Heat dissipation film and display device

Abstract

The utility model provides a heat dissipation film and a display device, and the heat dissipation film comprises a heat dissipation layer composed of graphite, a reinforcing member arranged around the periphery of the heat dissipation layer, and an electric conduction and heat conduction layer at least attached to the heat dissipation layer. Wherein the range of the tensile strength of the reinforcing piece is 500 MPa to 1050 MPa.

Description

Technical Field

[0001] This disclosure relates to the field of display technology, and in particular to a heat dissipation film and a display device. Background Technology

[0002] In recent years, Organic Light Emitting Diode (OLED) display technology has rapidly captured the market due to its advantages such as self-illumination and flexibility. However, with the widespread application of OLED in mainstream flagship smartphones, the number of returned products is also gradually increasing. During the repair process, OLED modules are prone to developing water ripple (molding) issues after disassembly, which seriously affects the product's reusability. Therefore, effectively improving the water ripple problem of OLED modules has become an urgent technical issue to be addressed. Utility Model Content

[0003] This disclosure provides a heat dissipation film and a display device, the specific solutions of which are as follows:

[0004] This disclosure provides a heat dissipation film, comprising:

[0005] A heat dissipation layer composed of graphite, a reinforcing member disposed around the periphery of the heat dissipation layer, and a conductive and thermally conductive layer at least in contact with the heat dissipation layer;

[0006] The tensile strength of the reinforcing member ranges from 515 MPa to 1035 MPa.

[0007] Optionally, in this embodiment of the present disclosure, a groove partially formed on the conductive and thermally conductive layer surrounding the heat dissipation layer is further included; the orthographic projection of the groove on the reinforcing member is located inside the reinforcing member.

[0008] Optionally, in this embodiment of the present disclosure, an adhesive is further included, which is disposed within the groove; the adhesive is used to bond to the middle frame, and the orthographic projection of the adhesive on the reinforcing member is located inside the reinforcing member.

[0009] Optionally, in this embodiment of the present disclosure, along a direction parallel to the plane where the heat dissipation layer is located, the groove is 0.2 mm to 1 mm away from the side edge of the heat dissipation layer opposite to the side edge of the reinforcing member opposite to the heat dissipation layer.

[0010] Optionally, in this embodiment of the present disclosure, it further includes a first through-hole penetrating the heat dissipation layer, a second through-hole penetrating the conductive and thermally conductive layer, and thermoplastic polyester material respectively attached to the sidewalls of the first through-hole and the second through-hole; wherein, the sidewall of the first through-hole is recessed relative to the sidewall of the second through-hole, and the area enclosed by the first through-hole and the second through-hole constitutes a fingerprint recognition area.

[0011] Optionally, in this embodiment of the present disclosure, along a direction perpendicular to the plane where the heat dissipation layer is located, the heat dissipation film further includes a buffer layer and an adhesive layer sequentially disposed on the side of the heat dissipation layer opposite to the conductive and thermally conductive layer.

[0012] Optionally, in this embodiment of the present disclosure, along a direction perpendicular to the plane where the heat dissipation layer is located, the heat dissipation film further includes a release film located on the side of the adhesive layer away from the heat dissipation layer, and a protective film located on the side of the conductive and thermally conductive layer away from the heat dissipation layer; wherein, the thickness of the release film is less than the thickness of the protective film, and the peeling force of the release film is less than the peeling force of the protective film.

[0013] Optionally, in this embodiment of the present disclosure, the distance between the heat dissipation layer and the reinforcing member is 0.05 mm to 0.35 mm along a direction parallel to the plane where the heat dissipation layer is located.

[0014] Optionally, in this embodiment of the present disclosure, along a direction parallel to the plane of the heat dissipation layer, the heat dissipation film further includes a polyester film material located between the reinforcing member and the heat dissipation layer. The polyester film material is disposed around the periphery of the heat dissipation layer and is bonded to the heat dissipation layer. The reinforcing member is disposed around the polyester film material. The tensile strength of the polyester film material is in the range of 150 MPa to 240 MPa.

[0015] Optionally, in this embodiment of the present disclosure, the edge of the reinforcing member is flush with the corresponding edge of the conductive and thermally conductive layer along a direction parallel to the plane where the heat dissipation layer is located.

[0016] Accordingly, embodiments of this disclosure provide a display device, comprising:

[0017] A heat dissipation film and a display module bonded to the heat dissipation film;

[0018] The heat dissipation film includes a heat dissipation layer composed of graphite, a reinforcing member disposed around the periphery of the heat dissipation layer, and a conductive and thermally conductive layer that is at least attached to the heat dissipation layer; the tensile strength of the reinforcing member is in the range of 500MPa to 1050MPa.

[0019] Optionally, in this embodiment of the present disclosure, an adhesive is further included on the side of the conductive and thermally conductive layer opposite to the display module; the adhesive is used to bond with the middle frame, and the orthogonal projection of the adhesive on the display module is located inside the reinforcing member.

[0020] Optionally, in this embodiment of the present disclosure, a groove partially formed on the conductive and thermally conductive layer surrounding the heat dissipation layer is further included, and an adhesive disposed within the groove; the adhesive is used to bond with the middle frame, and the orthographic projection of the adhesive on the display module is located inside the reinforcing member.

[0021] Optionally, in this embodiment of the present disclosure, at least one clip is further provided for fixing the heat dissipation film to the display module; the adhesive is provided with receiving spaces to accommodate each of the clips.

