Circuit board soldering tin quality detection device based on 3D line laser

Abstract

The utility model relates to the technical field of soldering tin quality detection devices, in particular to a circuit board soldering tin quality detection device based on 3D line laser. The problem of single detection size of the circuit board in the prior art is solved, and the practicability of the equipment is improved. The device structurally comprises a fixed seat, a detection table is arranged on the fixed seat, a placement groove is formed in the detection table, a first limiting plate, a second limiting plate, a third limiting plate and a fourth limiting plate are slidably connected into the placement groove, a stretching box is slidably connected to the fixed seat, and the stretching box is arranged at the top of the detection table; a first suction cup, a second suction cup, a third suction cup and a fourth suction cup are slidably connected into the stretching box, an adjusting structure used for controlling the positions of the first suction cup, the second suction cup, the third suction cup and the fourth suction cup is arranged in the stretching box, and a 3D line laser scanner is further fixed to the detection table. According to the embodiment, adjustment detection can be carried out according to the actual size of the circuit board to be detected, the detection application range is wider, and the practicability is higher.

Description

Technical Field

[0001] This utility model relates to the technical field of solder quality inspection devices, specifically to a circuit board solder quality inspection device based on 3D line laser. Background Technology

[0002] A 3D line laser-based circuit board solder quality inspection device is a device that uses 3D line laser scanning technology to inspect the solder quality on electronic circuit boards. This device is mainly used to check for defects in the solder joints on the circuit board, such as insufficient solder, excessive solder, cold solder joints, or other problems.

[0003] like Figure 1 As shown, existing solder quality inspection devices involve setting up several suction cups on a base cabinet, pulling the circuit board away via a telescopic rod, and recording and inspecting the solder quality of the circuit board using a CCD camera.

[0004] While this method allows for the recording and inspection of solder quality, the following problems still exist: To minimize damage to the circuit board, the suction cups are positioned at the four corners. This can lead to a situation where, if the dimensions of the circuit board being inspected change, the suction cups cannot accurately align with the corners, making it difficult to inspect the solder quality. Utility Model Content

[0005] This invention proposes a circuit board soldering quality inspection device based on 3D line laser, which solves the problem of limited circuit board inspection dimensions in the prior art and improves the practicality of the equipment.

[0006] The technical solution of this utility model is as follows:

[0007] A circuit board solder quality inspection device based on 3D line laser includes a mounting base.

[0008] The fixed base is equipped with a testing platform, and the testing platform is equipped with a placement groove. A first limiting plate, a second limiting plate, a third limiting plate, and a fourth limiting plate are slidably connected in the placement groove. A tension box is slidably connected to the fixed base and is located on the top of the testing platform. A first suction cup, a second suction cup, a third suction cup, and a fourth suction cup are slidably connected in the tension box. The tension box is equipped with an adjustment structure for controlling the position of the first suction cup, the second suction cup, the third suction cup, and the fourth suction cup. A 3D line laser scanner is also fixed on the testing platform.

[0009] Furthermore, the placement groove is provided with a first sliding groove, which has a "+" shaped structure. The first limiting plate, the second limiting plate, the third limiting plate and the fourth limiting plate are all slidably connected to the first sliding groove. The first limiting plate and the third limiting plate are parallel to each other, and the second limiting plate and the fourth limiting plate are parallel to each other.

[0010] Furthermore, the bottom of the testing platform is rotatably connected to a first lead screw and a second lead screw. The two ends of the first lead screw are respectively provided with a first thread and a second thread, and the two ends of the second lead screw are respectively provided with a third thread and a fourth thread. The first thread and the second thread have opposite directions of rotation, and the third thread and the fourth thread have opposite directions of rotation. The first limiting plate is threadedly connected to the first thread, the third limiting plate is threadedly connected to the second thread, the second limiting plate is threadedly connected to the third thread, and the fourth limiting plate is threadedly connected to the fourth thread.

[0011] Furthermore, the adjustment structure includes a second sliding groove and a third sliding groove, both of which are disposed on the tension box. The second and third sliding grooves are staggered in an "X" shape. The first and third suction cups are slidably connected to the second sliding groove, and the second and fourth suction cups are slidably connected to the third sliding groove.

