Vertical LED light-emitting device

Abstract

The utility model relates to the technical field of light-emitting semiconductors, and particularly discloses a vertical LED light-emitting device, which comprises a metal substrate, a light-emitting diode, a Zener diode, a first bonding wire, a second bonding wire and a packaging adhesive layer, the light-emitting diode is fixed above the metal substrate, the Zener diode is fixed on one side of the upper surface of the light-emitting diode, one end of the first bonding wire is connected with an electrode at one end of the metal substrate, the other end of the first bonding wire is connected with the light-emitting diode, and the other end of the first bonding wire is connected with the metal substrate. One end of the second bonding wire is connected with an electrode at the other end of the metal substrate, and the other end of the second bonding wire is connected with the Zener diode; and the packaging adhesive layer covers the metal substrate, the light emitting diode, the Zener diode, the first bonding wire and the second bonding wire. According to the utility model, through the design that the Zener diode is connected with the light emitting diode in parallel, an extra electrostatic protection mechanism is provided for the LED.

Description

Technical Field

[0001] This utility model relates to the field of light-emitting semiconductor technology, specifically a vertical LED light-emitting device. Background Technology

[0002] With the continuous advancement of semiconductor lighting technology, LED light-emitting diodes (LEDs) have become an important light source in modern lighting, display, and backlighting fields. Currently, LEDs mainly exist in three forms: upright, flip-chip, and vertical structure. Although the flip-chip structure has many performance advantages, its high technical threshold leads to high costs. Therefore, in terms of market share, upright and vertical chip structure LED light sources dominate due to the maturity of their packaging technology and the completeness of their industrial chain.

[0003] However, in all stages of LED packaging, manufacturing, testing, packaging, storage, and transportation, the influence of static electricity cannot be ignored. The PN junction inside the LED easily accumulates charge during these processes, creating a potential difference. When the charge accumulates to a certain level, exceeding the LED's tolerance limit, static electricity will discharge the LED in a very short time. This instantaneous surge current can potentially damage the LED's internal structure, leading to leakage, dead LEDs, and other defects, severely impacting the LED's reliability and lifespan.

[0004] To improve the electrostatic discharge (ESD) immunity of LED devices, a common industry practice is to connect a light-emitting diode (LED) in parallel with a Zener diode. As an electronic component with stable voltage characteristics, the Zener diode provides a bypass path during ESD, effectively protecting the LED from ESD shocks. However, this design also has limitations. Because the Zener diode requires additional planar space for mounting, this restricts the utilization rate of the light-emitting / refractive space within the package. Especially for LED packages that prioritize high brightness and compactness, this design undoubtedly negatively impacts the luminous efficiency and sulfidation performance of the package, thus affecting the overall product performance and market competitiveness.

[0005] Therefore, how to optimize the packaging structure and improve the utilization rate of the light-emitting / refractive space while ensuring the anti-static capability of LED devices has become an important issue that urgently needs to be addressed in the current LED packaging technology field. Utility Model Content

[0006] In order to overcome the problems existing in the prior art, the purpose of this utility model is to provide a vertical LED light-emitting device and its manufacturing method.

[0007] The technical solution adopted by this utility model to solve its technical problem is: a vertical LED light-emitting device, comprising:

[0008] Metal substrate, a vertical light-emitting diode, a vertical Zener diode, several bonding wires, and encapsulating adhesive layer;

[0009] The light-emitting diode (LED) is fixed above the metal substrate, and the Zener diode is fixed on the upper surface of the LED's electrodes. The remaining electrodes on the upper surface of the LED are connected to the metal substrate via bonding wires, and the upper surface electrodes of the Zener diode are connected to the metal substrate via the bonding wires. The Zener diode has the opposite polarity to the LED and forms a parallel circuit with the LED. The encapsulating adhesive layer covers the metal substrate, the LED, the Zener diode, and the bonding wires.

[0010] Main working principle: This vertical LED light-emitting device includes a metal substrate, a vertically structured light-emitting diode (LED), a vertically structured Zener diode, bonding wires, and an encapsulating layer. The LED is fixed above the metal substrate, and the Zener diode is fixed to the upper surface of one of the LED's electrodes. The remaining electrodes of the LED are connected to the metal substrate via bonding wires. The upper surface electrode of the Zener diode is also connected to the metal substrate via bonding wires. The Zener diode and the LED have opposite polarities, thus forming a parallel circuit. The encapsulating layer covers the entire structure, providing protection and insulation.