[0022] Optionally, in this embodiment of the present disclosure, along a direction perpendicular to the plane of the heat dissipation layer, the display device further includes a cover plate disposed on the side of the display module away from the heat dissipation film; each of the latches includes a first part and a second part connected in sequence; wherein, the first part extends along a direction parallel to the plane of the cover plate, and the second part extends along a direction perpendicular to the plane of the cover plate; the first part is fixedly connected to the conductive and thermally conductive layer by a first adhesive material, and the second part is fixedly connected to the cover plate by a second adhesive material.

[0023] Optionally, in this embodiment of the disclosure, each of the buckles is a one-piece molded structure.

[0024] Optionally, in this embodiment of the present disclosure, a middle frame connected to the adhesive is further included, the middle frame having an accommodating space that avoids the second part.

[0025] Optionally, in this embodiment of the present disclosure, the heat dissipation film further includes a first through-hole penetrating the heat dissipation layer, a second through-hole penetrating the conductive and thermally conductive layer, and thermoplastic polyester material respectively attached to the sidewalls of the first through-hole and the second through-hole; wherein, the sidewall of the first through-hole is recessed relative to the sidewall of the second through-hole, and the area enclosed by the first through-hole and the second through-hole constitutes a fingerprint recognition area. Attached Figure Description

[0026] Figure 1 This is a simplified schematic diagram illustrating one of the instantaneous deformations of an OLED module caused by the interaction between the disassembly pull and the mid-frame adhesive pull during the disassembly process in related technologies.

[0027] Figure 2 This is a schematic diagram of one structure of a heat dissipation film provided in an embodiment of the present disclosure;

[0028] Figure 3 For along Figure 2 A schematic diagram of one type of cross-sectional structure in the direction shown in MM;

[0029] Figure 4 for Figure 2A schematic diagram of one type of heat dissipation layer structure;

[0030] Figure 5 for Figure 2 A schematic diagram of one type of reinforcing component;

[0031] Figure 6 for Figure 2 A schematic diagram of one type of structure for bonding the heat dissipation layer and the reinforcing component;

[0032] Figure 7 for Figure 2 A schematic diagram of one type of structure for a conductive and thermally conductive layer;

[0033] Figure 8 A schematic diagram of one structure of the heat dissipation film provided in an embodiment of this disclosure;

[0034] Figure 9 A top view schematic diagram of one embodiment of the heat dissipation film provided in this disclosure;

[0035] Figure 10 For along Figure 9 A schematic diagram of one type of cross-sectional structure in the direction shown in the middle NN;

[0036] Figure 11 for Figure 9 A schematic diagram of one type of medium-strength rubber;

[0037] Figure 12 for Figure 9 A top view schematic diagram of one type of structure between the conductive and thermally conductive layer and the adhesive;

[0038] Figure 13 A schematic diagram of one structure of the heat dissipation film provided in an embodiment of this disclosure;

[0039] Figure 14 A schematic diagram of one structure of the heat dissipation film provided in an embodiment of this disclosure;

[0040] Figure 15 A schematic diagram of one structure of the heat dissipation film provided in an embodiment of this disclosure;

[0041] Figure 16 A schematic diagram of one structure of the heat dissipation film provided in an embodiment of this disclosure;

[0042] Figure 17 This is a schematic diagram of one structure of a display device provided in an embodiment of the present disclosure;

[0043] Figure 18 This is a schematic diagram of one structure of a display device provided in an embodiment of the present disclosure;

[0044] Figure 19This is a schematic diagram of one structure of a display device provided in an embodiment of the present disclosure;

[0045] Figure 20 This is a schematic diagram of one possible distribution of the latches in a display device provided in an embodiment of this disclosure;

[0046] Figure 21 For along Figure 20 A schematic diagram of one type of cross-sectional structure in the direction shown in SS;

[0047] Explanation of reference numerals in the attached figures:

[0048] 01-Mid-frame adhesive; 10-Heat dissipation layer; 20-Reinforcing component; 30-Conductive and thermally conductive layer; 40-Groove; 50-Adhesive; H1-First via; H2-Second via; 60-Thermoplastic polyester material; 70-Buffer layer; 80-Adhesive layer; 90-Release film; 91-Protective film; 92-Polyester film material; 100-Heat dissipation film; 200-Display module; 300-Snap-on; 400-Cover plate; 301-First part; 302-Second part; 303-First adhesive material; 304-Second adhesive material; 500-Back film; 600-Display panel; 700-Filter layer; 800-Adhesive layer; 900-Protective layer. Detailed Implementation

[0049] To make the objectives, technical solutions, and advantages of the embodiments of this disclosure clearer, the technical solutions of the embodiments of this disclosure will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only some, not all, of the embodiments of this disclosure. Furthermore, the embodiments and features in the embodiments of this disclosure can be combined with each other without conflict. All other embodiments obtained by those skilled in the art based on the described embodiments of this disclosure without creative effort are within the scope of protection of this disclosure.

[0050] Unless otherwise defined, the technical or scientific terms used in this disclosure shall have the ordinary meaning understood by one of ordinary skill in the art to which this disclosure pertains. The terms “first,” “second,” and similar terms used in this disclosure do not indicate any order, quantity, or importance, but are merely used to distinguish different components. Terms such as “comprising” or “including” mean that the element or object preceding the word encompasses the elements or objects listed following the word and their equivalents, without excluding other elements or objects. Terms such as “connected” or “linked” are not limited to physical or mechanical connections, but can include electrical connections, whether direct or indirect. Terms such as “inner,” “outer,” “upper,” and “lower” are used only to indicate relative positional relationships; when the absolute position of the described objects changes, the relative positional relationship may also change accordingly.

[0051] It should be noted that the dimensions and shapes of the figures in the accompanying drawings do not reflect actual proportions and are intended only to illustrate the content of this disclosure. Furthermore, the same or similar reference numerals denote the same or similar elements or elements having the same or similar functions throughout.