[0012] Furthermore, a third lead screw and a fourth lead screw are rotatably connected inside the stretching box. The third lead screw has a fifth thread and a sixth thread on both sides, and the fourth lead screw has a seventh thread and an eighth thread on both sides. The fifth thread and the sixth thread have opposite directions of rotation, and the seventh thread and the eighth thread have opposite directions of rotation. The first suction cup and the fifth thread are connected by threads, the third suction cup and the sixth thread are connected by threads, the second suction cup and the seventh thread are connected by threads, and the fourth suction cup and the eighth thread are connected by threads.

[0013] Furthermore, the top of the fixed base is also provided with a telescopic component, the fixed end of the telescopic component is fixedly connected to the top of the fixed base, and the telescopic end of the telescopic component is fixedly connected to the stretching box.

[0014] Furthermore, the placement slot is also provided with a vacuum hole, and the placement slot is connected to a vacuum box, which is connected to the vacuum hole.

[0015] The working principle and beneficial effects of this utility model are as follows:

[0016] The working process of this embodiment is as follows: When it is necessary to inspect circuit boards of other sizes, the circuit board to be inspected is first placed in the placement slot, and then the first and second lead screws are activated so that the first, second, third, and fourth limiting plates abut against the perimeter of the circuit board. Then the vacuum chamber is activated to ensure that the circuit board is adsorbed and fixed in the placement slot. Then the third and fourth lead screws are activated so that the first, second, third, and fourth suction cups reach the four corners of the circuit board. Then the telescopic components are activated to ensure that the first, second, third, and fourth suction cups are adsorbed and connected to the circuit board. Then the telescopic components are activated in the opposite direction to pull the circuit board away from both ends, and the solder quality between the circuit boards is inspected by a 3D line laser scanner.

[0017] In this embodiment, a testing platform is set on a fixed base, and a stretching box is slidably set on the fixed base. The circuit board is positioned by a first limiting plate, a second limiting plate, a third limiting plate, and a fourth limiting plate. The positions of the first suction cup, the second suction cup, the third suction cup, and the fourth suction cup inside the stretching box are adjusted by an adjustment structure. This replaces the design of the prior art that directly uses the first suction cup, the second suction cup, the third suction cup, and the fourth suction cup to adsorb and stretch the circuit board. This embodiment can adjust the testing according to the actual size of the circuit board to be tested, and the testing scope is wider and the practicality is stronger. Attached Figure Description

[0018] To more clearly illustrate the technical solutions in the embodiments of this utility model or the prior art, the drawings used in the description of the embodiments or the prior art will be briefly introduced below. Obviously, the drawings described below are only some embodiments of this utility model. For those skilled in the art, other drawings can be obtained based on the structures shown in these drawings without creative effort.

[0019] Figure 1 This is a schematic diagram of the existing technology;

[0020] Figure 2 This is a schematic diagram of the overall structure of this embodiment;

[0021] Figure 3 This is a schematic diagram of the overall structure of the placement slot in this embodiment;

[0022] Figure 4 This is a schematic diagram of the internal structure of the placement slot in this embodiment;

[0023] Figure 5 This is a schematic diagram of the tension box structure in this embodiment;

[0024] Figure 6 This is a schematic diagram of the internal structure of the stretching box in this embodiment.

[0025] Explanation of icon numbers:

[0026] 1. Fixed base; 11. Placement slot; 111. Vacuum hole; 112. First sliding groove; 12. Detection table; 21. First limiting plate; 22. Second limiting plate; 23. Third limiting plate; 24. Fourth limiting plate; 3. 3D line laser scanner; 31. Tension box; 41. First suction cup; 42. Second suction cup; 43. Third suction cup; 44. Fourth suction cup; 5. Telescopic component; 6. Vacuum box; 71. First lead screw; 711. First thread; 712. Second thread; 72. Second lead screw; 721. Third thread; 722. Fourth thread; 81. Third lead screw; 811. Fifth thread; 812. Sixth thread; 82. Fourth lead screw; 821. Seventh thread; 822. Eighth thread; 91. Second sliding groove; 92. Third sliding groove.

[0027] The purpose, features, and advantages of this utility model will be further explained in conjunction with the embodiments and with reference to the accompanying drawings. Detailed Implementation

[0028] To make the objectives, technical solutions, and advantages of this application clearer, the following detailed description is provided in conjunction with the accompanying drawings and embodiments. It should be understood that the specific embodiments described herein are merely illustrative and not intended to limit the scope of this application.

[0029] like Figures 2-6 As shown in the figure, this embodiment proposes a circuit board soldering quality inspection device based on 3D line laser, the structure of which includes a fixed base 1.