[0011] When a forward voltage is applied to an LED, the LED begins to emit light. Simultaneously, because the Zener diode is connected in parallel with the LED and has opposite polarity, it does not actually conduct during normal LED operation. The primary function of the Zener diode is as an overvoltage protection element. If the voltage in the circuit exceeds the LED's rated voltage (i.e., an overvoltage condition), the Zener diode will begin to conduct, shunting the excess voltage to ground, thus protecting the LED from damage. The encapsulating adhesive layer not only protects the LED and Zener diode from physical damage but also prevents moisture, dust, and other contaminants from entering the device, ensuring its long-term stability and reliability.

[0012] Under normal operating conditions, current primarily flows through the LED, causing it to emit light. Under overvoltage conditions, some current will flow through the Zener diode, bypassing the LED and thus protecting it from overvoltage damage. The breakdown voltage of the Zener diode is designed to be slightly higher than the LED's rated voltage. Therefore, under normal operating voltage, the Zener diode does not conduct. When the voltage rises to the Zener diode's breakdown voltage, it will quickly conduct, bypassing the LED and thus limiting the voltage across it, preventing damage.

[0013] In summary, this vertical LED light-emitting device achieves overvoltage protection for the LED by connecting a Zener diode with opposite polarity in parallel, while maintaining the LED's normal light-emitting function. The encapsulating adhesive layer provides additional physical and chemical protection, ensuring the long-term stable operation of the device.

[0014] Preferably, the light-emitting diode includes an active layer, a light-emitting protective layer, a first conductive layer, and a second conductive layer;

[0015] The active layer is connected to the first electrode plate through the first conductive layer, the light-emitting protective layer is disposed above the active layer, the second conductive layer is disposed around the light-emitting protective layer and connected to the active layer, and the second conductive layer is connected to the second electrode plate through the bonding wire.

[0016] Preferably, a third electrode plate is disposed above the Zener diode, and a fourth electrode plate is disposed below the Zener diode. The third electrode plate is connected to the bonding wire, and the fourth electrode plate is connected to the second conductive layer.

[0017] Preferably, an insulating receiving groove is provided between the Zener diode and the light-emitting protective layer.

[0018] Preferably, a white adhesive layer is disposed on the surface of the Zener diode, and the encapsulating adhesive layer is a transparent adhesive layer.

[0019] A method for fabricating a vertical LED light-emitting device, comprising the following steps:

[0020] S1. Clean the surface of the metal substrate to ensure it is free of dust and oil, and fix the second electrode plate in the metal substrate to both sides of the first electrode plate, ensuring that they are isolated from each other by an insulating groove.

[0021] S2. The active layer of the light-emitting diode is fixed to the first electrode plate of the metal substrate through the first conductive layer to ensure good contact. A light-emitting protective layer is set above the active layer. Then, a conductive material is applied to the second conductive layer to form a conductive connection.

[0022] S3. Install a Zener diode on one side of the upper surface of the second conductive layer, and provide an insulating receiving groove between the light-emitting diode and the Zener diode;

[0023] S4. Use bonding wires to connect the second electrode plate of the metal substrate to the second conductive layer of the light-emitting diode; one of the bonding wires connects the second electrode plate of the metal substrate to the Zener diode.

[0024] S5. Apply a white adhesive layer over the Zener diode. Excess white adhesive layer will flow into the insulating receiving groove.

[0025] S6. Apply a transparent encapsulating adhesive layer over the entire structure to ensure coverage of the metal substrate, light-emitting diode, Zener diode, and bonding wires. Then cure the encapsulating adhesive layer to form the final encapsulation protection.

[0026] Compared with the prior art, the beneficial effects of this utility model are:

[0027] This invention utilizes a Zener diode with opposite polarity connected in parallel within the LED circuit. This device effectively prevents damage to the LED caused by overvoltage. The Zener diode begins to conduct when it reaches its breakdown voltage, shunting excess voltage and thus protecting the LED from overvoltage, improving the stability and reliability of the entire circuit. This effective overvoltage protection mechanism significantly reduces the risk of LED damage due to voltage fluctuations, thereby extending the lifespan of the entire device and reducing maintenance costs.

[0028] Traditional overvoltage protection solutions may require additional circuit components and complex wiring, while this device achieves overvoltage protection through a built-in Zener diode, simplifying circuit design and reducing manufacturing costs.

[0029] Vertically structured LEDs and Zener diodes allow for a compact vertical arrangement of the entire device, improving space utilization and making them particularly suitable for applications with strict size requirements.

[0030] The encapsulating adhesive layer not only provides physical and chemical protection, preventing moisture, dust and other contaminants from entering the device, but also enhances the device's shock resistance and impact resistance, improving the product's durability and reliability.