[0052] In related technologies, the heat dissipation film (Super Clean Film, SCF) of OLED modules typically uses polyethylene terephthalate (PET) to wrap the graphite edges. However, after disassembly and heating, when the frame adhesive 01 separates from the heat dissipation film, wrinkles easily form on the film, leading to deformation of the polarizer (POL), ultimately resulting in a wavy pattern on the front of the module. Figure 1 The diagram shows a simplified illustration of the instantaneous deformation of the OLED module during disassembly, caused by the interaction of the disassembly pull and the mid-frame adhesive pull. Arrow y1 indicates the direction of the disassembly pull, and arrow y2 indicates the direction of the mid-frame adhesive pull.

[0053] In view of this, the present disclosure provides a heat dissipation film and a display device to fundamentally solve the problem of water ripples during disassembly and improve the performance of the display device.

[0054] like Figure 2 As shown, this disclosure provides a heat dissipation film, comprising:

[0055] A heat dissipation layer 10 composed of graphite, a reinforcing member 20 disposed around the periphery of the heat dissipation layer 10, and a conductive and thermally conductive layer 30 at least in contact with the heat dissipation layer 10.

[0056] The tensile strength of the reinforcing member 20 ranges from 500 MPa to 1050 MPa.

[0057] In specific implementation, the heat dissipation film provided in this embodiment includes a heat dissipation layer 10, a reinforcing member 20, and a conductive and thermally conductive layer 30. The heat dissipation layer 10 is composed of graphite, ensuring the uniformity of heat conduction. The reinforcing member 20 is disposed around the periphery of the heat dissipation layer 10, and the tensile strength of the reinforcing member 20 ranges from 515 MPa to 1035 MPa. This effectively improves the edge strength of the heat dissipation film. Therefore, even if the heat dissipation film is subsequently applied to a display device, upon disassembly, when the heat dissipation film and adhesive 50 delaminate, the increased strength of the heat dissipation film itself helps to prevent wrinkles, thus ensuring the improvement of water ripple patterns. Furthermore, the conductive and thermally conductive layer 30 is at least attached to the heat dissipation layer 10. For example, the same surface of the conductive and thermally conductive layer 30 is attached not only to the heat dissipation layer 10 but also to the reinforcing member 20. For example, the material of the conductive and thermally conductive layer 30 is copper foil. In this way, the stability of the heat dissipation film structure is ensured, while also guaranteeing the heat dissipation and electrical conductivity of the heat dissipation film.

[0058] In the embodiments disclosed herein, the heat dissipation film may be configured in several ways, but is not limited to these few ways.

[0059] In one exemplary embodiment, the orthographic projections of the reinforcing member 20 and the heat dissipation layer 10 onto the conductive and thermally conductive layer 30 are both located inside the conductive and thermally conductive layer 30.

[0060] like Figure 3 The following is along Figure 2 The schematic diagram of one type of cross-sectional structure in the direction shown in the middle MM shows that, specifically, the orthogonal projections of the reinforcing member 20 and the heat dissipation layer 10 on the conductive and thermally conductive layer 30 are both located inside the conductive and thermally conductive layer 30. Accordingly, the conductive and thermally conductive layer 30 can be a whole layer without a pattern design, so as to ensure the conductive and thermally conductive performance of the heat dissipation film while taking into account the structural stability of the heat dissipation film.

[0061] To explain more clearly Figure 2 In the exemplary embodiment shown, the relationship between the various film layer structures is combined with Figures 4 to 7 As shown, where, Figure 4 The diagram shows one possible structure of the heat dissipation layer 10. Figure 5 The diagram shown is a schematic diagram of one possible structure of the reinforcing member 20. Figure 6 The diagram shows one possible structure for the bonding between the heat dissipation layer 10 and the reinforcing member 20. Figure 7 The diagram shows one possible structure of the conductive and thermally conductive layer 30.

[0062] In one exemplary embodiment, combined with Figure 8As shown, the heat dissipation film also includes a groove 40 partially formed around the heat dissipation layer 10 on the conductive and thermally conductive layer 30; the orthographic projection of the groove 40 on the reinforcing member 20 is located inside the reinforcing member 20.

[0063] In practical implementation, after the heat dissipation film with the groove 40 is shipped to the terminal manufacturer, the terminal manufacturer can, according to actual application needs, set adhesive in the groove for bonding the mid-frame. This ensures both a lightweight design of the heat dissipation film and meets customer requirements. In one exemplary embodiment, the heat dissipation film further includes adhesive 50 disposed within the groove 40; the adhesive 50 is used for bonding to the mid-frame, and the orthographic projection of the adhesive 50 onto the reinforcing member 20 is located inside the reinforcing member 20.

[0064] Combination Figure 9 and Figure 10 As shown, where, Figure 9 This is a top view schematic diagram of one embodiment of the heat dissipation film provided in this disclosure. Figure 10 For along Figure 9 The schematic diagram of one type of cross-sectional structure in the direction shown in the middle NN shows that, in addition to the groove 40 formed on the conductive and thermally conductive layer 30 and surrounding the heat dissipation layer 10, the heat dissipation film also includes adhesive 50 contained in the groove 40; the adhesive 50 is used to bond with the middle frame, and the orthographic projection of the adhesive 50 on the reinforcing member 20 is located inside the reinforcing member 20. In this way, on the one hand, the groove 40 effectively constrains the adhesive 50, which can reduce the bonding area between the adhesive 50 and the middle frame to a certain extent. Even after the adhesive 50 is bonded to the middle frame, when the heat dissipation film and the adhesive 50 are separated, the pulling force at the moment of disassembly can be effectively reduced, thereby avoiding the generation of wrinkles on the back of the heat dissipation film, thus providing a guarantee for improving the water ripple problem. On the other hand, placing the adhesive 50 directly in the groove 40 opened on the conductive and heat-conducting layer 30 reduces the thickness of the heat dissipation film to a certain extent, providing a guarantee for the subsequent thinner and lighter design of the display device. In addition, the conductive and heat-conducting layer 30 can effectively disperse the stress between the middle frame and the adhesive 50 during disassembly to a certain extent, thus providing a guarantee for improving the water ripple problem.

