Clamp for repairing semiconductor electrostatic chuck

Abstract

The utility model discloses a fixture for repairing a semiconductor electrostatic chuck, which comprises a bottom plate, the upper surface of the bottom plate is fixedly connected with a support frame, the upper surface of the support frame is fixedly connected with a telescopic rod, one end of the telescopic rod is rotatably connected with an external connection disc through an end joint, and the inside of the external connection disc is fixedly connected with a motor. The output end of the motor is fixedly connected with a lap joint disc, the upper surface of the lap joint disc is rotationally connected with an inner connection disc, a clamping mechanism is arranged in the inner connection disc, and the clamping mechanism comprises a clamping block and an elastic piece. By means of the structure, the clamping blocks are rotated at a fixed point by rotating the inner connecting disc, then the inner connecting disc is opened, after electrostatic adsorption is well placed, the inner connecting disc is loosened, and the electrostatic chuck machine is rapidly clamped and fixed inwards through the clamping blocks under the action of the elastic pieces; the lap joint disc is driven by the motor so that the electrostatic chuck in the inner connection disc can be turned over rapidly.

Description

TECHNICAL FIELD

[0001] The utility model relates to electrostatic chuck adsorption technical field, especially a kind of clamp for the repair of semiconductor electrostatic chuck. BACKGROUND

[0002] In recent years, semiconductor electrostatic chuck is a kind of adsorption device based on electrostatic principle, can be used to adsorb and fix various objects, mainly utilize the electrostatic field adsorption object on the surface of semiconductor material, and the adsorption force can change electric field intensity and be adjusted accordingly, semiconductor electrostatic chuck is widely used in industrial production, but in the use process, damage phenomenon appears, need fixing device to fix electrostatic chuck, facilitate its repair, thus need to use a kind of clamp for repair, such as Chinese patent discloses a kind of clamp for the repair of semiconductor electrostatic chuck, its application number is: CN202221712778.1, by rotating adjusting rod, the angle of rotating plate can be adjusted, so as to adjust the angle of three-jaw chuck and chuck, facilitate the repair of electrostatic chuck, but slight wobble appears in the process of adjusting angle, in addition, when needing to repair the back of electrostatic chuck, it needs to be taken off from clamp and be turned over, then after being fixed, repair is carried out again, not set the mechanism that can rotate clamp without taking off electrostatic chuck, it is more time-consuming to take down electrostatic adsorption and fix again. UTILITARIAN CONTENT

[0003] The utility model aims at least to solve one of the technical problems existing in prior art, provide a kind of clamp for the repair of semiconductor electrostatic chuck, by rotating to inner interface dish, so that multiple clamping blocks are fixed point rotation, then open, after being placed well by electrostatic adsorption, loosen inner interface dish, by the action of elastic member, multiple clamping blocks are quickly clamped to electrostatic chuck machine towards inner, when needing to repair the back of electrostatic chuck, by motor driving lap joint dish, so that the electrostatic chuck in inner interface dish is quickly turned over.

[0004] This utility model also provides a clamp for repairing semiconductor electrostatic chucks, comprising: a base plate, a support frame fixedly connected to the upper surface of the base plate, a telescopic rod fixedly connected to the upper surface of the support frame, an end connector fixedly connected to the end of the telescopic rod away from the support frame, an outer receiving plate rotatably connected to the outside of the end connector, a motor fixedly connected inside the outer receiving plate, a connecting plate fixedly connected to the output end of the motor, an inner receiving plate rotatably connected to the upper surface of the connecting plate, and a clamping mechanism provided inside the inner receiving plate; a cylinder, a first recessed block rotatably connected to the bottom of the cylinder, the lower surface of the first recessed block fixedly connected to the base plate, an outer sleeve block fixedly connected to the output end of the cylinder, a second recessed block rotatably connected to the outside of the outer sleeve block, and a side surface of the second recessed block fixedly connected to the outer receiving plate. Through these components, the outer receiving plate is adjusted in angle by the cylinder. When repair of the back of the electrostatic chuck is required, the electrostatic chuck inside the inner receiving plate is quickly rotated by the motor driving the connecting plate.

[0005] According to the present invention, a clamp for repairing semiconductor electrostatic chucks includes a spring externally mounted on the telescopic rod. One end of the spring is fixedly connected to the telescopic rod, and the other end is fixedly connected to an end connector. With these components, when the angle of the outer plate is adjusted, a certain amount of wobbling may occur during rotation. The cooperation between the spring and the telescopic rod prevents unstable wobbling during rotation.

[0006] According to the present invention, a clamp for repairing semiconductor electrostatic chucks includes an inner contact plate with a connecting shaft fixedly connected to the side away from the motor, and an end of the connecting shaft away from the inner contact plate being rotatably connected to an outer contact plate. Through these components, the connecting shaft ensures a stable connection between the contact plate and the outer contact plate, preventing lateral displacement of the contact plate during rotation.

