Ultrasonic probe and ultrasonic equipment

Abstract

The utility model relates to an ultrasonic probe, which comprises a shell, the shell is provided with a working surface contacted with a detected object, a plurality of wafers distributed at intervals are arranged on the working surface, and an electrode plate is arranged between any two adjacent wafers on the working surface; through the collaborative layout of multiple wafers and multiple electrode plates, the detection precision, flexibility and adaptability of the ultrasonic probe are effectively improved, and the ultrasonic probe has wide application prospects.

Description

Technical Field

[0001] This utility model relates to the field of ultrasonic testing equipment technology, and more specifically, to an ultrasonic probe and ultrasonic equipment. Background Technology

[0002] Ultrasonic testing equipment is widely used in medicine. Ultrasonic probes primarily generate high-definition images of internal organs and tissues by emitting ultrasonic waves and receiving their echoes. Traditional ultrasonic probes typically employ a single transducer and a single ring electrode structure, which lacks focusing ability, flexibility, and adaptability, resulting in a limited detection range, difficulty in acquiring multiple signals, insufficient resolution, and low detection accuracy. Utility Model Content

[0003] The technical problem to be solved by this utility model is to provide an ultrasonic probe and ultrasonic equipment in view of the above-mentioned defects of the prior art.

[0004] The technical solution adopted by this utility model to solve its technical problem is:

[0005] On the one hand, the present invention provides an ultrasonic probe, the ultrasonic probe including a housing, the housing having a working surface that contacts the object being tested, the working surface having a plurality of spaced crystals, and an electrode plate being provided between any two adjacent crystals on the working surface.

[0006] In some embodiments, the plurality of wafers includes at least one first wafer and a plurality of second wafers; when there is one first wafer, the first wafer is located at the center of the working surface, and the plurality of second wafers are distributed in a circular interval with the first wafer as the center, and an electrode plate is provided on the working surface between any two adjacent second wafers and / or between any two adjacent first wafers and second wafers; when there are two or more first wafers, the two or more first wafers are distributed in a circular interval on the working surface, and the plurality of second wafers are distributed in a circular interval with all the first wafers as the center, and an electrode plate is provided on the working surface between any two adjacent first wafers and / or between any two adjacent second wafers.

[0007] In some embodiments, the working surface is further provided with at least one first trench and a plurality of second trenches, and the outer surface of at least one first wafer is sealed and connected to at least one first trench, and the outer surface of a plurality of second wafers is sealed and connected to a plurality of second trenches.

[0008] In some embodiments, the ultrasonic probe further includes a plurality of displacement driving mechanisms, which are connected one-to-one with a plurality of electrode plates to drive the electrode plates to move radially along the working surface and / or to drive the electrode plates to move circumferentially along the working surface.

[0009] In some embodiments, the working surface is further provided with a plurality of third grooves, the fixed ends of the plurality of displacement driving mechanisms are sealed and connected to the plurality of third grooves one by one, and the driving ends of the plurality of displacement driving mechanisms are connected to the plurality of electrode plates one by one.

[0010] In some embodiments, the outer periphery of each electrode sheet is located outside the corresponding third groove, and the side surface of each electrode sheet facing the working surface is in contact with the working surface.

[0011] In some embodiments, an insulating layer is provided on the inner wall of each of the third trenches, and a shielding layer is also provided on the insulating layer.

[0012] In some embodiments, the displacement driving mechanism is a piezoelectric ceramic micro-displacement device with biaxial motion.

[0013] In some embodiments, each of the electrode sheets is rectangular in shape.

[0014] On the other hand, the present invention also provides an ultrasonic device, the ultrasonic device comprising an ultrasonic probe as described in any of the preceding claims.