[0065] Still combined Figure 9 The exemplary embodiments shown are as follows: Figure 11 The diagram shown is a top view of one possible configuration of the adhesive 50. Correspondingly, a groove 40 for accommodating the adhesive 50 is also provided. Figure 11 The location shown; as Figure 12The diagram shows one possible top view of the structure between the conductive and thermally conductive layer 30 and the adhesive 50. Furthermore, the orthographic projection of the adhesive 50 onto the reinforcing member 20 is located inside the reinforcing member 20. This effectively prevents damage to the heat dissipation layer 10 from the adhesive 50 while maintaining the structural stability of the heat dissipation film, thus improving the performance of the heat dissipation film.

[0066] In this embodiment of the present disclosure, along a direction parallel to the plane where the heat dissipation layer 10 is located, the groove 40 is located on one side edge away from the heat dissipation layer 10, and is 0.2 mm to 1 mm away from the corresponding side edge away from the heat dissipation layer 10 of the reinforcing member 20.

[0067] Still combined Figure 9 In the exemplary embodiment shown, along a direction parallel to the plane of the heat dissipation layer 10, the groove 40 is positioned away from one edge of the heat dissipation layer 10, and the corresponding edge of the reinforcing member 20 away from the heat dissipation layer 10 is 0.2mm to 1mm away. For example, along a direction parallel to the plane of the heat dissipation layer 10, the distance between the groove 40 and the corresponding edge of the reinforcing member 20 away from the heat dissipation layer 10 is 0.2mm. In practical applications, the groove 40 can be positioned as close as possible to the edge of the reinforcing member 20. This can, to some extent, avoid the water ripple problem of the heat dissipation film during disassembly, thus improving the performance of the heat dissipation film.

[0068] In this embodiment of the present disclosure, the heat dissipation film further includes a first through-hole H1 penetrating the heat dissipation layer 10, a second through-hole H2 penetrating the conductive and thermally conductive layer 30, and a thermoplastic polyester material 60 respectively attached to the sidewalls of the first through-hole H1 and the second through-hole H2; wherein, the sidewall of the first through-hole H1 is recessed relative to the sidewall of the second through-hole H2, and the area enclosed by the first through-hole H1 and the second through-hole H2 constitutes a fingerprint recognition area.

[0069] Still combined Figure 2 and Figure 9 The exemplary embodiment shown further includes a first through-hole H1 penetrating the heat dissipation layer 10, a second through-hole H2 penetrating the conductive and thermally conductive layer 30, and a thermoplastic polyester material 60 respectively bonded to the sidewalls of the first through-hole H1 and the second through-hole H2; wherein the tensile strength of the thermoplastic polyester material 60 is in the range of 50 MPa to 80 MPa, and its impact strength is 1.5 kJ / m. 2 ~2.5kJ / m 2For example, the thermoplastic polyester material 60 can be PET, polybutylene terephthalate (PBT), polypropylene terephthalate (PTT), polycyclohexanediol terephthalate (PCT), polyethylene terephthalate copolymer (PETG), polyethylene terephthalate copolymer (PBTG), polyethylene terephthalate copolymer (PCTG), polyethylene terephthalate copolymer (PEN), etc., and is not limited thereto. In this way, the thermoplastic polyester material 60 effectively avoids the migration of powder from the heat dissipation layer 10 inside the heat sink, improving the performance of the heat dissipation film.

[0070] Furthermore, the sidewall of the first via H1 is recessed compared to the sidewall of the second via H2. This allows the conductive and thermally conductive layer 30 to constrain the edge of the heat dissipation layer 10 at the first via H1 to some extent, thereby improving the performance of the heat dissipation film. Moreover, the area enclosed by the first via H1 and the second via H2 constitutes a fingerprint recognition area. In this way, fingerprint recognition devices can be disposed within the area enclosed by the first via H1 and the second via H2, further improving the performance of the heat dissipation film.

[0071] In this embodiment of the present disclosure, along a direction perpendicular to the plane where the heat dissipation layer 10 is located, the heat dissipation film further includes a buffer layer 70 and an adhesive layer 80 sequentially disposed on the side of the heat dissipation layer 10 away from the conductive and thermally conductive layer 30.

[0072] In the specific implementation process, combined with Figure 13 and Figure 14 As shown, along a direction perpendicular to the plane of the heat dissipation layer 10, the heat dissipation film also includes a buffer layer 70 and an adhesive layer 80 sequentially disposed on the side of the heat dissipation layer 10 facing away from the conductive and thermally conductive layer 30. For example, the material of the buffer layer 70 is foam, and the material of the adhesive layer 80 is EMBO (extensive membrane adhesive). Of course, the materials of the buffer layer 70 and the adhesive layer 80 can be set according to actual application needs, and are not limited here.

[0073] In this embodiment of the present disclosure, along a direction perpendicular to the plane of the heat dissipation layer 10, the heat dissipation film further includes a release film 90 located on the side of the adhesive layer 80 away from the heat dissipation layer 10, and a protective film 91 located on the side of the conductive and thermally conductive layer 30 away from the heat dissipation layer 10; wherein, the thickness of the release film 90 is less than the thickness of the protective film 91, and the peel force of the release film 90 is less than the peel force of the protective film 91.