[0031] In summary, this vertical LED light-emitting device achieves overvoltage protection through a built-in Zener diode, simplifying circuit design, improving stability and reliability, enhancing protection effectiveness, extending product lifespan, and providing excellent encapsulation protection. These advantages make this device promising for broad applications in LED lighting, displays, and other fields. Attached Figure Description

[0032] To more clearly illustrate the technical solutions of the embodiments of this utility model, the drawings used in the description of the embodiments will be briefly introduced below. Obviously, the drawings described below are some embodiments of this utility model. For those skilled in the art, other drawings can be obtained based on these drawings without creative effort.

[0033] Figure 1 This is a schematic diagram of the vertical LED light-emitting device.

[0034] 1. Metal substrate; 11. First electrode plate; 12. Second electrode plate; 2. Light-emitting diode; 20. Active layer; 21. Light-emitting protective layer; 22. First conductive layer; 23. Second conductive layer; 3. Zener diode; 30. Third electrode plate; 31. Fourth electrode plate; 4. Bonding wire; 6. White adhesive layer; 7. Insulating receiving groove. Detailed Implementation

[0035] To better understand the above-mentioned objectives, features, and advantages of this utility model, it will be described in detail below with reference to the accompanying drawings and specific embodiments. It should be noted that, unless otherwise specified, the embodiments and features described in this application can be combined with each other. Many specific details are set forth in the following description to provide a thorough understanding of this utility model; the described embodiments are merely some, not all, of the embodiments of this utility model. All other embodiments obtained by those skilled in the art based on the embodiments of this utility model without inventive effort are within the scope of protection of this utility model.

[0036] Unless otherwise defined, all technical and scientific terms used herein have the same meaning as commonly understood by one of ordinary skill in the art to which this invention pertains. The terminology used in this specification is for the purpose of describing particular embodiments only and is not intended to be limiting of the invention.

[0037] Example 1

[0038] This embodiment discloses a vertical LED light-emitting device, such as... Figure 1 As shown, the structure includes a metal substrate 1, a vertically oriented light-emitting diode (LED) 2, a vertically oriented Zener diode 3, bonding wires 4, and an encapsulating layer. The LED 2 is fixed above the metal substrate 1, and the Zener diode 3 is fixed to the upper surface of one of the electrodes of the LED 2. The remaining electrodes of the LED are connected to the metal substrate 1 via bonding wires 4. The upper surface electrode of the Zener diode 3 is also connected to the metal substrate 1 via bonding wires 4. The Zener diode 3 has the opposite polarity to the LED 2, thus forming a parallel circuit. The encapsulating layer covers the entire structure, providing protection and insulation.

[0039] When a forward voltage is applied to LED 2, LED 2 begins to emit light. Simultaneously, since Zener diode 3 is connected in parallel with LED 2 and has opposite polarity, it does not actually conduct during normal operation of LED 2. The main function of Zener diode 3 is as an overvoltage protection element. If the voltage in the circuit exceeds the rated voltage of LED 2 (i.e., an overvoltage condition), Zener diode 3 will begin to conduct, shunting the excess voltage to ground, thereby protecting LED 2 from damage. The encapsulating adhesive layer not only protects LED 2 and Zener diode 3 from physical damage but also prevents moisture, dust, and other contaminants from entering the device, ensuring the long-term stability and reliability of the device.

[0040] Under normal operating conditions, current primarily flows through LED 2, causing it to emit light. Under overvoltage conditions, some current will flow through Zener diode 3, bypassing LED 2, thus protecting LED 2 from overvoltage damage. The breakdown voltage of Zener diode 3 is designed to be slightly higher than the rated voltage of LED 2. Therefore, under normal operating voltage, Zener diode 3 is non-conductive. When the voltage rises to the breakdown voltage of Zener diode 3, it will quickly conduct, bypassing current from LED 2, thereby limiting the voltage across LED 2 and preventing its damage.

[0041] In summary, this vertical LED light-emitting device achieves overvoltage protection for LED 2 by connecting a Zener diode 3 with opposite polarity in parallel, while maintaining the normal light-emitting function of LED 2. The encapsulating adhesive layer provides additional physical and chemical protection, ensuring the long-term stable operation of the device.

[0042] In some optional embodiments, a first electrode plate 11 and a second electrode plate 12 are added to the metal substrate 1, isolated from each other by an insulating region. The first electrode plate 11 is connected to the light-emitting diode 2, while the second electrode plate 12 is connected to the electrodes of the light-emitting diode 2 and the Zener diode 3 via bonding wires 4. The first electrode plate 11 provides a forward voltage to the light-emitting diode 2, while the second electrode plate 12 serves as another part of the current loop and is also connected to the Zener diode 3 to achieve overvoltage protection. The separate design of the first and second electrode plates 12 improves the flexibility of current distribution and the safety of the device.

