heat with the second heat exchange tube 12.

[0060] Specifically, a PN junction is provided within the semiconductor cooler 13. Based on the Peltier effect, when an electrical load flows within the semiconductor cooler 13, a cold end 132 absorbs heat while a hot end 131 releases heat. The semiconductor cooling principle generates a cooling effect at the cold end 132 of the semiconductor cooler 13, and the cold end 132 exchanges heat fully with the second heat exchange tube 12 to collect sufficient heat. Furthermore, the heat from the cold end 132 is transferred to the hot end 131 through electron movement within the semiconductor cooler 13. Heat from the cold end 132 and heat generated by the energization of the semiconductor cooling element 13 can be concentrated at the hot end 131, where it fully exchanges heat with the heat exchange medium in the first heat exchange tube 11. This improves the heat exchange effect of the first heat exchange tube 11 and the second heat exchange tube 12 in the heat exchanger 1, enhances the waste heat recovery and reuse capability of the heat exchanger 1, further improves the energy efficiency ratio of the vehicle 1000, reduces power consumption, saves battery power, and increases the driving range of the vehicle 1000 battery. Meanwhile, the temperature regulation system 100 is not limited by the external environment and can still operate normally in environments below -15℃.

[0061] Experimental verification shows that the above-mentioned temperature regulation system 100 can make the energy efficiency ratio of vehicle 1000 greater than 1, and up to 1.7. Compared with the existing technology, energy consumption can be reduced by up to 43% under the same heating demand.

[0062] For example, the semiconductor cooling element 13 may be in the form of a sheet.

[0063] Please continue reading. Figure 2 In some embodiments of this application, the temperature control system 100 further includes a first drive pump 6. The first drive pump 6 is disposed on the first pipe 80 and / or the second pipe 90. That is, the first drive pump 6 can be disposed on the first pipe 80, or it can be disposed on the second pipe 90, or both the first drive pump 6 and the second pipe 90 can be disposed on the first pipe 80 and the second pipe 90 respectively. The placement of the first drive pump 6 facilitates the circulation of the heat exchange medium between the first heat exchange tube 11 and the warm air core 2, thereby improving the heat exchange efficiency.

[0064] Please continue reading. Figure 2 In some embodiments of this application, the temperature control system 100 includes a second drive pump 7. The second drive pump 7 is disposed on the heat dissipation pipe 3. The placement of the second drive pump 7 facilitates the circulation of the heat exchange medium between the heat dissipation pipe 3 and the second heat exchange pipe 12, thereby improving the heat exchange efficiency.

[0065] In cold winter environments, although the waste heat recovery circulation path formed by the second heat exchange pipe 12 and the heat dissipation pipe 3 can be used to dissipate heat from the electronic heating device 300, in summer or in environments where there is no need to provide heat to the cabin 200, in order to achieve the purpose of dissipating heat generated by the electronic heating device 300, please refer to some embodiments of this application. Figure 2 The temperature control system 100 includes a radiator 4. The radiator 4 is used for heat exchange with the external environment of the vehicle 1000. A first end of the radiator 4 is connected to a first end of the heat dissipation pipe 3. A second end of the radiator 4 is connected to a second end of the heat dissipation pipe 3. In this way, the radiator 4 and the heat dissipation pipe 3 form a heat dissipation path for cooling the electronic heating device 300. The heat exchange medium in the heat dissipation pipe 3, after heat exchange with the electronic heating device 300, can flow to the radiator 4 and exchange heat with the external environment of the vehicle 1000 within the radiator 4, thereby improving the heat dissipation effect on the electronic heating device 300.

[0066] In some embodiments of this application, the temperature control system 100 includes a reversing component 5. The reversing component 5 selectively connects the heat dissipation pipe 3 and the second heat exchange pipe 12, or connects the heat dissipation pipe 3 and the radiator 4. In this way, in cold winter environments, the reversing component 5 connects the heat dissipation pipe 3 and the second heat exchange pipe 12, allowing the heat exchange medium within the heat dissipation pipe 3 to circulate entirely between the heat dissipation pipe 3 and the second heat exchange pipe 12, thereby improving the heating effect on the compartment 200. In summer or in environments where heat is not required in the compartment 200, the reversing component 5 connects the heat dissipation pipe 3 and the radiator 4, allowing the heat exchange medium within the heat dissipation pipe 3 to circulate entirely between the heat dissipation pipe 3 and the radiator 4, thereby utilizing the radiator 4 to dissipate heat from the electronic heating device 300 and preventing the heat exchange medium within the heat dissipation pipe 3 from flowing to the second heat exchange pipe 12 of the heat exchanger 1.