[0074] In the specific implementation process, it is still combined with Figure 13 and Figure 14As shown, along a direction perpendicular to the plane of the heat dissipation layer 10, the heat dissipation film also includes a release film 90 located on the side of the adhesive layer 80 facing away from the heat dissipation layer 10, and a protective film 91 located on the side of the conductive and thermally conductive layer 30 facing away from the heat dissipation layer 10. Exemplarily, the orthogonal projection of the conductive and thermally conductive layer 30 onto the protective film 91 is located inside the protective film 91. Exemplarily, the edge of the protective film 91 is recessed relative to the edge of the conductive and thermally conductive layer 30. In this way, the protective film 91 effectively protects the side of the conductive and thermally conductive layer 30 facing away from the heat dissipation layer 10, preventing damage from the outside. Furthermore, the edges of the release film 90 are flush with the edges of the buffer layer 70 and the adhesive layer 80, respectively, thereby effectively protecting the side of the adhesive layer 80 facing away from the heat dissipation layer 10, preventing damage from the outside. It should be noted that "flush" here can be understood as the edges of both being completely flush, or as relatively flush within the range of process tolerance. For example, the difference between the edges is 5%. Or, for example, the difference between the edges is within 5mm. Furthermore, the thickness of the release film 90 is less than the thickness of the protective film 91. For example, the thickness of the protective film 91 ranges from 75 μm to 95 μm, and the thickness of the release film 90 ranges from 40 μm to 60 μm. For example, in the same heat dissipation film, the thickness of the protective film 91 is 85 μm, and the thickness of the release film 90 is 50 μm. In addition, the peel force of the release film 90 is less than the peel force of the protective film 91. For example, the peel force of the release film 90 ranges from 2 gf / in to 4 gf / in, and the peel force of the protective film 91 ranges from 9 gf / in to 11 gf / in. For example, in the same heat dissipation film, the peel force of the release film 90 is 3 gf / in, and the peel force of the protective film 91 is 10 gf / in. In this way, when the adhesive layer 80 of the heat dissipation film is bonded to the back film in the display device by peeling off the release film 90, damage to the corresponding adhesive material of the adhesive layer 80 can be effectively avoided, thereby improving the performance of the heat dissipation film.

[0075] In this embodiment of the present disclosure, the distance between the heat dissipation layer 10 and the reinforcing member 20 is 0.05mm to 0.35mm along a direction parallel to the plane where the heat dissipation layer 10 is located.

[0076] Still combined Figure 3 and Figure 10 In the exemplary embodiment shown, the distance between the heat dissipation layer 10 and the reinforcing member 20 along a direction parallel to the plane of the heat dissipation layer 10 is 0.05 mm to 0.35 mm. For example, the distance between the heat dissipation layer 10 and the reinforcing member 20 is 0.2 mm. This avoids the problem of edge pressing between the heat dissipation layer 10 and the reinforcing member 20, thereby avoiding the water ripple problem caused by the protrusion on the surface of the heat dissipation film due to edge pressing.

[0077] In this embodiment of the present disclosure, along a direction parallel to the plane of the heat dissipation layer 10, the heat dissipation film further includes a polyester film material 92 located between the reinforcing member 20 and the heat dissipation layer 10. The polyester film material 92 is disposed around the periphery of the heat dissipation layer 10 and is bonded to the heat dissipation layer 10. The reinforcing member 20 is disposed around the polyester film material 92. The tensile strength of the polyester film material is in the range of 150 MPa to 240 MPa.

[0078] based on Figure 3 and Figure 10 The exemplary embodiments shown are as follows: Figure 15 and Figure 16 As shown, along a direction parallel to the plane of the heat dissipation layer 10, the heat dissipation film also includes a polyester film material 92 located between the reinforcing member 20 and the heat dissipation layer 10. The tensile strength of the polyester film material 92 ranges from 150 MPa to 240 MPa. For example, the polyester film material 92 can be a polyethylene terephthalate (i.e., Mylar) film manufactured by DuPont. Furthermore, the impact strength of the polyester film material 92 can be in the range of 6 kJ / m. 2 ~10kJ / m 2 Of course, other polyester film materials 92 can also be used according to actual application needs. These materials need to ensure high temperature resistance above 200℃ and good water vapor permeability, and are not limited here. Moreover, the polyester film material 92 is arranged around the periphery of the heat dissipation layer 10, and the polyester film material 92 is attached to the heat dissipation layer 10, with the reinforcing member 20 arranged around the polyester film material 92. For example, a certain space is reserved between the reinforcing member 20 and the polyester film material 92 for splicing. For example, a Mylar with a width of 10μm can be arranged around the graphite. Since the polyester film material 92 is relatively soft, it can effectively avoid water ripple problems at the corresponding positions of the splice, thereby improving the performance of the heat dissipation film.

[0079] In this embodiment of the disclosure, the edge of the reinforcing member 20 is flush with the corresponding edge of the conductive and thermally conductive layer 30 along a direction parallel to the plane where the heat dissipation layer 10 is located.

[0080] In the specific implementation process, it is still combined with Figure 3 , Figure 10 as well as Figures 13 to 16 As shown in the embodiment, the edge of the reinforcing member 20 is flush with the edge of the conductive and thermally conductive layer 30, thereby ensuring the structural stability of the heat dissipation film. It should be noted that "flush" here can be understood as the edges of both being completely flush, or as relatively flush within the range of manufacturing tolerances. For example, the edges may differ by 5%. Or, the edges may differ by less than 5mm.