[0043] In some optional embodiments, the internal structure of the light-emitting diode 2 includes an active layer 20, a light-emitting protective layer 21, a first conductive layer 22, and a second conductive layer 23. The active layer 20 is connected to the first electrode plate 11 through the first conductive layer 22. The light-emitting protective layer 21 covers the active layer 20, and the second conductive layer 23 is disposed around the light-emitting protective layer 21 and connected to the active layer 20. Finally, the second conductive layer 23 is connected to the second electrode plate 12 through bonding wires 4. When a forward voltage is applied to the light-emitting diode 2, current flows through the first conductive layer 22 into the active layer 20, exciting the phosphor in the light-emitting protective layer 21 to emit light. The second conductive layer 23 serves as a current outflow path.

[0044] In some alternative embodiments, a third electrode plate 30 and a fourth electrode plate 31 are respectively disposed above and below the Zener diode 3. The third electrode plate 30 is connected to the upper surface electrode of the Zener diode 3 via a bonding wire 4, while the fourth electrode plate 31 is connected to the second conductive layer 23 of the light-emitting diode 2. The third electrode plate 30 provides the necessary electrical connection for the Zener diode 3, while the fourth electrode plate 31 serves as an electrical bridge between the Zener diode 3 and the light-emitting diode 2.

[0045] Beneficial effects: By adding the third and fourth electrode plates 31, the electrical connection stability and reliability between the Zener diode 3 and the light-emitting diode 2 are improved.

[0046] In some alternative embodiments, an insulating receiving groove 7 is provided between the Zener diode 3 and the light-emitting protective layer 21. An insulating receiving groove 7 is formed around the light-emitting protective layer 21 of the light-emitting diode 2, and then the Zener diode 3 is fixed within the groove. The insulating receiving groove 7 ensures electrical isolation between the Zener diode 3 and the light-emitting protective layer 21, preventing potential short-circuit risks. The design of the insulating receiving groove 7 improves the safety and stability of the device.

[0047] In some optional embodiments, a white adhesive layer 6 is formed on the surface of the Zener diode 3. White resin has been widely used in the packaging of LEDs 2 to cover the black Zener diode and suppress its light absorption, thereby ensuring the overall brightness of the LED 2 package. However, when white resin is applied to packages that require metal bonding wires 4 to connect the LED 2 to the support, the white resin can easily contaminate the surface of the LED 2 along the bonding wires 4, affecting the brightness of the package. The presence of the insulating region provides a place to accommodate the white adhesive, preventing the white adhesive from contaminating the chip's light-emitting surface. This improves the optical performance of the device, enhances the light-emitting effect, protects the Zener diode 3, and extends the device's lifespan.

[0048] In some alternative embodiments, the encapsulating adhesive layer is made of a transparent material. A layer of transparent encapsulating adhesive is applied over the entire device structure and then cured. The transparent encapsulating adhesive layer not only protects the internal components but also allows light to be emitted from the LED 2 and pass through the encapsulation layer. The design of the transparent encapsulating adhesive layer makes the device's light-emitting effect more intuitive and aesthetically pleasing.

[0049] In summary, this utility model's vertical LED light-emitting device, through meticulous structural design and optimized assembly methods, achieves effective overvoltage protection for the LED, improves the device's stability and reliability, and simultaneously optimizes luminous efficiency and aesthetics. These beneficial effects make this device a promising candidate for applications in LED lighting, displays, and other fields.

[0050] Example 2

[0051] A method for fabricating a vertical LED light-emitting device, comprising the following steps:

[0052] S1: Pre-treatment of metal substrate 1 and fixation of electrode plates. First, the surface of metal substrate 1 needs to be thoroughly cleaned using professional cleaning agents and precision cleaning tools to completely remove dust, oil, and other impurities, ensuring absolute cleanliness of the substrate surface. Next, the second electrode plate 12 in metal substrate 1 is fixed to both sides of the first electrode plate 11 at precise angles and positions. During this process, it is necessary to ensure that the second electrode plate 12 and the first electrode plate 11 are completely isolated from each other through carefully designed insulating grooves to prevent electrical short circuits.