[0015] The beneficial effects of this utility model are as follows: Unlike the prior art, in the ultrasonic probe of this utility model, the housing has a working surface that contacts the object being detected, and a number of spaced crystals are provided on the working surface. An electrode plate is also provided between any two adjacent crystals on the working surface; thus forming a structure in which multiple crystals and multiple electrode plates are arranged in a coordinated manner. The contact area of ​​the multiple crystals and multiple electrode plates is wider, which helps to improve the detection accuracy, flexibility and adaptability of the ultrasonic probe, and has broad application prospects. Attached Figure Description

[0016] Figure 1 This is a schematic diagram showing the layout of the first wafer, the second wafer, and the electrode sheet in Embodiment 1 of this utility model;

[0017] Figure 2 This is a schematic diagram of the layout of the first groove, the second groove, the third groove and the displacement driving mechanism in Embodiment 1 of this utility model;

[0018] Figure 3 This is a schematic diagram of the layout of the insulating layer and the shielding layer in Embodiment 1 of this utility model;

[0019] Figure 4This is another schematic diagram showing the layout of the first wafer, the second wafer, and the electrode sheet in Embodiment 1 of this utility model;

[0020] Figure 5 This is a schematic diagram showing the layout of the first wafer, the second wafer, and the electrode sheet in Embodiment 2 of this utility model;

[0021] The labels and numbers in the diagram are as follows: housing-1; first wafer-2; second wafer-3; electrode plate-4; first trench-101; second trench-102; displacement drive mechanism-5; third trench-103; insulating layer-6; shielding layer-7. Detailed Implementation

[0022] The terms "first," "second," "third," and "fourth," etc., used in the specification, claims, and accompanying drawings of this utility model are used to distinguish different objects, not to describe a specific order. Furthermore, the terms "comprising" and "having," and any variations thereof, are intended to cover non-exclusive inclusion. For example, a process, method, system, product, or apparatus that includes a series of steps or units is not limited to the listed steps or units, but may optionally include steps or units not listed, or may optionally include other steps or units inherent to these processes, methods, products, or apparatuses.

[0023] In this document, the term "embodiment" means that a particular feature, structure, or characteristic described in connection with an embodiment may be included in at least one embodiment of the present invention. The appearance of this phrase in various places throughout the specification does not necessarily refer to the same embodiment, nor is it a separate or alternative embodiment mutually exclusive with other embodiments. It will be explicitly and implicitly understood by those skilled in the art that the embodiments described herein can be combined with other embodiments.

[0024] "Multiple" refers to two or more. "And / or" describes the relationship between related objects, indicating that three relationships can exist. For example, A and / or B can represent: A alone, A and B simultaneously, or B alone. The character " / " generally indicates that the preceding and following related objects have an "or" relationship.

[0025] Furthermore, the terms indicating orientation, such as "up," "down," "front," "back," "left," "right," "upper end," and "lower end," are all based on the posture and position of the device or equipment described in this solution during normal use.

[0026] To make the objectives, technical solutions, and advantages of the embodiments of this utility model clearer, a clear and complete description will be provided below in conjunction with the technical solutions in the embodiments of this utility model. Obviously, the described embodiments are some, but not all, embodiments of this utility model. Based on the embodiments of this utility model, all other embodiments obtained by those skilled in the art without creative effort are within the protection scope of this utility model.

[0027] This utility model provides an ultrasonic probe, which includes a housing 1. The housing 1 has a working surface that contacts the object being tested. The working surface is provided with a plurality of spaced crystals. An electrode plate 4 is also provided between any two adjacent crystals on the working surface.

[0028] Example 1: As Figures 1 to 3 As shown, the plurality of wafers includes at least one first wafer 2 and a plurality of second wafers 3; at least one first wafer 2 and a plurality of second wafers 3 are disposed on the working surface; when the first wafer 2 is set as one, the first wafer 2 is located at the center of the working surface, and the plurality of second wafers 3 are distributed in a circular interval with the first wafer 2 as the center, and an electrode sheet 4 is also disposed between any two adjacent second wafers 3 on the working surface.

[0029] In this embodiment of the ultrasonic probe, the housing 1 is made of high-strength engineering plastic, which can be selected according to actual application needs and is not specifically limited here; the working surface of the housing 1 is coated with a wear-resistant coating; the first crystal 2 is fixed at the center of the working surface of the housing 1 as the main transmitting / receiving unit; multiple second crystals 3 are distributed circumferentially around the first crystal 2, specifically at equal intervals, to form an array-type detection network; each electrode plate 4 is correspondingly located between any two adjacent second transducers to adjust the electric field distribution. The coordinated arrangement of the first crystal 2, multiple second crystals 3, and multiple electrode plates 4 helps to improve the detection accuracy, flexibility, and adaptability of the ultrasonic probe.