[0081] Based on the same publicly disclosed concept, such as Figure 17 As shown in the embodiments of this disclosure, a display device is also provided. Specifically, the display device includes:

[0082] Heat dissipation film 100 and display module 200 attached to heat dissipation film 100;

[0083] The heat dissipation film 100 includes a heat dissipation layer 10 composed of graphite, a reinforcing member 20 disposed around the periphery of the heat dissipation layer 10, and a conductive and thermally conductive layer 30 at least in contact with the heat dissipation layer 10; the tensile strength of the reinforcing member 20 is in the range of 500MPa to 1050MPa.

[0084] In specific implementation, the display device includes a heat dissipation film 100 and a display module 200 bonded to the heat dissipation film 100. The structural configuration of the heat dissipation film 100 can be referred to the description in the preceding sections. The display module 200 can be an OLED display module 200. Specifically, the heat dissipation film 100 includes a heat dissipation layer 10 composed of graphite, a reinforcing member 20 disposed around the periphery of the heat dissipation layer 10, and a conductive and thermally conductive layer 30 at least bonded to the heat dissipation layer 10. The specific configuration of the heat dissipation layer 10, the reinforcing member 20, and the conductive and thermally conductive layer 30 can be referred to the technical description in the preceding sections, and will not be repeated here. Furthermore, the tensile strength of the reinforcing member 20 ranges from 500 MPa to 1050 MPa. In this way, the edge strength of the heat dissipation film 100 is effectively improved by the reinforcing component 20 with high tensile strength. Thus, even when the heat dissipation film 100 and the adhesive 50 separate during disassembly, the high tensile strength of the reinforcing component 20 effectively prevents the formation of wrinkles on the back of the heat dissipation film 100. This fundamentally solves the problem of deformation of the back of the heat dissipation film 100 pulling the filter layer 700 in the display module 200, and effectively improves the water ripple problem.

[0085] In the embodiments of this disclosure, the display device may have the following configurations, but is not limited to these configurations.

[0086] In one exemplary embodiment, such as Figure 18 As shown, the display device further includes an adhesive 50 located on the side of the conductive and thermally conductive layer 30 facing away from the display module 200; the adhesive 50 is used to bond with the middle frame, and the orthogonal projection of the adhesive 50 on the display module 200 is located inside the reinforcing member 20.

[0087] In one exemplary embodiment, such as Figure 19As shown, the display device further includes a groove 40 partially formed on the conductive and thermally conductive layer 30 surrounding the heat dissipation layer 10, and an adhesive 50 disposed within the groove 40; the adhesive 50 is used to bond with the middle frame, and the orthographic projection of the adhesive 50 on the display module 200 is located inside the reinforcing member 20.

[0088] In the specific implementation process, the relevant settings of the grooves 40 in the conductive and thermally conductive layer 30 can be referred to the descriptions in the aforementioned sections, and will not be repeated here. Furthermore, the orthographic projection of the adhesive 50 on the display module 200 is located inside the reinforcing member 20. In this way, the grooves 40 can effectively constrain the adhesive 50, reducing its bonding area to a certain extent. This effectively reduces the pulling force during disassembly when the heat dissipation film 100 and adhesive 50 are separated after the adhesive 50 is bonded to the mid-frame, thus preventing wrinkles on the back of the heat dissipation film 100 and providing assurance for improving the water ripple problem. Moreover, it can also reduce the thickness of the heat dissipation film 100 to a certain extent, while ensuring a thinner and lighter design for the display device. In addition, the conductive and thermally conductive layer 30 can effectively disperse the stress between the mid-frame and adhesive 50 during disassembly, thus providing assurance for improving the water ripple problem on the front of the display device.

[0089] In this embodiment of the present disclosure, along a direction parallel to the plane where the heat dissipation layer 10 is located, the groove 40 is located on one side edge away from the heat dissipation layer 10, and is 0.2 mm to 1 mm away from the corresponding side edge away from the heat dissipation layer 10 of the reinforcing member 20.

[0090] Still combined Figure 19 In the exemplary embodiment shown, along a direction parallel to the plane of the heat dissipation layer 10, the groove 40 is spaced 0.2mm to 1mm away from one edge of the heat dissipation layer 10 and the corresponding edge of the reinforcing member 20 that is also away from the heat dissipation layer 10. For example, the distance between the groove 40 and the corresponding edge of the reinforcing member 20 that is also away from the heat dissipation layer 10 is 0.2mm. In practical applications, the groove 40 can be positioned as close as possible to the edge of the reinforcing member 20. This can, to some extent, avoid the water ripple problem on the heat dissipation film 100 during disassembly, thus improving the performance of the display device.

[0091] In one exemplary embodiment, the display device further includes at least one snap fastener 300 for fixing the heat dissipation film 100 to the display module 200; the adhesive 50 has accommodating spaces that accommodate each of the snap fasteners 300.

[0092] In specific implementations, the display device further includes at least one latch 300 for fixing the heat dissipation film 100 to the display module 200. For example, the at least one latch 300 can be one, or two or more, and this is not limited thereto. Figure 20 The diagram shows one possible distribution of multiple clips 300 within a local area of ​​the display device. Of course, the number and distribution of at least one clip 300 can be adjusted according to actual application needs, which will not be detailed here. Correspondingly, the adhesive 50 has accommodating spaces to accommodate each clip 300. In this way, while ensuring the adhesion between the heat dissipation film 100 and the display module 200, the structural stability of the display device is also guaranteed.