[0030] In this embodiment, the testing platform 12 is mounted on the fixed base 1, and the placement groove 11 is mounted on the testing platform 12. The first limiting plate 21, the second limiting plate 22, the third limiting plate 23, and the fourth limiting plate 24 are slidably mounted within the placement groove 11. The stretching box 31 is slidably mounted on the fixed base 1 and is located on top of the testing platform 12. The first suction cup 41, the second suction cup 42, the third suction cup 43, and the fourth suction cup 44 are slidably mounted within the stretching box 31. An adjustment structure is located within the stretching box 31 to control the positions of the first suction cup 41, the second suction cup 42, the third suction cup 43, and the fourth suction cup 44. The 3D line laser scanner 3 is fixedly mounted on the testing platform 12. In this embodiment, the 3D line laser scanner 3 uses a laser projection system to irradiate a laser line onto the surface of the welding area. The scanner's receiver receives the reflected light signal after being irradiated by the laser line. Based on the time difference and angle of the reflected light, the laser scanner can accurately calculate the three-dimensional spatial coordinates of the target surface, thereby obtaining the three-dimensional surface morphology data of the area. The 3D line laser scanner 3 provides high-precision three-dimensional data at the micron level, detecting parameters such as the height, shape, and flatness of solder joints to ensure the consistency and reliability of solder quality. 3D scanning technology can adapt to complex soldering surfaces, effectively detecting not only planar soldering areas but also complex three-dimensional soldering positions. In this embodiment, the circuit board being tested is a double-layer circuit board. A tensile test is performed on both sides of the circuit board using a tensile test chamber 31 to detect the connection strength between the two layers.

[0031] In this embodiment, the first sliding groove 112 is disposed within the placement groove 11. The first sliding groove 112 has a cross-shaped structure. The first limiting plate 21, the second limiting plate 22, the third limiting plate 23, and the fourth limiting plate 24 are all slidably connected to the first sliding groove 112. The first limiting plate 21 and the third limiting plate 23 are parallel to each other, as are the second limiting plate 22 and the fourth limiting plate 24. This design allows for the placement of circuit boards of different sizes by adjusting the spacing between the first limiting plate 21, the second limiting plate 22, the third limiting plate 23, and the fourth limiting plate 24. This effectively prevents components from exceeding the set range of motion during sliding, ensuring the safety and accuracy of the structure.

[0032] In this embodiment, the first lead screw 71 and the second lead screw 72 are rotatably disposed at the bottom of the detection table 12. The first thread 711 and the second thread 712 are respectively disposed at both ends of the first lead screw 71, and the third thread 721 and the fourth thread 722 are respectively disposed at both ends of the second lead screw 72. The first thread 711 and the second thread 712 have opposite directions of rotation, and the third thread 721 and the fourth thread 722 have opposite directions of rotation. The first limiting plate 21 is threadedly connected to the first thread 711, the third limiting plate 23 is threadedly connected to the second thread 712, the second limiting plate 22 is threadedly connected to the third thread 721, and the fourth limiting plate 24 is threadedly connected to the fourth thread 722. In this embodiment, the movement of the first limiting plate 21, the second limiting plate 22, the third limiting plate 23, and the fourth limiting plate 24 are controlled by the first lead screw 71 and the second lead screw 72. Since the rotational stroke of the first lead screw 71 and the second lead screw 72 is much greater than the movement stroke of the first limiting plate 21, the second limiting plate 22, the third limiting plate 23, and the fourth limiting plate 24, the control by the first lead screw 71 and the second lead screw 72 is more precise and reliable. Moreover, since the first limiting plate 21, the second limiting plate 22, the third limiting plate 23, and the fourth limiting plate 24 cannot drive the first lead screw 71 or the second lead screw 72 to rotate in the reverse direction, a self-locking mechanism will be formed when the first lead screw 71 and the second lead screw 72 are de-energized, to prevent misalignment during operation from affecting the detection of the next circuit board.

[0033] The adjustment structure in this embodiment includes a second sliding groove 91 and a third sliding groove 92. Both the second and third sliding grooves 91 and 92 are mounted on the tension box 31, forming an "X" shape. The first suction cup 41 and the third suction cup 43 are slidably connected to the second sliding groove 91, and the second suction cup 42 and the fourth suction cup 44 are slidably connected to the third sliding groove 92. This design ensures that the spacing between the first suction cup 41, the second suction cup 42, the third suction cup 43, and the fourth suction cup 44 can be adjusted according to the actual size of the circuit board. This ensures that the first suction cup 41, the second suction cup 42, the third suction cup 43, and the fourth suction cup 44 can pull the four shorter parts of the circuit board, thereby minimizing damage to the circuit board during testing.