[0053] S2: The light-emitting diode 2 is assembled and electrically connected. The active layer 20 of the light-emitting diode 2 is firmly fixed to the first electrode plate 11 of the metal substrate 1 via a highly conductive first conductive layer 22 using welding or bonding techniques, ensuring a stable and reliable electrical connection between the two. A protective light-emitting layer 21 is carefully laid on top of the active layer 20 to protect it from damage by the external environment while ensuring effective light output. A conductive material is applied to the second conductive layer 23 using advanced sputtering or electroplating techniques to form a conductive connection with the second electrode plate 12, ensuring smooth current flow.

[0054] S3: Zener diode 3 is mounted in an insulating recess 7. The Zener diode 3 is mounted on one side of the upper surface of the second conductive layer 23. During this process, it is necessary to ensure electrical isolation between the Zener diode 3 and the light-emitting diode 2, as well as their correct connection to their respective electrode plates. An insulating recess 7 is precisely machined between the light-emitting diode 2 and the Zener diode 3 to further ensure electrical isolation between them, while also providing additional mechanical support.

[0055] S4: Bonding wire 4 connection and electrical testing. High-quality bonding wire 4 is used to connect the second electrode plate 12 of the metal substrate 1 to the second conductive layer 23 of the light-emitting diode 2. Simultaneously, another bonding wire 4 connects the second electrode plate 12 of the metal substrate 1 to the Zener diode 3, ensuring the integrity of the entire circuit and the stability of the electrical connections. After completing the bonding wire 4 connection, rigorous electrical testing of the entire circuit is required to ensure that the electrical performance of all connection points meets the design requirements.

[0056] S5: White adhesive layer 6 is applied and filled. A layer of white adhesive layer 6 is uniformly applied above the Zener diode 3. This adhesive layer not only protects the Zener diode 3 but also improves the device's reflection efficiency, thereby enhancing the light-emitting effect. Excess white adhesive layer 6 will naturally flow into the insulating receiving groove 7, further filling and curing to form a more stable protective layer.

[0057] S6: Application and Curing of Transparent Encapsulating Adhesive Layer. A layer of transparent encapsulating adhesive is uniformly applied over the entire structure. This adhesive layer must possess excellent light transmittance, weather resistance, and chemical stability to ensure effective protection of internal components. The device coated with the transparent encapsulating adhesive layer is placed in a professional curing device and subjected to heat curing for a specific period of time to ensure complete curing of the encapsulating adhesive layer and a tight bond with the internal structure.

[0058] The above description is merely a preferred embodiment of the present utility model and is not intended to limit the present utility model in any way. Therefore, any modifications, equivalent changes, and alterations made to the above embodiments based on the technical essence of the present utility model without departing from the technical solution of the present utility model shall still fall within the scope of the technical solution of the present utility model.

Claims

1. A vertical LED light emitting device, characterized by, It includes: A metal substrate, a vertical structure light emitting diode, a vertical structure Zener diode, several bonding wires and a packaging adhesive layer; The light emitting diode is fixed above the metal substrate, and the Zener diode is fixed on the electrode upper surface of the light emitting diode, the rest of the electrode upper surface of the light emitting diode is connected with the metal substrate through the bonding wire, and the electrode upper surface of the Zener diode is connected with the metal substrate through the bonding wire; The polarity of the Zener diode is opposite to that of the light emitting diode, and a parallel circuit is formed with the light emitting diode; The packaging adhesive layer covers the metal substrate, the light emitting diode, the Zener diode and the several bonding wires.

2. The vertical LED light emitting device according to claim 1, wherein The metal substrate includes a first electrode plate and a second electrode plate, and an insulating region is arranged between the first electrode plate and the second electrode plate, the first electrode plate is connected with the light emitting diode, and the second electrode plate is connected with the electrode of the light emitting diode and the Zener diode through the bonding wire.

3. The vertical LED light emitting device according to claim 2, wherein The light emitting diode includes an active layer, a light emitting protection layer, a first conductive layer and a second conductive layer; The active layer is connected with the first electrode plate through the first conductive layer, the light emitting protection layer is arranged above the active layer, the second conductive layer is arranged around the light emitting protection layer and connected with the active layer, and the second conductive layer is connected with the second electrode plate through the bonding wire.

4. The vertical LED light emitting device according to claim 3, wherein A third electrode plate is arranged above the Zener diode, and a fourth electrode plate is arranged below the Zener diode, the third electrode plate is connected with the bonding wire, and the fourth electrode plate is connected with the second conductive layer.

5. The vertical LED light emitting device according to claim 3, wherein An insulating accommodating groove is arranged between the Zener diode and the light emitting protection layer.

6. The vertical LED light emitting device according to claim 5, wherein A white adhesive layer is arranged on the surface of the Zener diode.

7. The vertical LED light emitting device according to claim 1, wherein The packaging adhesive layer is a transparent adhesive layer.

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