[0067] For further information, please refer to [link / reference]. Figure 2 The reversing component 5 can be a three-way solenoid valve. The three-way solenoid valve is connected to the second end of the heat dissipation pipe 3, the second outlet 1D, and the second end of the heat sink 4, respectively. Therefore, the structure is simple, the cost is low, and the sensitivity is high.

[0068] Of course, this application is not limited to this. In some other embodiments, the commutation component 5 may also be connected to the first end of the heat dissipation pipe 3, the second inlet 1C and the first end of the heat sink 4 respectively.

[0069] Please refer to some embodiments of this application. Figure 3 The first heat exchange tube 11 and the semiconductor cooler 13 are both located inside the second heat exchange tube 12, and the semiconductor cooler 13 is fixedly connected to the first heat exchange tube 11 via a hot end 131. The second inlet 1C and the second outlet 1D are both disposed on the second heat exchange tube 12. In this way, the first heat exchange tube 11 and the semiconductor cooler 13 can be immersed in the heat exchange medium of the second heat exchange tube 12, which is beneficial to improving the heat exchange effect of the second heat exchange tube 12 and the first heat exchange tube 11.

[0070] For example, a plurality of semiconductor cooling elements 13 are fixed on the first heat exchange tube 11. The plurality of semiconductor cooling elements 13 are distributed circumferentially on the first heat exchange tube 11. This is beneficial to further improve the heat exchange effect of the second heat exchange tube 12 and the first heat exchange tube 11.

[0071] For example, the first heat exchange tube 11 is a flat tube, and a semiconductor cooling element 13 is provided on both sides of the thickness direction of each first heat exchange tube 11. This facilitates the fixed connection between the semiconductor cooling element 13 and the first heat exchange tube 11.

[0072] For example, there are multiple first heat exchange tubes 11. The multiple first heat exchange tubes 11 are arranged in parallel and spaced apart.

[0073] Please continue reading. Figure 3 The heat exchanger 1 also includes a first manifold 15 and a second manifold 16. The first manifold 15 and the second manifold 16 are located outside the second heat exchange tube 12. A plurality of first heat exchange tubes 11 are fixed and connected between the first manifold 15 and the second manifold 16. The first manifold 15 is provided with a first inlet 1A, and the second manifold 16 is provided with a first outlet 1B. As a result, the structure is simple and it is convenient to use the first manifold 15 and the second manifold 16 to connect the plurality of first heat exchange tubes 11 with the warm air core 2.

[0074] For example, the first heat exchange tube 11 is a flat tube, and the semiconductor cooling element 13 is a sheet, with the semiconductor cooling element 13 and the first heat exchange tube 11 stacked together. This helps to increase the overlap area between the two and improve the heat exchange efficiency.

[0075] Of course, this application is not limited to this; please refer to other embodiments of this application. Figure 4 The second heat exchange tube 12 and the semiconductor cooling element 13 are both located inside the first heat exchange tube 11, and the semiconductor cooling element 13 is fixedly connected to the second heat exchange tube 12 via a cold end 132. This is beneficial to improving the heat exchange efficiency of the first heat exchange tube 11 and the second heat exchange tube 12.

[0076] Regarding the specific arrangement of the second heat exchange tube 12 and the semiconductor cooling element 13 within the first heat exchange tube 11, please refer to the specific arrangement of the first heat exchange tube 11 and the semiconductor cooling element 13 within the second heat exchange tube 12 described above, which will not be repeated here.

[0077] In some other embodiments of this application, please refer to Figure 5 The structure of heat exchanger 1 in this embodiment is similar to... Figure 3 The difference in the structure of the heat exchanger 1 shown is that the first heat exchange tube 11 and the second heat exchange tube 12 are arranged in parallel. The semiconductor cooling element 13 is disposed between the first heat exchange tube 11 and the second heat exchange tube 12. As a result, the structure is simple and easy to manufacture.