[0034] In this embodiment, the third lead screw 81 and the fourth lead screw 82 are rotatably disposed within the tension box 31. The third lead screw 81 is provided with a fifth thread 811 and a sixth thread 812 on both sides, and the fourth lead screw 82 is provided with a seventh thread 821 and an eighth thread 822 on both sides. The fifth thread 811 and the sixth thread 812 rotate in opposite directions, and the seventh thread 821 and the eighth thread 822 rotate in opposite directions. The first suction cup 41 is threadedly connected to the fifth thread 811, the third suction cup 43 is threadedly connected to the sixth thread 812, the second suction cup 42 is threadedly connected to the seventh thread 821, and the fourth suction cup 44 is threadedly connected to the eighth thread 822. In this embodiment, the movement of the first suction cup 41, the second suction cup 42, the third suction cup 43, and the fourth suction cup 44 is controlled by the third lead screw 81 and the fourth lead screw 82. Since the rotational stroke of the third lead screw 81 and the fourth lead screw 82 is much greater than the movement stroke of the first suction cup 41, the second suction cup 42, the third suction cup 43, and the fourth suction cup 44, the movement of the first suction cup 41, the second suction cup 42, the third suction cup 43, and the fourth suction cup 44 is more precise when controlled by the third lead screw 81 and the fourth lead screw 82. Moreover, since the first suction cup 41, the second suction cup 42, the third suction cup 43, and the fourth suction cup 44 cannot drive the third lead screw 81 and the fourth lead screw 82 in the reverse direction, the positions of the first suction cup 41, the second suction cup 42, the third suction cup 43, and the fourth suction cup 44 can be self-locked when the third lead screw 81 and the fourth lead screw 82 stop moving, which facilitates the testing of the next circuit board.

[0035] In this embodiment, the top of the fixed base 1 is also provided with a telescopic member 5. The fixed end of the telescopic member 5 is fixedly connected to the top of the fixed base 1, and the telescopic end of the telescopic member 5 is fixedly connected to the tension box 31. In this embodiment, the telescopic member 5 is preferably a hydraulic cylinder or a pneumatic cylinder. Hydraulic cylinders or pneumatic cylinders are existing technologies and will not be described in detail in this embodiment.

[0036] In this embodiment, a vacuum hole 111 is disposed on a placement groove 11, which is connected to a vacuum box 6, which is also connected to the vacuum hole 111. After the vacuum hole 111 is connected to the vacuum box 6, a negative pressure is generated within the placement groove 11, adsorbing the object or component to be placed. This adsorption force effectively fixes the position of the component, preventing displacement due to vibration or external interference during operation, thereby improving the stability and positioning accuracy of the object. This is particularly suitable for processes or assembly operations requiring precise positioning.

[0037] The working process of this embodiment is as follows: When it is necessary to inspect circuit boards of other sizes, the circuit board to be inspected is first placed into the placement groove 11, and then the first lead screw 71 and the second lead screw 72 are activated so that the first limiting plate 21, the second limiting plate 22, the third limiting plate 23 and the fourth limiting plate 24 abut against the perimeter of the circuit board. Then the vacuum box 6 is activated to ensure that the circuit board is adsorbed and fixed to the placement groove 11. Then the third lead screw 81 and the fourth lead screw 82 are activated so that the first suction cup 41, the second suction cup 42, the third suction cup 43 and the fourth suction cup 44 reach the four corners of the circuit board. Then the telescopic component 5 is activated to ensure that the first suction cup 41, the second suction cup 42, the third suction cup 43 and the fourth suction cup 44 are adsorbed and connected to the circuit board. Then the telescopic component 5 is activated in the opposite direction to pull the circuit board away from both ends, and the solder quality between the circuit boards is inspected by the 3D line laser scanner 3.

[0038] In the accompanying drawings of this embodiment, the same or similar reference numerals correspond to the same or similar components. In the description of this application, it should be understood that if terms such as "upper," "lower," "left," and "right" indicate the orientation or positional relationship based on the orientation or positional relationship shown in the accompanying drawings, they are only for the convenience of describing this application and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation. Therefore, the terms used to describe positional relationships in the accompanying drawings are only for illustrative purposes and should not be construed as limiting this patent. For those skilled in the art, the specific meaning of the above terms can be understood according to the specific circumstances.