[0093] In this embodiment of the present disclosure, along a direction perpendicular to the plane of the heat dissipation layer 10, the display device further includes a cover plate 400 disposed on the side of the display module 200 facing away from the heat dissipation film 100; each of the latches 300 includes a first part 301 and a second part 302 sequentially connected; wherein, the first part 301 extends along a direction parallel to the plane of the cover plate 400, and the second part 302 extends along a direction perpendicular to the plane of the cover plate 400; the first part 301 is fixedly connected to the conductive and thermally conductive layer 30 by a first adhesive 303, and the second part 302 is fixedly connected to the cover plate 400 by a second adhesive 304.

[0094] In one exemplary embodiment, such as Figure 21 For along Figure 20 The diagram shows one possible cross-sectional structure along the direction indicated by SS. Specifically, along the direction perpendicular to the plane of the heat dissipation layer 10, the display device also includes a cover plate 400 disposed on the side of the display module 200 facing away from the heat dissipation film 100. This effectively protects the display module 200 through the cover plate 400. Each clip 300 includes a first portion 301 and a second portion 302 connected sequentially; the first portion 301 extends parallel to the plane of the cover plate 400, and the second portion 302 extends perpendicular to the plane of the cover plate 400; furthermore, the first portion 301 is fixedly connected to the conductive and thermally conductive layer 30 by a first adhesive material 303, and the second portion 302 is fixedly connected to the cover plate 400 by a second adhesive material 304. For example, the first adhesive material 303 and the second adhesive material 304 can be foam adhesive. Of course, the materials of the first adhesive material 303 and the second adhesive material 304 can be chosen according to the actual application requirements, and are not limited here. In this way, the heat dissipation film 100 and the display module 200 can be stably attached through the various clips 300, thereby reducing the risk of deformation of the heat dissipation film 100 during disassembly, providing a guarantee for improving the water ripple pattern on the front of the display module 200, and thus ensuring the performance of the display device.

[0095] In the embodiments disclosed herein, each of the buckles 300 is a one-piece molded structure.

[0096] In practice, each snap fastener 300 is a one-piece molded structure. This improves the manufacturing efficiency of each snap fastener 300. For example, injection molding can be used to manufacture each snap fastener 300 using polycarbonate (PC) material. Of course, snap fasteners 300 can also be manufactured according to actual application needs, and this is not limited here.

[0097] In this embodiment of the present disclosure, the display device further includes a mid-frame connected to the adhesive 50, the mid-frame having an accommodating space that avoids the second portion 302.

[0098] In practical implementation, the display device also includes a mid-frame connected to the adhesive 50, thus ensuring the structural stability of the display device. Furthermore, the mid-frame has an accommodating space to avoid interference between the mid-frame and the clip 300. This effectively avoids the problem of water ripples on the front of the display device while maintaining its structural stability.

[0099] In this embodiment, the heat dissipation film 100 further includes a first through-hole H1 penetrating the heat dissipation layer 10, a second through-hole H2 penetrating the conductive and thermally conductive layer 30, and thermoplastic polyester material 60 respectively attached to the sidewalls of the first through-hole H1 and the second through-hole H2; wherein, the sidewall of the first through-hole H1 is recessed relative to the sidewall of the second through-hole H2, and the area enclosed by the first through-hole H1 and the second through-hole H2 constitutes a fingerprint recognition area.

[0100] In the specific implementation process, the specific settings of the first through hole H1, the second through hole H2 and the thermoplastic polyester material 60 in the heat dissipation film 100 can be implemented with reference to the description of the relevant parts mentioned above, and will not be described in detail here.

[0101] In this embodiment of the present disclosure, along a direction perpendicular to the plane where the heat dissipation layer 10 is located, the heat dissipation film 100 further includes a buffer layer 70 and an adhesive layer 80 sequentially disposed on the side of the heat dissipation layer 10 away from the conductive and thermally conductive layer 30.

[0102] In the specific implementation process, the specific settings of the buffer layer 70 and the adhesive layer 80 in the heat dissipation film 100 can be implemented with reference to the description of the relevant parts mentioned above, and will not be described in detail here.

[0103] In this embodiment of the disclosure, along a direction perpendicular to the plane where the heat dissipation layer 10 is located, the display module 200 further includes a back film 500 connected to the adhesive layer 80, and a display panel 600, a filter layer 700, and an adhesive layer 800 sequentially disposed on the side of the back film 500 away from the heat dissipation film 100.

[0104] Still combined Figure 20 In the exemplary embodiment shown, the display module 200 further includes a back film 500, a display panel 600, a light filter layer 700, and an adhesive layer 800. The back film 500 is connected to the adhesive layer 80, and the display panel 600, the light filter layer 700, and the adhesive layer 800 are sequentially disposed on the side of the back film 500 facing away from the heat dissipation film 100. For example, the light filter layer 700 may be a polarizer. For example, the adhesive layer 800 may be an optically transparent adhesive (OCA).

[0105] It should be noted that the display device provided in this disclosure, in addition to the film layer structure mentioned above, may also include other film layer structures. For example, the display device further includes a protective layer 900 located on the side of the cover plate 400 facing away from the display module 200. Of course, other film layer structures may be provided in the display device according to actual application needs, which will not be detailed here.

[0106] In specific implementation, the display device provided in this utility model embodiment can be any product or component with display function, such as a mobile phone, tablet computer, television, monitor, laptop computer, digital photo frame, or navigator. Other essential components of this display device are understood by those skilled in the art and will not be described in detail here, nor should they be construed as limiting this utility model.

[0107] Although preferred embodiments of this disclosure have been described, those skilled in the art, upon learning the basic inventive concept, can make other changes and modifications to these embodiments. Therefore, the appended claims are intended to be interpreted as including the preferred embodiments as well as all changes and modifications falling within the scope of this disclosure.