[0030] Furthermore, in this embodiment, a first trench 101 and multiple second trenches 102 are also provided on the working surface. The outer periphery of the first wafer 2 is sealed and connected within the first trench 101, and the outer peripheries of the multiple second wafers 3 are correspondingly sealed and connected within the multiple second trenches 102 to ensure signal isolation and structural stability. Specifically, both the first wafer 2 and the second wafer 3 are circular piezoelectric ceramic sheets. The first wafer 2 is embedded in the first trench 101, and the second wafer 3 is embedded in the second trenches 102, both sealed with epoxy resin.

[0031] Furthermore, in this embodiment, the ultrasonic probe also includes multiple displacement driving mechanisms 5, which are connected one-to-one with multiple electrode plates 4. These mechanisms drive the electrode plates 4 to move radially along the working surface to approach or move away from the first wafer 2; and / or drive the electrode plates 4 to move circumferentially along the working surface relative to the first wafer 2, thereby flexibly adjusting the electric field distribution in the detection area. The electrode plates 4 are metal electrode plates.

[0032] Furthermore, in this embodiment, the working surface is also provided with multiple third grooves 103, and the fixed ends of multiple displacement driving mechanisms 5 are correspondingly and sealed within the multiple third grooves 103, and the driving ends of multiple displacement driving mechanisms 5 are correspondingly connected to multiple electrode plates 4. In addition, each third groove 103 has an insulating layer 6 on its inner wall, and a shielding layer 7 is also provided on the insulating layer 6. Specifically, each third groove 103 is coated with an insulating coating, for example, a polytetrafluoroethylene coating is sprayed on the inner walls around the perimeter and the bottom wall of the third groove 103 as an insulating coating to prevent leakage. The shielding layer 7 is, for example, a metal film or a conductive polymer coating, to enhance the electromagnetic shielding effect, reduce external interference or internal signal leakage, and play a role in preventing crosstalk isolation.

[0033] Specifically, the displacement drive mechanism 5 employs a biaxial piezoelectric ceramic micro-displacement device, capable of simultaneously moving the drive electrode 4 radially along the working surface and circumferentially, offering high flexibility. The piezoelectric ceramic micro-displacement device can be sealed within the third groove 103 using a fluororubber bellows and nano-sealing adhesive. The size of the third groove 103 should ideally allow the drive electrode 4 to move a suitable distance; however, no specific limitation is made here, and the actual application should be considered.

[0034] Furthermore, in this embodiment, the outer periphery of each electrode sheet 4 is located outside the corresponding third groove 103, and the side surface of each electrode sheet 4 facing the working surface is in contact with the working surface, which can effectively avoid motion interference. Each electrode sheet 4 is rectangular in shape, so that multiple electrode sheets 4 are arranged in a gradient density array relative to the first wafer 2 on the working surface. For example, between two electrode sheets 4 located on either side of any first wafer 2, a first gap is formed between the ends closer to the first wafer 2, and a second gap is formed between the ends farther from the first wafer 2. The first gap is smaller than the second gap to meet the near-field / far-field requirements of the matching sound field.

[0035] It should be noted that in this embodiment, the number of the second wafer 3 and the electrode sheet 4 is not limited; they can be designed and selected according to actual application needs, resulting in high application flexibility. For example... Figure 1In this configuration, there are five second wafers 3 and five electrode plates 4, meaning that there is one electrode plate 4 between every two adjacent second wafers 3; for example... Figure 4 In this design, there are 8 second wafers 3 and 4 electrode plates 4. An electrode plate 4 is provided between some two adjacent second wafers 3. Furthermore, an electrode plate 4 is also provided between any two adjacent first wafers 2 and second wafers 3 on the working surface. It is understood that the attached drawings are for illustrative purposes only and should be based on actual applications.

[0036] It should be noted that, in this embodiment, the housing 1 should also be provided with related electronic control components, such as circuit boards and electrode leads electrically connected to the circuit boards. The electrode plates need to be electrically connected through the electrode leads. In actual applications, the specific settings can be referenced from existing ultrasonic probes, and no specific limitations are made in this embodiment.