[0078] Based on this, for example, there are multiple first heat exchange tubes 11, multiple second heat exchange tubes 12, and multiple semiconductor cooling elements 13. Multiple first heat exchange tubes 11 and multiple second heat exchange tubes 12 are arranged alternately. A semiconductor cooling element 13 is arranged between each adjacent first heat exchange tube 11 and second heat exchange tube 12. This helps to improve the heat exchange efficiency of the heat exchanger 1.

[0079] Please continue reading. Figure 5The heat exchanger 1 also includes a third manifold 17 and a fourth manifold 18. Multiple second heat exchange tubes 12 are fixed and connected between the third manifold 17 and the fourth manifold 18. The third manifold 17 has a second outlet 1D. The fourth manifold 18 has a second inlet 1C. This design simplifies the structure and facilitates the connection between the multiple second heat exchange tubes 12 and the heat dissipation pipes 3 using the third manifold 17 and the fourth manifold 18.

[0080] In some embodiments of this application, please refer to Figure 6 There are multiple heat dissipation pipes 3 and multiple electronic heating elements 300. The multiple heat dissipation pipes 3 are connected in parallel, and one heat dissipation pipe 3 corresponds to one electronic heating element 300. In this way, the heat dissipation effect of the heat dissipation pipes 3 on the electronic heating elements 300 is improved.

[0081] In some other embodiments of this application, a single heat dissipation pipe 3 may correspond to multiple electronic heating devices 300. This simplifies the structure of the temperature control system 100.

[0082] In other embodiments, each electronic heating device 300 may correspond to multiple parallel-connected heat dissipation pipes 3. This can further improve the heat dissipation effect of the electronic heating device 300.

[0083] In some embodiments of this application, for the purpose of cooling the compartment 200, please refer to [the relevant documentation / reference needed]. Figure 2 and Figure 6 The temperature control system 100 also includes a compressor 20, a condenser 8, a throttling element 10, and an evaporator 9.

[0084] The compressor 20 has an exhaust port 201 and a return port 202. The first end of the condenser 8 is connected to the exhaust port 201. The throttling element 10 is connected between the second end of the condenser 8 and the first end of the evaporator 9. The second end of the evaporator 9 is connected to the return port 202.

[0085] The condenser 8 is used for heat exchange with the external environment of the vehicle 1000. The evaporator 9 is used to provide cooling to the compartment 200. For example, the evaporator 9 can be located within the aforementioned air duct 400.

[0086] In this way, the high-temperature, high-pressure refrigerant generated by compressor 20 can flow to condenser 8 through exhaust port 201, where it exchanges heat with the external environment of vehicle 1000. After heat exchange, the refrigerant is throttled and depressurized by throttling element 10, forming a low-temperature, low-pressure refrigerant. This low-temperature, low-pressure refrigerant enters evaporator 9 to cool the interior of compartment 200. The refrigerant flowing out of evaporator 9 returns to compressor 20 through return port 202.

[0087] For example, the throttling element 10 may be a capillary tube, an electronic expansion valve, or a thermostatic expansion valve.

[0088] In some embodiments of this application, for new energy vehicles, the power battery 500 often generates heat during the charging and discharging process. To ensure the reliability of the power battery 500's operation and prevent it from spontaneously combusting due to heat generation, the temperature regulation system 100 includes a heat exchange pipe 50 and a battery cooler 30. The heat exchange pipe 50 is used for heat exchange with the power battery 500.

[0089] The battery cooler 30 has a first heat exchange flow path 301 and a second heat exchange flow path 302. The first end of the heat exchange pipe 50 is connected to the first end of the first heat exchange flow path 301, and the second end of the heat exchange pipe 50 is connected to the second end of the first heat exchange flow path 301. In this way, the heat exchange pipe 50 and the first heat exchange flow path 301 form a heat exchange circulation flow path.

[0090] The first end of the second heat exchange flow path 302 is connected to the second end of the condenser 8 through the throttling element 40, and the second end of the second heat exchange flow path 302 is connected to the return gas port 202.

[0091] In this way, the refrigerant flowing out of the condenser 8 can be throttled and depressurized by the throttling device 40 and then flow to the second heat exchange flow path 302. In the second heat exchange flow path 302, it exchanges heat with the first heat exchange flow path 301 to reduce the temperature of the heat exchange medium in the first heat exchange flow path 301, thereby achieving the purpose of cooling the power battery 500.