[0108] Obviously, those skilled in the art can make various modifications and variations to this disclosure without departing from its spirit and scope. Therefore, if such modifications and variations fall within the scope of the claims of this disclosure and their equivalents, this disclosure is also intended to include such modifications and variations.

Claims

1. A heat dissipating film, wherein, The heat dissipation layer is composed of graphite, a reinforcing member arranged around the periphery of the heat dissipation layer, and an electrically and thermally conductive layer at least attached to the heat dissipation layer. The tensile strength of the reinforcing member ranges from 500 MPa to 1050 MPa. The heat dissipation film further comprises a groove arranged around the heat dissipation layer and opened on the electrically and thermally conductive layer; the orthographic projection of the groove on the reinforcing member is located inside the reinforcing member.

2. The heat dissipating film of claim 1, wherein, The heat dissipation film further comprises glue accommodated in the groove; the glue is used for bonding with a middle frame, and the orthographic projection of the glue on the reinforcing member is located inside the reinforcing member.

3. The heat dissipating film of claim 2, wherein, In the direction parallel to the plane where the heat dissipation layer is located, the side edge of the groove away from the heat dissipation layer is 0.2 mm to 1 mm away from the corresponding side edge of the reinforcing member away from the heat dissipation layer.

4. The heat dissipating film of claim 2 or 3, wherein, The heat dissipation film further comprises a first via hole penetrating through the heat dissipation layer, a second via hole penetrating through the electrically and thermally conductive layer, and a thermoplastic polyester material attached to the sidewalls of the first via hole and the second via hole respectively; the sidewall of the first via hole is arranged inwardly compared with the sidewall of the second via hole, and the area surrounded by the first via hole and the second via hole constitutes a fingerprint identification area.

5. The heat dissipating film of any one of claims 1-3, wherein, In the direction perpendicular to the plane where the heat dissipation layer is located, the heat dissipation film further comprises a buffer layer and an adhesive layer arranged in sequence on the side of the heat dissipation layer away from the electrically and thermally conductive layer.

6. The heat dissipating film of claim 5, wherein, In the direction perpendicular to the plane where the heat dissipation layer is located, the heat dissipation film further comprises a release film located on the side of the adhesive layer away from the heat dissipation layer, and a protective film located on the side of the electrically and thermally conductive layer away from the heat dissipation layer; the thickness of the release film is smaller than the thickness of the protective film, and the peeling force of the release film is smaller than the peeling force of the protective film.

7. The heat dissipating film of claim 6, wherein, In the direction parallel to the plane where the heat dissipation layer is located, the heat dissipation layer is 0.05 mm to 0.35 mm away from the reinforcing member.

8. The heat dissipating film of any one of claims 1-3, 6, 7, wherein, In the direction parallel to the plane where the heat dissipation layer is located, the heat dissipation film further comprises a polyester film material located between the reinforcing member and the heat dissipation layer; the polyester film material is arranged around the periphery of the heat dissipation layer, and the polyester film material is attached to the heat dissipation layer together, and the reinforcing member is arranged around the polyester film material; the tensile strength of the polyester film material ranges from 150 MPa to 240 MPa.

9. The heat dissipating film of claim 8, wherein, In the direction parallel to the plane where the heat dissipation layer is located, the edge of the reinforcing member is flush with the corresponding edge of the electrically and thermally conductive layer.

10. The heat dissipating film of any one of claims 1-3, 6, 7, 9, wherein, The heat dissipation film and a display module attached to the heat dissipation film; 11. A display device, wherein, The heat dissipation layer is composed of graphite, a reinforcing member arranged around the periphery of the heat dissipation layer, and an electrically and thermally conductive layer at least attached to the heat dissipation layer; the tensile strength of the reinforcing member ranges from 500 MPa to 1050 MPa. The heat dissipation film further comprises glue located on the side of the electrically and thermally conductive layer away from the display module; the glue is used for bonding with a middle frame, and the orthographic projection of the glue on the display module is located inside the reinforcing member. ​ 12. The display device of claim 11, wherein, ​ 13. The display device of claim 11, wherein, The display device further comprises a groove formed on the conductive and heat-conductive layer and arranged around the heat-dissipating layer, and a glue accommodated in the groove; the glue is used for bonding with a middle frame, and a normal projection of the glue on the display module is located inside the reinforcing member.

14. A display device as claimed in claim 12 or 13, wherein, The display device further comprises at least one buckle used for fixedly connecting the heat-dissipating film and the display module; the glue is provided with an accommodation space for avoiding the buckles.

15. The display device of claim 14, wherein, In a direction perpendicular to a plane where the heat-dissipating layer is located, the display device further comprises a cover plate arranged on a side of the display module away from the heat-dissipating film; each buckle comprises a first part and a second part which are sequentially connected; the first part is arranged in a direction parallel to a plane where the cover plate is located, and the second part is arranged in a direction perpendicular to the plane where the cover plate is located; the first part is fixedly connected with the conductive and heat-conductive layer by a first glue material, and the second part is fixedly connected with the cover plate by a second glue material.

16. The display device of claim 15, wherein, Each buckle is an integrally formed structure.

17. A display device as claimed in claim 15 or 16, wherein, The display device further comprises a middle frame connected with the glue, and the middle frame is provided with an accommodation space for avoiding the second part.

18. The display device of any of claims 11-13, 15, 16, wherein, The heat-dissipating film further comprises a first via hole penetrating through the heat-dissipating layer, a second via hole penetrating through the conductive and heat-conductive layer, and a thermoplastic polyester material respectively attached to side walls of the first via hole and the second via hole; the side wall of the first via hole is arranged to be recessed compared with the side wall of the second via hole, and an area surrounded by the first via hole and the second via hole constitutes a fingerprint recognition area.

Images