[0037] Example 2: A plurality of wafers include at least one first wafer 2 and a plurality of second wafers 3; such as Figure 5 As shown, when there are two or more first wafers 2, the two or more first wafers 2 are distributed in a circular interval on the working surface, and a plurality of second wafers 3 are distributed in a circular interval with all the first wafers 2 as the center. An electrode sheet 4 is also provided on the working surface between any two adjacent first wafers 2 and / or between any two adjacent second wafers 3.

[0038] For example Figure 5 As shown, there are four first wafers 2, which are arranged in a circular pattern on the working surface, with an electrode plate 4 between any two adjacent first wafers 2. There are eight second wafers 3, which are arranged in a circular pattern with the four first wafers 2 as the center, and an electrode plate 4 is also provided between any two adjacent second wafers 3. The attached figure is for illustrative purposes only and should be based on actual applications.

[0039] It should be noted that the connection and layout of the electrode plate 4 and the displacement driving mechanism 5 can be referred to the corresponding description in Embodiment 1, and will not be repeated here.

[0040] In both Embodiment 1 and Embodiment 2, the first wafer and the second wafer are identical, meaning they are identical in size, material, etc.

[0041] Example 3: This embodiment of the present invention also provides an ultrasonic device, which includes the ultrasonic probe provided in Example 1 or Example 2. The description of the ultrasonic probe can be found in Example 1 or Example 2, and will not be repeated here.

[0042] It should be understood that those skilled in the art can make improvements or modifications based on the above description, and all such improvements and modifications should fall within the protection scope of the appended claims.

Claims

1. An ultrasonic probe, characterized in that: The ultrasonic probe includes a housing with a working surface that contacts the object being tested. The working surface is provided with a plurality of spaced crystals, and an electrode plate is provided between any two adjacent crystals on the working surface.

2. The ultrasonic probe according to claim 1, characterized in that: The plurality of wafers includes at least one first wafer and a plurality of second wafers; when there is one first wafer, the first wafer is located at the center of the working surface, and the plurality of second wafers are distributed in a circular interval with the first wafer as the center, and an electrode plate is provided on the working surface between any two adjacent second wafers and / or between any two adjacent first wafers and second wafers; when there are two or more first wafers, the two or more first wafers are distributed in a circular interval on the working surface, and the plurality of second wafers are distributed in a circular interval with all the first wafers as the center, and an electrode plate is provided on the working surface between any two adjacent first wafers and / or between any two adjacent second wafers.

3. The ultrasonic probe according to claim 2, characterized in that: The working surface is also provided with at least one first groove and a plurality of second grooves, and the outer surface of at least one first wafer is sealed and connected to at least one first groove, and the outer surface of a plurality of second wafers is sealed and connected to a plurality of second grooves.

4. The ultrasonic probe according to claim 2, characterized in that: The ultrasonic probe also includes multiple displacement driving mechanisms, which are connected one-to-one with multiple electrode plates to drive the electrode plates to move radially along the working surface and / or to drive the electrode plates to move circumferentially along the working surface.

5. The ultrasonic probe according to claim 4, characterized in that: The working surface is also provided with a plurality of third grooves, and the fixed ends of the plurality of displacement driving mechanisms are sealed and connected to the plurality of third grooves in a corresponding manner, and the driving ends of the plurality of displacement driving mechanisms are connected to the plurality of electrode plates in a corresponding manner.

6. The ultrasonic probe according to claim 5, characterized in that: The outer periphery of each electrode sheet is located outside the corresponding third groove, and the side surface of each electrode sheet facing the working surface is in contact with the working surface.

7. The ultrasonic probe according to claim 5, characterized in that: Each of the third trenches has an insulating layer on its inner wall, and a shielding layer is also provided on the insulating layer.

8. The ultrasonic probe according to any one of claims 4-7, characterized in that: The displacement driving mechanism is a piezoelectric ceramic micro-displacement device with dual-axis motion.

9. The ultrasonic probe according to any one of claims 1-7, characterized in that: Each of the electrode sheets is rectangular in shape.

10. An ultrasonic device, characterized in that: The ultrasonic device includes the ultrasonic probe as described in any one of claims 1-9.

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