[0092] In some embodiments of this application, the temperature control system 100 further includes a PTC heater 60. The PTC heater 60 is used to heat the heat exchange medium in the heat exchange circulation path. In this way, in low-temperature environments, before the power battery 500 officially enters the fast charging process, the PTC heater 60 can be used to heat the power battery 500 to improve the charging efficiency of the power battery 500.

[0093] In some embodiments of this application, the temperature control system 100 further includes a third drive pump 70. The third drive pump 70 is disposed between the first heat exchange flow path 301 and the heat exchange pipeline 50 to facilitate the circulation of the heat exchange medium between the heat exchange pipeline 50 and the first heat exchange flow path.

[0094] In the description of this specification, specific features, structures, materials or characteristics may be combined in any suitable manner in one or more embodiments or examples without contradicting each other.

[0095] Finally, it should be noted that the above embodiments are only used to illustrate the technical solutions of this application, and are not intended to limit them. Although this application has been described in detail with reference to the foregoing embodiments, those skilled in the art should understand that modifications can still be made to the technical solutions described in the foregoing embodiments, or equivalent substitutions can be made to some of the technical features. Such modifications or substitutions do not cause the essence of the corresponding technical solutions to deviate from the scope of the technical solutions of the embodiments of this application.

Claims

1. A heat exchanger, characterized by, The heat exchanger has a first inlet, a second inlet, a first outlet and a second outlet; the heat exchanger comprises: a first heat exchange pipe, which is in communication with the first inlet and the first outlet; a second heat exchange pipe, which is independent of the first heat exchange pipe and not in communication with the first heat exchange pipe, and is in communication with the second inlet and the second outlet; a semiconductor refrigeration device, which has a hot end and a cold end, the hot end is in thermal conduction with the first heat exchange pipe, and the cold end is in thermal conduction with the second heat exchange pipe.

2. The heat exchanger of claim 1, wherein The first heat exchange pipe and the semiconductor refrigeration device are both located inside the second heat exchange pipe, and the semiconductor refrigeration device is fixedly connected with the first heat exchange pipe by means of the hot end, and the second inlet and the second outlet are both arranged on the second heat exchange pipe.

3. The heat exchanger of claim 2, wherein, A plurality of semiconductor refrigeration devices are fixed on the first heat exchange pipe, and the plurality of semiconductor refrigeration devices are distributed in the circumferential direction of the first heat exchange pipe.

4. The heat exchanger of claim 3, wherein The first heat exchange pipe is a flat tube, and the two sides in the thickness direction of each first heat exchange pipe are respectively provided with the semiconductor refrigeration device.

5. The heat exchanger of claim 2, wherein, The first heat exchange pipe is a plurality of; wherein the plurality of first heat exchange pipes are arranged in parallel and are spaced apart; and / or, The heat exchanger further comprises a first header and a second header, the first header and the second header are located outside the second heat exchange pipe, the plurality of first heat exchange pipes are in communication between the first header and the second header, the first inlet is arranged on the first header, and the first outlet is arranged on the second header.

6. The heat exchanger according to any one of claims 1 to 5, characterized in that The first heat exchange pipe and the second heat exchange pipe are arranged in parallel, and the semiconductor refrigeration device is arranged between the first heat exchange pipe and the second heat exchange pipe.

7. A temperature regulation system characterized by, comprising: the heat exchanger according to any one of claims 1-6; a warm air core for providing heat to a cabin of a vehicle, the warm air core being in communication with the first inlet through a first pipeline and in communication with the first outlet through a second pipeline; a heat dissipation pipeline for dissipating heat of electronic heat generating devices of the vehicle, a first end of the heat dissipation pipeline being in communication with the second inlet, and a second end of the heat dissipation pipeline being in communication with the second outlet.

8. The temperature regulation system of claim 7, wherein, a heat sink and a reversing assembly, a first end of the heat sink being in communication with the first end of the heat dissipation pipeline, and a second end of the heat sink being in communication with the second end of the heat dissipation pipeline; the reversing assembly selectively communicates the heat dissipation pipeline and the second heat exchange pipe, or communicates the heat dissipation pipeline and the heat sink.

9. A vehicle characterized by comprising: comprising: a cabin, electronic heat generating devices, and the temperature regulation system according to claim 7 or 8.

10. The vehicle of claim 9, wherein, The heat dissipation pipeline and the electronic heat generating devices are both a plurality of, the plurality of heat dissipation pipelines are arranged in parallel, and one heat dissipation pipeline corresponds to one electronic heat generating device.

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