[0007] According to the present invention, a clamp for repairing semiconductor electrostatic chucks includes an overlapping plate and an inner plate located inside an outer plate, with multiple columns fixedly connected to the upper surface of the overlapping plate. These components allow the inner plate to rotate and secure the columns via the overlapping plate.

[0008] According to the present invention, a clamp for repairing semiconductor electrostatic chucks includes a clamping mechanism comprising a locking block. One end of the locking block is rotatably connected to a column, and the outside of the locking block is rotatably connected to an inner receiving plate. A rubber sleeve is fixedly connected to the other end of the locking block. Through these components, the column fixes one end of the locking block, allowing the locking block to rotate at a fixed point.

[0009] According to the present invention, a clamp for repairing a semiconductor electrostatic chuck includes multiple columns, each externally fixedly connected to an elastic element. The end of each elastic element away from the column is rotatably connected to an inner plate. Through these components, and the elastic action of the elastic elements, the inner plate, rotated at a certain angle, causes the locking block to return to its original position, thereby securing the electrostatic chuck.

[0010] According to the present invention, a clamp for repairing semiconductor electrostatic chucks includes a handle fixedly connected to the surface of the inner plate, and an anti-slip part provided on the outside of the handle. These components facilitate rotation of the inner plate via the handle, making operation more convenient and efficient.

[0011] Beneficial effects: Compared with the prior art, this new type of clamp for repairing semiconductor electrostatic chucks rotates the inner plate, causing multiple clamping blocks to rotate at fixed points and then open. After the electrostatic adsorption is placed, the inner plate is released, and through the action of the elastic element, the multiple clamping blocks quickly clamp the electrostatic chuck machine inward. When it is necessary to repair the back of the electrostatic chuck, the motor drives the overlapping plate to make the electrostatic chuck in the inner plate quickly flip. Attached Figure Description

[0012] The present invention will be further described below with reference to the accompanying drawings and embodiments;

[0013] Figure 1 This is a complete structural diagram of the clamp used for repairing semiconductor electrostatic chucks according to this utility model;

[0014] Figure 2 This is a side view of the fixture for repairing semiconductor electrostatic chucks according to the present invention.

[0015] Figure 3 This is a structural diagram of the clamping mechanism of the fixture used for repairing semiconductor electrostatic chucks according to this utility model;

[0016] Figure 4 This utility model relates to a clamp for repairing semiconductor electrostatic chucks. Figure 2 Partial structural diagram at point A in the middle.

[0017] Legend:

[0018] 1. Base plate; 2. Support frame; 3. Telescopic rod; 4. End connector; 5. Outer plate; 6. Cylinder; 7. First concave block; 8. Second concave block; 9. Outer sleeve block; 10. Motor; 11. Inner plate; 12. Spring; 14. Connecting shaft; 15. Overlap plate; 16. Column; 17. Locking block; 18. Rubber sleeve; 19. Elastic element; 20. Handle. Detailed Implementation

[0019] This section will describe in detail the specific embodiments of the present utility model. The preferred embodiments of the present utility model are shown in the accompanying drawings. The purpose of the drawings is to supplement the textual description with graphics, so that people can intuitively and vividly understand each technical feature and the overall technical solution of the present utility model, but they should not be construed as limiting the scope of protection of the present utility model.

[0020] Reference Figures 1-4 This utility model discloses a clamp for repairing semiconductor electrostatic chucks, comprising: a base plate 1, a support frame 2 fixedly connected to the upper surface of the base plate 1 for supporting and fixing; a telescopic rod 3 fixedly connected to the upper surface of the support frame 2 for fixing a spring 12; and a spring 12 externally mounted on the telescopic rod 3. When the outer plate 5 rotates, the telescopic rod 3 moves, causing the end connector 4 to stretch or compress the spring 12. The spring 12 remains stable during rotation and has a vibration damping effect. One end of the spring 12 is connected to the telescopic rod 3. Fixed connection, the other end of spring 12 is fixedly connected to end connector 4, the end of telescopic rod 3 away from support frame 2 is fixedly connected to end connector 4, connecting component, the outside of end connector 4 is rotatably connected to outer plate 5, the inside of outer plate 5 is fixedly connected to motor 10, which is the power source to drive overlapping plate 15 to rotate, the output end of motor 10 is fixedly connected to overlapping plate 15 to support inner plate 11, which can make inner plate 11 rotate, the upper surface of overlapping plate 15 is rotatably connected to inner plate 11, and the inside of inner plate 11 is provided with clamping mechanism;

[0021] The cylinder 6 has a first recessed block 7 rotatably connected to its bottom to fix the bottom of the cylinder 6. The lower surface of the first recessed block 7 is fixedly connected to the base plate 1. The output end of the cylinder 6 is fixedly connected to an outer sleeve block 9, which is a cooperating component that can drive the second recessed block 8 to rotate. The outer sleeve block 9 is rotatably connected to the second recessed block 8 to support its rotation. The side surface of the second recessed block 8 is fixedly connected to the outer plate 5.