[0039] The above are merely preferred embodiments of this application and are not intended to limit this application. Any modifications, equivalent substitutions, and improvements made within the spirit and principles of this application should be included within the protection scope of this application.

Claims

1. A circuit board soldering quality inspection device based on 3D line laser, comprising a fixing base (1), characterized in that, The fixed base (1) is provided with a testing platform (12), the testing platform (12) is provided with a placement groove (11), a first limiting plate (21), a second limiting plate (22), a third limiting plate (23) and a fourth limiting plate (24) are slidably connected in the placement groove (11), a tension box (31) is slidably connected on the fixed base (1), the tension box (31) is set on the top of the testing platform (12), a first suction cup (41), a second suction cup (42), a third suction cup (43) and a fourth suction cup (44) are slidably connected in the tension box (31), the tension box (31) is provided with an adjustment structure for controlling the position of the first suction cup (41), the second suction cup (42), the third suction cup (43) and the fourth suction cup (44), and a 3D line laser scanner (3) is also fixed on the testing platform (12).

2. The circuit board solder quality inspection device based on 3D line laser according to claim 1, characterized in that, The placement slot (11) is provided with a first sliding slot (112), which is a "+" shaped structure. The first limiting plate (21), the second limiting plate (22), the third limiting plate (23) and the fourth limiting plate (24) are all slidably connected to the first sliding slot (112). The first limiting plate (21) and the third limiting plate (23) are parallel to each other, and the second limiting plate (22) and the fourth limiting plate (24) are parallel to each other.

3. The circuit board solder quality inspection device based on 3D line laser according to claim 2, characterized in that, The bottom of the testing platform (12) is rotatably connected to a first lead screw (71) and a second lead screw (72). The two ends of the first lead screw (71) are respectively provided with a first thread (711) and a second thread (712). The two ends of the second lead screw (72) are respectively provided with a third thread (721) and a fourth thread (722). The first thread (711) and the second thread (712) have opposite directions of rotation. The third thread (721) and the fourth thread (722) have opposite directions of rotation. The first limiting plate (21) is threaded to the first thread (711). The third limiting plate (23) is threaded to the second thread (712). The second limiting plate (22) is threaded to the third thread (721). The fourth limiting plate (24) is threaded to the fourth thread (722).

4. The circuit board solder quality inspection device based on 3D line laser according to claim 1, characterized in that, The adjustment structure includes a second sliding groove (91) and a third sliding groove (92). The second sliding groove (91) and the third sliding groove (92) are both provided on the tension box (31). The second sliding groove (91) and the third sliding groove (92) are staggered in an "X" shape. The first suction cup (41) and the third suction cup (43) are both slidably connected to the second sliding groove (91). The second suction cup (42) and the fourth suction cup (44) are both slidably connected to the third sliding groove (92).

5. The circuit board solder quality inspection device based on 3D line laser according to claim 4, characterized in that, The stretching box (31) is rotatably connected to a third lead screw (81) and a fourth lead screw (82). The third lead screw (81) has a fifth thread (811) and a sixth thread (812) on both sides. The fourth lead screw (82) has a seventh thread (821) and an eighth thread (822) on both sides. The fifth thread (811) and the sixth thread (812) have opposite directions of rotation. The seventh thread (821) and the eighth thread (822) have opposite directions of rotation. The first suction cup (41) and the fifth thread (811) are connected by threads. The third suction cup (43) and the sixth thread (812) are connected by threads. The second suction cup (42) and the seventh thread (821) are connected by threads. The fourth suction cup (44) and the eighth thread (822) are connected by threads.

6. The circuit board solder quality inspection device based on 3D line laser according to claim 1, characterized in that, The top of the fixed base (1) is also provided with a telescopic component (5), the fixed end of the telescopic component (5) is fixedly connected to the top of the fixed base (1), and the telescopic end of the telescopic component (5) is fixedly connected to the stretching box (31).

7. The circuit board solder quality inspection device based on 3D line laser according to claim 3, characterized in that, The placement slot (11) is also provided with a vacuum hole (111), and the placement slot (11) is connected to a vacuum box (6), which is connected to the vacuum hole (111).

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