[0022] A connecting shaft 14 is fixedly connected to the side of the inner plate 11 away from the motor 10, so that the overlapping plate 15 can be rotated stably. The end of the connecting shaft 14 away from the inner plate 11 is rotatably connected to the outer plate 5. The overlapping plate 15 and the inner plate 11 are located inside the outer plate 5. Multiple columns 16 are fixedly connected to the upper surface of the overlapping plate 15 to fix the elastic element 19.

[0023] The clamping mechanism includes a clamping block 17 for clamping the electrostatic chuck. One end of the clamping block 17 is rotatably connected to the column 16, and the outside of the clamping block 17 is rotatably connected to the inner receiving plate 11. The other end of the clamping block 17 is fixedly connected to a rubber sleeve 18 to protect one end of the clamping block 17 and to provide a certain degree of elasticity to prevent excessive compression of the electrostatic adsorption. Elastic elements 19 are fixedly connected to the outside of multiple columns 16 to provide a buffering effect. The end of the elastic element 19 away from the column 16 is rotatably connected to the inner receiving plate 11. A grip bar 20 is fixedly connected to the surface of the inner receiving plate 11, and the outside of the grip bar 20 is provided with an anti-slip part.

[0024] Working principle: First, rotating the handle 20 causes the inner plate 11 to rotate on the overlapping plate 15, thereby stretching the elastic element 19 and causing multiple locking blocks 17 to rotate around a fixed point. Then, the electrostatic chuck is placed between the multiple locking blocks 17, and the handle 20 is released. The elastic element 19 returns to its original position under the action of elastic force, thereby causing the inner plate 11 to rotate and fixing the multiple locking blocks 17 inward, thus clamping the electrostatic chuck. When the angle position needs to be adjusted, the cylinder 6 is started to push the outer plate 5 to change the angle, which facilitates the repair of any position of the electrostatic chuck. When the back of the electrostatic chuck needs to be repaired, the motor 10 is started to drive the overlapping plate 15 to rotate the inner plate 11. The inner plate 11 drives the electrostatic chuck to rotate, which can quickly flip the electrostatic chuck over and then repair the back of the electrostatic chuck.

[0025] The embodiments of the present utility model have been described in detail above with reference to the accompanying drawings. However, the present utility model is not limited to the above embodiments. Within the scope of knowledge possessed by those skilled in the art, various changes can be made without departing from the spirit of the present utility model.

Claims

1. A clamp for repairing semiconductor electrostatic chucks, characterized in that, include: A base plate (1) is fixedly connected to a support frame (2) on its upper surface. A telescopic rod (3) is fixedly connected to the upper surface of the support frame (2). An end connector (4) is fixedly connected to one end of the telescopic rod (3) away from the support frame (2). An outer plate (5) is rotatably connected to the outside of the end connector (4). A motor (10) is fixedly connected inside the outer plate (5). A connecting plate (15) is fixedly connected to the output end of the motor (10). An inner plate (11) is rotatably connected to the upper surface of the connecting plate (15). A clamping mechanism is provided inside the inner plate (11). A cylinder (6) is rotatably connected to a first recessed block (7) at its bottom. The lower surface of the first recessed block (7) is fixedly connected to a base plate (1). An outer sleeve block (9) is fixedly connected to the output end of the cylinder (6). A second recessed block (8) is rotatably connected to the outside of the outer sleeve block (9). The side surface of the second recessed block (8) is fixedly connected to an outer plate (5).

2. The clamp for repairing semiconductor electrostatic chucks according to claim 1, characterized in that, A spring (12) is provided on the outside of the telescopic rod (3). One end of the spring (12) is fixedly connected to the telescopic rod (3), and the other end of the spring (12) is fixedly connected to the end connector (4).

3. The clamp for repairing semiconductor electrostatic chucks according to claim 1, characterized in that, The inner plate (11) is fixedly connected to a connecting shaft (14) on the side away from the motor (10), and the end of the connecting shaft (14) away from the inner plate (11) is rotatably connected to the outer plate (5).

4. A clamp for repairing semiconductor electrostatic chucks according to claim 1, characterized in that, The overlapping plate (15) and the inner plate (11) are located inside the outer plate (5), and multiple columns (16) are fixedly connected to the upper surface of the overlapping plate (15).

5. A clamp for repairing semiconductor electrostatic chucks according to claim 4, characterized in that, The clamping mechanism includes a clamping block (17), one end of which is rotatably connected to the column (16), the outside of which is rotatably connected to the inner plate (11), and the other end of which is fixedly connected to a rubber sleeve (18).

6. A clamp for repairing semiconductor electrostatic chucks according to claim 5, characterized in that, Each of the columns (16) is fixedly connected to an elastic element (19), and the end of the elastic element (19) away from the column (16) is rotatably connected to the inner plate (11).

7. A clamp for repairing semiconductor electrostatic chucks according to claim 1, characterized in that, The inner plate (11) is fixedly connected to a handle (20), and the handle (20) is provided with an anti-slip part on its outside.

Images